946results about "Cross-talk/noise/interference reduction" patented technology

The invention provides an embedded substrate and a manufacturing method thereof. The manufacturing method specifically comprises the following steps: forming a conduction copper column and a shielding copper column on a first circuit layer of the substrate; pressing a second dielectric layer on the first circuit layer, the conduction copper column and the shielding copper column; mounting a component on the second dielectric layer; pressing the component into the second dielectric layer to enable the shielding copper column and the first circuit layer to surround the component; pressing a fourth dielectric layer on the second dielectric layer and the component, and curing the second dielectric layer and the fourth dielectric layer; forming an outer circuit layer on the fourth dielectric layer; and the outer circuit layer is in conducting connection with the conducting copper column, the shielding copper column and the terminal of the component. The shielding copper columns can reduce the deviation of the component in the extrusion process of the component and improve the yield, five surfaces of the embedded component are all provided with metal copper, and a good electromagnetic shielding effect can be achieved. Moreover, the second dielectric layer and the fourth dielectric layer are made of high-thermal-conductivity materials, so that heat can be quickly guided into the shielding copper columns, and the heat dissipation effect is obviously improved.

The embodiment of the invention provides a flexible circuit board and electronic equipment, relates to the technical field of signal transmission, and is used for relieving the problem of relatively high signal loss of an FPC (Flexible Printed Circuit) caused by electromagnetic shielding. The flexible circuit board may have a first region and a second region. A reference layer of the flexible circuit board is located in the first area, and the reference layer and the signal layer are stacked. The first shielding layer is located in the first area, and the first shielding layer is stacked on the side, away from the reference layer, of the signal layer. The second shielding layer is located in the second area, and the second shielding layer and the signal layer are stacked. The first grounding wire is electrically connected with the first shielding layer and the reference layer. The first grounding wire is also electrically connected with the second shielding layer. A backflow signal of a signal transmitted by the signal line in the signal layer can flow through the first grounding line from the second shielding layer in the second area, and respectively flows into the first shielding layer and the reference layer in the first area.

A retention mechanism is provided to couple a compression attached memory module (CAMM) to a printed circuit board (PCB). The retention mechanism includes a retention bracket and a retention spring. The retention bracket is soldered by a solder flange to the PCB and retains a CAMM connector within the retention bracket. The retention spring retains the CAMM and compresses the CAMM onto the CAMM connector and the PCB.

A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

An active compensation device including a first element group including an integrated sensing / compensation unit configured to generate a sensing signal corresponding to at least one of common-mode noise and differential-mode noise on at least two high-current paths, and a second element group including a compensation control unit including a negative impedance converter and configured to generate a compensation signal corresponding to the sensing signal and provide the compensation signal to the integrated sensing / compensation unit. The compensation control unit further including a stabilization unit configured to prevent oscillation caused by the sensed noise. The first element group and the second element group are mounted on a single substrate.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

To improve isolation among a plurality of electronic components. A radio frequency module includes a mounting substrate, a first electronic component and a second electronic component, a metal member, a first metal layer, a resin layer, and a second metal layer. The metal member is disposed between the first electronic component and the second electronic component on a first main surface of the mounting substrate. The first metal layer is disposed on the first main surface of the mounting substrate. The second metal layer covers at least a part of the resin layer. The first metal layer has a ground potential, and is in contact with the second metal layer. The metal member is in contact with the first metal layer and the second metal layer.

A phased array antenna system includes a flexible printed circuit board formed of a flexible material. The flexible printed circuit board includes a component layer, an antenna layer, and a phase matching layer between the component layer and the antenna layer. A control unit is coupled to the component layer. A plurality of antenna elements are coupled to the antenna layer. A plurality of signal paths extend through the component layer, the phase matching layer, and the antenna layer. Each of the plurality of signal paths connects the control unit to a respective one of the plurality of antenna elements. The control unit provides an independent phase controllable source, which allows beams emitted from the antenna elements to be steered.

Disclosed are an automotive Ethernet circuit board and communications system, and a vehicle. The automotive Ethernet circuit board includes: a component placement layer, configured to carry a PHY chip and a control chip of the PHY chip; a plurality of signal wiring layers, configured to carry signal wiring between components in the component placement layer; and a signal shielding layer, located between the plurality of signal wiring layers and configured to prevent interference of a clock signal in the signal wiring. In the embodiments of the present application, a plurality of signal wiring layers are used for signal wiring between components, and a plurality of complete signal shielding layers are used to prevent interference of a clock signal in the wiring. The embodiments help reduce signal crosstalk between PCBs, prevent interference of a clock signal in signal wiring, and improve stability and consistency of a data communications system.

An FPC cable is provided that includes a first ground trace on a first side of an insulator substrate and a second ground trace on the first side of the insulator substrate spaced from the first ground trace. A plurality of signal lines are located between the first ground trace and the second ground trace. A ground reference layer is located on a second side of the insulator substrate, with the ground reference layer comprising a plurality of ground reference layer segments spaced from one another. Each of the ground reference layer segments is connected with a via to the first ground trace and the second ground trace.

A paddle card includes a printed circuit board (PCB), a shielded cable, and an electromagnetic interference (EM) shield. The PCB includes a first metal layer on a top surface of the PCB, a second metal layer within the PCB, and a cavity in the top surface of the PC. The cavity exposes the second metal layer. The first metal layer includes a first ground pad. The second metal layer includes a signal pad located within the cavity. The shielded cable includes a signal conductor coupled to the first signal pad. The EMI shield is coupled to the ground pad and covers the cavity.

A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.

An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.

The present application relates to the technical field of electrical performance test, in particular to a kind of printed board for cable test and cable test fixture, cable test fixture includes printed board for cable test, printed board for cable test is equipped with shielding slot, shielding slot has the extension section for the shielding layer exposed section of cable along its extension direction clamping, printed board is equipped with the signal contact conductor for the signal line exposed section of cable to be pressed in the interval of shielding slot, the slot wall of shielding slot is equipped with the shielding contact conductor for the shielding layer exposed section contact, shielding layer exposed section of cable is fixed and electrically contacted by using the clamping of shielding slot on printed board, shielding layer exposed section of cable does not need to be considered to be pressed, only signal line exposed section of cable needs to be pressed, it does not affect signal conduction, it is easy to operate, not prone to poor contact due to operation deviation, it is beneficial to guarantee the reliability of cable and printed board signal conduction and shielding conduction.

The invention discloses a stacked power module and a preparation method, and relates to the field of semiconductors, the power module comprises a metal radiator and circuit boards which are sequentially stacked above the metal radiator, and at least more than two layers of circuit boards are subjected to function conduction through arrangement of conductive columns and conductive through holes. A, the conductive columns are fixed at the input end and / or the output end of the bottom layer circuit board so as to meet the function conduction between the upper circuit board and the lower circuit board; b, the conductive through holes are correspondingly arranged right above the conductive columns, and the loop length is the shortest after the function is conducted; and c, vertically fixing the welded conductive columns on the bottom layer circuit board through a mold so as to meet the requirement that the upper ends of the conductive columns can be correspondingly assembled into the conductive through holes. According to the invention, innovative conductive column direct connection structure design and positioning design are adopted, and the problems of large size, poor integration level, tedious preparation process, difficulty in accurate assembly, relatively long loop, relatively large parasitic inductance, relatively high voltage peak and relatively large electromagnetic radiation of the existing module are solved.

Vehicle imaging device, comprising: • an image sensor (15), • a lens (1), • a printed circuit board (3), • a pin (21.1) comprising a ground connection and in electrical connection with the printed circuit board (3), • a housing (7, 8) comprising an inner cavity (12) enclosing at least the printed circuit board (3), the image sensor (15) and a portion of the pin (21.1) comprising a ground connection, • an electrically conductive element (30) located in electrical connection with the pin (21.1) comprising a ground connection, the electrically conductive element (30) being in electrical contact with the housing (7, 8) such that a closed electrical loop is formed among the printed circuit board (3), the pin (21.1) comprising a ground connection, the electrically conductive element (30), the housing (7, 8) and the printed circuit board (3).

The present disclosure discloses a microphone including a shell, a printed circuit board enclosing a cavity together with the shell, a first chip assembly located in the cavity, and a second chip assembly embedded and accommodated in the printed circuit board. The printed circuit board is a multilayer structure including a chip mounting layer, a first alignment layer, a plurality of shielding layers, a second alignment layer, and an SMT layer arranged in sequence, each of the plurality of shielding layers is connected with a grounding point of the printed circuit board and provided with an avoiding aperture running through it. Compared with the related art, the microphone disclosed by the present disclosure could avoid a heat generated by the operation of the first AISC chip and the second ASIC chip affecting the performance of other devices.

An optical transceiver is disclosed that implements smooth high frequency connection between a DSP and an optical module. The optical module may include an optical receiver module and an optical modulator module. The optical transceiver may include a single optical module in which functions of both the optical receiver and the optical modulator are integrated. The high frequency connection is implemented by a flexible circuit board (FPC), and the FPC electrically connects between a PAD on the upper surface of a DSP circuit board and a PAD of a package of the optical module. A connection PAD on one surface of the FPC is connected to the DSP circuit board side, and a connection PAD on the other surface is connected to the optical module side. A DSP chip may be mounted on the DSP circuit board, and the entire DSP may be covered with a lid except for a region of the DSP circuit board connected to the FPC.

Disclosed in the present invention is a filter circuit. A first PCB layer consists of a power line, a power interface, a second filter capacitor, and a first filter capacitor; the power line comprises a power supply network and a GND network; the second PCB layer is provided with a conductor plane; the power interface is connected to the GND network and is further connected to the conductor plane; the GND network, the second filter capacitor, and the conductor plane are sequentially connected; the power supply network, the first filter capacitor, and the conductor plane are sequentially connected. The circuit design of the circuit structure and the overall layout design idea in the present invention have a good suppression effect on common-mode noise, differential mode noise, radiation noise and conduction noise.

The invention relates to a PCB component (1) for a force feedback actuator (10) comprising a motor (5) of a steer-by-wire system (10) with a rotor position sensor unit (2), wherein the PCB component (1) has a phase connection (3) for the motor (5).

To provide a printed circuit board capable of reducing signal interference while maintaining a short distance between a plurality of wiring patterns.SOLUTION: The printed circuit board 100A includes a first insulating layer 111, a plurality of first wiring patterns 121 disposed on the first insulating layer and spaced apart from each other, a first insulating film 131 disposed on the first insulating layer and covering the plurality of first wiring patterns along surfaces of the plurality of first wiring patterns, a first metallic layer 141 covering the first insulating film along surfaces of the first insulating film, and a second insulating layer 112 covering the first metallic layer and filling at least a portion of spaces between the plurality of first wiring patterns.SELECTED DRAWING: Figure 3

The application discloses a manufacturing method of a ground performance metal-based circuit board for an intelligent networked automobile. According to design data, a substrate is manufactured, first drilling is performed, and carbon oil is filled, then first baking and curing are performed, a filling hole is formed, and a filling plate is formed on the whole plate; then polishing is performed, a ground circuit pattern is manufactured on the surface copper layer, and a metal-based circuit board is formed on the whole plate through subsequent processing; through the manufacturing method, the problem of hole wall cracking and separation caused by the thermal expansion and cold shrinkage difference of multi-layer materials of the substrate is effectively avoided in the method for forming a ground circuit by adopting an electroplating hole in the prior art; meanwhile, the complex processes such as copper deposition and copper plating required in electroplating are omitted, the processing flow is simplified, the carbon oil material cost is lower than that of silver paste and copper paste in the prior art, the material matching of the carbon oil with the circuit board body is better, the electrical connection between the ground circuit and the metal-based layer can be stably realized, and good ground performance is ensured.

A detector array for a radiation system includes a radiation detection sub¬ assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub¬ assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

The invention relates to the technical field of power panels, and particularly discloses a wide-voltage-input multi-output adaptive power panel which comprises a power mainboard, the power mainboard comprises a first printed board layer, a middle board layer and a second printed board layer from top to bottom, a wide-voltage-input circuit module is arranged on the first printed board layer, and a wide-voltage-output circuit module is arranged on the middle board layer. A multi-path output circuit module is arranged on the second printed board layer, and the multi-path output circuit module is electrically connected with the wide voltage input circuit module; soaking guide plates which are in contact with the wide voltage input circuit module and the multi-path output circuit module are respectively arranged in the first printed board layer and the second printed board layer, and a heat dissipation unit is also arranged in the middle board layer; the electromagnetic interference is reduced by physical isolation, and the voltage conversion precision is improved; and meanwhile, by combining the synergistic effect of the soaking guide plates and the heat dissipation units, heat is rapidly transferred to the phase change material of the middle plate layer through the heat conduction columns, and efficient heat diffusion and temperature balance are achieved.

Methods, systems, and devices for crosstalk cancellation for signal lines are described. In some examples, a device (e.g., a host device or a memory device) may generate a first signal and may invert the first signal to obtain an inverted first signal. The device may obtain a second signal based on attenuating a first range of frequencies of the inverted first signal and a second range of frequencies of the inverted first signal, where the first range of frequencies is below a first threshold frequency and the second range of frequencies is above a second threshold frequency that is greater than the first threshold frequency. The device may transmit the first signal via a first signal line of a set of signal lines and the second signal line via a second signal line of the set of signal lines.

The invention discloses a three-dimensional multilayer circuit board and a production process thereof, the circuit board comprises a power supply mainboard and high-frequency transformer winding integrated press-fit structure and a thick copper circuit layer, the power supply mainboard and the high-frequency transformer winding are both PCBs with at least two layers, the high-frequency transformer winding forms a three-dimensional structure through pre-forming processing, and the thick copper circuit layer is arranged between the high-frequency transformer winding and the power supply mainboard. The circuit alignment tolerance is controlled within 100 [mu] m, and copper foils or / and copper plates are laminated on the upper surface and the lower surface of the integrated structure to form thick copper circuit layers. According to the invention, integration of the two parts is realized, assembly gaps are eliminated, volume power density is improved, accurate butt joint of lines is guaranteed, stability and reliability are improved, large-current bearing capacity is enhanced, conversion efficiency is improved, heat resistance is reduced through thick copper heat dissipation, conversion energy efficiency is improved, electromagnetic shielding performance is optimized, interference is reduced, and copper usage amount is reduced. And the assembly process is simplified and the cost is reduced.

A differential transmission board set includes a mounting board on which a compression connector is mounted and a contact board configured to come into contact with the compression connector. In the contact board, a second conductor layer is a ground layer and has a penetrating hole. The penetrating hole is formed in such a way that a first signal pad and a second signal pad are both located inside an inner edge of the penetrating hole. In the contact board, the penetrating hole is formed to overlap an outer region of the first ground pad and an outer region of the second ground pad.

To provide a resin composition which can achieve high relative magnetic permeability in a low frequency band and is excellent in appearance when applied.SOLUTION: A resin composition comprising a thermosetting resin and an iron alloy-based magnetic powder, wherein when a non-volatile component of the resin composition is 100% by volume, (a) a content of the iron alloy-based magnetic powder having a particle diameter of more than 20 μm and 50 μm or less is 26% by volume or more and 45% by volume or less, (b) a content of the iron alloy-based magnetic powder having a particle diameter of more than 2 μm and 20 μm or less is 28% by volume or more and 68% by volume or less, and (c) a content of the iron alloy-based magnetic powder having a particle diameter of 2 μm or less is 1% by volume or more and 41% by volume or less.SELECTED DRAWING: Figure 1

A wiring board includes a wiring layer, a shield layer, and an insulating layer. The wiring layer includes at least one signal line and at least one ground line. The shield layer overlaps the wiring layer in plan view. The insulating layer is provided between the wiring layer and the shield layer. The insulating layer includes at least one end portion surrounded by the insulating layer. The at least one end portion is located on at least the at least one ground line. A connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.