1572 results about "Sense amplifier" patented technology

A non-volatile memory device capable of reading and writing a large number of memory cells with multiple read/write circuits in parallel has an architecture that reduces redundancy in the multiple read/write circuits to a minimum. The multiple read/write circuits are organized into a bank of similar stacks of components. Redundant circuits such as a processor for processing data among stacks each associated with multiple memory cells are factored out. The processor is implemented with an input logic, a latch and an output logic. The input logic can transform the data received from either the sense amplifier or the data latches. The output logic further processes the transformed data to send to either the sense amplifier or the data latches or to a controller. This provides an infrastructure with maximum versatility and a minimum of components for sophisticated processing of the data sensed and the data to be input or output.

A DRAM-like non-volatile memory array includes a cell array of non-volatile cell units with a DRAM-like cross-coupled latch-type sense amplifier. Each non-volatile cell unit has two non-volatile cell devices with respective bit lines and source lines running in parallel and laid out perpendicular to the word line associated with the non-volatile cell unit. The two non-volatile cell devices are programmed with erased and programmed threshold voltages as a pair for storing a single bit of binary data. The two bit lines of each non-volatile cell unit are coupled through a Y-decoder and a latch device to the two respective inputs of the latch-type sense amplifier which provides a large sensing margin for the cell array to operate properly even with a narrowed threshold voltage gap. Each non-volatile cell device may be a 2 T FLOTOX-based EEPROM cell, a 2 T flash cell, 11 T flash cell or a 1.5 T split-gate flash cell.

A sense amplifier of a memory array may be provided to amplify data presented from storage cells of the memory array. Additionally, a sense amplifier latch may be provided to store data received from the sense amplifier. The sense amplifier may be enabled for operation by a sense amplifier enable signal that is distinct from a clock signal. Moreover, the latch enable signal of the sense amplifier latch may be controlled by the sense amplifier enable signal, such that the sense amplifier latch opens in response to activation of the sense amplifier and closes in response to deactivation of the sense amplifier.

A content addressable memory (CAM) device and process for searching a CAM. The CAM device includes a plurality of CAM cells, match-lines (MLs), search lines, and ML sense amplifiers. The ML sense amplifiers are capable of self-calibration to their respective thresholds to reduce effects of random device variation between adjacent sense amplifiers.

A sense amplifier-based flip-flop includes a first latch, a second latch, a floating reduction unit, an input signal applying unit, a ground switch and a delay reduction unit. The first latch outputs a signal to a first output terminal pair, and outputs an evaluation signal pair corresponding to an input single pair to the first output terminal pair. The second latch latches the evaluation signal pair and outputs the evaluation signal pair to a second output terminal pair. The floating reduction unit is controlled by signals of the first output terminal pair and is operationally connected between current passing nodes of the first latch to prevent the first output terminal pair from floating. The input signal applying unit is disposed between the current passing nodes and a ground terminal, and receives the input signal pair. The ground switch is disposed between the input signal applying unit and the ground terminal, and is controlled by the clock signal. The delay reduction unit is disposed between the input signal applying unit and the ground switch, and reduces a signal delay from when the clock signal to when the evaluation signal pair is output from the second output terminal pair.

One or more sense amplifiers for sensing the conduction current of non-volatile memory is controlled by signals that are timed by a reference sense amplifier having similar characteristics and operating conditions. In one aspect, a sensing period is determined by when the reference sense amplifier sensing a reference current detects an expected state. In another aspect, an integration period for an amplified output is determined by when the reference sense amplifier outputs an expected state. When these determined timings are used to control the one or more sense amplifiers, environment and systemic variations are tracked.

A sense amplifier latch may be provided to controllably latch the output of a sense amplifier. The latch may open in response to assertion of a latch enable signal to receive data, and close in response to deassertion of the latch enable signal to capture and store the received data. Additionally, a multiplexer may be provided to select from among multiple sources of test data, such as scan data and bypass data. The multiplexer may produce a test data input to the sense amplifier latch that encodes a data value and a control value that causes the data value to be selected. Depending on the state of the test data input, the sense amplifier latch may output either a value received from the sense amplifier or a value encoded in the test data input.

An integrated circuit design, structure and method for fabrication thereof includes at least one logic device layer and at least two additional separate memory array layers. Each of the logic device layer and the at least two memory array layers is independently optimized for a particular type of logic device or memory device disposed therein. Preferably also disposed within the logic device layer are array sense amplifiers, memory array output drivers and like higher performance circuitry otherwise generally disposed within memory array layer substrates. All layers may be independently powered to provide additional performance enhancement.

A design structure comprising an integrated circuit architecture, circuit structure, and/or instructions for fabrication thereof. The circuit structure includes at least one logic device layer and at least two additional separate memory array layers. Each of the logic device layer and the at least two memory array layers is independently optimized for a particular type of logic device or memory device disposed therein. Preferably also disposed within the logic device layer are array sense amplifiers, memory array output drivers and like higher performance circuitry otherwise generally disposed within memory array layer substrates. All layers may be independently powered to provide additional performance enhancement.

There are many inventions described and illustrated herein. In a first aspect, the present invention is a technique and circuitry for reading data that is stored in memory cells. In one embodiment of this aspect, the present invention is a technique and circuitry for generating a reference current that is used, in conjunction with a sense amplifier, to read data that is stored in memory cells of a DRAM device. The technique and circuitry for generating a reference current may be implemented using an analog configuration, a digital configuration, and/or combinations of analog and digital configurations.

A 3D memory device includes a plurality of ridge-shaped stacks, in the form of multiple strips of conductive material separated by insulating material, arranged as bit lines which can be coupled through decoding circuits to sense amplifiers. The strips of conductive material have side surfaces on the sides of the ridge-shaped stacks. A plurality of conductive lines arranged as word lines which can be coupled to row decoders, extends orthogonally over the plurality of ridge-shaped stacks. The conductive lines conform to the surface of the stacks. Memory elements lie in a multi-layer array of interface regions at cross-points between side surfaces of the conductive strips on the stacks and the conductive lines. The memory elements are programmable, like the anti-fuses or charge trapping structures. The 3D memory is made using only two critical masks for multiple layers.

A 3D memory device includes a plurality of ridge-shaped stacks, in the form of multiple strips of conductive material separated by insulating material, arranged as bit lines which can be coupled through decoding circuits to sense amplifiers. Diodes are connected to the bit lines at either the string select of common source select ends of the strings. The strips of conductive material have side surfaces on the sides of the ridge-shaped stacks. A plurality of word lines, which can be coupled to row decoders, extends orthogonally over the plurality of ridge-shaped stacks. Memory elements lie in a multi-layer array of interface regions at cross-points between side surfaces of the semiconductor strips on the stacks and the word lines.

The present invention discloses a testing circuit and method for thin film transistor display array, for testing the yield of thin film transistor array. The testing circuit comprising: An array tester, a test panel (DUT), a sense amplifier array. The sense amplifier is composed by a plurality of trans- impedance amplifier unit and a plurality of parasitic capacitance discharge circuit unit. Every sense amplifier includes: a trans-impedance amplifier, which is implemented by an operational amplifier, two switches and an operation capacitance, the trans-impedance amplifier is used to form an integrated circuit, the output is transmitted to a sampling/hold circuit via a switch; a parasitic capacitance discharge circuit is used to form a discharge rout for the charge of the parasitic capacitance.

A digital multibit non-volatile memory integrated system includes autozero multistage sensing. One stage may provide local sensing with autozero. Another stage may provide global sensing with autozero. A twisted bitline may be used for array arrangement. Segment reference may be used for each segment. The system may read data cells using a current sensing one or two step binary search. The system may use inverse voltage mode or inverse current mode sensing. The system may use no current multilevel sensing. The system may use memory cell replica sensing. The system may use dynamic sensing. The system may use built-in byte redundancy. Sense amplifiers capable of sub-volt (<<1V) sensing are described.

In the file storage system, each portion belonging to a data file is identified by its file ID and an offset along the data file, where the offset is a constant for the file and every file data portion is always kept at the same position within a memory page to be read or programmed in parallel. In this way, every time a page containing a file portion is read and copy to another page, the data in it is always page-aligned, and each bit within the file portion can always be manipulated by the same sense amplifier and same set data latches within the same memory column. In a preferred implementation, the page alignment is such that (offset within a page)=(data offset within a file) MOD (page size). Any gaps that may exist in page can be padded with any existing page-aligned valid data.

A semiconductor memory device includes: a device substrate having a semiconductor layer separated by a dielectric layer from a base substrate; a memory cell array having a plurality of memory cells formed and arranged on the semiconductor layer of the device substrate, each the memory cell having a MOS transistor structure with a body in an electrically floating state to store data based on a majority carrier accumulation state of the body; and a sense amplifier circuit configured to read out data of a selected memory cell in the memory cell array to store the read data in a data latch, then transfer the read data to an output circuit and write back the read data into the selected memory cell.

An array of non-volatile memory cells arranged in logical columns and logical rows, and associated circuitry to enable reading or writing one or more memory cells on a row in parallel. In some embodiments, the array of memory cells may include a phase change material. In some embodiments, the circuitry may include a write driver, a read driver, a sense amplifier, and circuitry to isolate the memory cells from the sense amplifier with extended refresh. In some embodiments, the circuitry may further include shift registers and one or more arithmetic logic units to provide a video memory.

Implantable medical devices (IMDs) having sense amplifiers for sensing physiologic signals and parameters, RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming and interrogation commands to and from an external programmer or other medical device are disclosed. At least one IC chip and discrete components have a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include forming notch filters of MEMS structures or forming discrete circuit notch filters by one or more of: (1) IC fabricating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate. The IC fabricated inductors are preferably fabricated as planar spiral wound conductive traces formed of high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with a ground plane of the IC chip. The spiral winding preferably is square or rectangular, but having truncated turns to eliminate 90° angles that cause point-to-point parasitic capacitances. The planar spiral wound conductive traces are further preferably suspended over the ground plane of the IC chip substrate by micromachining underlying substrate material away to thereby reduce parasitic capacitances.

A 3D memory device includes a plurality of ridges, in some embodiments ridge-shaped, in the form of multiple strips of conductive material separated by insulating material, arranged as bit lines which can be coupled through decoding circuits to sense amplifiers. The strips of conductive material have side surfaces on the sides of the stacks. A plurality of conductive lines arranged as word lines which can be coupled to row decoders, extends orthogonally over the plurality of stacks. The conductive lines conform to the surface of the stacks. Memory elements lie in a multi-layer array of interface regions at cross-points between side surfaces of the semiconductor material strips on the stacks and the conductive lines. The memory elements are programmable, like the anti-fuses or charge trapping structures. In some embodiments, the 3D memory is made using only two critical masks for multiple layers. Some embodiments include a staircase-shaped structure positioned at ends of the semiconductor material strips. Some embodiments include SSL interconnects on a metal layer parallel to the semiconductor material strips, and further SSL interconnects on a higher metal layer, parallel to the word lines.

The present invention provides a dual reference cell sensing scheme for non-volatile memory. A high voltage reference cell and a low voltage reference cell are individually coupled to two sense amplifiers for providing two distinct reference voltages for comparison against the memory cell voltage. The output of the two sense amplifiers is further connected to a second stage sense amplifier to determine the status of the memory. The dual reference cell sensing scheme provides an increased sensing window which increases performance under low voltage application. The dual reference cell sensing scheme can be implemented by either voltage-based, current-based, or ground.

An internal power supply circuit produces an internal power supply voltage from an external power supply voltage. A voltage level control circuit controls a voltage level and a temperature characteristic of the internal power supply voltage generated by the internal power supply circuit. The internal power supply circuit produces the internal power supply voltage having a negative or zero temperature characteristic in a low temperature region and a positive temperature characteristic in a high temperature region. The voltage level control circuit includes a structure optimizing a capacitance value of a sense power supply line stabilizing capacitance for driving a sense amplifier circuit, a level converting circuit determining the lowest operable region of the external power supply voltage of the internal power supply circuit, or a structure forcedly operating the internal voltage down converter upon power-on. The internal power supply voltage at a desired level is stably produced with a small occupied area and a low current consumption.

An apparatus is provided which integrates sensor functionality with an active matrix display such as an AMLCD. A conventional active matrix 6 of LCD pixels 10 is provided with standard display source and gate drivers 4 and 5. The display source driver 4 supplies data signals for generating the required pixel response to column electrodes 12 which are also connected to an output arrangement 19 including sense amplifiers 20. During a display phase of operation, the AMLCD operates conventionally with the matrix 6 being refreshed a row at a time and frame by frame. Between frames, the sense amplifiers 20 are enabled and the matrix 6 is again scanned by the gate driver 5. The characteristics of each pixel represent an external stimulus which is sensed by the relevant sense amplifier 20 and supplied at an output 23 of the arrangement.

A memory array with staggered local data/bit lines extending generally in a first direction formed in an upper surface of a substrate and memory cell access transistors extending generally upward and aligned generally atop a corresponding local data/bit line. Selected columns of the memory cell access transistors are sacrificed to define local data/bit access transistors which are interconnected with overlying low resistance global data/bit lines. The global data/bit lines provide selectable low resistance paths between memory cells and sense amplifiers. The sacrificed memory cell access transistors and staggered local data/bit lines provide increased footprints for sense amplifiers to facilitate increased circuit integration.

A phase change memory apparatus is presented. The phase change memory apparatus includes a phase change memory cell, a sense amplifier, and a voltage selecting unit. The sense amplifier is configured to differentially amplify a current that through the memory cell and a comparison voltage. The voltage selecting unit is configured to provide a reference voltage as the comparison voltage when performing a normal read function and to selectively provide either a first voltage level or a second voltage level as the comparison voltage in accordance with data when performing a verify read function.

A sense amplifier having a sampling circuit to sample the amplifier input signal; a reference node storing a reference signal corresponding to the input signal; and a timing circuit activating the sampling circuit for a predetermined interval, and admitting the reference signal to the reference node. The sense amplifier also can include a pump capacitor substantially maintaining a value of the reference signal; and a gain circuit coupled with the reference node and disposed to adaptively adjust gain of an output signal produced by the sense amplifier. The sense amplifier can be a single-ended sense amplifier.

A ferroelectric memory comprises a plurality of memory cells and circuitry to sense data thereof. Power supply decoupling circuitry may decouple supplies of the memory device during a portion of reading data. Additionally, ferroelectric domains of the memory cells may receive a series of polarization reversals to improve domain alignment and malleability. To drive reference cells of the memory with such polarization reversals, a multiplexer may be configured to swap a data bitline with a reference bitline so that reference cells may be accessed as regular data cells. While reading a ferroelectric memory, a self-timer circuit may monitor characteristics of the ferroelectric material and adjust an integration duration for a sense amplifier based on the monitored characteristics. A sampling-comparator may sample a signal related to the ferroelectric material at one instant, which may then be used subsequently thereafter by the self-timer circuit to influence an integration duration of the sense amplifier.

A semiconductor memory device includes a memory cell array including a plurality of memory cells having a DRAM cell structure and is treated as a SRAM memory device without controlling the data refreshing cycle for the memory cells. The refreshing cycle is separated into a read operation and a write operation, which sandwich therebetween a read/write operation for the input address of the memory cell. The data read in the refreshing cycle is saved in a refreshing sense amplifier during the read/write operation and stored in the memory cell after the read/write operation.

A memory may includes: word lines; bit lines; memory array blocks including memory cells, each memory array block being a unit of a data read operation or a data write operation; a row decoder configured to selectively drive the word lines; sense amplifiers configured to detect data; and an access counter provided for each memory cell block, the access counter counting the number of times of accessing the memory array blocks in order to read data or write data, and activating a refresh request signal when the number of times of access reaches a predetermined number of times, wherein during an activation period of the refresh request signal of the access counter, the row decoder periodically and sequentially activates the word lines of the memory array blocks corresponding to the access counter, and the sense amplifier performs a refresh operation of the memory cells connected to the activated word lines.

Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for reversible resistive memory cells that can be programmed based on magnitude, duration, voltage-limit, or current-limit of a supply voltage or current. These cells are PCM, RRAM, CBRAM, or other memory cells that have a reversible resistive element coupled to a diode. The diode can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diode. The memory cells can be used to construct a two-dimensional memory array with the N terminals of the diodes in a row connected as a wordline and the reversible resistive elements in a column connected as a bitline. By applying a voltage or a current to a selected bitline and to a selected wordline to turn on the diode, a selected cell can be programmed into different states reversibly based on magnitude, duration, voltage-limit, or current-limit. The data in the reversible resistive memory can also be read by turning on a selected wordline to couple a selected bitline to a sense amplifier. The wordlines may have high-resistivity local wordlines coupled to low-resistive global wordlines through conductive contact(s) or via(s).

An improved sense amplifier ad method for sensing signals in a silicon-on-insulator (SOI) integrated circuit improve the performance of semiconductor memories and other circuits implemented in SOI technology. The bodies of amplifier transistors within the sense amplifier and bodies of input transistors to the sense amplifier are coupled to corresponding input signals, eliminating the history dependance that would result from unconnected bodies, while achieving faster switching times due to a dynamically produced difference in threshold voltage of the input transistors and amplifier transistors. The switching time is improved over circuits using input transistors and amplifier transistors having statically biased bodies.