The present invention provides a light-emitting element lamp 1 capable of preventing a temperature rise of a substrate 9, on which light-emitting elements 4 are mounted, by effectively utilizing a thermally conductive casing 2 and a thermally conductive cover 5.
The light emitting element lamp 1 includes a thermally conductive casing 2, a light source part 3, a thermally conductive cover 5, and an insulative cover 6. The thermally conductive casing 2 includes an irradiation opening 2b, is formed so as to be widened toward the irradiation opening 2b, has its outer circumferential surface exposed outwardly, and has a substrate mounting part 2c secured on its inner circumferential surface. The light source part 3 has a substrate 9 having the light-emitting elements 4 mounted thereon and causes the substrate 9 to be thermally coupled to and attached to the substrate mounting part 2c of the thermally conductive casing 2. The thermally conductive cover 5 is thermally coupled to and connected to the outer circumferential surface of the thermally conductive casing 2 in a surface-contacted state. The insulative cover 6 has one end side thereof connected to the thermally conductive cover 5, and the cap 7 is connected to the other end side thereof. The lighting circuit 12 controls lighting of the light-emitting elements 4 accommodated in the insulative cover 6.