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77results about "Circuit bendability/stretchability" patented technology

Foldable electronic device comprising fpcb

According to an embodiment of the disclosure, there may be provided a foldable electronic device. A foldable electronic device may include a flexible printed circuit board (FPCB). The foldable electronic device may comprise a first housing including a first component, a second housing including a second component, a hinge assembly rotatably connecting the first housing and the second housing, a flexible display disposed from the first housing across a folding area where the hinge assembly is disposed to the second housing, and a flexible printed circuit board electrically connecting the first component and the second component, including a plurality of layers, and including a flexible portion corresponding to the folding area and rigid portions at one end and another end of the flexible portion. A signal line for transmitting a signal and / or power included in the plurality of layers of the flexible printed circuit board may include a metal material and include a first area, a second area, and a third area classified according to a degree of bending in a folding area of the flexible printed circuit board. At least one layer among the plurality of layers may be formed so that the metal material has different thicknesses in the first area, the second area, and the third area on a same layer. Other various embodiments may also apply.
Owner:SAMSUNG ELECTRONICS CO LTD

Flexible circuit board, terminal device and manufacturing method of flexible circuit board

ActiveCN119342679BCircuit bendability/stretchabilityLaminating printed circuit boardsFlexible circuitsTerminal equipment
The application discloses a flexible circuit board, which comprises a first dielectric layer, a second dielectric layer, a glue layer, a circuit layer and a reinforcing sheet, the glue layer is arranged between the first dielectric layer and the second dielectric layer, the circuit layer is embedded in the glue layer, and the reinforcing sheet is embedded in the glue layer and is arranged in a spaced mode with the circuit layer. The application further provides a terminal device and a manufacturing method of the flexible circuit board. The flexible circuit board provided by the application is beneficial to reducing the rebound of the reinforcing sheet, avoiding the cracking of the reinforcing sheet and the flexible circuit board and preventing interference and the like.
Owner:QING DING PRECISION ELECTRONICS HUAIAN CO LTD +1

Housing for electronic circuits arranged on printed circuit boards

The present invention relates to a housing (1) for an electronic circuit, the housing having a housing bottom (2), a housing top (3), and a printed circuit board (4) arranged in the housing (1) for receiving the electronic circuit. The housing bottom (2) is designed in a basin shape and has at least two support elements (6) for the printed circuit board (4) on at least two opposing inner walls (5). Furthermore, at least one position-fixing molded portion (7) is provided on each of the at least two opposing inner walls (5) for engaging with a corresponding fixing slot (8) in the printed circuit board (4) for position fixing. A first portion (10) of a locking device is provided on each of the at least two opposite outer walls (9) for connection with the housing top (3). The printed circuit board (4) is designed in a rectangular shape and has fixing slots (8) on at least two opposite sides for receiving the position of the housing bottom (2). The molded part is formed, and the printed circuit board (4) has slots (13) at its four corners (15), the slots extending parallel to the inner wall (5) of the bottom of the housing (2), on which support elements (6) are mounted, wherein the length of the slot (13) is greater than the distance between the slot (13) and the adjacent edge (14) of the printed circuit board, so that an elongated, elastic tab (16) is formed at each corner (15) of the printed circuit board (4), wherein the top of the housing (3) is designed to be basin-shaped and has pin-shaped portions (19) extending from the plane of the top edge (18) of the housing at its four corners, the pin-shaped portions being designed to press the tabs (16) formed on the printed circuit board (4) from the plane of the printed circuit board into the bottom of the housing (2) in the assembled state of the housing (1), and has a second part (11) of a locking device on at least two opposite outer walls (9) for connection with the bottom of the housing (2).
Owner:CONTINENTAL AUTOMOTIVE TECHNOLOGIES GMBH

Fabricating stretchable liquid metal circuits with a physical sacrificial layer

Stretchable electronics with mechanical properties compatible with biological systems enable emerging applications such as continuous physiological monitoring, neural sensing and modulation, and programmable mechanoreceptors is disclosed. Here, we introduce a physical sacrificial layer strategy that significantly accelerates and simplifies the fabrication of stretchable electronics. By using poly(vinyl alcohol) (PVA) as a physical sacrificial layer, devices can be rapidly released through manual peeling followed by direct contact etching in 2 minutes irrespective of the area. This approach not only offers exponential speed improvements over traditional methods but is also broadly applicable to existing stretchable electronics fabrication processes. Furthermore, it enables vertical interconnect access (VIA) and interposers to integrate diverse electronic components, modules, and systems on different scales. To demonstrate its versatility, we demonstrate stretchable circuits featuring integration between soft circuit, surface mount components and human interaction underscoring its potential for rapid implementation of sophisticated heterogeneously integrated stretchable electronic systems.
Owner:UNIV OF MASSACHUSETTS

Circuit board, image sensor module, lens driving device, and camera module

This application discloses a circuit board, an image sensor module, a lens driving device, and a camera module. The circuit board includes an insulating portion and a patterned portion. The insulating portion includes a first insulating region and a second insulating region, separated by a separation region. The patterned portion includes a first patterned portion and a second patterned portion. The first patterned portion includes a first terminal portion, a second terminal portion, and a connecting portion disposed on the separation region and connecting the terminal portions. The separation region includes a first corner portion to a fourth corner portion, and the connecting portion includes a first connecting portion to a fourth connecting portion, each of the first to fourth corner portions including a bent portion. The insulating portion also includes an organic material layer disposed on the separation region and covering the upper, lower, and side surfaces of the metal layer of each of the first to fourth connecting portions, thereby insulating the first to fourth connecting portions.
Owner:LG INNOTEK CO LTD

Thermal flow sensor with a heat-conducting frame element in the shape of a printed circuit board (PCB)

The present invention relates to a thermal flow sensor (1) for a flow meter. The thermal flow sensor (1) comprises a main channel portion (3b), a sensor tube (4), and a thermally conductive frame element (13). The main channel portion (3b) comprises a main channel (3) for a medium whose flow rate is to be determined. The sensor tube (4) comprises a first tube portion (5) with an inlet (6) fluidly connected to the main channel (3), a second tube portion (8) with an outlet (9) fluidly connected to the main channel (3) on the opposite side of the inlet (6), a sensing portion (11) connected to the first tube portion (5) and the second tube portion (8) so that the fluid flows from the inlet (6) to the outlet (9) through the sensor tube (4), and at least two sensing heating elements (12) for measuring a temperature or power difference within the sensor tube (4) to determine the flow rate. A thermally conductive frame element (13) contacts the first tube portion (5), the second tube portion (8) and the main channel portion (3b) to equalize the temperature gradient across the first tube portion (5), the second tube portion (8) and the main channel portion (3b). The thermally conductive frame element 13 is a printed circuit board (PCB) 14.
Owner:ベルキンビーブイ

Multilayered flexible printed circuit board and electronic device comprising same

A flexible printed circuit board, and an electronic device are provided. The flexible printed circuit board includes a first layer including at least one RF conductive wire for transmitting a radio frequency signal, a second layer spaced apart from the first layer by a first distance in a first direction perpendicular to a surface of the flexible printed circuit board and including a second ground conductor, a third layer spaced apart from the first layer by a second distance, which is longer than the first distance, in a direction opposite to the first direction and including a third ground conductor, and at least one fourth layer positioned between the first layer and the third layer.
Owner:SAMSUNG ELECTRONICS CO LTD

Connector, connector unit, and method for connecting to connection substrate in connector

A connector that contributes to improving signal transmission characteristics is provided. A connector (2) according to the present disclosure includes a contact assembly (12) including an insulating member (23) that holds a first contact group (21) and a second contact group (22). The insulating member (23) includes a main body (23a) holding the first contact group (21) and the second contact group (22), protruding parts (23b) protruded from the main body (23a), engaged parts (23f) with which engaging parts (3d) of the connection substrate (3) are engaged, and contacting parts that are in contact with side surfaces of the connection substrate (3). The engaged parts (23f) sandwich side parts of the connection substrate (3). End parts of each of the first contact group (21) and the second contact group (22) connected to the connection substrate (3) are disposed between the protruding parts (23b) in a state in which the end parts are protruded from the insulating member (23).
Owner:JAPAN AVIATION ELECTRONICS IND LTD

Continuous interconnection between dissimilar materials

To provide structures having one or more media extending between two heterogeneous materials to form a continuous interconnect between the materials, and / or formation of such structures.SOLUTION: A deformable electronic device comprises: a substrate 32, 34; an encapsulant 38; a trace 36 formed from a deformable conductor disposed between the substrate and the encapsulant; a pattern of conductive material 30; and an interconnect 40 electrically coupling the trace and the pattern of conductive material. The interconnect comprises the deformable conductor. Preferably, the deformable conductor is a conductive gel. Preferably, the deformable electronic device further comprises a stencil layer positioned between the encapsulant layer and the substrate. Preferably, the stencil layer contains, at least in part, the deformable conductor. Preferably, the pattern of conductive material is positioned on the substrate.SELECTED DRAWING: Figure 10
Owner:LIQUID WIRE INC

Circuit board assembly and electronic device

This application relates to the field of electronic device technologies, and in particular, to a circuit board assembly and an electronic device. The circuit board assembly includes a circuit board, an electrical connection board, and a flexible circuit board. The electrical connection board is mounted on the circuit board in a thickness direction of the circuit board assembly, and is electrically connected to the circuit board. At least a part of the flexible circuit board has a flexible structure. The flexible circuit board includes a first connection segment and a second connection segment. The first connection segment is configured to connect to a component of an electronic device. The second connection segment is connected to the electrical connection board. The electrical connection board is configured to adjust a distance between the second connection segment and the circuit board in the thickness direction of the circuit board assembly, to adjust a bent form of the flexible circuit board without changing a distance between the component of the electronic device and the circuit board in a width direction of the electronic device.
Owner:HONOR DEVICE CO LTD

Multi-use flexible circuit for an augmented-reality headset

A flex circuit of an augmented-reality headset is described.  A shape of the flex circuit allows for placement of the flex circuit at a nose-bridge region of the augmented-reality headset.  The flex circuit includes an image sensor that provides image data related to disparity between a first display and a second display of the augmented-reality headset, and circuitry used for charging a battery of the augmented-reality headset.  The circuitry includes battery charging terminals that are located at the nose-bridge region of the augmented-reality headset.
Owner:META PLATFORMS TECHNOLOGIES LLC

Flexible wiring element and conductive module

A wiring main body (1A) of a flexible wiring element (1) comprises a slot (31) cut out in the arrangement direction from one end to the other end, a first branch wiring section (41) on one side of a first electrode terminal group (BC5), a second branch wiring section (42) on one side of a second electrode terminal group (BC6), and a coupling wiring section (43) that couples them on one side of the other end in the arrangement direction. The first branch wiring section (41) comprises a first inclined side section (41a) that is a side section on one side of the first electrode terminal group (BC5), the side section being connected to an end section on the side of the first electrode terminal group (BC5) in the coupling wiring section (43).The second branch wiring section (42) includes a second inclined side section (42a) which is a side section on one side of the second electrode terminal group (BC6).
Owner:YAZAKI CORP

Electronics Assembly

An electronics substrate spanning cell terminals of a plurality of energy storage units, the electronics substrate including at least one terminal bonding region configured as a primary path for electrical current between the electronics substrate and the cell unit terminals, at least one circuit region including at least a first conductive layer and a second non-conductive layer, and two or more electronic components disposed on the one or more electronics substrates and connected to the conductive layers in the circuit region, wherein at least a portion of the terminal bonding region and / or the circuit region have specified mechanical bending characteristics and / or combined thickness characteristics that allow at least some displacement from a predetermined geometric arrangement.
Owner:RELECTRIFY PTY LTD

Wiring circuit board and method for producing wiring circuit board

A method for producing a wiring circuit board includes a step (1) of producing a substrate with a metal support board including a metal support board and a step (2) of etching the metal support board. The wiring circuit board includes a frame, a mounting portion, an opening portion, and a joint. Each of the frame and the mounting portion includes a metal support layer, a base insulating layer, a conductive layer, and a cover insulating layer. The joint does not include the metal support layer. In step (2), by etching the metal support board corresponding to the opening portion and the joint from the other side in the thickness direction by using an etching resist, the metal support layer is formed.
Owner:NITTO DENKO CORP

device

ActiveJP7866394B2Circuit bendability/stretchabilityFlexible printed circuits
To provide a device, equipped with three or more circuit members overlapping one another, whose height can be reduced.SOLUTION: A device 10 comprises a first circuit member 40, a second circuit member 50, and a third circuit member 60. The first circuit member 40 has: a first main part 41 in which a main electrode 422 is formed; and a first flexible substrate 46 in which a first collective electrode part 47 is formed. The second circuit member 50 has: a second main part 51 in which a second conductive pattern is formed; and a second flexible substrate 56 in which a second collective electrode part 57 is formed. The third circuit member 60 has: a third main part 61 in which a third conductive pattern is formed; and a third flexible substrate 66 in which a third collective electrode part 67 is formed. The first collective electrode part 47, the second collective electrode part 57, and the third collective electrode part 67 overlap one another in the vertical direction. The first main part 41, the second main part 51, and the third main part 61 are separated from one another when viewed along the vertical direction.SELECTED DRAWING: Figure 4
Owner:JAPAN AVIATION ELECTRONICS IND LTD

Electronic device

PendingEP4749841A1Circuit bendability/stretchabilityPrinted circuit grounding
Embodiments of this application provide an electronic device. The electronic device includes a charging interface, a first circuit board, a metal reinforcement member and a bracket assembly. The first circuit board includes a connection end. The connection end has a ground terminal. The connection end is electrically connected to the charging interface. The metal reinforcement member and the connection end are stacked. The metal reinforcement member is electrically connected to the ground terminal. The bracket assembly includes a metal bracket and a conductive member. At least part of the connection end is located in the metal bracket. The metal bracket includes a body portion and a ground portion. The ground portion is electrically connected to the body portion. The metal reinforcement member and the body portion are respectively electrically connected to the conductive member. The ground portion is configured to be grounded. The electronic device in the embodiments of this application helps reduce structural design difficulty, and reduce assembly difficulty and production costs.
Owner:HONOR DEVICE CO LTD

Electromagnetic wave shielding sheet, flexible printed circuit board attached with electromagnetic wave shielding sheet, and manufacturing method thereof

Provided is an electromagnetic wave shielding sheet, a flexible printed circuit board attached with the electromagnetic wave shielding sheet, and a manufacturing method thereof. The flexible printed circuit board attached with the electromagnetic wave shielding sheet comprises: an electromagnetic wave shielding sheet including a nonwoven fabric having a plated surface and including an adhesive layer adsorbed therein without containing conductive particles, and a nonwoven fabric layer including a first insulating layer formed on the nonwoven fabric; and a flexible printed circuit board attached with the electromagnetic wave shielding sheet, wherein the flexible printed circuit board includes: a base film having a wiring pattern and a ground pattern formed on one side; and a second insulating layer covering the wiring pattern and exposing the ground pattern, and the nonwoven fabric layer having the adhesive layer adsorbed therein is in direct contact with the ground pattern.
Owner:WISOL CO LTD

Conductive coating material and circuit former

A conductive coating material includes a silicone resin (A), and a conductive powder (B) at a specific mass ratio, in which the conductive powder (B) includes a flake-shaped conductive powder (B1) having an average particle size of 1 to 7 µm and an amorphous conductive powder (B2) having an average particle size of 1 to 6 µm at a specific mass ratio, and Expression (1) below is satisfied, 100 ≤ X1 + X2 ≤ 260 (1), X1 = (the average particle size of the conductive powder (B1) / a tap density of the conductive powder (B1)) × (a content of the conductive powder (B1) with respect to a total mass of the conductive powder (B)), X2 = (the average particle size of the conductive powder (B2) / a tap density of the conductive powder (B2)) × (a content of the conductive powder (B2) with respect to the total mass of the conductive powder (B)).
Owner:FUJIKURA KASEI CO LTD

Stretchable substrate, stretchable device, and method for producing same

A stretchable substrate having a first main surface and a second main surface facing opposite of each other, wherein the stretchable substrate satisfies at least one of (1) to (4): (1) at least either the first main surface or the second main surface has an oxygen atomic proportion of 5 at % or more with respect to all atoms as measured by X-ray photoelectron spectroscopy; (2) the first main surface or the second main surface has an arithmetic average surface roughness of 6 μm or more as measured with a laser microscope; (3) at least either the first main surface or the second main surface includes a metal-containing portion containing a metal atom; or (4) a metal-containing region containing a metal atom that is positioned along at least either the first main surface or the second main surface.
Owner:MURATA MFG CO LTD

Band-to-capsule connection techniques and assembly methods for a wrist-wearable device

An example band portion of a wrist-wearable device includes a flexible printed circuit (FPC) board, a mounting plate, a structural component coupled to a capsule portion of the wrist-wearable device, and one or more electrodes. The one or more electromyography sensors each include one or more electrodes configured to couple to the FPC board. The wrist-wearable device also includes a strain relief layer coupled to the FPC board. A first portion of the strain relief layer is configured to secure the mounting plate within the strain relief layer and the mounting plate includes at least one recess for engaging the mounting plate with a structural component of the band portion, the mounting plate configured to couple the strain relief layer to the structural component.
Owner:META PLATFORMS TECHNOLOGIES LLC

Connector, connector unit, and method for connecting a connector to a connection board.

To realize a connector that contributes to improving signal transmission characteristics. [Solution] The connector (2) of the present disclosure comprises a contact assembly (12) having an insulating member (23) that holds a first contact group (21) and a second contact group (22). The insulating member (23) has a main body portion (23a) that holds the first contact group (21) and the second contact group (22), a protruding portion (23b) that protrudes from the main body portion (23a), an engaged portion (23f) into which the engaging portion (3d) of the connecting substrate (3) engages, and a contact portion that contacts the side surface of the connecting substrate (3). The engaged portion (23f) sandwiches the side of the connecting substrate (3). The ends of the first contact group (21) and the second contact group (22) that connect to the connecting substrate (3) are positioned between the protruding portions (23b) in a state that protrudes from the insulating member (23).
Owner:JAPAN AVIATION ELECTRONICS IND LTD