103results about "Cross-talk/noise/interference reduction" patented technology

An electronic device may include: a display; a conductive plate facing the display; a first circuit board including a first opening having an electronic component disposed thereon; a second circuit board having an integrated circuit disposed thereon, wherein the integrated circuit is disposed in the first opening; a shield can having a second opening and disposed on the first circuit board to surround the periphery of the electronic component; a shielding member covering the second opening; a vapor chamber disposed between the conductive plate and the shielding member when the display is viewed from a first direction; a first conductive member electrically connecting the conductive plate and the vapor chamber; and a second conductive member electrically connecting the vapor chamber and the shield can. The second conductive member may be disposed so as not to overlap the shielding member when viewed from the first direction.

A circuit board according to an embodiment of the disclosure can include a substrate layer on a first portion of the circuit board and a second portion of the circuit board different from the first portion, a power line on the first portion of the circuit board, a signal line on the second portion of the circuit board, a shield layer spaced apart from the power line and the signal line, and a cover layer between the substrate layer and the shield layer, wherein the cover layer includes a cover substrate layer on the first portion and the second portion of the circuit board, a conductive layer on the first portion of the circuit board corresponding to the power line and between the cover substrate layer and the shield layer, and an insulating layer on the second portion of the circuit board corresponding to the signal line and disposed between the cover substrate layer and the shield layer.

According to an embodiment of the disclosure, an electronic device may include a housing, a first printed circuit board, a second printed circuit board, an interposer, a first electrical component, a power management integrated circuit(PMIC), and a capacitor. The first printed circuit board or the second printed circuit board may be disposed in the housing. The interposer may be disposed along at least a portion of an edge of the first printed circuit board or at least a portion of an edge of the second printed circuit board. The first electrical component may be disposed on the first printed circuit board. The PMIC may be disposed on the second printed circuit board. The capacitor may interconnect the first printed circuit board and the second printed circuit board. The capacitor may be coupled to the first printed circuit board and the second printed circuit board. The capacitor may be disposed adjacent to the PMIC. The capacitor may be configured to supply power that is supplied from the PMIC, to the first electrical component. The capacitor may include at least two electrodes disposed to be spaced apart from each other and in parallel to each other.

An electrical component includes at least one conducting trace configured for conducting radiofrequency (RF) signals. The at least one conducting trace has a broadband conductive material applied onto one or more specific locations along the at least one conducting trace. In certain embodiments, the one or more specific locations are locations detected or anticipated to have surface roughness. In certain embodiments, the presence of the broadband conductive material improves the signal integrity of RF signals conducted along the conducting trace (compared to if the broadband conductive material was not present). Certain embodiments provide methods for fabricating such electrical components.

An electronic device is provided. The electronic device includes a substrate, a first conductive layer, an insulating layer, and a second conductive layer. The first conductive layer is disposed on the substrate. The first conductive layer has a first connection wire and a second connection wire. In a cycle, the first connection wire transmits a positive polarity signal and the second connection wire transmits a negative polarity signal. The insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the insulating layer. The second conductive layer includes a plurality of portions covering the first connection wire and the second connection wire. In addition, the number of first connection wire covered by each of the plurality of portions is equal to the number of second connection wire covered by each of the plurality of portions.

An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of first ground patterns include a first meander form at the first portion, and the first layer and the second layer are joined at the second portion and the third portion, and are configured to be flexible relative to each other at the first portion.

Provided is an integrated antenna device, which includes a substrate, at least one antenna, a radio-frequency integrated circuit (RFIC), multiple metal pillars, an encapsulation and a heat conducting structure. The antenna and the RFIC are respectively disposed on a first surface and a second surface of the substrate. A third surface of the RFIC is facing the second surface. Multiple first ends of the metal pillars that surround the RFIC are disposed on the second surface. The encapsulation is disposed on the second surface and encapsulates at least one portion of the RFIC and at least one portion of each of the metal pillars. The heat conducting structure is disposed above a fourth surface of the RFIC.

A method (200, 200a, 300) of manufacturing an integrated antenna device (100, 100a, 100b) includes: a circuit board assembly is provided; the circuit board assembly includes a substrate (110) and at least one antenna (120); an at least one radio-frequency integrated circuit module (189) is positioned to the second surface (114) of the substrate (110), each of the radio-frequency integrated circuit modules (189) includes a radio-frequency integrated circuit (130) and a heat conducting structure (160, 160b); at least one set of metal pillars (140) is positioned to the second surface (114); an encapsulant is disposed on the second surface (114), and solidified into an encapsulation (150, 152) to encapsulate each of the radio-frequency integrated circuit modules (189) and the metal pillars (140); and the encapsulation (150, 152) is polished until each of the heat conducting structures (160, 160b) and the second ends (144) are exposed from the encapsulation (150, 152).

An electronic system having a mounting substrate with a plurality of layers. The mounting substrate combines an upper shield structure and a lower shield structure to form an interlocking shielding structure to reduces crosstalk interference and improve return loss and insertion loss for high-speed serial communication circuits. The upper shield structure and the lower shield structure have a series of grounded reference shields that reduce unwanted electrical signal interferences.

A high speed circuit and a method of manufacturing low crosstalk differential traces are disclosed. The high speed circuit includes a printed circuit board, a ground plane layer, a pair of first and second differential traces, and a cascading common mode filter. The printed circuit board has a first surface and a second surface opposite the first surface. The ground plane layer has a first surface that contacts the second surface of the printed circuit board. The pair of first and second differential traces are located on the first surface of the printed circuit board. The first differential trace and the second differential trace carry an electrical signal. The cascading common mode filter includes an external common mode filter and an internal common mode filter. The external common mode filter includes a U-shaped gap segment located on the first surface of the ground plane layer. The internal common mode filter includes an H-shaped gap segment located on the first surface of the ground plane layer. The H-shaped gap segment is located adjacent to the U-shaped gap segment.

The invention relates to an automation field device (1), having: - a housing (2) which encloses an interior (3); - a sensor and / or actuator element (4) arranged on or in the housing (2); - an electronic circuit (5) arranged in the housing (2) for operating the sensor and / or actuator element (4), wherein the electronic circuit (5) has at least one printed circuit board (5.1), wherein the at least one printed circuit board has at least two spring arms formed from the printed circuit board, wherein at least two of the spring arms are formed in a plane of the printed circuit board such that the two spring arms extend outwards at mutually opposite printed circuit board edges of the printed circuit board, and wherein the two opposite spring arms are designed and matched to the interior such that the spring arms generate a clamping force for the printed circuit board introduced into the interior and hold the printed circuit board in the interior, wherein at least one of the spring arms has an electrically conductive coating in order to achieve an electrically conductive connection between the printed circuit board and the housing.

A semiconductor device may comprise an insulator substrate, a second substrate, a first structured metallization layer comprising a first section configured to operate at a first potential, and a second section configured to operate at a second potential. The insulator substrate may comprise a second structured metallization layer which may comprise a first section coupled to the first potential and a second section coupled to the second potential. At least one routable third structured metallization layer may comprise a first segment coupled to the second potential and a second segment coupled to the first potential.

Particular embodiments described herein provide for an electronic device can include a support structure, a radiation source on the support structure, and a radiation shield around the radiation source. The radiation shield includes a wall secured to the support structure, a vacuum bag on the wall, where the vacuum bag has an inside air pressure less than an air pressure outside the vacuum bag, and a lid. The air pressure inside the vacuum bag is less than the atmospheric pressure outside the vacuum bag. When the vacuum is created in the vacuum bag, the vacuum bag deforms and compresses to help provide a vacuum-based mechanical loading that helps to create an applied load on the one or more radiation sources by the lid.

A filter device includes an inductor component, and a substrate on which the inductor component is mounted, the substrate including a first dielectric layer having a mounting surface, a first pad electrode, which is provided on the mounting surface and to which a first terminal of the inductor component is connected, and a first electrode, which is connected and is provided such that the first dielectric layer is positioned between the first electrode and the first pad electrode. At least part of the first electrode overlaps the first pad electrode when the mounting surface is viewed in a plan view. The first pad electrode and the at least part of the first electrode form a first capacitor.

The present application relates to the technical field of LED display, and discloses an LED module having through channels and conforming to certification standards of DCI and a display screen. The LED module includes a printed circuit board, the printed circuit board being provided with a plurality of first through channels, an inner peripheral side wall of the first through channel being provided with a first conductive layer, both sides of the printed circuit board being respectively provided with a conductive edge corresponding to the first through channel one to one, the conductive edge being disposed around a peripheral side of the first through channel and connected to the first conductive layer, and the first conductive layer being disposed in a grounding manner; and a supporting structure, which is disposed opposite to the printed circuit board and tightly connected to the printed circuit board, and has a plurality of second through channels, the supporting structure having a second conductive layer, and the second conductive layer being grounded and abutting against the conductive edge. The present application solves the problems for reducing blockage of the LED screen on sound and having a risk of data leakage.

An electronic apparatus includes: an electronic component; a substrate including a first layer at which the electronic component and a first ground pattern are disposed, and a second layer at which a second ground pattern is disposed; and a case which is in contact with the first ground pattern, covers the electronic component, reduces magnetic noise, and is fixed to the substrate, and plural conductors connecting the first ground pattern and the second ground pattern are disposed along a portion of the first ground pattern, the portion being in contact with the case.

A circuit board includes a first circuit base board, a second circuit base board, an annular interposer disposed between the first circuit base board and the second circuit base board, and a conductive element. A first annular groove of the first circuit base board has a first internal extension groove. A second annular groove of the second circuit base board has a second internal extension groove. The annular interposer is located in the first annular groove and the second annular groove. The conductive element is disposed in the first internal extension groove and the second internal extension groove and electrically connects the first conductive layer and the second conductive layer.

A semiconductor device includes: an insulator substrate; a second substrate disposed at a first surface of the insulator substrate; a first structured metallization layer disposed at a second surface of the insulator substrate opposite the first surface, the first structured metallization layer comprising a first portion configured to operate at a first potential and a second portion configured to operate at a second potential; the insulator substrate comprises: a second structured metallization layer buried in the insulator substrate and configured for EMI shielding, arranged adjacent to the second substrate and comprising: a first portion coupled to the first potential; a second portion coupled to the second potential, where the first portion and the second portion do not overlap; and at least one routable third structured metallization layer, the at least one routable third structured metallization layer comprising: a first section coupled to the second potential; a second section, the second section being coupled to the first potential; wherein the first part of the second structured metallization layer and the first section of the third structured metallization layer form a first buffer capacitor.

Electronic device includes a housing including a conductive portion, an antenna module disposed in an inner space of the housing and including printed circuit board (PCB) disposed in the inner space, including a first surface and a second surface facing a direction opposite to the first surface, at least one antenna element disposed on the first surface of the PCB or near the first surface in the PCB, a wireless communication circuit disposed on the second surface and configured to transmit and / or receive a radio signal through the at least one antenna element, a protective member disposed on the second surface of the PCB to surround at least partially the wireless communication circuit, and a conductive shielding layer disposed on the protective layer, and a conductive member connected to the conductive portion of the housing and facing the conductive shielding layer of the antenna module at least in part.

The power conversion device of the present application includes a power module having a plurality of power devices, and a circuit substrate connected to the power module, the circuit substrate having a drive circuit arrangement region in which a plurality of drive circuits for driving the plurality of power devices are arranged, and a control circuit arrangement region in which a control circuit for controlling the drive circuits is arranged, the two drive circuit arrangement regions being arranged with the control circuit arrangement region interposed therebetween.

A resin film (10) with a conductor layer has a resin film (1) containing a thermoplastic resin and provided with a void (1h) inside and a conductor layer (2) adjacent to at least one main surface side of the resin film (1). In the resin film (1), when a position of an end surface on the conductor layer (2) side is set as a first position (E1), a position at a distance of exactly 1 / 3 of the thickness of the resin film (1) from the first position (E1) in the stacking direction is set as a second position (E2), and a position at a distance of exactly 1 / 3 of the thickness of the resin film (1) from the second position (E2) in the stacking direction toward the side opposite to the first position (E1) is set as a third position (E3), the void (1h) is present more between the first position (E1) and the second position (E2) than between the second position (E2) and the third position (E3).

A flexible printed circuit board, and an electronic device are provided. The flexible printed circuit board includes a first layer including at least one RF conductive wire for transmitting a radio frequency signal, a second layer spaced apart from the first layer by a first distance in a first direction perpendicular to a surface of the flexible printed circuit board and including a second ground conductor, a third layer spaced apart from the first layer by a second distance, which is longer than the first distance, in a direction opposite to the first direction and including a third ground conductor, and at least one fourth layer positioned between the first layer and the third layer.

Examples described herein relate to a system that includes: a circuit board comprising a plurality of layers, first and second conductive connections, first and second trace portions, first, second, and third routings, and a via wherein: the first conductive connection is coupled to the first trace portion, the second conductive connection is coupled to the second trace portion, the first routing is formed in a first layer of the plurality of layers, the second routing is formed in a second layer of the plurality of layers, the third routing is formed in the first layer of the plurality of layers, a portion of the first routing overlaps with a portion of the second routing to provide a capacitive region, and the via conductively couples a portion of the second routing overlaps with a portion of the third routing.

This invention relates to a packaging structure and design method for an embedded notch filter circuit within a single-photon detector readout module. The packaging structure includes a microwave multilayer dielectric substrate; the microwave multilayer dielectric substrate comprises multiple dielectric layers stacked along its thickness direction, with metal conductive strips at the top, bottom, and between each dielectric layer; multiple metallized vias are disposed within the microwave multilayer dielectric substrate; the metal conductive strips and metallized vias cooperate to form a distributed circuit, enabling signal transmission and circuit interconnection between the dielectric layers; an input notch filter circuit and an output notch filter circuit are embedded within the microwave multilayer dielectric substrate, both of which are interconnected by metal conductive strips and metallized vias located between the dielectric layers. Compared to traditional readout modules, this invention not only reduces the overall circuit size and manufacturing costs but also significantly improves the readout module's suppression performance for gated frequency signals and their harmonic signals.

Disclosed is a hearing device. The hearing device comprises a telecoil for communication in a first frequency band; a wireless communication device for communication in a second frequency band; and a printed circuit board, (PCB), comprising at least one conductive layer and at least one dielectric layer. The telecoil is arranged in a first section of the PCB and the wireless communication device is arranged in a second section of the PCB. The conductive layer comprises a first conductive trace provided in the first section of the PCB and a second conductive trace provided in the second section of the PCB. Further disclosed is a method of manufacturing a hearing device