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A heat dissipating apparatus for lighting utility includes a casing, a light-focusing unit, a light-reflecting unit, a heat-dissipating unit, a light generator, a wind generator, a cover and a circuit board. The heat-dissipating unit absorbs a heat generated from the light generator, the wind generator circulates air outside the casing and inside the casing, whereby the heat absorbed by the heat-dissipating unit is dissipated outside the casing.

A light emitting device has: a light emitting element; a lead that is electrically connected to the light emitting element at its one end and serves as a terminal to supply a power source to the light emitting element; a metal base that the light emitting element is mounted thereon and radiates heat of the light emitting element; and a sealing member that is of transparent resin or glass and covers the light emitting element. The lead is secured to the metal base by a heat-resisting insulating member with a thermal expansion coefficient nearly equal to that of the metal base.

A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section. The thermal energy generated by the LEDs is conducted from the heat exchange base to the heated section of the heat pipe, whereby allowing the working fluid in the heat pipe to be heated and vaporized, and flows, from the conducting section to the cooling section for dissipation at the heat dissipation module.

A light-emitting device (10) using an LED is proposed. This light-emitting device (10) is provided with a packaging substrate (1), a light-emitting element (2) which is mounted on this packaging substrate (1) with its face down, a fluorescent member (3) that is arranged face to face with a light-extracting surface (S) of the light-emitting element (2) without contacting the light-emitting element (2) and an optical member (4) which receives light that has been emitted from the light-emitting element (2) and made incident thereon through the fluorescent member (3), and aligns the incident light toward the outside of the device. Light, emitted from the light-emitting element (2), is made incident on the fluorescent member (3) to excite the fluorescent material so that the fluorescent material re-emits light having a wavelength different from that of the incident light. Those light rays, emitted from the light-emitting element (2), which have not been absorbed by the fluorescent member (3) and have passed through the fluorescent member (3) and those light rays that have been emitted from the fluorescent material are made incident on the optical member (4) and are aligned. Because the fluorescent member (3) is not made in contact with the light-emitting element (2), it does not receive the heat from the light-emitting element (2) through heat conduction, and consequently becomes less susceptible to degradation due to heat. Moreover, with the face-down mounting structure, the fluorescent member (3) and the optical member (4) can be placed closer to the light-emitting element (2) as long as they dose not contact the light-emitting element (2). Consequently, the service life of the fluorescent material or the fluorescent-material-mixed resin that tends to deteriorate can be lengthened, lights can be extracted more efficiently, and light rays can be properly aligned in a predetermined direction.

Disclosed is a high power LED package. In the LED package, a lower board has a heat radiation member in an LED mounting area and at least one via hole around the heat radiation member. First and second bottom electrodes are formed in the underside of the lower board, and connected to the heat radiation member and the via hole. An insulation layer is formed on the lower board to cover the heat radiation member. First and second electrode patterns on the insulation layer are connected to the first and second bottom electrodes through the via hole.

The present invention provides a radiator for a light emitting unit, annexed to the light emitting unit including a multiplicity of light emitting diodes mounted on substantially the same axis line on a first principal surface of a wiring substrate. The radiator includes a radiating plate and a heat pipe. The radiating plate is combined with the wiring substrate, with a first principal surface faced as a faying surface to a second principal surface opposite to the first principal surface of the wiring substrate, and is provided with a heat pipe fitting portion. The heat pipe is mounted into the heat pipe fitting portion of the radiating plate while keeping close contact with the inner wall of the heat pipe fitting portion. The heat generated from the light emitting diode group is transferred to a radiating means through the radiating plate and the heat pipe.

This invention relates to a method of straddling an intraosseous nerve with an energy transmitting device to improve the therapeutic treatment of the nerve.

The present invention is related to an UV LED curing apparatus, and more particularly, to an UV LED curing apparatus with improved housing and switch controller. The UV LED curing apparatus of the present invention is preferably provided for curing UV hardening gel applied onto the nails of multiple fingers or toes all at once and with automatic controls; the UV LED curing apparatus comprises a light reflective inner casing enclosing a curing chamber having a front opening, an outer casing detachably attached to the inner casing and an UV LED light source disposed on the inner casing and capable of providing an illumination covering a large space in the curing chamber. The automatic controls of the apparatus may be achieved by a switch controller having a photo interrupter, timer and current regulator such that the UV light from the UV LED light source is triggered to an on-state by the sensor of the photo interrupter and switched to an off-state by the timer and current regulator with reference to a preset curing time automatically. The UV LED light source is preferably to be of a wavelength between 360 nm and 460 nm. The light reflective inner casing is preferably provided as an effective UV light reflector and as a supporting substrate of the UV LED light source while being capable of transmitting heat from the UV LED light source away for further heat dissipation to the ambient by the outer casing. The outer casing is detachably attached to the inner casing and allows a greater user interaction for decorative and entertainment purposes while also being a protective and heat dissipation means.

A solid state lighting subassembly or fixture includes an anisotropic heat spreading material. A heat spreading layer may be placed between a light emitting diode (LED) and luminaire or reflector and serves to spread heat laterally away from the LED. Low profile, low weight heat spreading may be utilized both to retrofit existing light fixtures with. LEDs or to replace existing incandescent and fluorescent fixtures with LED based fixtures.

A multiphase inverter has two card shaped arm modules facing each other along a stacking direction. Each module has semiconductor switching elements disposed along an element arranging direction substantially perpendicular to the stacking direction, a common heat sink plate connecting direct current electrodes of the elements with one of terminals of the power source, and phase heat sink plates connecting respective alternating current electrodes of the elements with respective multiphase terminals of a motor. The elements of each module correspond to all phases of an alternating current. Each common heat sink plate forms a principal surface of the corresponding module, and the phase heat sink plates of each module forms another principal surface. The principal surfaces of each module face each other along the stacking direction.

A flat heat pipe has a vacuum chamber, an evaporator connected to a heating element, and a condenser connected to a cooling device. The vacuum chamber is provided in an interior with a wick structure and a working fluid by which an evaporation-condensation cyclic process is effected. The vacuum chamber is further provided in the interior with a plurality of heat conduction pillars, which are confined to the area of the evaporator and are connected with an upper wall and a lower wall of the interior of the chamber. The heat conduction pillars serve to enhance the heat conduction to the condenser from the evaporator.

The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external point of electrical connection to buried package leads. Lead carriers are formed with apertures that partially surround each lead and electrically and thermally couple conductive elements or traces in the lead carrier to each package lead. Optionally thin layers of thermally conductive adhesive located between the lead carrier and adjacent packages facilitates the transfer of heat between packages and to the lead carrier. Lead carriers may be formed of custom flexible circuits having multiple layers of conductive material separated by a substrate to provide accurate impedance control and providing high density signal trace routing and ball-grid array connection to a printed wiring board.

A heat-conductive sheet comprising a cured or semi-cured binder wherein a carbon fiber is orientated in the direction of the thickness of the heat-conductive sheet. This heat-conductive sheet exhibits a high anisotropic heat conductivity along the direction of the thickness thereof to thereby enable efficiently releasing heat from a heating element such as a semiconductor element or semiconductor package. Moreover, the heat-conductive sheet is excellent in not only heat resistance, durability and mechanical strength but also adherence to the heating element.

Disclosed is a preferred mold design for producing plastic, molded preforms, which may be blow-molded into a container of a final, desired shape. A preferred mold includes a temperature control system for maintaining the preform mold at a desired temperature. The temperature control system can pass fluid through channels within the preform mold to cool plastic that is injected into the preform mold. In some arrangements, a mold comprises a neck finish mold, the neck finish mold comprising high heat transfer material positioned to transfer heat away from melt within a mold cavity of the mold.

An electro-optical device includes a display panel having an electro-optical layer, a first resin film stacked on the display panel to cover a first surface on the side of a display area of the display panel, and a second resin film stacked on the display panel to cover a second surface opposite the first surface, and at least one reinforcing member disposed on at least one of the first resin film and the second resin film.

A surface light-source device (50) includes: a plurality of point light sources (2); a light-guide plate (4) arranged for emitting from its emitting surface the light incident on one lateral side thereof from the point light sources (2); a lower case (10) having a lateral side formed approximately in parallel to the incident surface of the light-guide plate (4); and a light-source substrate (3) on which the plurality of point light sources (2) are arranged at predetermined intervals, disposed on the light-guide plate (4) side; wherein the surface light-source device (50) is provided with a substrate holder (8) that clamps the light-source substrate (3) and the lateral side of the lower case (10) by projections arranged on the substrate holder (8) between adjacent two of the light sources (2).

A lighting device contains a plurality of light emitting sources mounted on a thermally conductive housing and electrically connected to a circuit board. The housing includes a base portion which is spaced apart from the circuit board, and an intermediate heat dissipation structure which is disposed between the circuit board and the base portion of the housing, for promoting cooling by convection. The plurality of light emitting sources are in thermal communication with the intermediate heat dissipation structure.

A liquid crystal display (“LCD”) module includes a backlight assembly emitting light, a LCD panel overlapping the backlight assembly, and an upper cover. The backlight includes a light source module emitting the light, a light guide plate (“LGP”) including edges and a middle portion, and a LGP support overlapping the edges of the LGP. The LGP support includes a plurality of LGP supporting pieces connected to each other so as to form a polygonal shape, each of the LGP supporting pieces including a LGP supporting portion including a LGP supporting surface overlapping the edges of the LGP, and the LGP supporting surfaces of each of the LGP supporting pieces of the LGP support are placed on a same plane. Opposing LGP supporting pieces are interconnected by an LCD module mounting member.

The T-bar includes an elongate rigid spine extending between terminal ends including either a fixed anchor or adjustable anchor for attachment to adjacent T-bars or other supports. An upper heat sink is provided on an upper portion of the spine to enhance heat transfer from the T-bar to air surrounding upper portions of the T-bar. A light housing is provided on a lower portion of the T-bar which is configured to support a lighting module therein, such as a light emitting diode (LED) light. A lower heat sink is provided above this light housing and integrated into a rest shelf which supports ceiling tiles adjacent the T-bar. A power supply is provided which can be removably attached to the T-bar and provide appropriately conditioned power for the lighting module.

The present invention provides a heat dissipating housing for electronic circuits and associated components, wherein the housing includes a top, two side panels, and a bottom to form a cavity or chamber for installing therein electronic circuit boards and the like. A first end panel and a second end panel, which are attached to opposite ends of the housing, complete the housing enclosure. For superior heat dissipation efficiency, a fan or other air moving device is attached to the housing to move air through the housing. The housing structure and the electronic components positioned therein are configured so as to direct the cooling air in multiple passes through the housing in a serpentine manner before exiting the housing. The multiple pass feature of the present invention provides superior cooling for the electronic components installed inside the housing.

A LED (light emitting diode) illumination device includes a ceramic substrate to integrate a plurality of LED dies and a control circuit together so that a volume of the LED illumination device can be reduced and the heat dissipation of the LED illumination device can be enhanced. The LED illumination device utilizes sound control to change the light emitted from each LED die, so that the illuminating light mixed from the emitting light of the LED dies of the LED illumination device can vary in color and brightness according to the tempo and volume of music, for example, to provide more cheerful and joyful feeling.