827results about How to "Effective cooling" patented technology

A multiphase inverter has two card shaped arm modules facing each other along a stacking direction. Each module has semiconductor switching elements disposed along an element arranging direction substantially perpendicular to the stacking direction, a common heat sink plate connecting direct current electrodes of the elements with one of terminals of the power source, and phase heat sink plates connecting respective alternating current electrodes of the elements with respective multiphase terminals of a motor. The elements of each module correspond to all phases of an alternating current. Each common heat sink plate forms a principal surface of the corresponding module, and the phase heat sink plates of each module forms another principal surface. The principal surfaces of each module face each other along the stacking direction.

An electro-optical device includes a display panel having an electro-optical layer, a first resin film stacked on the display panel to cover a first surface on the side of a display area of the display panel, and a second resin film stacked on the display panel to cover a second surface opposite the first surface, and at least one reinforcing member disposed on at least one of the first resin film and the second resin film.

The present invention provides a heat dissipating housing for electronic circuits and associated components, wherein the housing includes a top, two side panels, and a bottom to form a cavity or chamber for installing therein electronic circuit boards and the like. A first end panel and a second end panel, which are attached to opposite ends of the housing, complete the housing enclosure. For superior heat dissipation efficiency, a fan or other air moving device is attached to the housing to move air through the housing. The housing structure and the electronic components positioned therein are configured so as to direct the cooling air in multiple passes through the housing in a serpentine manner before exiting the housing. The multiple pass feature of the present invention provides superior cooling for the electronic components installed inside the housing.

A thermally enhanced semiconductor package and a fabrication method thereof are provided. A plurality of conductive bumps are formed on bond pads on an active surface of a chip. A heat sink is attached to an inactive surface of the chip and has a surface area larger than that of the chip. An encapsulation body encapsulates the heat sink, chip and conductive bumps, while exposing a bottom or surfaces, not for attaching the chip, of the heat sink and ends of the conductive bumps outside. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with a plurality of openings for exposing predetermined portions of the conductive traces. A solder ball is implanted on each exposed portion of the conductive traces.

A semiconductor light emitting device package includes a substrate with a core and a copper layer overlying the core. The light emitting device is connected to the substrate directly or indirectly through a wiring substrate. The core of the substrate may be, for example, ceramic, Al₂O₃, AlN, alumina, silicon nitride, or a printed circuit board. The copper layer may be bonded to the core by a process such as direct bonding of copper or active metal brazing.

A liquid crystal display device includes a support main having a rectangular frame shape, a reflection plate in the support main, a light guide plate over the reflection plate, a light-emitting diode (LED) assembly including LEDs arranged along a light-incident surface of the light guide plate and a metal core printed circuit board (MCPCB) on which the LEDs are mounted, a thermal conductive means contacting the MCPCB and having a thermal conductivity within a range of 1.5 to 3 W/m·K, a plurality of optical sheets over the light guide plate, a liquid crystal panel over the plurality of optical sheets, a cover bottom at a rear surface of the reflection plate and having a bottom wall and at least one side wall perpendicular to the bottom wall, wherein heats are conducted from the thermal conductive means to the at least one side wall, and a top cover covering edges of a front surface of the liquid crystal and combined with the support main and the cover bottom.

A centrifugal fan is mounted to an inner plate of a centrifugal clutch as a heat-generating rotating device, and an intake port of a casing is formed near a front side in the axial direction of the centrifugal fan. The centrifugal fan includes a base plate connected to the inner plate of the centrifugal clutch, plural fins formed on the base plate, blow-off holes each formed between arbitrary adjacent fins and extending axially through the base plate, and guide walls for guiding a radially outward air flow over the base plate into the blow-off holes. Air just after admitted from the intake port passes through the blow-off holes and is blown against the centrifugal clutch.

A bicycle disc brake rotor basically has an outer portion and a cooling fin. The outer portion has first and second base surfaces facing in opposite axial directions. The cooling fin is disposed radially offset from at least one of the first and second braking surfaces.

A headlamp (1) includes a semiconductor laser (3); a light-emitting element (7) that emits light in response to laser light emitted from the semiconductor laser (3); a heat-conducting member (13) that receives heat generated by the light-emitting element (7) through a light-emitting-element facing surface (13a); and a gap layer (15) that is disposed between the light-emitting element (7) and the light-emitting-element facing surface (13a) and that conducts the heat generated by the light-emitting element (7) to the light-emitting-element facing surface (13a). The gap layer (15) contains at least an inorganic amorphous material.

A lighting fixture utilizing LED light sources for illumination of commercial, outdoor and other large area applications incorporates efficient heat dissipation and improved convective air flow. An integrated heat transfer assembly is disclosed that is configured to enhance heat dissipation by providing an efficient thermal conductive pathway for radiation of heat to an external environment. The lighting fixture body is configured with a lens body and heat sink having a chimney tube with internally facing finned heat sink arrangement for providing enhanced convective air flow through the light fixture body. When the heat sink transfers heat from the LED light sources during operation so as to create heated air surrounding the heat sink, ambient air is drawn through the chimney and the heated air is exhausted through air gaps so as to create a conductive air current with the environment. The heat sink fins are configured to enhance the natural air draw through the chimney by tapering the surface areas of the fins.

A wet scrubber having a series of chambers for capturing and cooling exhaust gases generated during static test firing of rocket motors. Exhaust gas enters an inlet to a first chamber and is cooled and slowed by a spray solution. HCL gas is condensed and absorbed by the spray solution and precipitates to a liquid slurry at the bottom of the device. The remaining exhaust products enter a demister chamber where nozzles continue to spray the gasses as they pass upward and through a mesh-style demister at the top of the vessel. The demister filters liquid and solid waste particles from the gas stream, and the clean, dry gases are accelerated through a centrifugal fan into the atmosphere. A deflector is positioned within the inlet to the first chamber for containing parts in the event of a motor mal-function.

A direct expansion geothermal heat exchange unit, which can be placed in sub-surface ground and/or water, consisting of at least one insulated refrigerant liquid/fluid line, with a liquid trap at the bottom of the liquid/fluid line, with at least one un-insulated refrigerant vapor/fluid line operatively connected to the insulated liquid/fluid line at a point above the liquid trap, where the un-insulated vapor/fluid line is in thermal contact with its adjacent sub-surface surrounding elements by means of a heat conductive fill material inserted as necessary to fill any void space, in any borehole or excavated area, between the vapor/fluid line and its respective adjacent sub-surface surroundings.

A method for managing the charging of a battery array 100, including the steps of: charging the battery array with a constant current at maximum rating 101; monitoring the status of a plurality of partitions among the battery array for overheating conditions 102; reducing the charging current to turn off charge balancing when overheat conditions are detected in any of the partitions 105; maintaining the charging current when overheat conditions are eliminated in all of the partitions 103; and repeating the steps of reducing and maintaining charging current until the charging current reaches the optimum rating where heat generated thereby can be tolerated.

A backlight system usable in a display positionable in an upright manner, and an LCD employing the backlight system. The backlight system includes a plurality of light emitting device arrangement lines, each line including a plurality of light emitting devices, and a plurality of heat pipes each mounted along one of the plurality of light emitting device arrangement lines, and the plurality of light emitting device arrangement lines and the corresponding mounted heat pipe form a predetermined angle with respect to a horizontal direction such that a movement of working fluid condensed in the heat pipe is accelerated by gravity.

In a hand warmer, a heat dissipating plate is thermally coupled to a heater that is supplied with current by a battery that is accommodated in a case. The battery is a box-shaped rechargeable battery of a box-shaped rechargeable lithium-ion battery or lithium-polymer battery that has flat surfaces opposed to each other. The heater is a heating element that is opposed to the flat surface of the battery. A shielding plate is arranged between the heating element and the flat surface of the battery. The heat dissipating plate that is thermally coupled to the heating element is secured to the case on the surface side of the case. In the hand warmer, the flat surface of the box-shaped rechargeable battery, the shielding plate and the heat dissipating plate are arranged in a stack structure. The heat dissipating plate is heated by the heating element.

A serpentine cooling circuit is formed in a gas turbine blade to cool portions of the tip shroud, primarily the fillet between the airfoil and the tip shroud and the shroud edges.

The present invention provides an illumination device that includes a light source (11) incorporating light emitting elements, a support member (13), an anisotropic heat conduction layer (14) formed on at least a part of a surface of the support member (13) and is configured so that a thermal conductivity thereof in a surface direction is higher than a thermal conductivity thereof in a thickness direction, and a heat radiation layer (15) formed on a part of a surface of the anisotropic heat conduction layer, and the illumination device is characterized in that the light source (11) is disposed on a part of the surface of the anisotropic heat conduction layer. This makes it possible to efficiently radiate heat generated by the light emitting elements, and provides the illumination device with high degree of freedom in designing devices that make use of the light source.

Structure and method for fabrication of a leadless chip carrier have been disclosed. A disclosed embodiment comprises a substrate having a top surface for receiving a semiconductor die. The disclosed embodiment also comprises a printed circuit board attached to a bottom surface of the substrate. The disclosed embodiment further comprises at least one via in the substrate, which provides an electrical connection between a signal bond pad of the semiconductor die and the printed circuit board. The at least one via also electrically connects a substrate bond pad and the printed circuit board. The substrate bond pad is further connected to the signal bond pad of the semiconductor die by a signal bonding wire. The at least one via further provides an electrical connection between the signal bond pad of the semiconductor die and a land that is electrically connected to the printed circuit board.

Lamps and bulbs are disclosed generally comprising different combinations and arrangements of a light source, a reflective optical element, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of an arrangement of LEDs. The lamps according to the present invention can also comprise thermal management features that provide for efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps can also comprise optical elements to help change the emission pattern from the generally directional pattern of the LEDs to a more omni-directional pattern.

The information storage apparatus has an internal structure and arrangement of fans in consideration of the cooling effect. The capacity of the entire apparatus can be smaller than that of a conventional apparatus and an optimum air channel can be formed so as to maintain reliability of performance, life and the like of components at high temperatures. Further, relatively speaking, a module which does not produce a large amount of heat and does not require cooling is provided in a front stage of the channel while a module including heat-producing components and a cooling fan is provided in a rear stage of the channel.

A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high power density device and rejecting the heat at a heat sink located at a distance. The system may make use of a thermoelectric generator to power the electromagnetic pumps by utilizing the temperature difference between the inlet and outlet pipes of the heat sink. The system also provides networks of primary and secondary closed conduits having series and parallel arrangements of electromagnetic pumps for dissipating heat from multiple devices at a remotely located heat sink.

An optical device includes a base and an optical element. The base has a through hole in a center and includes leads and a resin. Each lead has an L-shaped cross-section and is formed by an inner lead extending from the center toward a peripheral edge and an outer lead connected to the inner lead and extending downward. The optical element is provided under the base so as to correspond to the through hole. Electrode pads of the optical element are connected to the leads of the base through bumps, respectively. The resin is formed so as to cover respective inner ends of the leads and respective front surfaces of the inner leads and to fill a gap between adjacent leads, and respective outer ends of the leads and respective front surfaces of the outer leads are exposed.

By using the same liquid for cooling and lubricating a feed shaft, a simpler structure is obtained, thereby allowing easier maintenance. A feed shaft that is rotatably supported at one end thereof moves a slide of a machine tool. The feed shaft is supported by a support member via a bearing. A pipe is fitted to the feed shaft, and a pathway space is provided allowing the reciprocal flow of the cooling/lubricating liquid in the axial direction. Some of the cooling/lubricating liquid supplied via the support member to the feed space passes through the pathway space as cooling liquid, cools the feed shaft, and is held in a discharge space. At the same time, some of the cooling/lubricating liquid flows, as lubricating liquid, into the bearing, is discharged, and is held in a discharge space. The cooling/lubricating liquid in the discharge space that has absorbed the heat of the structure is immediately discharged out of the support member.

An electronic appliance includes a circuit board mounted with an electronic-circuit component. The circuit board is covered with a shield, and a metallic heat-dissipating member is arranged on the electronic-circuit component. The shield is grounded on the circuit board, and arranged such that at least one of the surfaces is in the vicinity of the heat-dissipating member. The heat-dissipating member is grounded on the circuit board by a ground member, and at the periphery of the ground member, magnetic members are arranged.

The present invention relates to a heat-dissipating tape to be used in a variety of electronic products so as to dissipate heat from said electronic products, and to a method for manufacturing the heat-dissipating tape. The heat-dissipating tape of the present invention comprises: a metal mesh base; and a heat-dissipating paint layer, wherein the heat-dissipating paint layer is formed on one side or either side of the metal mesh base. In addition, the heat-dissipating tape of the present invention comprises: a metal mesh base; a heat-dissipating paint layer; and an adhesive layer, wherein the heat dissipating paint layer is formed on one side or either side of the metal mesh base, and the adhesive layer is made of thermally conductive adhesives.; The heat-dissipating tape of the present invention is thin, dissipates heat in a vertical direction with respect to a heat-generating source to thereby achieve improved heat-dissipating effects, and has superior adhesion.

An integrated motherboard for a small form factor computer comprises a CPU socket located in a central region of the motherboard. A south bridge/north bridge chipset is located next to the CPU socket towards the front of the motherboard, and a memory module is located next to the south bridge/north bridge chipset towards the front of the motherboard. One or more PCI slots are located on one side of the CPU socket, and a power module is located on the other side of the CPU socket.

The invention relates to an integrally-packaged power semiconductor device. A top source electrode of an inverted low-end MOSFET (Metal-Oxide-Semiconducotr Field Effect Transistor) chip is electrically connected to the top surface of a chip base; a bottom drain electrode of a high-end MOSFET chip or a top source electrode of the inverted high-end MOSFET is electrically connected with a bottom drain electrode of the low-end MOSFET chip through a first metal connecting plate; a second metal connecting plate is stacked on the high-end MOSFET chip; and the chip base is also provided with a control chip and is electrically connected with the electrodes of the high-end MOSFET chip and the low-end MOSFET chip. According to the invention, a plurality of chips are stereoscopically packaged so as to reduce the whole size of the semiconductor device; in addition, the product performance of the semiconductor device is improved by largening the size of each chip in a packaging body which has the same size as that of the chip; and because the top source electrode of the low-end MOSFET chip and the top surface of the chip base are connected, the bottom surface of the packaged and exposed chip base is connected with a ground electrode, and the shape of the exposed bottom surface is simplified, and the area of the exposed bottom surface is maximized so as to facilitate heat dissipation.

The present invention provides a light-emitting element lamp 1 capable of preventing a temperature rise of a substrate 9, on which light-emitting elements 4 are mounted, by effectively utilizing a thermally conductive casing 2 and a thermally conductive cover 5.

The light emitting element lamp 1 includes a thermally conductive casing 2, a light source part 3, a thermally conductive cover 5, and an insulative cover 6. The thermally conductive casing 2 includes an irradiation opening 2b, is formed so as to be widened toward the irradiation opening 2b, has its outer circumferential surface exposed outwardly, and has a substrate mounting part 2c secured on its inner circumferential surface. The light source part 3 has a substrate 9 having the light-emitting elements 4 mounted thereon and causes the substrate 9 to be thermally coupled to and attached to the substrate mounting part 2c of the thermally conductive casing 2. The thermally conductive cover 5 is thermally coupled to and connected to the outer circumferential surface of the thermally conductive casing 2 in a surface-contacted state. The insulative cover 6 has one end side thereof connected to the thermally conductive cover 5, and the cap 7 is connected to the other end side thereof. The lighting circuit 12 controls lighting of the light-emitting elements 4 accommodated in the insulative cover 6.

A radial flow heat exchanger for heating or cooling a fluid includes a sealed fluid manifold for passage of fluid. A sealed fluid receiving hub is spaced interiorly of the interior peripheral portion of the manifold and includes a passageway for passage of fluid into or out of the heat exchanger. A plurality of separate and spaced fluid flow tubes are disposed between the manifold and the hub. Each of the tubes are in sealed fluid communication with the manifold at one end and the other end is in sealed fluid communication with the hub. A fin assembly is positioned between the manifold and the hub and includes a heat conducting material arranged at spaced intervals between the manifold and the hub, the heat conducting material including a plurality of spaced apertures through which tubes pass. The heat conducting material is in intimate heat conducting contact with the tubes whereby fluid flowing between the manifold and the hub flows into each of the tubes in a radial direction between the manifold and the hub and wherein the heat conducting material of the fin assembly operates to give up or pick up heat from the fluid through the wall of the tubes.

A heat exchanger assembly is provided including a multi-function boiling chamber having a top wall and a bottom wall parallel to the top wall and a first side wall and a second side wall both extending inwardly from the bottom wall to the top wall and a pair of end walls closing the chamber. First and second condensing tubes attached to the first and second side walls, respectively, of the boiling chamber have an elongated width presenting an upper surface and a lower surface and extend in opposite respective directions to distal ends of the tubes at an inclined angle relative to the bottom wall of the boiling chamber. The condensing tubes include a plurality of channels across the width and extending from the boiling chamber to the distal end of the tube. A tank disposed at each of the distal ends of the condensing tubes is in fluid communication with the channels tubes. Upper air fins extending upwardly in a plane containing the top wall of the boiling chamber and lower air fins extending downwardly in a plane containing the bottom wall of the boiling chamber engage the respective upper and lower surfaces of both condensing tubes between the respective side walls of the boiling chamber and a position adjacent the respective distal ends of the condensing tubes.