884results about "Circuit bendability/stretchability" patented technology

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

The invention discloses a printed circuit stiffening plate processing device which comprises a bottom plate, a shell is fixedly connected to the middle of the upper end of the bottom plate, symmetrical moving grooves are formed in the upper end of the shell, moving blocks used for centering and positioning a stiffening plate are slidably connected to inner cavities of the moving grooves, and a placement table is arranged in the middle of the upper end of the shell. And a piston is vertically and slidably connected to the middle of an inner cavity of the placement table, a driving mechanism is arranged below the placement table, and when the driving mechanism rotates clockwise, the piston moves downwards after the moving block is driven to be close to the reinforcing plate. Under the action of elasticity, the connecting plate can synchronously get close to the position of the placement table, at the moment, the connecting plate can drive the positioning rod to synchronously get close to the position where the stiffening plate is located, and even if the shape of the stiffening plate is irregular and the position state of the stiffening plate is inclined during placement, the stiffening plate can be elastically clamped and centered through the positioning rod; and the thin reinforcing plate is prevented from warping under the action of clamping force.

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a charging interface, a first circuit board, a metal reinforcing piece and a support assembly. The first circuit board comprises a connecting end. The connecting end is provided with a grounding terminal. The connecting end is electrically connected with the charging interface. The metal reinforcing member and the connecting end are arranged in a stacked manner. The metal reinforcing member is electrically connected with the grounding terminal. The support assembly comprises a metal support and a conductive part. At least part of the connecting end is located in the metal support. The metal support comprises a main body part and a grounding part. The grounding part is electrically connected with the main body part. And the metal reinforcing piece and the main body part are electrically connected with the conductive piece respectively. The grounding part is used for grounding. According to the electronic equipment provided by the embodiment of the invention, the structural design difficulty is reduced, and the assembly difficulty and the production cost are reduced.

A stretchable circuit board assembly and a method for manufacturing the same are provided. The circuit board assembly includes a flexible circuit board and an outer circuit board. The flexible circuit board includes a first base layer and an inner wiring layer. The flexible circuit board is divided into a connecting area and a stretchable area. The inner wiring layer within the connecting area includes an electrical connecting portion exposed from the outer circuit board. The stretchable area is configured to deform into at least one bent portion. The bent portion is used to cause the electrical connecting portion to stretch relative to the outer circuit board. The outer circuit board includes a second base layer and an outer wiring layer. A surface of the second base layer away from the outer wiring layer defines at least one blind groove. The blind groove is configured to receive the bent portion.

The invention discloses a stiffening plate fitting, positioning and dust removing mechanism which comprises a fixed plate fixed to a workbench, a positioning frame which is hollow in the middle and is of a square structure is arranged at the top of the fixed plate, the four side faces of the inner side of the positioning frame are inclined faces, and moving grooves are formed in the front side edge and the rear side edge, opposite to each other, of the positioning frame. Placing grooves are formed in the left and right opposite side edges of the positioning frame, connecting rods are arranged at the two ends of the electrostatic dust collection rod, and the two ends of the electrostatic dust collection rod are in sliding insertion connection with the two moving grooves of the positioning frame correspondingly. The device is used for reinforcing and attaching the plate, automatic positioning and position adjusting are achieved when the plate moves to the bearing plate, the attaching accuracy is improved, reinforcing and attaching of various reinforcing plates at different positions of the same plate are achieved at the same time, the dust collection paste can adsorb and collect dust falling after an electrostatic dust collection rod stops working, and the device is simple and practical.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

The invention provides a double-frequency array type annular transducer for intravascular ultrasonic imaging, and relates to the technical field of medical ultrasonic imaging. The double-frequency array type annular transducer for intravascular ultrasonic imaging comprises a catheter and a flexible circuit board arranged on the outer wall of the catheter in a surrounding mode in the circumferential direction of the catheter, and a backing layer, a piezoelectric layer and a conducting layer are sequentially arranged on the flexible circuit board in the radial direction of the catheter; the piezoelectric layer comprises a plurality of high-frequency transduction units and a plurality of low-frequency transduction units, and the high-frequency transduction units and the low-frequency transduction units are arranged at intervals in the circumferential direction of the conduit; and a filling piece is arranged between the adjacent high-frequency transduction unit and low-frequency transduction unit. According to the invention, a surface layer high-resolution image can be obtained to accurately identify vulnerable lesions such as TCFA and the like, and high-quality imaging can be carried out on a deep blood vessel wall and an outer membrane structure.

The embodiment of the invention provides a flexible circuit board assembly, a rotating shaft assembly and foldable electronic equipment, and belongs to the technical field of electronic equipment, a flexible circuit board is arranged on a rotating shaft in a penetrating mode through a through hole in the rotating shaft, a first adsorption part is connected with a second adsorption part in the through hole in an adsorption mode, and a clamping part is matched with the rotating shaft in a clamping mode. High limiting fastness of the flexible circuit board is achieved, the problem that the flexible circuit board falls off in scenes such as falling is solved, and the risk of breakage of the rotating shaft is reduced. The first adsorption part and the second adsorption part are located on the same side of the flexible circuit board, so that the thickness space occupied by the adsorption parts in the rotating shaft is reduced, the strength of the rotating shaft is improved, and the breakage risk of the rotating shaft in scenes such as falling is reduced under the condition of high adsorption effect. Moreover, the clamping part is detachably connected with the rotating shaft in a clamping manner, and the first adsorption part and the second adsorption part can be separated under the action of external force, so that the flexible circuit can be conveniently detached from the rotating shaft, and the detachment in the scenes of repair and the like is facilitated.

A wiring module is attached to a plurality of power storage elements, and includes: a flexible printed circuit board; and a protector holding the flexible printed circuit board, wherein the flexible printed circuit board includes a base film, a plurality of conduction paths that are disposed on a surface of the base film, and a connector that has an opposing surface opposing the surface of the base film and that is connected to the plurality of conduction paths, the plurality of conduction paths and electrode terminals of the plurality of power storage elements are electrically connected, the connector includes connection portions that are connected to the plurality of conduction paths, and at least some of the plurality of conduction paths are routed from the connection portions through a space between the surface of the base film and the opposing surface of the connector.

The invention provides a rigid-flex board 3D steel sheet reinforced press-fit structure. The rigid-flex board 3D steel sheet reinforced press-fit structure comprises a first press-fit auxiliary material, a second press-fit auxiliary material, a lower alignment jig, a laminated structure, an upper alignment jig, a second press-fit auxiliary material and a first press-fit auxiliary material which are sequentially arranged from bottom to top. The laminated structure comprises a windowed lower press-fit auxiliary material, a rigid-flex board and a windowed upper press-fit auxiliary material, and the 3D steel sheet comprises a substrate and a lug boss arranged on the substrate; the position, corresponding to the protruding part, of the rigid-flex board is windowed, the substrate is arranged on the lower side of the lower press-fit auxiliary material, and the protruding part penetrates through the windowed lower press-fit auxiliary material, the rigid-flex board and the windowed upper press-fit auxiliary material; and the lower alignment jig and the upper alignment jig are provided with mutually matched grooves corresponding to the bulge positions of the laminated structure. Through pretreatment of the rigid-flex board and the steel sheet, the surface activity is enhanced, the cohesiveness is improved, and the bonding strength of the 3D steel sheet and the rigid-flex board is remarkably improved in cooperation with a gradient pressing process.

A sensing device (100) for collecting a motion signal of a target object and a wearable device comprising the sensing device (100). The sensing device (100) comprises a first sensing unit (120) arranged on a first side face (110-a), facing a target object, of a flexible substrate (110). An electric signal generated by a first sensing unit (120) is conducted to a target position (A) through a first conductive channel (111) arranged on a flexible substrate (110), and the target position (A) is farther away from a target object relative to a first side face (110-a), so that the connection position of the sensing device (100) and an external circuit can be away from the first side face (110-a). The first side surface (110-a), facing the target object, of the sensing device (100) can be kept flat, and non-uniform deformation of the first sensing unit (120) of the first side surface (110-a) is avoided, so that the working stability of the sensing device (100) is improved. Meanwhile, the first side surface (110-a) is kept flat, so that the foreign body sensation when the sensing device (100) is worn can be reduced, and the wearing comfort of the sensing device (100) is improved.

The present invention provides a flexible LED vehicle-mounted display screen and a production process thereof. The production process includes the following steps: adopting an FPC as a basic material of the display screen main body, fixing the flexible screen on a mold, mixing a PU glue, degassing treatment, glue dripping, automatic degassing, curing, and collecting. The flexible screen is fixed on a mold tray by magnetic suction or vacuum, and an air pressure sensor, a camera, a solenoid valve and the like are used to intelligently process the glue dripping and degassing processes. A plurality of Bluetooth BLE is installed on an FPC for communication, an MCU with a DMA function is adopted, and data are compressed to 50% of original data by an LZSS coding algorithm, which greatly reduces the time for the flexible screen to send data and improves the user experience.

A stacked printed circuit board (PCB) assembly is provided comprising a first rigid PCB having high complexity components, a dynamic bending flexible PCB, and a PCB interposer electrically interconnected between the rigid and flexible PCBs. The high complexity components may have a pin count exceeding 100 and pitch under 0.4 mm. The dynamic bending flexible PCB is optimized for flexing by using fabrication processes unsuitable for the complexity components. The rigid and flexible PCBs are manufactured separately then integrated using the PCB interposer. This enables the rigid PCB to utilize processes for optimizing density and complexity without constraining the flexible PCB bending requirements. The discrete approach improves fabrication and bend cycle yields compared to conventional rigid-flex solutions. Reliable dynamic flexing is achieved while integrating complex components requiring rigid PCB fabrication.

Provided is a composite substrate having a variable dielectric constant, the composite substrate comprising: a stretchable polymer matrix formed of a stretchable polymer having elasticity; and a dielectric cluster having a predetermined shape, the dielectric cluster being contained in the polymer matrix and formed from a dielectric powder having dielectric properties, wherein when the composite substrate is stretched, the predetermined shape of the dielectric cluster changes and thus the dielectric constant changes.

A permeable bioelectronic system comprising stretchable multilayered circuits comprising liquid metal (LM), and LM interconnects for bonding one or more inorganic electronic circuit components to the stretchable multilayered circuits.

To provide a stretchable device high in sensitivity for detecting pressure.SOLUTION: A stretchable device includes a stretchable substrate, a sensor layer and a counter electrode laminated in this order. When viewed from the stretchable substrate, a direction of arranging the sensor layer is a first lamination direction, and a direction opposite to the first lamination direction is a second lamination direction; the stretchable substrate includes a resin base material and an array layer laminated in order in the first lamination direction; and the array layer includes a first surface facing the first lamination direction and contacting the sensor layer, a depression part depressed in the second lamination direction from the first surface, and a detection electrode arranged in the depression part and contacting the sensor layer only when the sensor layer moves in the second lamination direction.SELECTED DRAWING: Figure 5

To provide a fabric hybrid electronic system that can realize multiple functions such as sensing detection and signal transmission, and also has stable performance that can withstand washing and rubbing. [Solution] The system includes a chip component, a laser-induced flexible sensor, a fabric substrate, a conductive fabric line, a physiological electrode, and a vertical interconnection via, and uses the laser's material modification ability to form a patterned sensor 131 on the surface 111 of the fabric substrate, uses the laser's micro-cutting ability to form patterned flexible electrodes and interconnection wires, and forms highly stable vertical interconnection vias by infiltrating a conductive composite into the inherent structure of the fabric, and welds the chip electronic device to form a fabric hybrid electronic integrated system.

The invention discloses a manufacturing method of a flexible electronic skin light source, which comprises the following steps: cutting a base material to obtain a base material raw material with a required size; obtaining conductive silver paste, mixing the conductive silver paste with a diluent, and uniformly stirring to prepare conductive ink; printing conductive ink on the surface of the base material raw material according to a preset circuit pattern by using screen printing equipment to obtain a base material circuit diagram; placing a light source patch at a corresponding position of the substrate circuit diagram, and electrically connecting the light source patch with the circuit diagram by adopting welding equipment to obtain an electrically connected light source patch substrate; laminating a polyimide reinforcing material on the back surface of the light source patch to obtain a flexible light source semi-finished product; the flexible light source semi-finished product is packaged, the flexible light source semi-finished product is completely wrapped, and the flexible electronic skin light source is obtained; the flexible electronic skin light source manufactured through the method can be bent in any direction, the bending frequency of the flexible light source is greatly increased, and the service life of the flexible light source is greatly prolonged.

A battery pack includes a battery module including battery cells and a bus bar configured to electrically connect the battery cells, and a circuit board connected to the battery module that includes a first portion extending in a longitudinal direction of the battery module, second portions extending from the first portion in a direction crossing the first portion that each include a circuit pattern, and a third portion connected to an end of each of the second portions and connected to the bus bar. Each second portion extends straight without being bent or folded.

A cooling plate assembly for dual-sided cooling, the cooling plate assembly can include a first cooling plate and a second cooling plate. The first cooling plate that has a first cooling plate connector side and a first cooling plate cooling side that is opposite the first cooling plate connector side. The second cooling plate that has a second cooling plate connector side and a second cooling plate cooling side that is opposite the second cooling plate connector side. The second cooling plate is configured to attach to the first cooling plate such that formed between the first cooling plate connector side and the second cooling plate connector side is at least one cooling passage through which a cooling fluid is flowed to transfer heat from both the first cooling plate cooling side and the second cooling plate cooling side to the cooling fluid.

The present invention provides a "circuit board manufacturing method" that allows for the formation of multiple pixel circuits using a film with a thickness of a certain value or greater, while also enabling the appropriate connection of the wiring patterns of each pixel circuit with an appropriate amount of liquid metal. [Solution] In the first step, multiple pixel circuits 2 are formed on the PI film 1 with the pixels connected by the wiring pattern 3. In the second to second-fourth steps, the PI film 1 is processed to reduce the thickness at the positions between pixels, and the PI film 1 is divided into individual pixel pieces so that the PI film 1 is cut together with the wiring pattern 3 at the positions between pixels. This makes it possible to properly connect the wiring patterns 3 of each pixel circuit 2 with an appropriate amount of liquid metal 6 in the region where the liquid metal 6 is attached between pixels, by making the step difference between the wiring pattern 3 formed on the pixel circuit 2 and the flexible substrate 5 to which the individual pieces 4 are transferred less than a certain value, thereby enabling the wiring patterns 3 of each pixel circuit 2 to be properly connected with an appropriate amount of liquid metal 6.

According to an embodiment of the disclosure, there may be provided a foldable electronic device. A foldable electronic device may include a flexible printed circuit board (FPCB). The foldable electronic device may comprise a first housing including a first component, a second housing including a second component, a hinge assembly rotatably connecting the first housing and the second housing, a flexible display disposed from the first housing across a folding area where the hinge assembly is disposed to the second housing, and a flexible printed circuit board electrically connecting the first component and the second component, including a plurality of layers, and including a flexible portion corresponding to the folding area and rigid portions at one end and another end of the flexible portion. A signal line for transmitting a signal and / or power included in the plurality of layers of the flexible printed circuit board may include a metal material and include a first area, a second area, and a third area classified according to a degree of bending in a folding area of the flexible printed circuit board. At least one layer among the plurality of layers may be formed so that the metal material has different thicknesses in the first area, the second area, and the third area on a same layer. Other various embodiments may also apply.

Disclosed are a thin, stretchable and flexible printed circuit and a manufacturing method therefor. The manufacturing method comprise: attaching an adhesion-reducing carrier film to a first side of a flexible circuit board provided with a circuit layer and two protective films, wherein the adhesion-reducing carrier film has a large first preset adhesive force; and attaching a first elastomer composite film, and then performing an adhesion-reducing operation on the adhesion-reducing carrier film to allow the adhesion-reducing carrier film to have a small second preset adhesive force. The elastomer composite film is formed by two polymer films with different melting points. The invention can increase the product yield in mass production based on the adhesion-reducing carrier film and can wrap a serpentine circuit by means of the elasticity of a composite structure of the polymer films to realize thin and light design and miniaturization.

The invention relates to the technical field of display, and discloses a flexible circuit board and a display device. The flexible circuit board is used for connecting a display panel and a connector, and comprises a body part and a connecting part, the body part is provided with a binding area, the binding area is used for being bound with the display panel, the binding area is located on the edge portion of the second direction of the body part and extends in the first direction, the second direction intersects with the first direction, the body part is provided with a touch wire and other wires, and the touch wire is at least arranged on the edge area, away from the binding area, of the body part; the connecting part is connected to the body part and connected to an area between the touch wire and the binding area, at least part of the other wires extends to the binding area from the connecting part so that the touch wire and the other wires do not intersect, the connecting part can be bent relative to the body part, the connecting part is provided with a connecting area, and the connecting area is used for being connected with a connector. The noise of a touch signal on the flexible circuit board is relatively low.

This application discloses an electronic device. The electronic device provided in this application includes a frame, a circuit board, and a radio frequency component. The frame includes a metal member used as an antenna. The circuit board includes a board body and a reinforcement member, the board body has a peripheral region close to the frame, and the reinforcement member is available for radio frequency transmission. The radio frequency component is electrically connected to the circuit board, and is electrically connected to the metal member of the frame. A projection of the radio frequency component on a plane on which the board body is located is a first projection, a projection of the reinforcement member on the plane on which the board body is located is a second projection, and at least a part of the first projection is located in a range of a projection region of the second projection. According to the electronic device provided in this application, the reinforcement member is disposed on a periphery that is of the circuit board and that is close to the frame, and the reinforcement member is available for radio frequency transmission, and does not affect electrical performance of the radio frequency component disposed on a periphery of the circuit board, so that the antenna has good radiation performance, and the electronic device has good communication performance.

One aspect of the present invention provides a stretchable device including a stretchable substrate, a stretchable wiring provided on the stretchable substrate, a conductive member that is in contact with the stretchable wiring, a solder member that is provided on the conductive member and is in contact with the conductive member, an electronic component electrically connected to the conductive member with the solder member interposed therebetween, and a first insulating layer covering at least a part of the stretchable wiring. An outer surface of an end portion, on a side in contact with the conductive member, of the stretchable wiring is in contact with the conductive member and the first insulating layer continuous with the conductive member.

A busbar module (1) comprises: a flexible printed circuit board (3) with a main section (30) having a longitudinal direction (X) and a width direction (Y), and a branch section (31) connected to an edge of the main section in the width direction; a busbar (10) connected to the branch section of the flexible printed circuit board; and a housing (4) that accommodates the flexible printed circuit board and the busbar. The branch section is cut into a shape having: a base end (32) connected to the main section; and a section (33) extending longitudinally from the base end. The branch section is connected to the busbar (10) in a state where the section is deformed so that it extends in the width direction (Y).

To provide flexible circuit boards and the like that can reduce manufacturing costs while improving reliability. [Solution] A flexible substrate according to one embodiment of the present disclosure is a flexible substrate for transmitting electrical signals to be applied to a liquid spray head having a plurality of nozzles, and comprises a terminal portion having one or more electrode terminals that are arranged in the edge region of the substrate surface and are electrically connected to other members. The electrode terminals are arranged within the edge region, spaced apart from the outer shape of the substrate surface via a non-electrode region.

A method of manufacturing a circuit board is disclosed. The method includes: a first step of forming a plurality of pixel circuits on a film with the pixels connected to each other by a wiring pattern; a second step of processing the film to thin the film at least at a position between pixels, and singulating the film into individual pixel units such that the film is cut together with the wiring pattern at the position between the pixels; a third step of transferring a plurality of singulated pieces, each having a pixel circuit formed thereon, onto a flexible substrate; and a fourth step of forming a stretchable interconnect by depositing liquid metal between wiring patterns cut in the second step.