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11303results about "Magnetic/electric field screening" patented technology

Noncontact electric power receiving device, noncontact electric power transmitting device, noncontact electric power feeding system, and electrically powered vehicle

A first shielding box is disposed so that its first surface can be opposite to an electric power feeding unit. The first surface has an opening and remaining five surfaces thereof reflect, during reception of electric power from the electric power feeding unit, a resonant electromagnetic field (near field) generated in the surroundings of the electric power receiving unit. The electric power receiving unit is provided in the first shielding box to receive the electric power from the electric power feeding unit via the opening (first surface) of the first shielding box. A second shielding box has a similar configuration, i.e., has a second surface with an opening and remaining five surfaces thereof reflect the resonant electromagnetic field (near field) generated in the surroundings of the electric power feeding unit.
Owner:TOYOTA JIDOSHA KK

Non-optical signal isolator

A non-optical isolator having a driver circuit for providing an input signal to one or more first passive components which are coupled across a galvanic isolation barrier to one or more corresponding second passive components, and an output circuit that converts the signal from the second passive components to an output signal corresponding to the input signal. The entire structure may be formed monolithically as an integrated circuit on one or two die substrates, for low cost, small size, and low power consumption. The passive components may be coils or capacitor plates, for example. When the first and second passive components are capacitor plates, a Faraday shield may be provided between them, with the first and second passive components being referenced to separate grounds and the Faraday shield referenced to the same ground as the second passive components.
Owner:ANALOG DEVICES INC

Portable electronic device with two-piece housing

Portable electronic devices are provided. Each device may be formed from two parts. A first part may be provided with components such as a display, a touch screen, a cover glass, and a frame. A second part may be provided with a plastic housing, circuit boards containing electrical components, and a bezel. Engagement members may be connected to the first and second parts. The engagement members may be formed from metal clips with holes and springs with flexible spring prongs that mate with the holes in the clips. The metal clips may be welded to frame struts on the frame and the springs may be welded to the bezel. During assembly, the first part may be rotated into place within the second part. Retention clips attached to the frame may be used to secure the two parts together. Assembly instructions and associated connector numbers may be provided within the devices.
Owner:APPLE INC

Removable small form factor fiber optic transceiver module and electromagnetic radiation shield

An easily removable modular optical signal transceiver unit for conversion between modulated light signal transmission and electronic data signals and which conforms to the Small Form Factor standard for transceiver interfaces is disclosed. The structural details of its chassis include aspects which insure the proper positioning of electronic circuit boards of a transmitter optical subassembly and a receiver optical subassembly as well as the positioning of electromagnetic radiation shielding on the chassis. In conjunction with an interface device on an electronic circuit board of a host device, the chassis supports electromagnetic radiation shielding which substantially encloses the sources of electromagnetic radiation within the module and suppresses the escape of electromagnetic radiation, thereby preventing electromagnetic interference with sensitive components and devices in proximity to the module.
Owner:LUMENTUM OPERATIONS LLC

Stacked SFP connector and cage assembly

An electrical connector assembly is shown having a stamped and formed shielded cage having a plurality of ports for receiving SFP modules. The cages have an opening extending through a lower face thereof for receiving a header connector having first and second extensions which are aligned with the first and second columnar ports in the cage. Thus, the SFP modules are pluggable into individual ports, whereby two modules are interconnected to a single header connector interconnected to a motherboard.
Owner:TYCO ELECTRONICS LOGISTICS AG (CH)

Printed circuit board with capacitors connected between ground layer and power layer patterns

A printed circuit board is disclosed. A top layer power supply pattern and a top layer ground pattern are formed. The top layer power supply pattern and the top layer ground pattern are connected to a power supply layer and a ground layer through a plurality of viaholes, respectively. A plurality of capacitors or a plurality of capacitor resistor series circuits are disposed at predetermined intervals between the top layer power supply pattern and the top layer ground pattern.
Owner:NEC CORP

Packaged microelectronic component assemblies

Various aspects of the invention provide microelectronic component assemblies, memory modules, computer systems, and methods of assembling microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a non-leaded first package, a second package, and a plurality of electrical junctions. The first package has a confronting surface that includes an exposed back surface of a microelectronic component and exposed contact surfaces. The second package has a confronting surface that includes an exposed back surface of a microelectronic component and exposed contact surfaces of a number of leads. Each of the junctions couples one of the contacts to the contact surface of one of the leads. The electrical junctions may also physically support the packages with their respective confronting surfaces juxtaposed with but spaced from one another, defining a peripherally open fluid passage and enhancing thermal performance.
Owner:MICRON TECH INC

EMI feedthrough filter terminal assembly utilizing hermetic seal for electrical attachment between lead wires and capacitor

ActiveUS6888715B2Reliable electrical attachmentAnti-noise capacitorsElectrotherapyHermetic sealEngineering
EMI feedthrough filter terminal assembly includes a feedthrough filter capacitor having first and second sets of electrode plates, and a first passageway having a first termination surface conductively coupling the first set of electrode plates. At least one lead wire extends through the first passageway and is conductively attached to a first oxide resistant conductive pad. The first pad is conductively coupled to the first termination surface independently of the lead wire. The terminal assembly may also include a conductive ferrule through which the lead wire passes in non-conductive relation, and an insulator fixed to the ferrule for conductively isolating the lead wire from the ferrule. The ferrule and insulator form a pre-fabricated hermetic terminal pin sub-assembly. The capacitor may include a second passageway having a second termination surface conductively coupling the second set of electrode plates, and a conductive ground lead extending therethrough.
Owner:WILSON GREATBATCH LTD

Conformal electromagnetic interference shield

An electromagnetic shield for an electronic module includes a surface finish that is applied to the surface of an electronic module so as to minimize the size of the shield. Once the shield is in place, the shield acts to address electromagnetic interference (EMI) concerns associated with the electronic module. An electronic module having a ring of conductive material embedded about its peripheral edge is formed. The electronic module is then sub-diced so as to expose the ring of conductive material. After sub-dicing, a conductive material may be applied through an electroless plating process followed by an electrolytic plating process. Alternatively, a conductive epoxy may be sprayed or painted onto the surface of the electronic module.
Owner:QORVO US INC

Foldable display apparatus

ActiveUS9173287B1Maintain bending areaMinimizes bending stressCircuit bendability/stretchabilityMagnetic/electric field screeningDisplay deviceEngineering
Disclosed is a foldable display apparatus which can stably maintain a bending curvature of a folded flexible display, and can maintain a bending area of an unfolded flexible display in a plane state. The foldable display apparatus includes a link assembly connected between first and second housings to support a bending area of a display panel, and configured to guide bending of the bending area. The link assembly includes a plurality of bending guide members configured to support the bending area, a plurality of link parts connected to both ends of each of the plurality of bending guide members, and a plurality of link connecting members respectively provided between the plurality of link parts, and configured to connect two adjacent link parts.
Owner:LG DISPLAY CO LTD

Magnetic and electric shielding of on-board devices

Improved electromagnetic compatibility for integrated motherboard or device board designs is provided by magnetic shielding, electric shielding, or both integrated into the chip packaging materials. Motherboard emissions may be reduced by use of the shielding. A nonconductive primary and tertiary layer sandwich a high-conductivity metal secondary layer forming a Faraday cage for electric field shielding. A nonconductive primary layer is covered by a tertiary layer formed of a composite having permeable material for magnetic shielding. The tertiary layer formed of a composite could include a high permeability particulate ferrous material. Both the secondary layer and the tertiary layer formed of a composite could be used for both electric and magnetic shielding of chips.
Owner:INTEL CORP

Heat Sink Riveted to Memory Module with Upper Slots and Open Bottom Edge for Air Flow

A memory module has a two-plate heat sink attached by rivets. A front plate contacts the flat surfaces of memory chips on a front surface of the module printed-circuit board (PCB) substrate, while another back plate contacts chips on the back surface of the substrate. The plates contact the substrate along the top edge opposite the connector edge, and along the upper half of the substrate's side edges. Holes in the substrate allow for rivets or other fasteners to pass through to firmly attach the plates to the substrate, prevent wobble. Four top-edge slots are cut in the plates near the top edge, between the rivets along the top edge. The top-edge slots allow air to flow underneath the plates, in small gaps between memory chips, and between the plate and the substrate. The added air flow underneath the plates helps cool the heat-sink plates, reduce hot spots and failures.
Owner:SUPER TALENT ELECTRONICS

Heat sink subassembly

A heat sink subassembly may include a retainer comprising several attachment points, a heat sink coupled to the retainer, and a force-generating device. The heat sink includes several fins, one of which is shorter than the other fins. The force-generating device is coupled to at least one of the attachment points and to the first fin. The force-generating device is configured to exert a force that keeps the heat sink securely coupled to the retainer when the force-generating device is coupled to the attachment points.
Owner:GLOBALFOUNDRIES US INC

Radiation Redirecting External Case For Portable Communication Device and Antenna Embedded In Battery of Portable Communication Device

An advanced antenna or set of antennae for a wireless device is provided by embedding the antennae into the battery case or generally the largest surface area of a wireless phone. The antenna connections are made through the battery's connections to the wireless device. The antenna design can be compact and located in any area of the battery. The antenna design can be thin and flat, located at the back surface of the battery or the large rear surface of a wireless phone, facing away from the user. An RF shielding device can be embedded into the battery and configured in relation to the antenna such that the RF field intensity and the consequent specific absorption rate for the user is lowered while the outgoing signals of the wireless device remain fully adequate for the function of the wireless device. This feature is preserved for a multi-band operation because a digital phase shifter is used between two radiating antennae. An external case is used as a complement to the wireless phone to provide additional antennae, power and capability.
Owner:PENUMBRA BRANDS LLC

High frequency component, communication apparatus, and method for measuring characteristics of high frequency component

A high frequency component is constructed such that the characteristics of a high frequency circuit that cannot be measured only by an outwardly extending terminal electrode are easily measured at the final-product stage. In the high frequency component, a substrate has an electrode pattern provided including a signal measuring electrode pad. Additionally, chip components are mounted on the substrate. A metal cover has a hole provided near the signal measuring electrode pad. Through the hole, a probe of a measuring apparatus is inserted from the outside to abut with the electrode pad. With the arrangement, a voltage signal obtained at a predetermined point of the high frequency circuit is measured.
Owner:MURATA MFG CO LTD

Circuit and method for broadband switching noise suppression in multilayer printed circuit boards using localized lattice structures

InactiveUS20050205292A1Eliminate power plane resonanceImproved RF isolationMagnetic/electric field screeningCross-talk/noise/interference reductionBroadbandNoise suppression
An apparatus for suppressing noise in an electronic device includes a multiple layer structure in which localized arrays of chip capacitors and / or patches around sources of electromagnetic waves are used. The PCB includes multiple conductive layers at different potentials, dielectric layers separating the conductive layers, conductive rods extending between at least two of the conductive layers, and a layer of patches disposed adjacent or on one or more of the conductive layers. The conductive rods are connected to one of the conductive layers and chip capacitors connect the conductive rods to another of the conductive layers. A particular location can be effectively isolated from noise using a few unit cells of an array of patches / capacitors partially or completely surrounding the particular location.
Owner:ETENNA

LED display module

An LED display module having features for improvement over prior art devices by providing novel features for improved LED visibility, improved weather and climatological sealing, improved electromagnetic interference (EMI) suppression, improved heat dissipation, and improved airflow.
Owner:DAKTRONICS

Nanomagnetically shielded substrate

A shielded substrate assembly that contains a magnetic shield with a layer of magnetic shielding material; the magnetic shield has a magnetic shielding factor of at least about 0.5. The magnetic shield contains nanomagnetic material nanomagnetic material with a mass density of at least about 0.01 grams per cubic centimeter, a saturation magnetization of from about 1 to about 36,000 Gauss, a coercive force of from about 0.01 to about 5,000 Oersteds, a relative magnetic permeability of from about 1 to about 500,000, and an average particle size of less than about 100 nanometers. The nanomagnetic material contains magnetic material with a coherence length of from about 0.1 to about 100 nanometers.
Owner:BIOPHAN TECH

Handheld computing device

A handheld computing device is disclosed. The handheld computing device includes a seamless enclosure formed from an extruded tube. The extruded tube includes open ends and internal rails which serve as a guide for slidably assembling an operational assembly through the open ends of the extruded tube, a reference surface for positioning the operational assembly relative to an access opening in the seamless enclosure, and a support structure for supporting the operational assembly during use.
Owner:APPLE INC

Substrate for reducing electromagnetic interference and enclosure

A substrate for reducing electromagnetic emissions is provided. The substrate may include a plurality of ground layers, signal layers and power layers. All of the layers other than the ground layer are provided with a ground ring that may extend around the perimeter of the layer. The ground rings are electrically coupled together by ground stitching or vias that are randomly spaced. The random spacing of the ground stitching is based on the operating frequencies of the integrated circuit devices mounted on the substrate. Additional shielding may be provided by providing a cover assembly made of any conductive material that is coupled to the exposed ground rings on the uppermost and lowermost surfaces of the substrate. The cover assembly is coupled to the exposed ground rings in a randomized pattern. The device provides a virtual electrical ground cage in which the internal signal layers are totally enclosed, thereby reducing electromagnetic emissions.
Owner:INTEL CORP
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