1109results about "Cross-talk/noise/interference reduction" patented technology

Methods, systems, and apparatuses for grounding of integrated external electromagnetic interference (EMI) shields are provided. A portion of a module substrate, different from a circuit board substrate, may protrude past the module as a location for one or more grounding pads to which the EMI shield is grounded. The EMI shield may cover at least a portion of the thickness of the module substrate. The EMI shield may be comprised of one or more parts, which may be coupled to one another. The module substrate may include conductive vias. The EMI shield may include a sprayed and / or printed coating. The EMI shield may include a darkened coating.

The invention provides an embedded substrate and a manufacturing method thereof. The manufacturing method specifically comprises the following steps: forming a conduction copper column and a shielding copper column on a first circuit layer of the substrate; pressing a second dielectric layer on the first circuit layer, the conduction copper column and the shielding copper column; mounting a component on the second dielectric layer; pressing the component into the second dielectric layer to enable the shielding copper column and the first circuit layer to surround the component; pressing a fourth dielectric layer on the second dielectric layer and the component, and curing the second dielectric layer and the fourth dielectric layer; forming an outer circuit layer on the fourth dielectric layer; and the outer circuit layer is in conducting connection with the conducting copper column, the shielding copper column and the terminal of the component. The shielding copper columns can reduce the deviation of the component in the extrusion process of the component and improve the yield, five surfaces of the embedded component are all provided with metal copper, and a good electromagnetic shielding effect can be achieved. Moreover, the second dielectric layer and the fourth dielectric layer are made of high-thermal-conductivity materials, so that heat can be quickly guided into the shielding copper columns, and the heat dissipation effect is obviously improved.

The embodiment of the invention provides a flexible circuit board and electronic equipment, relates to the technical field of signal transmission, and is used for relieving the problem of relatively high signal loss of an FPC (Flexible Printed Circuit) caused by electromagnetic shielding. The flexible circuit board may have a first region and a second region. A reference layer of the flexible circuit board is located in the first area, and the reference layer and the signal layer are stacked. The first shielding layer is located in the first area, and the first shielding layer is stacked on the side, away from the reference layer, of the signal layer. The second shielding layer is located in the second area, and the second shielding layer and the signal layer are stacked. The first grounding wire is electrically connected with the first shielding layer and the reference layer. The first grounding wire is also electrically connected with the second shielding layer. A backflow signal of a signal transmitted by the signal line in the signal layer can flow through the first grounding line from the second shielding layer in the second area, and respectively flows into the first shielding layer and the reference layer in the first area.

A retention mechanism is provided to couple a compression attached memory module (CAMM) to a printed circuit board (PCB). The retention mechanism includes a retention bracket and a retention spring. The retention bracket is soldered by a solder flange to the PCB and retains a CAMM connector within the retention bracket. The retention spring retains the CAMM and compresses the CAMM onto the CAMM connector and the PCB.

A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

An active compensation device including a first element group including an integrated sensing / compensation unit configured to generate a sensing signal corresponding to at least one of common-mode noise and differential-mode noise on at least two high-current paths, and a second element group including a compensation control unit including a negative impedance converter and configured to generate a compensation signal corresponding to the sensing signal and provide the compensation signal to the integrated sensing / compensation unit. The compensation control unit further including a stabilization unit configured to prevent oscillation caused by the sensed noise. The first element group and the second element group are mounted on a single substrate.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

An inverter device includes: an interconnect substrate having a first interconnect layer and a second interconnect layer; and a plurality of transistors arranged in a middle layer, each having a source region and a drain region surrounding the source region on one face. The plurality of transistors include a first transistor placed with the one face facing the first interconnect layer and having a drain connected to a first interconnect in the first interconnect layer and a source connected to a second interconnect in the first interconnect layer. The first interconnect overlaps the drain region of the first transistor in planar view, and the second interconnect extends from the opening of the first interconnect to the position overlapping the source region of the first transistor in planar view.

Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed. Electronic modules are disclosed that include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged on or over the sub-modules. Bonding wires are disclosed that form one or more bonding wire walls along the substrate. The one or more bonding wire walls may be located between sub-modules of a module and about peripheral boundaries of the module. The electromagnetic shield may be electrically coupled to ground by way of the one or more bonding wire walls. Portions of the electromagnetic shield and the one or more bonding wire walls may form divider walls that are configured to reduce electromagnetic interference between the sub-modules or from external sources.

To improve isolation among a plurality of electronic components. A radio frequency module includes a mounting substrate, a first electronic component and a second electronic component, a metal member, a first metal layer, a resin layer, and a second metal layer. The metal member is disposed between the first electronic component and the second electronic component on a first main surface of the mounting substrate. The first metal layer is disposed on the first main surface of the mounting substrate. The second metal layer covers at least a part of the resin layer. The first metal layer has a ground potential, and is in contact with the second metal layer. The metal member is in contact with the first metal layer and the second metal layer.

A phased array antenna system includes a flexible printed circuit board formed of a flexible material. The flexible printed circuit board includes a component layer, an antenna layer, and a phase matching layer between the component layer and the antenna layer. A control unit is coupled to the component layer. A plurality of antenna elements are coupled to the antenna layer. A plurality of signal paths extend through the component layer, the phase matching layer, and the antenna layer. Each of the plurality of signal paths connects the control unit to a respective one of the plurality of antenna elements. The control unit provides an independent phase controllable source, which allows beams emitted from the antenna elements to be steered.

There is provided a printed wiring board including an outermost conductive layer that includes a plurality of conductive pads, a first conductive layer that includes a first inner-layer wiring and is stacked on the conductive layer, a second conductive layer that includes a second inner-layer wiring and is stacked on the conductive layer and the first conductive layer, a first signal via that connects one of the conductive pads and the first inner-layer wiring with each other, a second signal via connecting another one of the conductive pads and the second inner-layer wiring with each other, and a stitching via that is connected to a ground. The first inner-layer wiring and the second inner-layer wiring form a common wiring route in which the first inner-layer wiring and the second inner-layer wiring are stacked and disposed in a connection area in which the conductive pads are arranged.

The invention provides a PCB optimization method for video analog signal transmission. The problems of signal integrity, electromagnetic interference and impedance matching of analog signals in traditional PCB design are solved. The method comprises the following steps: arranging analog signals and digital signals in a layered manner by adopting a four-layer plate design; arranging an independent grounding plane on the analog signal layer, and connecting the independent grounding plane to the main grounding layer through grounding via holes with the diameter of 0.3 mm and the spacing of not more than 5mm; a shielding layer is added to a key signal path; linear path layout is adopted according to the signal flow direction, and the distance between key components is controlled within 30 mm; uniform line width is kept, standard definition video signals are 8mil, high definition video signals are 10mil, and corners of signal lines are in 45-degree dip angle or circular arc transition. Compared with the traditional design, the PCB designed by the method has the advantages that the video signal noise is reduced by more than 15dB, the image quality is remarkably improved, the system stability is greatly enhanced, and the PCB is particularly suitable for application scenes such as medical imaging equipment, high-definition monitoring systems and professional video processing equipment.

A power module having a first integrated power board having a first positive terminal, a first power semiconductor die, a first middle point terminal, a second power semiconductor die and a first negative terminal, a second integrated power board having a second positive terminal, another first power semiconductor die, a second middle point terminal, another second power semiconductor die and a second negative terminal, a PCB busbar having opposite first face and second face and having power conductive tracks and connection pads, on both said first face and said second face, wherein said first integrated power board has its first positive terminal, first middle point terminal and first negative terminal connected to connection pads on said first face, wherein said second integrated power board has its first positive terminal, first middle point terminal and first negative terminal connected to further connection pads on said second face.

Disclosed are an automotive Ethernet circuit board and communications system, and a vehicle. The automotive Ethernet circuit board includes: a component placement layer, configured to carry a PHY chip and a control chip of the PHY chip; a plurality of signal wiring layers, configured to carry signal wiring between components in the component placement layer; and a signal shielding layer, located between the plurality of signal wiring layers and configured to prevent interference of a clock signal in the signal wiring. In the embodiments of the present application, a plurality of signal wiring layers are used for signal wiring between components, and a plurality of complete signal shielding layers are used to prevent interference of a clock signal in the wiring. The embodiments help reduce signal crosstalk between PCBs, prevent interference of a clock signal in signal wiring, and improve stability and consistency of a data communications system.

An FPC cable is provided that includes a first ground trace on a first side of an insulator substrate and a second ground trace on the first side of the insulator substrate spaced from the first ground trace. A plurality of signal lines are located between the first ground trace and the second ground trace. A ground reference layer is located on a second side of the insulator substrate, with the ground reference layer comprising a plurality of ground reference layer segments spaced from one another. Each of the ground reference layer segments is connected with a via to the first ground trace and the second ground trace.

A paddle card includes a printed circuit board (PCB), a shielded cable, and an electromagnetic interference (EM) shield. The PCB includes a first metal layer on a top surface of the PCB, a second metal layer within the PCB, and a cavity in the top surface of the PC. The cavity exposes the second metal layer. The first metal layer includes a first ground pad. The second metal layer includes a signal pad located within the cavity. The shielded cable includes a signal conductor coupled to the first signal pad. The EMI shield is coupled to the ground pad and covers the cavity.

A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.

An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.

A voltage regulator module is provided. The voltage regulator module includes a circuit board assembly and a magnetic core assembly. The circuit board assembly includes a printed circuit board and at least one switch element. The printed circuit board comprises an upper surface, a lower surface, an inner layer and a plurality of conductive portions. The upper surface and the lower surface are opposite to each other. The inner layer is embedded within the printed circuit board. A plurality of conductive portions are electrically connected between the upper surface and the lower surface of the printed circuit board. The at least one switch element is disposed on the upper surface of the printed circuit board. The magnetic core assembly is disposed in the inner layer.

The present application relates to the technical field of electrical performance test, in particular to a kind of printed board for cable test and cable test fixture, cable test fixture includes printed board for cable test, printed board for cable test is equipped with shielding slot, shielding slot has the extension section for the shielding layer exposed section of cable along its extension direction clamping, printed board is equipped with the signal contact conductor for the signal line exposed section of cable to be pressed in the interval of shielding slot, the slot wall of shielding slot is equipped with the shielding contact conductor for the shielding layer exposed section contact, shielding layer exposed section of cable is fixed and electrically contacted by using the clamping of shielding slot on printed board, shielding layer exposed section of cable does not need to be considered to be pressed, only signal line exposed section of cable needs to be pressed, it does not affect signal conduction, it is easy to operate, not prone to poor contact due to operation deviation, it is beneficial to guarantee the reliability of cable and printed board signal conduction and shielding conduction.

The present invention relates to a Harness PCB that replaces the traditional wiring harness used in a pinball machine. The Harness PCB comprises circuit traces, connectors for all playfield components, LED assemblies, and connectors for device boards. The Harness PCB is attached to the bottom of the playfield and may comprise a single PCB or multiple interconnected PCBs. All playfield components, cabinet components, device boards, and LEDs are connected to the Harness PCB in such a manner that all components that may fail during normal operation are both modular and replaceable. The Harness PCB can be replicated by connecting the device boards directly to breakout boards to create an identical software and hardware environment as the full Harness PCB.

A base station for an unmanned aerial vehicle (UAV) is disclosed that includes: an enclosure defining an internal cavity that is configured to receive the UAV; a door that is movably connected to the enclosure; actuators that extend between the door and the enclosure to facilitate opening and closure of the door; a cradle that is configured to receive the UAV and which is movable in relation to the enclosure such that the cradle is repositionable between a retracted position and an extended position to facilitate movement of the UAV into and out of the enclosure; and engagement members that are secured to the actuators and which are configured for contact with propeller assemblies on the UAV to facilitate folding of the propeller assemblies during movement of the UAV into the enclosure.

An inverter device includes: an interconnect substrate having a first interconnect layer and a second interconnect layer; and a plurality of transistors arranged in a middle layer, each having a source on one face and a drain on the other face. The plurality of transistors include a first transistor placed with the one face facing the first interconnect layer and a second transistor placed with the other face facing the first interconnect layer, and the source of the first transistor and the drain of the second transistor are connected through a first interconnect in the first interconnect layer.

The invention discloses a stacked power module and a preparation method, and relates to the field of semiconductors, the power module comprises a metal radiator and circuit boards which are sequentially stacked above the metal radiator, and at least more than two layers of circuit boards are subjected to function conduction through arrangement of conductive columns and conductive through holes. A, the conductive columns are fixed at the input end and / or the output end of the bottom layer circuit board so as to meet the function conduction between the upper circuit board and the lower circuit board; b, the conductive through holes are correspondingly arranged right above the conductive columns, and the loop length is the shortest after the function is conducted; and c, vertically fixing the welded conductive columns on the bottom layer circuit board through a mold so as to meet the requirement that the upper ends of the conductive columns can be correspondingly assembled into the conductive through holes. According to the invention, innovative conductive column direct connection structure design and positioning design are adopted, and the problems of large size, poor integration level, tedious preparation process, difficulty in accurate assembly, relatively long loop, relatively large parasitic inductance, relatively high voltage peak and relatively large electromagnetic radiation of the existing module are solved.

A power module includes a power circuit board, a signal pin, a shielding substrate, and an electrically insulating component. The signal pin is disposed and stands on the power circuit board. The shielding substrate is located above the power circuit board and spaced apart from the power circuit board. The shielding substrate has a first through hole. The signal pin is disposed through the first through hole. The electrically insulating component surrounds the signal pin. The electrically insulating component has a second through hole. The signal pin is disposed through the second through hole. The signal pin is spaced apart from the shielding substrate by a distance by the electrically insulating component.

Vehicle imaging device, comprising: • an image sensor (15), • a lens (1), • a printed circuit board (3), • a pin (21.1) comprising a ground connection and in electrical connection with the printed circuit board (3), • a housing (7, 8) comprising an inner cavity (12) enclosing at least the printed circuit board (3), the image sensor (15) and a portion of the pin (21.1) comprising a ground connection, • an electrically conductive element (30) located in electrical connection with the pin (21.1) comprising a ground connection, the electrically conductive element (30) being in electrical contact with the housing (7, 8) such that a closed electrical loop is formed among the printed circuit board (3), the pin (21.1) comprising a ground connection, the electrically conductive element (30), the housing (7, 8) and the printed circuit board (3).

The present disclosure discloses a microphone including a shell, a printed circuit board enclosing a cavity together with the shell, a first chip assembly located in the cavity, and a second chip assembly embedded and accommodated in the printed circuit board. The printed circuit board is a multilayer structure including a chip mounting layer, a first alignment layer, a plurality of shielding layers, a second alignment layer, and an SMT layer arranged in sequence, each of the plurality of shielding layers is connected with a grounding point of the printed circuit board and provided with an avoiding aperture running through it. Compared with the related art, the microphone disclosed by the present disclosure could avoid a heat generated by the operation of the first AISC chip and the second ASIC chip affecting the performance of other devices.

An inverter device includes: an interconnect substrate with a first interconnect layer formed on a surface; a plurality of transistors embedded in the interconnect substrate; a first capacitor provided between a first power line and a ground line in the first interconnect layer; and a second capacitor provided between the ground line and a second power line in the first interconnect layer. In the first interconnect layer, the ground line is provided between the first power line provided at the position overlapping the first transistor and the second power line provided at the position overlapping the second transistor in planar view.