4473 results about "Sense amplifier" patented technology

A non-volatile memory device capable of reading and writing a large number of memory cells with multiple read/write circuits in parallel has an architecture that reduces redundancy in the multiple read/write circuits to a minimum. The multiple read/write circuits are organized into a bank of similar stacks of components. Redundant circuits such as a processor for processing data among stacks each associated with multiple memory cells are factored out. The processor is implemented with an input logic, a latch and an output logic. The input logic can transform the data received from either the sense amplifier or the data latches. The output logic further processes the transformed data to send to either the sense amplifier or the data latches or to a controller. This provides an infrastructure with maximum versatility and a minimum of components for sophisticated processing of the data sensed and the data to be input or output.

In a parallel operational processing device having an operational processing unit arranged between memory blocks each having a plurality of memory cells arranged in rows and columns, the respective columns of each memory block are alternately connected to the operational processing units on the opposite sides of the memory block. By selecting one word line in one memory block, data can be transferred to two operational processing units. The number of the word lines selected per one operational processing unit is reduced, and power consumption is reduced. The bit operation units and sense amplifiers/write drivers of the operational processing units have arrangement pitch conditions mitigated and are reduced in number, and an isolation region between the memory blocks is not required and the layout area is reduced. Thus, the parallel operational processing device with a layout area and the power consumption reduced, can achieve a fast operation.

A DRAM-like non-volatile memory array includes a cell array of non-volatile cell units with a DRAM-like cross-coupled latch-type sense amplifier. Each non-volatile cell unit has two non-volatile cell devices with respective bit lines and source lines running in parallel and laid out perpendicular to the word line associated with the non-volatile cell unit. The two non-volatile cell devices are programmed with erased and programmed threshold voltages as a pair for storing a single bit of binary data. The two bit lines of each non-volatile cell unit are coupled through a Y-decoder and a latch device to the two respective inputs of the latch-type sense amplifier which provides a large sensing margin for the cell array to operate properly even with a narrowed threshold voltage gap. Each non-volatile cell device may be a 2 T FLOTOX-based EEPROM cell, a 2 T flash cell, 11 T flash cell or a 1.5 T split-gate flash cell.

A sense amplifier of a memory array may be provided to amplify data presented from storage cells of the memory array. Additionally, a sense amplifier latch may be provided to store data received from the sense amplifier. The sense amplifier may be enabled for operation by a sense amplifier enable signal that is distinct from a clock signal. Moreover, the latch enable signal of the sense amplifier latch may be controlled by the sense amplifier enable signal, such that the sense amplifier latch opens in response to activation of the sense amplifier and closes in response to deactivation of the sense amplifier.

Various logic elements such as SR flip-flops, JK flip-flops, D-type flip-flops, master-slave flip-flops, parallel and serial shift registers, and the like are converted into non-volatile logic elements capable of retaining a current output logic state even though external power is removed or interrupted through the strategic addition of ferroelectric capacitors and supporting circuitry. In each case, the building blocks of a cross-coupled sense amplifier are identified within the logic element and the basic cell is modified and/or optimized for sensing performance.

A content addressable memory (CAM) device and process for searching a CAM. The CAM device includes a plurality of CAM cells, match-lines (MLs), search lines, and ML sense amplifiers. The ML sense amplifiers are capable of self-calibration to their respective thresholds to reduce effects of random device variation between adjacent sense amplifiers.

A sense amplifier-based flip-flop includes a first latch, a second latch, a floating reduction unit, an input signal applying unit, a ground switch and a delay reduction unit. The first latch outputs a signal to a first output terminal pair, and outputs an evaluation signal pair corresponding to an input single pair to the first output terminal pair. The second latch latches the evaluation signal pair and outputs the evaluation signal pair to a second output terminal pair. The floating reduction unit is controlled by signals of the first output terminal pair and is operationally connected between current passing nodes of the first latch to prevent the first output terminal pair from floating. The input signal applying unit is disposed between the current passing nodes and a ground terminal, and receives the input signal pair. The ground switch is disposed between the input signal applying unit and the ground terminal, and is controlled by the clock signal. The delay reduction unit is disposed between the input signal applying unit and the ground switch, and reduces a signal delay from when the clock signal to when the evaluation signal pair is output from the second output terminal pair.

One or more sense amplifiers for sensing the conduction current of non-volatile memory is controlled by signals that are timed by a reference sense amplifier having similar characteristics and operating conditions. In one aspect, a sensing period is determined by when the reference sense amplifier sensing a reference current detects an expected state. In another aspect, an integration period for an amplified output is determined by when the reference sense amplifier outputs an expected state. When these determined timings are used to control the one or more sense amplifiers, environment and systemic variations are tracked.

A sense amplifier latch may be provided to controllably latch the output of a sense amplifier. The latch may open in response to assertion of a latch enable signal to receive data, and close in response to deassertion of the latch enable signal to capture and store the received data. Additionally, a multiplexer may be provided to select from among multiple sources of test data, such as scan data and bypass data. The multiplexer may produce a test data input to the sense amplifier latch that encodes a data value and a control value that causes the data value to be selected. Depending on the state of the test data input, the sense amplifier latch may output either a value received from the sense amplifier or a value encoded in the test data input.

An integrated circuit design, structure and method for fabrication thereof includes at least one logic device layer and at least two additional separate memory array layers. Each of the logic device layer and the at least two memory array layers is independently optimized for a particular type of logic device or memory device disposed therein. Preferably also disposed within the logic device layer are array sense amplifiers, memory array output drivers and like higher performance circuitry otherwise generally disposed within memory array layer substrates. All layers may be independently powered to provide additional performance enhancement.

A design structure comprising an integrated circuit architecture, circuit structure, and/or instructions for fabrication thereof. The circuit structure includes at least one logic device layer and at least two additional separate memory array layers. Each of the logic device layer and the at least two memory array layers is independently optimized for a particular type of logic device or memory device disposed therein. Preferably also disposed within the logic device layer are array sense amplifiers, memory array output drivers and like higher performance circuitry otherwise generally disposed within memory array layer substrates. All layers may be independently powered to provide additional performance enhancement.

There are many inventions described and illustrated herein. In a first aspect, the present invention is a technique and circuitry for reading data that is stored in memory cells. In one embodiment of this aspect, the present invention is a technique and circuitry for generating a reference current that is used, in conjunction with a sense amplifier, to read data that is stored in memory cells of a DRAM device. The technique and circuitry for generating a reference current may be implemented using an analog configuration, a digital configuration, and/or combinations of analog and digital configurations.

A touch screen system includes a capacitive touch screen (1) including a plurality of row conductors (7-1,2 . . . n) and a column conductor (5-1). A plurality of cotemporaneous orthogonal excitation signals (S₁(t), S₂(t) . . . S_n(t)) are simultaneously driven onto the row conductors, respectively. The capacitively coupled signals on the column conductor may be influenced by a touch (10) on the capacitive touch screen. Receiver circuitry (50) includes a sense amplifier (21-1) coupled to generate an amplifier output signal (r₁(t)) in response to signals capacitively coupled onto the column conductor. WHT-based circuitry (35) determines amounts of signal contribution capacitively coupled by each of the excitation signals, respectively, to the amplifier output signal.

A 3D memory device includes a plurality of ridge-shaped stacks, in the form of multiple strips of conductive material separated by insulating material, arranged as bit lines which can be coupled through decoding circuits to sense amplifiers. The strips of conductive material have side surfaces on the sides of the ridge-shaped stacks. A plurality of conductive lines arranged as word lines which can be coupled to row decoders, extends orthogonally over the plurality of ridge-shaped stacks. The conductive lines conform to the surface of the stacks. Memory elements lie in a multi-layer array of interface regions at cross-points between side surfaces of the conductive strips on the stacks and the conductive lines. The memory elements are programmable, like the anti-fuses or charge trapping structures. The 3D memory is made using only two critical masks for multiple layers.

A 3D memory device includes a plurality of ridge-shaped stacks, in the form of multiple strips of conductive material separated by insulating material, arranged as bit lines which can be coupled through decoding circuits to sense amplifiers. Diodes are connected to the bit lines at either the string select of common source select ends of the strings. The strips of conductive material have side surfaces on the sides of the ridge-shaped stacks. A plurality of word lines, which can be coupled to row decoders, extends orthogonally over the plurality of ridge-shaped stacks. Memory elements lie in a multi-layer array of interface regions at cross-points between side surfaces of the semiconductor strips on the stacks and the word lines.