111 results about "Planar capacitor" patented technology

A shielded planar capacitor structure (202) is discussed, formed within a Faraday cage (210) in an integrated circuit device (200). The capacitor structure (202) reduces parasitic capacitances within the integrated circuit device (200). The capacitor (202) comprises a capacitor stack (102) formed between a first and second metal layers (230,232) of the integrated circuit. The capacitor stack (102) has a first conductive layer formed from a third metal layer (106) disposed between the first and second metal layers (230,232) of the integrated circuit, a dielectric isolation layer (110) disposed upon the first conductive layer (106); and a second conductive layer (112) disposed upon the dielectric isolation layer (110) and overlying the first conductive layer (106). The structure (202) further has a first and second isolation layers (104,114) disposed upon opposite sides of the capacitor stack (102). The Faraday cage (210) is formed between the first and second metal layers (230,232) of the integrated circuit (200), comprising a first and second shield layers (402,414) each having a plurality of mutually electrically conductive spaced apart traces (404). The first and second isolation layers (404,414) and the capacitor stack (102,434) are sandwiched between the first and second shield layers (402,414). Conductive elements (432) are distributed around the periphery of the capacitor stack (102,434) and the first and second isolation layers (404,412). The conductive traces (424) of the first shield layer (402) are connected to the conductive traces (424) of the second shield layer (414) through the conductive elements (432).

Low Q associated with passive components of monolithic integrated circuits (ICs) when operated at microwave frequencies can be avoided or mitigated using high resistivity (e.g., ≧100 Ohm-cm) semiconductor substrates (60) and lower resistance inductors (44′, 45′) for the IC (46). This eliminates significant in-substrate electromagnetic coupling losses from planar inductors (44, 45) and interconnections (50-1′, 52-1′, 94, 94′, 94″) overlying the substrate (60). The active transistor(s) (41′) are formed in the substrate (60) proximate the front face (63). Planar capacitors (42′, 43′) are also formed over the front face (63) of the substrate (60). Various terminals (42-1′, 42-2′, 43-1, 43-2′,50′, 51′, 52′, 42-1′, 42-2′, etc.) of the transistor(s) (41′), capacitor(s) (42′, 43′) and inductor(s) (44′, 45′) are coupled to a ground plane (69) on the rear face (62) of the substrate (60) using through-substrate-vias (98, 98′) to minimize parasitic resistance. Parasitic resistance associated with the planar inductors (44′, 45′) and heavy current carrying conductors (52-1′) is minimized by placing them on the outer surface of the IC where they can be made substantially thicker and of lower resistance. The result is a monolithic microwave IC (46, 58) previously unobtainable.

Conductive lines constituting word lines of memory cells and conductive lines constituting memory cell plate electrodes are formed in the same interconnecting layer in a memory device including a plurality of memory cells each including a capacitor for storing data in an electrical charge form. By forming the capacitors of the memory cells into a planar capacitor configuration, a step due to the capacitors is removed. Thus. a dynamic semiconductor memory device can be formed through CMOS process, and a dynamic semiconductor memory device suitable for merging with logic is achieved. Data of 1 bit is stored by two memory cells, and data can be reliably stored even if the capacitance value of the memory cell is reduced due to the planar type capacitor.

A transducer comprising at least one planar capacitor with a thin coverlayer of material selected to maximize electric field coupling between cooperating capacitor electrodes within a region external to a principal surface of the coverlayer. Preferred coverlayer materials have low values of moisture absorption, surface free energy, permittivity, dielectric dissipation, and electrical conductance. According to one embodiment of the invention, a driven shield further enhances electric field coupling over and in a region external to the principal surface. The transducer also can promote a physical change in specific adsorbates and materials and simultaneously detect and measure an effect of the induced change. Applications for the transducer of the invention include the measurement of the moisture content of grain and bulk stored commodities, humidity, a dew point temperature, the onset of condensation and rates of adsorption and desorption.

The present invention relates to methods of forming multilayer structures and the structures themselves. In one embodiment, a method of forming a multilayer structure comprising: providing a dielectric composition comprising: paraelectric filler and polymer wherein said paraelectric filler has a dielectric constant between 50 and 150; applying said dielectric composition to a carrier film thus forming a multilayer film comprising a dielectric layer and carrier film layer; laminating said multilayer film to a circuitized core wherein the dielectric layer of said multilayer film is facing said circuitized core; and removing said carrier film layer from said dielectric layer prior to processing; applying a metallic layer to said dielectric layer wherein said circuitized core, dielectric layer and metallic layer form a planar capacitor; and processing said planar capacitor to form a multilayer structure.

An isolated shallow trench isolation portion is formed in a top semiconductor portion of a semiconductor-on-insulator substrate along with a shallow trench isolation structure. A trench in the shape of a ring is formed around a doped top semiconductor portion and filled with a conductive material such as doped polysilicon. The isolated shallow trench isolation portion and the portion of a buried insulator layer bounded by a ring of the conductive material are etched to form a cavity. A capacitor dielectric is formed on exposed semiconductor surfaces within the cavity and above the doped top semiconductor portion. A conductive material portion formed in the trench and above the doped top semiconductor portion constitutes an inner electrode of a capacitor, while the ring of the conductive material, the doped top semiconductor portion, and a portion of a handle substrate abutting the capacitor dielectric constitute a second electrode.

A structure for storing a native binary code in an integrated circuit, including an array of planar MIM capacitors above an insulating layer formed above a copper metallization network, wherein at least one metallization portion is present under each MIM capacitor. The size of the portion(s) is selected so that from 25 to 75% of the MIM capacitors have a breakdown voltage smaller by at least 10% than that of the other MIM capacitors.

A system for testing integrated circuits is described. A contactor board of the system has pins with ends that contact terminals on a power and signal distribution board. Opposing ends of the pins make contact with die terminals on an unsingulated wafer. The distribution board also carries a plurality of capacitors, at least one capacitor corresponding to every die on the unsingulated wafer. Each capacitor may include two substantially flat planar capacitor conductors and a dielectric layer between the capacitor conductors. Alternatively, the capacitors may be discrete components mounted to and standing above the distribution board, in which case corresponding capacitor openings are formed in the contactor substrate to accommodate the capacitors when the distribution board and the contactor board are brought together. A plurality of fuses made of a polymer material are also provided. The polymer material limits the flow of current flowing therethrough when the temperature of a fuse increases, and increases the current therethrough when the temperature of the fuse decreases.

Stacked planar capacitor structures and methods of fabricating the same generally include stacking two or more capacitors with three electrodes by sharing a middle electrode, wherein each capacitor has a different area. The stacked structure does not include step heights, which permits fabrication of multiple structures where desired.

The sensor is a pair of planar electrodes in some interval formed on the inner surface of automobile glass via adhering, pressing, painting or plating conductor, and electrode pair constitutes one planar capacitor via glass and near dielectric space. When some rain drops or other foreign matter attach to the outer surface of the glass, there will be changes in the average dielectric constant, the area covered by the planar capacitor plates and the minor axis radius of the dielectric space and thus change in capacitance, and the intelligent adaptive signal amplifying and processing unit with microprocessor detects the change in capacitance and converts it into digital signal to drive the control unit of the automatic windscreen wiper system.

A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, a planar capacitor device that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin and conductor metal foil to heat pressurize the same for forming a multi-layer plate; forming via holes for electrically connecting an outer layer conductor circuit to the electrodes of the capacitor device; forming a conductor layer on them; and forming the outer layer conductor circuits on the surfaces of the multi-layer plate.

The present invention relates generally to polymer composites having dispersed therein both useful spinel crystal fillers and ferroelectric (and/or paraelectric) fillers wherein the composite is both light activatable and can be used as a planar capacitor material. The light activation is typically employed via a laser beam (or other light emitting device) where the material has a pattern formed thereon. Electrodes are typically formed on the material's surface after patterning is complete via electroless metal plating. These composite polymers can be used as planar capacitors embedded in printed wiring boards or in integrated circuit packages.

Disclosed herein are embodiments of non-planar capacitor. The non-planar capacitor can comprise a plurality of fins above a semiconductor substrate. Each fin can comprise at least an insulator section on the semiconductor substrate and a semiconductor section, which has essentially uniform conductivity, stacked above the insulator section. A gate structure can traverse the center portions of the fins. This gate structure can comprise a conformal dielectric layer and a conductor layer (e.g., a blanket or conformal conductor layer) on the dielectric layer. Such a non-planar capacitor can exhibit a first capacitance, which is optionally tunable, between the conductor layer and the fins and a second capacitance between the conductor layer and the semiconductor substrate. Also disclosed herein are method embodiments, which can be used to form such a non-planar capacitor and which are compatible with current state of the art multi-gate non-planar field effect transistor (MUGFET) processing.

A semiconductor memory device and method of fabricating the same, which improves adhesion of the lower electrode of a ferroelectric planar capacitor, and prevents inter-diffusion between the Pt electrode of the capacitor and adhesion layer placed under the Pt electrode. The semiconductor memory device includes an insulating layer formed on a substrate, a paraelectric layer formed on the insulating layer, and a conductive layer formed on the paraelectric layer.

A memory cell transistor and a planar capacitor are provided in a memory region, and both transistors of a CMOS device are provided in a logic circuit region. A capacitance dielectric 15 and a plate electrode 16b of the planar capacitor are provided over a trench shared with a shallow trench isolation 12a, and the upper part of the trench is filled with the capacitance dielectric 15 and the plate electrode 16b. An n-type diffusion layer 19 that is a storage node is formed, with an end region thereof extending along one side of the upper part of the trench, to a region of the substrate overlapping with the shallow trench isolation 12a. The area of a part of the substrate functioning as a capacitor can be increased without increasing the substrate area.

A composition comprising: a polymer with a glass transition temperature greater than 250° C. and a water absorption of 2% or less; one or more metals or metal compounds; and an organic solvent. The polymer can optionally include sites that can crosslink with one or more crosslinking agents. The compositions can be used to produce electronic components such as resistors, discrete or planar capacitors, conductive adhesives and electrical and thermal conductors. The invention is also directed to a composition comprising a polymer with a glass transition temperature greater than 250° C. and a water absorption of 2% or less, and an organic solvent. These compositions can also be used in a number of electronic applications such as an encapsulant and as an integrated circuit packaging material.