2969results about "Cross-talk/noise/interference reduction" patented technology

A base station is disclosed for an unmanned aerial vehicle (UAV) that includes: an enclosure defining a window that is configured to receive the UAV to allow for entry of the UAV into the base station and exit of the UAV from the base station; a door that is movably connected to the enclosure such that the door is repositionable between a closed position and an open position; a sealing member that extends about the window and which is configured for engagement with the door so as to form a seal therewith in the closed position; and a heating system that is supported by the enclosure and which is configured to heat the door and / or the sealing member to support operation (e.g., opening and closure) of the door in a cold environment, wherein the heating system includes at least one light source and at least one heating element.

A base station is disclosed for an unmanned aerial vehicle (UAV). The base station includes: an enclosure; a slide mechanism that is connected to the enclosure and which is repositionable between a retracted position and an extended position; and a cradle that is connected to the slide mechanism and which defines a chamber that is configured to receive the UAV such that the UAV is movable into and out of the enclosure during repositioning of the slide mechanism between the retracted position and the extended position. The cradle includes: an upper shell; a lower shell that is connected to the upper shell; and at least one thermal insulator that is located between the upper shell and the lower shell.

A docking system is disclosed for an unmanned aerial vehicle (UAV). The docking system includes a base station that is configured to receive the UAV and a pedestal that is configured to support the base station in an elevated position. The pedestal defines an interior space that is configured in correspondence with an outer contour of the base station such that the base station is positionable within the pedestal to protect the base station during nonuse.

The invention relates to the technical field of electromagnetic shielding compensation, and discloses an electromagnetic shielding compensation method and system for an FPC high-performance computing chip interface, and the method comprises the steps: carrying out the impedance signal collection of the FPC high-performance computing chip interface, obtaining a time domain signal and a second-order change rate curve, a time domain signal is acquired by applying an alternating current excitation signal between a signal layer and a grounding layer; performing feature extraction on the time domain signal and the second-order change rate curve to obtain a feature vector; inputting the feature vector into a support vector machine model to perform electromagnetic interference classification identification to obtain an electromagnetic interference mode type; performing weighted fusion analysis on the time domain signal to obtain an electromagnetic interference state parameter; according to the method, a layered compensation controller is constructed, the impedance parameters of the shielding layer are adjusted through a self-adaptive backstepping control algorithm, compensation control parameters are obtained, accurate adjustment of the impedance parameters of the shielding layer is achieved, and stability and effectiveness of electromagnetic shielding compensation are guaranteed.

A mating module includes a tongue plate configured to be inserted into a mating slot of an electrical connector. The tongue plate includes a first surface, a second surface opposite to the first surface, a number of conductive pads exposed to the first surface and / or the second surface, and at least one metal grounding plate located between the first surface and the second surface. An end surface of the metal grounding plate extends at least close to an edge of the tongue plate. The end surface of the metal grounding plate is configured to be electrically connected to a metal shielding sheet of the electrical connector, so as to improve the grounding and shielding effects. A connector assembly having the mating module is also disclosed.

A network of Intermediate Device Structure (IDS) members communicatively coupled, mounted to elevated structure / s within urban settings, each configured to operate by a processor / controller with resident code, and in real time receive sensed environmental inputs from each IDS' vicinity, remote data / instruction / s processing the inputs with resident code parameters generating outputs that are configured to mitigate / avert intermittent environmental events harmful / hazardous to humans. The IDS's include a launch and charging pad that hosts a UAV, which patrols an area within communication range of at least one of the IDSs so the UAV, perhaps with AI-engine assistance, can detect events in the area patrolled by the UAV.

The invention discloses a stamp hole and LGA combined board card, and relates to the technical field of embedding. Comprising a core board and a bottom board, the bottom board is provided with a bonding pad corresponding to the core board in position, and the bonding pad is used for welding the core board and the bottom board; the core board comprises a board card body, and the board card body is provided with a plurality of stamp holes, a plurality of LGA packaging pads, a plurality of LGA special pads, a positioning hole and a shielding cover welding module. The mode of combining the stamp hole and the LGA is used as the connection mode of the core board, and the advantages of the stamp hole and LGA packaging are achieved at the same time.

RF absorbing structures include a dielectric layer, such as polycarbonate, and one or more layers of a carbon resistive material, such as carbon ink. The RF absorbing structures can further include one or more layers of a conductive material, such as silver ink.

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

Millimeter wave (mmWave) technologies, devices, and methods related to transceivers, receivers, and antenna structures for wireless communications are described. Various aspects include collocated millimeter wave (mmWave) antennas and near field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication systems with MIMO support and phase noise synchronization on a single coaxial cable, passing RF signals over cable (RFoC) in distributed phased array communication systems, clock noise leakage reduction, IF to RF auxiliary chips for backward and forward compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architectures, and the like.

The invention relates to the technical field of PCBA board anti-interference, and discloses a vehicle-mounted display PCBA board anti-interference method, device and equipment. The method comprises the following steps: carrying out electromagnetic interference data acquisition on a PCBA (Printed Circuit Board Assembly) of the vehicle-mounted display to obtain an electromagnetic interference data set, and constructing a PCBA structure matrix; performing feature extraction to obtain interference feature data; constructing a probability distribution function, generating a feature transformation matrix and performing joint operation to obtain an interference suppression matrix; constructing a multivariable constraint condition and solving an anti-interference optimization parameter; inputting the anti-interference optimization parameters and the interference signal matrix into a particle swarm-radial basis function neural network for training to obtain an anti-interference neural network model; and performing filtering processing and compensation correction on the original input signal of the PCBA board through the anti-interference neural network model to obtain a target output signal. Compensation correction can be dynamically carried out, the compensation coefficient is adjusted in real time according to the signal error, and the stability and accuracy of the output signal are ensured.

The invention discloses an integration and optimization method of a multilayer circuit board in a photovoltaic inverter, and the method comprises at least seven layers of functional stacked structures which are an electromagnetic shielding layer, a power device layer, a first insulating dielectric layer, a control circuit layer, a second insulating dielectric layer, a heat dissipation substrate layer and a mechanical strengthening layer from top to bottom in sequence. Wherein the power device layer adopts a three-dimensional embedded packaging technology to integrate an IGBT module and a SiC MOSFET module, and a gate drive circuit of the power device layer is embedded into a first insulating dielectric layer in a coplanar waveguide structure; the heat dissipation substrate layer is provided with a micro-channel array with gradient apertures, and the inner wall of each micro-channel is subjected to anodic oxidation treatment to form an Al2O3 ceramic layer with the thickness of 20-50 microns.

The invention discloses a broadband multi-level three-dimensional vertical interconnection structure based on an HTCC technology, and belongs to the field of radio frequency front-end system integration. The structure comprises a PCB mother board, a ball grid array and an SiP module which are sequentially arranged from bottom to top, in the SiP module, the chips are distributed among different levels, and a connection mode of the chips among the different levels is set; a radio frequency signal is transmitted upwards through the PCB mother board, and after flowing through the lower-layer bare chip, the radio frequency signal is orderly transmitted upwards through the strip line and the signal via hole in the HTCC and finally transmitted to the surface-layer chip, so that a complete and efficient vertical interconnection signal transmission system is formed. According to the invention, the layout flexibility of interconnection lines among the chips is improved, the wiring crosstalk among the chips is reduced, the three-dimensional integration scene of bare chips in the HTCC is greatly widened, high-density SiP packaging is realized, and the strict technical requirements on radio frequency signal transmission, processing and chip interconnection under a complex circuit architecture can be met.

The embodiment of the utility model provides a circuit board assembly and electronic equipment, and relates to the technical field of chips, the circuit board assembly comprises a circuit board, an electronic device, a shielding structure and a heat dissipation structure, the electronic device is arranged on the circuit board, the shielding structure is arranged on the circuit board, and a through opening is formed in the position, opposite to the circuit board, of the shielding structure; at least part of the heat dissipation structure covers the through opening, the heat dissipation structure and the shielding structure form a shielding cover, and the shielding cover covers the electronic device. According to the circuit board assembly provided by the invention, when the height of the electronic device is increased, the height of the shielding cover does not need to be increased, the height of the shielding cover is reduced, the occupied space in the electronic equipment is reduced, and further thinning of the electronic equipment is facilitated. The heat dissipation structure is used as a part of the shielding cover, so that the heat dissipation structure can dissipate heat of the electronic device and can also achieve the electromagnetic shielding function of the electronic device, and functional diversification of the heat dissipation structure is achieved.

There is provided an electronic device that is capable of restraining static electricity from flowing to electronic components mounted on the electronic device. A connector shield has an electrostatic protecting portion disposed along an opening of a fitting recess of a connector. The electrostatic protecting portion is positioned in a direction along a circuit board on which the connecter is mounted, rather than at least one of a plurality of signal terminals that the connector has.

Methods, systems, and apparatuses for grounding of integrated external electromagnetic interference (EMI) shields are provided. A portion of a module substrate, different from a circuit board substrate, may protrude past the module as a location for one or more grounding pads to which the EMI shield is grounded. The EMI shield may cover at least a portion of the thickness of the module substrate. The EMI shield may be comprised of one or more parts, which may be coupled to one another. The module substrate may include conductive vias. The EMI shield may include a sprayed and / or printed coating. The EMI shield may include a darkened coating.

The invention relates to an electromagnetic shielding film and a circuit board, and the electromagnetic shielding film comprises a shielding layer, the thickness d of the shielding layer in a slicing state and in a preset observation range satisfies # imgabs0 #, the thickness uniformity of the shielding layer is less than or equal to 20% through the modes of adjusting a production technology and the like, the shielding layer with uniform thickness is formed, the consistency of impedance characteristics can be improved, and the electromagnetic shielding film has good electromagnetic shielding performance. And meanwhile, the skin effect of the shielding layer is reduced, the surface current is better borne, the influence of electromagnetic interference of a high-frequency and high-speed line on an internal circuit is reduced, the shielding effect of the electromagnetic shielding film on the high-frequency and high-speed line is improved, and the working reliability of the circuit board is further improved. Besides, the first protection layer forms an undulating surface through the particle member, and the shielding layer conformal to the undulating surface of the first protection layer can be grounded with the circuit board by using a downward projection, so that non-conductive particle grounding is realized, more use scenes are satisfied, and the material applicability is improved.

The invention provides an embedded substrate and a manufacturing method thereof. The manufacturing method specifically comprises the following steps: forming a conduction copper column and a shielding copper column on a first circuit layer of the substrate; pressing a second dielectric layer on the first circuit layer, the conduction copper column and the shielding copper column; mounting a component on the second dielectric layer; pressing the component into the second dielectric layer to enable the shielding copper column and the first circuit layer to surround the component; pressing a fourth dielectric layer on the second dielectric layer and the component, and curing the second dielectric layer and the fourth dielectric layer; forming an outer circuit layer on the fourth dielectric layer; and the outer circuit layer is in conducting connection with the conducting copper column, the shielding copper column and the terminal of the component. The shielding copper columns can reduce the deviation of the component in the extrusion process of the component and improve the yield, five surfaces of the embedded component are all provided with metal copper, and a good electromagnetic shielding effect can be achieved. Moreover, the second dielectric layer and the fourth dielectric layer are made of high-thermal-conductivity materials, so that heat can be quickly guided into the shielding copper columns, and the heat dissipation effect is obviously improved.

The invention provides an electric connection structure and electronic equipment, relates to the technical field of circuit board interconnection, and can reduce the size of a circuit board and increase the sizes of other parts around the circuit board. The electric connection structure comprises a circuit board, a first connector, a third group of terminals and a fourth group of terminals. The circuit board comprises a first group of signal wires, a second group of signal wires, a first reference ground and a second reference ground. The first reference ground is spaced apart from the second reference ground. The first connector is arranged on the circuit board, and the first connector comprises a first group of terminals and a second group of terminals. The third group of terminals are electrically connected with the first group of terminals through the first group of signal wires and the first reference ground, and the fourth group of terminals are electrically connected with the second group of terminals through the second group of signal wires and the second reference ground. The electric connection structure provided by the invention is used for circuit board interconnection.

The invention relates to the technical field of PCBs, in particular to a method and system for automatically adjusting the line spacing in PCB design and computer equipment. According to the invention, crosstalk between the adjacent signal lines is effectively reduced by reasonably adjusting the distance between the component and the signal line, impedance matching of the signal lines is better controlled by considering electrical characteristic information, and the line distance in PCB design is adjusted by obtaining the characteristic information of the component, so that the impedance matching accuracy of the signal lines is improved. The interference is reduced, the signal integrity is improved, the electrical performance and the reliability are improved, the crosstalk between the signal lines is effectively reduced by calculating the actual distance between the reference line segment and the component pin, the impedance of the signal lines can be ensured to be matched with the component by considering the pin characteristics and the electrical characteristics, and the reliability of the component is improved. Through accurate analysis of the size and characteristics of the middle line segment group, crosstalk between adjacent signal lines can be effectively reduced, coupling of an electromagnetic field can be reduced through a reasonable line spacing, and the definition of signals is ensured, so that the signal transmission efficiency is improved, and the reflection phenomenon is reduced.

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a charging interface, a first circuit board, a metal reinforcing piece and a support assembly. The first circuit board comprises a connecting end. The connecting end is provided with a grounding terminal. The connecting end is electrically connected with the charging interface. The metal reinforcing member and the connecting end are arranged in a stacked manner. The metal reinforcing member is electrically connected with the grounding terminal. The support assembly comprises a metal support and a conductive part. At least part of the connecting end is located in the metal support. The metal support comprises a main body part and a grounding part. The grounding part is electrically connected with the main body part. And the metal reinforcing piece and the main body part are electrically connected with the conductive piece respectively. The grounding part is used for grounding. According to the electronic equipment provided by the embodiment of the invention, the structural design difficulty is reduced, and the assembly difficulty and the production cost are reduced.

The embodiment of the invention provides a flexible circuit board and electronic equipment, relates to the technical field of signal transmission, and is used for relieving the problem of relatively high signal loss of an FPC (Flexible Printed Circuit) caused by electromagnetic shielding. The flexible circuit board may have a first region and a second region. A reference layer of the flexible circuit board is located in the first area, and the reference layer and the signal layer are stacked. The first shielding layer is located in the first area, and the first shielding layer is stacked on the side, away from the reference layer, of the signal layer. The second shielding layer is located in the second area, and the second shielding layer and the signal layer are stacked. The first grounding wire is electrically connected with the first shielding layer and the reference layer. The first grounding wire is also electrically connected with the second shielding layer. A backflow signal of a signal transmitted by the signal line in the signal layer can flow through the first grounding line from the second shielding layer in the second area, and respectively flows into the first shielding layer and the reference layer in the first area.

The invention provides a flexible circuit board, a display module and a display device.The flexible circuit board comprises a first pin area located at the first end, a second pin area located at the second end and a wiring area located between the first pin area and the second pin area, the first pin area comprises a plurality of first pins, and the second pin area comprises a plurality of second pins; the wiring area comprises a high-frequency signal line, a plurality of first signal lines located on the first side of the high-frequency signal line and at least one second signal line located on the second side of the high-frequency signal line, the first signal lines and the second signal lines do not receive ground signals, one end of each first signal line is electrically connected with one first pin, and the other end of each second signal line is electrically connected with one second pin. One end of at least one second signal line is electrically connected with at least one first pin, the multiple first signal lines are electrically connected, and wires electrically connected with the first signal lines and wires electrically connected with the second signal lines in the wiring area do not overlap with the high-frequency signal lines. According to the flexible circuit board, the interference of network wiring on the high-frequency signal line is avoided.

A connection body comprises a body having upper and lower surfaces, a first path and a second path. The first path has a first wired portion configured to be connected to a first core wire of a cable structure and a first terminal portion coupled to the first wired portion by a first coupling portion. The first wired portion, the first terminal portion and the first coupling portion are formed on the upper surface of the body. The second path has a second wired portion configured to be connected to a second core wire of the cable structure and a second terminal portion coupled to the second wired portion by a second coupling portion. The second wired portion is formed on the upper surface of the body. The second terminal portion is formed on the lower surface of the body.

A self-centering washer is positioned between a feedthrough and a filter circuit board. The washer has openings through which first and second terminal pins extend. A first opening has an inner arcuate portion contacting the first terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. A second opening has an inner arcuate portion contacting the second terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. In an imaginary configuration with the first and second washer openings superimposed one on top of the other, the cumulative arcuate distance of the inner arcuate portions about one of the terminal pins, subtracting overlap, results in a gap between the superimposed washer openings that is less than a diameter of the first and second terminal pins so that the washer is prevented from lateral movement.

The present application provides a packaging substrate and a communication device. The packaging substrate includes a packaging body, a first circuit layer, a second circuit layer, an electronic component and a moisture-proof structure. The packaging body includes a top surface and a bottom surface arranged opposite to each other, the first circuit layer is arranged on the top surface of the packaging body, and the second circuit layer is arranged on the bottom surface of the packaging body. The electronic component is packaged inside the packaging body. The moisture-proof structure is arranged in the packaging body and connected between the first circuit layer and the second circuit layer, and the moisture-proof structure surrounds the electronic component. The technical solution of the present application can prevent external water vapor from entering the interior of the packaging substrate from the peripheral side of the packaging substrate, and effectively prevent the failure of the packaging substrate due to moisture absorption.

A printed circuit board comprising a primary dielectric layer disposed underneath a microstrip trace and a secondary dielectric layer disposed above portions of the primary dielectric layer and the microstrip trace. The printed circuit board also includes a conductive plane disposed above the secondary dielectric layer and the microstrip trace, wherein the conductive plane is grounded.

The invention relates to the technical field of terminals, and discloses electronic equipment. The electronic equipment comprises a circuit board, an electromagnetic shielding assembly and a functional device. The circuit board is provided with a first board surface, and the first board surface comprises a wiring area. The electromagnetic shielding assembly is overlapped on the side, provided with the first plate face, of the circuit board and comprises conductive cloth, the conductive cloth is connected with the wiring area in an insulating mode, the orthographic projection area of the conductive cloth in a projection plane is a first projection area, and the projection plane is perpendicular to the overlapping direction of the electromagnetic shielding assembly and the circuit board. The functional device is arranged on one side, back to the circuit board, of the electromagnetic shielding assembly, and the orthographic projection area of the functional device in the projection plane is a second projection area. The first projection area does not coincide with the second projection area. According to the electronic equipment, the conductive cloth and the functional device are arranged in the projection plane in a staggered manner, so that the thickness space is effectively saved, and the overall thickness is reduced.

A switching power supply device includes a power conversion circuit including input and output capacitors, a switching element, and an inductor, and a common-mode choke coil that is between a DC power supply and the power conversion circuit and includes a core material around which first and second windings are linearly wound and aligned by being turned in one direction. The power conversion circuit and the common-mode choke coil constitute a noise equalization circuit that is an electric closed circuit including a low-frequency band blocking filter including an input capacitor and a mutual inductance of the common-mode choke coil, and a high-frequency band blocking filter including the mutual inductance and a stray capacitance of the common-mode choke coil. The noise equalization circuit cancels out noise generated by a switching operation of the switching element in each of a low-frequency band and a high-frequency band different from the low-frequency band.

A component carrier, including: i) a stack comprising at least one electrically conductive layer structure and / or at least one electrically insulating layer structure; ii) a first electronic switch component and a second electronic switch component embedded side-by-side in the stack; and iii) a capacitor device, electrically connected in parallel to the first electronic switch component and the second electronic switch component; wherein the capacitor device is assembled, in particular surface-mounted, to the stack, so that the first electronic switch component and the second electronic switch component are at least partially arranged below the capacitor device in a direction z, perpendicular to the directions of main extension x, y, of the component carrier.