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667 results about "Multiple pass" patented technology

Creating optimized physical implementations from high-level descriptions of electronic design using placement-based information

An electronic design automation system provides optimization of RTL models of electronic designs, to produce detailed constraints and data precisely defining the requirements for the back-end flows leading to design fabrication. The system takes a RTL model of an electronic design and maps it into an efficient, high level hierarchical representation of the hardware implementation of the design. Automatic partitioning partitions the hardware representation into functional partitions, and creates a fully characterized performance envelope for a range of feasible implementations for each of the partitions, using accurate placement based wire load models. Chip-level optimization selects and refines physical implementations of the partitions to produce compacted, globally routed floorplans. Chip-level optimization iteratively invokes re-partitioning passes to refine the partitions and to recompute the feasible implementations. In this fashion, a multiple-pass process converges on an optimal selection of physical implementations for all partitions for the entire chip that meet minimum timing requirements and other design goals. The system outputs specific control and data files which thoroughly define the implementation details of the design through the entire back-end flow process, thereby guaranteeing that the fabricated design meets all design goals without costly and time consuming design iterations.
Owner:SYNOPSYS INC

Creating optimized physical implementations from high-level descriptions of electronic design using placement-based information

An electronic design automation system provides optimization of RTL models of electronic designs, to produce detailed constraints and data precisely defining the requirements for the back-end flows leading to design fabrication. The system takes a RTL model of an electronic design and maps it into an efficient, high level hierarchical representation of the hardware implementation of the design. Automatic partitioning partitions the hardware representation into functional partitions, and creates a fully characterized performance envelope for a range of feasible implementations for each of the partitions, using accurate placement based wire load models. Chip-level optimization selects and refines physical implementations of the partitions to produce compacted, globally routed floorplans. Chip-level optimization iteratively invokes re-partitioning passes to refine the partitions and to recompute the feasible implementations. In this fashion, a multiple-pass process converges on an optimal selection of physical implementations for all partitions for the entire chip that meet minimum timing requirements and other design goals. The system outputs specific control and data files which thoroughly define the implementation details of the design through the entire back-end flow process, thereby guaranteeing that the fabricated design meets all design goals without costly and time consuming design iterations.
Owner:MAGMA DESIGN AUTOMATION

Packaged chilling systems for building air conditioning and process cooling

Disclosed is a packaged chilling system for providing chilled water to an air conditioning system for a building that includes: a duct system; an air handling system; and a water chilling system; wherein: the duct system is in operable communication with a building that has a plurality of rooms, at least one of the rooms having a sensor for detecting the room air temperature in the room, the duct system comprising at least one supply duct for directing low temperature air from the air handling system to the building and at least one return duct for directing high temperature air from the building to the air handling system; the air handling system includes a plurality of air handling units, each air handling unit comprising an air inlet for receiving high temperature air from the building, a cooling coil that includes at least one conduit through which chilled water flows, the cooling coil having multiple passes and positioned for heat transfer contact with the high temperature air, and a fan for increasing the velocity of air in the air handling unit; the water chilling system is installed at a location proximate the building, and is operably connected to the air handling system; and the water chilling system includes a moveable support structure comprising a support base on which a plurality of water chilling system components are affixed, the components including at least one water chiller for lowering the temperature of water from a high temperature to a low temperature. This packaged chilling system may also be used to provide chilled water to industrial processes such as chemical plants, automotive plants, textile mills, paper mills, computer cooling, and factory air-conditioning.
Owner:TAS LTD
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