1781results about "Cross-talk/noise/interference reduction" patented technology

A docking system is disclosed for an unmanned aerial vehicle (UAV). The docking system includes a base station that is configured to receive the UAV and a pedestal that is configured to support the base station in an elevated position. The pedestal defines an interior space that is configured in correspondence with an outer contour of the base station such that the base station is positionable within the pedestal to protect the base station during nonuse.

A network of Intermediate Device Structure (IDS) members communicatively coupled, mounted to elevated structure / s within urban settings, each configured to operate by a processor / controller with resident code, and in real time receive sensed environmental inputs from each IDS' vicinity, remote data / instruction / s processing the inputs with resident code parameters generating outputs that are configured to mitigate / avert intermittent environmental events harmful / hazardous to humans. The IDS's include a launch and charging pad that hosts a UAV, which patrols an area within communication range of at least one of the IDSs so the UAV, perhaps with AI-engine assistance, can detect events in the area patrolled by the UAV.

The invention discloses a stamp hole and LGA combined board card, and relates to the technical field of embedding. Comprising a core board and a bottom board, the bottom board is provided with a bonding pad corresponding to the core board in position, and the bonding pad is used for welding the core board and the bottom board; the core board comprises a board card body, and the board card body is provided with a plurality of stamp holes, a plurality of LGA packaging pads, a plurality of LGA special pads, a positioning hole and a shielding cover welding module. The mode of combining the stamp hole and the LGA is used as the connection mode of the core board, and the advantages of the stamp hole and LGA packaging are achieved at the same time.

The invention discloses an integration and optimization method of a multilayer circuit board in a photovoltaic inverter, and the method comprises at least seven layers of functional stacked structures which are an electromagnetic shielding layer, a power device layer, a first insulating dielectric layer, a control circuit layer, a second insulating dielectric layer, a heat dissipation substrate layer and a mechanical strengthening layer from top to bottom in sequence. Wherein the power device layer adopts a three-dimensional embedded packaging technology to integrate an IGBT module and a SiC MOSFET module, and a gate drive circuit of the power device layer is embedded into a first insulating dielectric layer in a coplanar waveguide structure; the heat dissipation substrate layer is provided with a micro-channel array with gradient apertures, and the inner wall of each micro-channel is subjected to anodic oxidation treatment to form an Al2O3 ceramic layer with the thickness of 20-50 microns.

There is provided an electronic device that is capable of restraining static electricity from flowing to electronic components mounted on the electronic device. A connector shield has an electrostatic protecting portion disposed along an opening of a fitting recess of a connector. The electrostatic protecting portion is positioned in a direction along a circuit board on which the connecter is mounted, rather than at least one of a plurality of signal terminals that the connector has.

Methods, systems, and apparatuses for grounding of integrated external electromagnetic interference (EMI) shields are provided. A portion of a module substrate, different from a circuit board substrate, may protrude past the module as a location for one or more grounding pads to which the EMI shield is grounded. The EMI shield may cover at least a portion of the thickness of the module substrate. The EMI shield may be comprised of one or more parts, which may be coupled to one another. The module substrate may include conductive vias. The EMI shield may include a sprayed and / or printed coating. The EMI shield may include a darkened coating.

The invention provides an embedded substrate and a manufacturing method thereof. The manufacturing method specifically comprises the following steps: forming a conduction copper column and a shielding copper column on a first circuit layer of the substrate; pressing a second dielectric layer on the first circuit layer, the conduction copper column and the shielding copper column; mounting a component on the second dielectric layer; pressing the component into the second dielectric layer to enable the shielding copper column and the first circuit layer to surround the component; pressing a fourth dielectric layer on the second dielectric layer and the component, and curing the second dielectric layer and the fourth dielectric layer; forming an outer circuit layer on the fourth dielectric layer; and the outer circuit layer is in conducting connection with the conducting copper column, the shielding copper column and the terminal of the component. The shielding copper columns can reduce the deviation of the component in the extrusion process of the component and improve the yield, five surfaces of the embedded component are all provided with metal copper, and a good electromagnetic shielding effect can be achieved. Moreover, the second dielectric layer and the fourth dielectric layer are made of high-thermal-conductivity materials, so that heat can be quickly guided into the shielding copper columns, and the heat dissipation effect is obviously improved.

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a charging interface, a first circuit board, a metal reinforcing piece and a support assembly. The first circuit board comprises a connecting end. The connecting end is provided with a grounding terminal. The connecting end is electrically connected with the charging interface. The metal reinforcing member and the connecting end are arranged in a stacked manner. The metal reinforcing member is electrically connected with the grounding terminal. The support assembly comprises a metal support and a conductive part. At least part of the connecting end is located in the metal support. The metal support comprises a main body part and a grounding part. The grounding part is electrically connected with the main body part. And the metal reinforcing piece and the main body part are electrically connected with the conductive piece respectively. The grounding part is used for grounding. According to the electronic equipment provided by the embodiment of the invention, the structural design difficulty is reduced, and the assembly difficulty and the production cost are reduced.

The embodiment of the invention provides a flexible circuit board and electronic equipment, relates to the technical field of signal transmission, and is used for relieving the problem of relatively high signal loss of an FPC (Flexible Printed Circuit) caused by electromagnetic shielding. The flexible circuit board may have a first region and a second region. A reference layer of the flexible circuit board is located in the first area, and the reference layer and the signal layer are stacked. The first shielding layer is located in the first area, and the first shielding layer is stacked on the side, away from the reference layer, of the signal layer. The second shielding layer is located in the second area, and the second shielding layer and the signal layer are stacked. The first grounding wire is electrically connected with the first shielding layer and the reference layer. The first grounding wire is also electrically connected with the second shielding layer. A backflow signal of a signal transmitted by the signal line in the signal layer can flow through the first grounding line from the second shielding layer in the second area, and respectively flows into the first shielding layer and the reference layer in the first area.

A connection body comprises a body having upper and lower surfaces, a first path and a second path. The first path has a first wired portion configured to be connected to a first core wire of a cable structure and a first terminal portion coupled to the first wired portion by a first coupling portion. The first wired portion, the first terminal portion and the first coupling portion are formed on the upper surface of the body. The second path has a second wired portion configured to be connected to a second core wire of the cable structure and a second terminal portion coupled to the second wired portion by a second coupling portion. The second wired portion is formed on the upper surface of the body. The second terminal portion is formed on the lower surface of the body.

The embodiment of the invention provides a circuit board and electronic equipment, relates to the technical field of signal transmission, and is used for solving the problem of signal crosstalk between different channels in the circuit board. A signal layer of the circuit board can comprise a first dielectric layer, a first grounding part and a second grounding part of two adjacent signal channels. The signal channel can comprise a transmission line arranged on the first dielectric layer, and a first grounding part and a second grounding part of the transmission line are located on the same side surface of the first dielectric layer to form a coplanar waveguide. The first grounding part and the second grounding part are located between the two adjacent signal channels and are arranged at intervals. The first grounding part and the second grounding part are used for providing different backflow paths to flow backflow signals of two adjacent signal channels, so that crosstalk between different backflow signals is reduced.

A gold finger connector and memory storage device having the same. The gold finger connector includes a connector body; a plurality of ground pins; and at least one signal shielding structures, disposed on a first ground pin of the plurality of ground pins, wherein the at least one first signal shielding structure is connected to the outside of a first side of an extension part of the first ground pin and electrically conducts at least two layers of the first ground pin.

A semiconductor package structure includes a substrate, a redistribution layer, a first semiconductor die, and a first capacitor. The substrate has a wiring structure. The redistribution layer is disposed over the substrate. The first semiconductor die is disposed over the redistribution layer. The first capacitor is disposed in the substrate and is electrically coupled to the first semiconductor die. The first capacitor includes a first capacitor substrate, a plurality of first capacitor cells, and a first through via. The first capacitor substrate has a first top surface and a first bottom surface. The first capacitor cells are disposed in the first capacitor substrate. The first through via is disposed in the first capacitor substrate and electrically couples the first capacitor cells to the wiring structure on the first top surface and the first bottom surface.

The invention provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a circuit board, a chip module and a heat dissipation piece, the chip module and the heat dissipation piece are stacked and arranged on the circuit board, the chip module and the circuit board are conducted through a solder ball, and the heat dissipation piece is in heat conduction connection with the chip module; the circuit board assembly further comprises heat-conducting glue and a heat-conducting piece, in the plane direction of the circuit board, a part of the heat-conducting glue is filled in the gap between the chip module and the circuit board and makes contact with the solder balls, the other part of the heat-conducting glue is located outside the chip module, and the heat-conducting piece extends in the thickness direction of the circuit board and makes contact with the solder balls. The heat-conducting piece is used for being in heat-conducting connection with the heat-dissipating piece and the other part of the heat-conducting glue. According to the circuit board assembly, through contact between the solder balls and the heat-conducting glue and contact between the heat-conducting glue and the heat-conducting piece, heat-conducting connection between the chip module and the heat-dissipating piece is achieved, thermal resistance between the chip module and the heat-dissipating piece is reduced through the heat-conducting piece and the heat-conducting glue, and therefore the heat-dissipating efficiency of the circuit board assembly is improved.

Various embodiments of a wireless connector system are described. The system has a transmitter module and a receiver module that are configured to wirelessly transmit electrical energy and / or data via near field magnetic coupling. The wireless connector system is designed to increase the amount of wirelessly transmitted electrical power over a greater separation distance. The system is configured with various sensing circuits that alert the system to the presence of the receiver module to begin transfer of electrical power as well as undesirable objects and increased temperature that could interfere with the operation of the system. The wireless connector system is a relatively small footprint that is designed to be surface mounted.

A retention mechanism is provided to couple a compression attached memory module (CAMM) to a printed circuit board (PCB). The retention mechanism includes a retention bracket and a retention spring. The retention bracket is soldered by a solder flange to the PCB and retains a CAMM connector within the retention bracket. The retention spring retains the CAMM and compresses the CAMM onto the CAMM connector and the PCB.

A multifunctional charging and data adapter includes a housing, a plurality of data transmission connection holes, a first circuit board, a second circuit board, a charging plug, a charging module and a flexible circuit board. The first circuit board is provided with at least one of the data transmission connection holes. The second circuit board is adjacent to the first circuit board and is provided with at least another of the data transmission connection holes. The charging plug and the charging module are configured to receive external electrical power via the charging plug and transmit the external power to at least one of the data transmission connection holes via the first or second circuit board. The flexible circuit board is configured to be electrically connected between the first and second circuit boards so as to provide an electrical signal transmission path between the first and second circuit boards.

A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

A high-frequency signal transmission line (102) is provided with: a resin laminate part in which first resin layers (11, 12, 13) and second resin layers (21, 22) are laminated; a signal conductor pattern (4) formed on the first resin layer (11); and ground conductor layers (51, 52) that face the signal conductor pattern across the resin laminate part. Opening portions are formed in the first resin layers (11, 12) at a position along the signal conductor pattern (4) in the resin laminate part so that a hollow portion (HP) is provided in the resin laminate part at the opening portions. The second resin layers (22) in contact with the first resin layers (11, 12) having the opening portions are provided with a maximum thickness and a minimum thickness that are different in the opening portions formed in the first resin layers so that the second resin layers in contact with the first resin layers are adhered to a part of end surfaces of the first resin layers (11, 12) at the opening portions.

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

An active compensation device including a first element group including an integrated sensing / compensation unit configured to generate a sensing signal corresponding to at least one of common-mode noise and differential-mode noise on at least two high-current paths, and a second element group including a compensation control unit including a negative impedance converter and configured to generate a compensation signal corresponding to the sensing signal and provide the compensation signal to the integrated sensing / compensation unit. The compensation control unit further including a stabilization unit configured to prevent oscillation caused by the sensed noise. The first element group and the second element group are mounted on a single substrate.

A layout of signal traces includes a first set of signal traces and a second set of signal traces that are used for transmitting a first differential signal and a second differential signal respectively. Each set of signal traces includes a first part, a second part, and a third part along the direction of signal transmission. Different parts of the same signal trace as a whole is not straight. All the first parts are in a first signal layer and parallel. The second parts of the two sets of signal traces are in a second signal layer and the first signal layer, respectively, and are across each other. The second part of the first / second set of signal traces is coupled with the first and third parts of the first / second set of signal traces. All the third parts are in the first signal layer and parallel.

The present disclosure provides a shield and an electronic assembly. The electronic assembly comprises a base plate and a chip located on the base plate. According to the embodiments of the present disclosure, the shield is plate-shaped; in the shield, a first cover cap is connected to side walls around a second cover cap, the first cover cap is used for electromagnetic shielding around the chip, electromagnetic radiation is refracted multiple times on an inner surface of the first cover cap, energy of the electromagnetic radiation is lost during the refraction process, radiation energy of the electromagnetic radiation coupled to the first cover cap is reduced, and radiation energy radiated out of the first cover cap is reduced, such that an electromagnetic shielding effect of the shield is good; in addition, the second cover cap is closer to the chip than the first cover cap, and the second cover cap and the chip absorb heat generated by the chip; and because the first cover cap is connected to the second cover cap, the first cover cap can also absorb energy in the chip. In conclusion, the shield achieves not only the effect of heat radiation but also the effect of electromagnetic shielding, and is thus beneficial to reduce costs.

A filter module includes a circuit board on or in which a ground electrode is provided, and a low pass filter on the circuit board. The low pass filter includes first and second inductors, and a capacitor. The first and second inductors are cumulatively connected to each other. Relationships of Lp+Lg−M≥0 and Lp−M<0 are satisfied, where Lp denotes an inductance of a path between a connection portion between the first and second inductors and a ground terminal, Lg denotes an inductance of a path between the ground terminal and the ground electrode, and M denotes a mutual inductance between the first and second inductors.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

The present disclosure relates to flexible printed circuit boards (FPCBs) for augmented reality (AR) eyewear. Disclosed examples provide an FPCB with air gaps for enhanced bending flexibility and an Electromagnetic Interference (EMI) film for consistent ground reference, enabling high-speed signal transmission with controlled impedance. The FPCB may include asymmetrical dielectric thicknesses and a crosshatch pattern in the ground reference layer to further support signal integrity and mechanical durability.

An inverter device includes: an interconnect substrate having a first interconnect layer and a second interconnect layer; and a plurality of transistors arranged in a middle layer, each having a source region and a drain region surrounding the source region on one face. The plurality of transistors include a first transistor placed with the one face facing the first interconnect layer and having a drain connected to a first interconnect in the first interconnect layer and a source connected to a second interconnect in the first interconnect layer. The first interconnect overlaps the drain region of the first transistor in planar view, and the second interconnect extends from the opening of the first interconnect to the position overlapping the source region of the first transistor in planar view.

The disclosure relates to a circuit board. A circuit board according to an embodiment of the disclosure may comprise a base layer positioned in a first portion of the circuit board and a second portion of the circuit board different from the first portion of the circuit board, a power line positioned in the first portion of the circuit board, a signal line positioned in the second portion of the circuit board, a shielding layer spaced apart from the power line and the signal line, and a cover layer disposed between the base layer and the shielding layer. The cover layer may include a cover base layer positioned in the first portion and the second portion of the circuit board, a conductive layer positioned in the first portion of the circuit board to correspond to the power line, and disposed between the cover base layer and the shielding layer, and an insulating layer positioned in the second portion of the circuit board to correspond to the signal line, and disposed between the cover base layer and the shielding layer.

Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed. Electronic modules are disclosed that include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged on or over the sub-modules. Bonding wires are disclosed that form one or more bonding wire walls along the substrate. The one or more bonding wire walls may be located between sub-modules of a module and about peripheral boundaries of the module. The electromagnetic shield may be electrically coupled to ground by way of the one or more bonding wire walls. Portions of the electromagnetic shield and the one or more bonding wire walls may form divider walls that are configured to reduce electromagnetic interference between the sub-modules or from external sources.