653results about "Circuit bendability/stretchability" patented technology

The invention discloses a printed circuit stiffening plate processing device which comprises a bottom plate, a shell is fixedly connected to the middle of the upper end of the bottom plate, symmetrical moving grooves are formed in the upper end of the shell, moving blocks used for centering and positioning a stiffening plate are slidably connected to inner cavities of the moving grooves, and a placement table is arranged in the middle of the upper end of the shell. And a piston is vertically and slidably connected to the middle of an inner cavity of the placement table, a driving mechanism is arranged below the placement table, and when the driving mechanism rotates clockwise, the piston moves downwards after the moving block is driven to be close to the reinforcing plate. Under the action of elasticity, the connecting plate can synchronously get close to the position of the placement table, at the moment, the connecting plate can drive the positioning rod to synchronously get close to the position where the stiffening plate is located, and even if the shape of the stiffening plate is irregular and the position state of the stiffening plate is inclined during placement, the stiffening plate can be elastically clamped and centered through the positioning rod; and the thin reinforcing plate is prevented from warping under the action of clamping force.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

The embodiment of the invention provides a flexible circuit board assembly, a rotating shaft assembly and foldable electronic equipment, and belongs to the technical field of electronic equipment, a flexible circuit board is arranged on a rotating shaft in a penetrating mode through a through hole in the rotating shaft, a first adsorption part is connected with a second adsorption part in the through hole in an adsorption mode, and a clamping part is matched with the rotating shaft in a clamping mode. High limiting fastness of the flexible circuit board is achieved, the problem that the flexible circuit board falls off in scenes such as falling is solved, and the risk of breakage of the rotating shaft is reduced. The first adsorption part and the second adsorption part are located on the same side of the flexible circuit board, so that the thickness space occupied by the adsorption parts in the rotating shaft is reduced, the strength of the rotating shaft is improved, and the breakage risk of the rotating shaft in scenes such as falling is reduced under the condition of high adsorption effect. Moreover, the clamping part is detachably connected with the rotating shaft in a clamping manner, and the first adsorption part and the second adsorption part can be separated under the action of external force, so that the flexible circuit can be conveniently detached from the rotating shaft, and the detachment in the scenes of repair and the like is facilitated.

A wiring module is attached to a plurality of power storage elements, and includes: a flexible printed circuit board; and a protector holding the flexible printed circuit board, wherein the flexible printed circuit board includes a base film, a plurality of conduction paths that are disposed on a surface of the base film, and a connector that has an opposing surface opposing the surface of the base film and that is connected to the plurality of conduction paths, the plurality of conduction paths and electrode terminals of the plurality of power storage elements are electrically connected, the connector includes connection portions that are connected to the plurality of conduction paths, and at least some of the plurality of conduction paths are routed from the connection portions through a space between the surface of the base film and the opposing surface of the connector.

The invention provides a rigid-flex board 3D steel sheet reinforced press-fit structure. The rigid-flex board 3D steel sheet reinforced press-fit structure comprises a first press-fit auxiliary material, a second press-fit auxiliary material, a lower alignment jig, a laminated structure, an upper alignment jig, a second press-fit auxiliary material and a first press-fit auxiliary material which are sequentially arranged from bottom to top. The laminated structure comprises a windowed lower press-fit auxiliary material, a rigid-flex board and a windowed upper press-fit auxiliary material, and the 3D steel sheet comprises a substrate and a lug boss arranged on the substrate; the position, corresponding to the protruding part, of the rigid-flex board is windowed, the substrate is arranged on the lower side of the lower press-fit auxiliary material, and the protruding part penetrates through the windowed lower press-fit auxiliary material, the rigid-flex board and the windowed upper press-fit auxiliary material; and the lower alignment jig and the upper alignment jig are provided with mutually matched grooves corresponding to the bulge positions of the laminated structure. Through pretreatment of the rigid-flex board and the steel sheet, the surface activity is enhanced, the cohesiveness is improved, and the bonding strength of the 3D steel sheet and the rigid-flex board is remarkably improved in cooperation with a gradient pressing process.

A sensing device (100) for collecting a motion signal of a target object and a wearable device comprising the sensing device (100). The sensing device (100) comprises a first sensing unit (120) arranged on a first side face (110-a), facing a target object, of a flexible substrate (110). An electric signal generated by a first sensing unit (120) is conducted to a target position (A) through a first conductive channel (111) arranged on a flexible substrate (110), and the target position (A) is farther away from a target object relative to a first side face (110-a), so that the connection position of the sensing device (100) and an external circuit can be away from the first side face (110-a). The first side surface (110-a), facing the target object, of the sensing device (100) can be kept flat, and non-uniform deformation of the first sensing unit (120) of the first side surface (110-a) is avoided, so that the working stability of the sensing device (100) is improved. Meanwhile, the first side surface (110-a) is kept flat, so that the foreign body sensation when the sensing device (100) is worn can be reduced, and the wearing comfort of the sensing device (100) is improved.

A permeable bioelectronic system comprising stretchable multilayered circuits comprising liquid metal (LM), and LM interconnects for bonding one or more inorganic electronic circuit components to the stretchable multilayered circuits.

To provide a fabric hybrid electronic system that can realize multiple functions such as sensing detection and signal transmission, and also has stable performance that can withstand washing and rubbing. [Solution] The system includes a chip component, a laser-induced flexible sensor, a fabric substrate, a conductive fabric line, a physiological electrode, and a vertical interconnection via, and uses the laser's material modification ability to form a patterned sensor 131 on the surface 111 of the fabric substrate, uses the laser's micro-cutting ability to form patterned flexible electrodes and interconnection wires, and forms highly stable vertical interconnection vias by infiltrating a conductive composite into the inherent structure of the fabric, and welds the chip electronic device to form a fabric hybrid electronic integrated system.

The invention discloses a manufacturing method of a flexible electronic skin light source, which comprises the following steps: cutting a base material to obtain a base material raw material with a required size; obtaining conductive silver paste, mixing the conductive silver paste with a diluent, and uniformly stirring to prepare conductive ink; printing conductive ink on the surface of the base material raw material according to a preset circuit pattern by using screen printing equipment to obtain a base material circuit diagram; placing a light source patch at a corresponding position of the substrate circuit diagram, and electrically connecting the light source patch with the circuit diagram by adopting welding equipment to obtain an electrically connected light source patch substrate; laminating a polyimide reinforcing material on the back surface of the light source patch to obtain a flexible light source semi-finished product; the flexible light source semi-finished product is packaged, the flexible light source semi-finished product is completely wrapped, and the flexible electronic skin light source is obtained; the flexible electronic skin light source manufactured through the method can be bent in any direction, the bending frequency of the flexible light source is greatly increased, and the service life of the flexible light source is greatly prolonged.

The present invention provides a "circuit board manufacturing method" that allows for the formation of multiple pixel circuits using a film with a thickness of a certain value or greater, while also enabling the appropriate connection of the wiring patterns of each pixel circuit with an appropriate amount of liquid metal. [Solution] In the first step, multiple pixel circuits 2 are formed on the PI film 1 with the pixels connected by the wiring pattern 3. In the second to second-fourth steps, the PI film 1 is processed to reduce the thickness at the positions between pixels, and the PI film 1 is divided into individual pixel pieces so that the PI film 1 is cut together with the wiring pattern 3 at the positions between pixels. This makes it possible to properly connect the wiring patterns 3 of each pixel circuit 2 with an appropriate amount of liquid metal 6 in the region where the liquid metal 6 is attached between pixels, by making the step difference between the wiring pattern 3 formed on the pixel circuit 2 and the flexible substrate 5 to which the individual pieces 4 are transferred less than a certain value, thereby enabling the wiring patterns 3 of each pixel circuit 2 to be properly connected with an appropriate amount of liquid metal 6.

According to an embodiment of the disclosure, there may be provided a foldable electronic device. A foldable electronic device may include a flexible printed circuit board (FPCB). The foldable electronic device may comprise a first housing including a first component, a second housing including a second component, a hinge assembly rotatably connecting the first housing and the second housing, a flexible display disposed from the first housing across a folding area where the hinge assembly is disposed to the second housing, and a flexible printed circuit board electrically connecting the first component and the second component, including a plurality of layers, and including a flexible portion corresponding to the folding area and rigid portions at one end and another end of the flexible portion. A signal line for transmitting a signal and / or power included in the plurality of layers of the flexible printed circuit board may include a metal material and include a first area, a second area, and a third area classified according to a degree of bending in a folding area of the flexible printed circuit board. At least one layer among the plurality of layers may be formed so that the metal material has different thicknesses in the first area, the second area, and the third area on a same layer. Other various embodiments may also apply.

Disclosed are a thin, stretchable and flexible printed circuit and a manufacturing method therefor. The manufacturing method comprise: attaching an adhesion-reducing carrier film to a first side of a flexible circuit board provided with a circuit layer and two protective films, wherein the adhesion-reducing carrier film has a large first preset adhesive force; and attaching a first elastomer composite film, and then performing an adhesion-reducing operation on the adhesion-reducing carrier film to allow the adhesion-reducing carrier film to have a small second preset adhesive force. The elastomer composite film is formed by two polymer films with different melting points. The invention can increase the product yield in mass production based on the adhesion-reducing carrier film and can wrap a serpentine circuit by means of the elasticity of a composite structure of the polymer films to realize thin and light design and miniaturization.

This application discloses an electronic device. The electronic device provided in this application includes a frame, a circuit board, and a radio frequency component. The frame includes a metal member used as an antenna. The circuit board includes a board body and a reinforcement member, the board body has a peripheral region close to the frame, and the reinforcement member is available for radio frequency transmission. The radio frequency component is electrically connected to the circuit board, and is electrically connected to the metal member of the frame. A projection of the radio frequency component on a plane on which the board body is located is a first projection, a projection of the reinforcement member on the plane on which the board body is located is a second projection, and at least a part of the first projection is located in a range of a projection region of the second projection. According to the electronic device provided in this application, the reinforcement member is disposed on a periphery that is of the circuit board and that is close to the frame, and the reinforcement member is available for radio frequency transmission, and does not affect electrical performance of the radio frequency component disposed on a periphery of the circuit board, so that the antenna has good radiation performance, and the electronic device has good communication performance.

A busbar module (1) comprises: a flexible printed circuit board (3) with a main section (30) having a longitudinal direction (X) and a width direction (Y), and a branch section (31) connected to an edge of the main section in the width direction; a busbar (10) connected to the branch section of the flexible printed circuit board; and a housing (4) that accommodates the flexible printed circuit board and the busbar. The branch section is cut into a shape having: a base end (32) connected to the main section; and a section (33) extending longitudinally from the base end. The branch section is connected to the busbar (10) in a state where the section is deformed so that it extends in the width direction (Y).

To provide flexible circuit boards and the like that can reduce manufacturing costs while improving reliability. [Solution] A flexible substrate according to one embodiment of the present disclosure is a flexible substrate for transmitting electrical signals to be applied to a liquid spray head having a plurality of nozzles, and comprises a terminal portion having one or more electrode terminals that are arranged in the edge region of the substrate surface and are electrically connected to other members. The electrode terminals are arranged within the edge region, spaced apart from the outer shape of the substrate surface via a non-electrode region.

A method of manufacturing a circuit board is disclosed. The method includes: a first step of forming a plurality of pixel circuits on a film with the pixels connected to each other by a wiring pattern; a second step of processing the film to thin the film at least at a position between pixels, and singulating the film into individual pixel units such that the film is cut together with the wiring pattern at the position between the pixels; a third step of transferring a plurality of singulated pieces, each having a pixel circuit formed thereon, onto a flexible substrate; and a fourth step of forming a stretchable interconnect by depositing liquid metal between wiring patterns cut in the second step.

The antenna substrate of the embodiment includes a substrate, an antenna pattern layer on the substrate, a first insulating layer containing a resin and an inorganic filler on the substrate and the antenna pattern layer, and a second insulating layer containing a resin and an inorganic filler on the first insulating layer, wherein the second insulating layer has a greater dielectric constant and thickness than the first insulating layer.

A transmission component is provided. The transmission component includes a flexible printed circuit board including a first signal transmission section, a second signal transmission section, and a signal transmission route changing section, a first signal line provided on a first surface of the flexible printed circuit board, a first ground provided on a second surface of the flexible printed circuit board, a second signal line provided on the first surface of the flexible printed circuit board, a third signal line provided on the second surface of the flexible printed circuit board, a fourth signal line provided on the second surface of the flexible printed circuit board, and a second ground provided on the first surface of the flexible printed circuit board.

The present invention refers to a pre-package for a flexible printed circuit board for a smartcard. The pre-package comprises a flexible printed circuit board including one or more non-planar circuit portions; a first layer of a first material at least partially covering a first side of the flexible printed circuit board so as to form a planar layer; a second layer of a second material covering a second side of the flexible printed circuit board; and a third layer comprising a hardening material at least partially covering the first side so as to form a planar layer. The third layer has a third hardness value which is higher than the first hardness value and / or than the second hardness value of the first and second dielectric materials, respectively. The pre-package may be advantageously inserted into a smartcard having a suitable window for accommodating the pre-package comprising the electronic components. The present invention also refers to the methods for forming the pre-package and the smartcard comprising it.

The invention belongs to the technical field of electronic packaging and printed circuit boards, and particularly relates to a method for improving the bending resistance of a flexible circuit board, which comprises the following steps: after plasma pretreatment is carried out on the surface of a polyimide substrate, a three-dimensional nano-column array structure is constructed by depositing gold nanoparticles as a mask and combining reactive ion etching; then removing the mask to obtain a clean polyimide nano structure; and depositing a titanium / copper seed crystal layer through magnetron sputtering, and realizing conformal filling and coating of the copper conductive layer on the nano structure by adopting pulse reverse electroplating to form an adhesive-free mechanical interlocking interface. An adhesive-free three-dimensional mechanical interlocking structure is used for replacing an adhesive layer which is weak in physical performance and prone to fatigue failure, and the structural weak link that a traditional flexible circuit board is layered and cracked first under dynamic bending stress is thoroughly removed.

A display device includes a display panel, which includes a plurality of panel pads arranged along a first direction, and a flexible printed circuit board. The flexible printed circuit board includes a base portion, a first protrusion protruding in a second direction intersecting a first direction from one side of the base portion extending in the first direction, a second protrusion protruding in the second direction from the one side of the base portion and spaced apart from the first protrusion in the first direction, first connection pads disposed on the first protrusion, and second connection pads disposed on the second protrusion. At least some of the first connection pads extend in a direction inclined with respect to the first direction and the second direction, and at least some of the second connection pads extend in a direction inclined with respect to the first direction and the second direction.

A circuit board structure includes a glass substrate, a plurality of conductive penetration structures, a first conductive layer, a first insulating layer, a second conductive layer and a plurality of passive components. The conductive penetration structures are disposed on the rigid substrate of the glass substrate. The first conductive layer is disposed on the glass substrate. The first conductive layer includes a plurality of first conductive traces and a plurality of first conductive patterns. One of the first conductive traces is electrically connected to one of the conductive penetration structures, and one of the first conductive patterns is electrically connected to one of the first conductive traces. The first insulating layer is disposed on the glass substrate to cover the first conductive layer. The second conductive layer is disposed on the first insulating layer, and the second conductive layer includes a plurality of second conductive patterns.

According to one embodiment of the present invention, an electronic substrate includes a base including a first surface and a second surface that is a surface opposite to the first surface, an electronic component disposed on the second surface of the base, and a line disposed on the second surface of the base and connected to the electronic component, wherein the base includes a frame region including a flexible material and a plurality of opening regions passing between the first surface and the second surface, and the electronic component and the line are disposed in the frame region.

The present disclosure relates to fabric-covered electronic devices. An electronic device, such as a voice-controlled speaker device, can have a housing characterized by a vertical longitudinal axis. A flexible substrate, such as a flexible mesh substrate having component support regions coupled by flexible sections, can be wrapped around the housing and the vertical axis. The housing can include a surface region having compound curvature. The flexible substrate can conform to the region having compound curvature. A fabric spacer layer can be interposed between the flexible substrate and the housing. Electronic components, such as input-output devices, can be mounted to the component support regions. A display can be formed from an array of light-emitting devices mounted on respective component support regions. Light from the light-emitting devices can pass through the fabric spacer layer toward the housing and exit away from the housing. An outer fabric layer can cover the mesh.

The invention relates to the technical field of radio altimeter Sip integration design, and discloses an FMCW radio altimeter transceiver Sip integration device and method, and the device comprises an integration box and an integrated circuit board. The integrated box comprises a shell, an upper cover plate and a lower cover plate; the upper cover plate and the lower cover plate are respectively fixed at the top and the bottom of the shell; the integrated circuit board is assembled in the integrated shell; the shell is provided with a DB15 connector, an information receiving hole and an information transmitting hole. The DB15 connector is connected to the integrated circuit board, an information receiving end and an information transmitting end of the integrated circuit board are connected with external signals through an information receiving hole and an information transmitting hole respectively, and the information receiving end and the information transmitting end are used for generating, amplifying and transmitting radio-frequency signals and carrying out amplification, frequency conversion and signal processing on the received radio-frequency signals; and outputting a height signal and an alarm signal. According to the invention, miniaturization of the FMCW radio altimeter transceiver is realized.

A rigid-flex printed circuit board with blind holes made of different materials and in the same layer comprises single-face flexible base materials arranged on the upper side surface and the lower side surface, and semi-solidified layers and double-face flexible base materials which are sequentially and alternately stacked between the single-face flexible base materials. The rigid-flex board comprises a rigid area and a flexible area, and the flexible area can be bent relative to the rigid area; the semi-cured layer comprises at least one mixed layer, the mixed layer comprises a semi-cured part located in a rigid area, and the rest part is a pure glue part; the mixed layer is arranged between the single-sided flexible base material and the double-sided flexible base material, and the single-sided flexible base material is communicated with the double-sided flexible base material through a blind hole; the blind holes comprise rigid blind holes located in the rigid area and flexible blind holes located in the flexible area. The rigid blind holes and the flexible blind holes are arranged, so that the problem that excessive glue removal or glue residue is easy to occur in blind hole processing due to the fact that prepreg glue and pure glue exist in the same dielectric layer of an existing rigid-flexible combined board is solved.

The application discloses a flexible circuit board, which comprises a first dielectric layer, a second dielectric layer, a glue layer, a circuit layer and a reinforcing sheet, the glue layer is arranged between the first dielectric layer and the second dielectric layer, the circuit layer is embedded in the glue layer, and the reinforcing sheet is embedded in the glue layer and is arranged in a spaced mode with the circuit layer. The application further provides a terminal device and a manufacturing method of the flexible circuit board. The flexible circuit board provided by the application is beneficial to reducing the rebound of the reinforcing sheet, avoiding the cracking of the reinforcing sheet and the flexible circuit board and preventing interference and the like.

A driving substrate, a light-emitting device, and a method for fabricating the same are disclosed. The driving substrate includes a substrate, comprising a first surface, a second surface, and a plurality of side surfaces, at least one of which is a selected side surface; a flexible film disposed on the first surface, the selected side surface, and a portion of the second surface near the selected side surface; the flexible film includes a first region on the first surface, a second region on the second surface, and a bending region between the first and second regions, the bending region including a first corner region, a second corner region, and a side surface region; a wiring layer, an electrode layer, and a connection lead layer are sequentially disposed on the side of the flexible film away from the substrate; the wiring layer is located in the first region, the second region, and the side surface region; the electrode layer includes a plurality of first electrodes, a plurality of second electrodes, a plurality of third electrodes, and a plurality of fourth electrodes, each third electrode being electrically connected to a fourth electrode through the wiring layer; the connection lead layer includes a plurality of first connection leads and a plurality of second connection leads.

The present invention relates to an ink composition, a kit comprising components of the ink composition, a method of manufacturing a deformable conductor utilizing the ink composition, a deformable conductor obtainable by the method, an electronic device, in particular a wearable and / or stretchable electronic device, comprising the deformable conductor, a method of manufactuing a conductor, a conductor obtainable by the method and an electronic device comprising the conductor. The ink composition comprises a source of transition metal ions, a reducing agent and a polymer and / or a polymer precursor, the polymer precursor comprising a polymerizable terminal multiple bond. The method of manufacturing a deformable conductor comprises the steps of applying the ink composition on at least a part of a surface of a deformable substrate and thermally treating and / or irradiating the ink composition.