81 results about "Discrete circuit" patented technology

Implantable medical devices (IMDs) having sense amplifiers for sensing physiologic signals and parameters, RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming and interrogation commands to and from an external programmer or other medical device are disclosed. At least one IC chip and discrete components have a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include forming notch filters of MEMS structures or forming discrete circuit notch filters by one or more of: (1) IC fabricating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate. The IC fabricated inductors are preferably fabricated as planar spiral wound conductive traces formed of high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with a ground plane of the IC chip. The spiral winding preferably is square or rectangular, but having truncated turns to eliminate 90° angles that cause point-to-point parasitic capacitances. The planar spiral wound conductive traces are further preferably suspended over the ground plane of the IC chip substrate by micromachining underlying substrate material away to thereby reduce parasitic capacitances.

The invention relates to the field of electronics, more particularly to the wire bonds incorporated into an integrated circuit package such as a quad flat pack, a ball grid array or hybrid style module. The present invention takes the normally undesirable wire bond inductance and uses it in an operational circuit where positive inductance is required. The circuit in which the wire bond inductance is used is located primarily in the integrated circuit die housed in the integrated circuit package, but may also include off-die components. In one example, a wire bond is used as the required series inductance in a discrete circuit impedance inverter which consists of two shunt-to-ground negative inductances and one series positive inductance. One of the negative inductances is located on-die, while the other is located off-die.

A transducer assembly utilizing at least two MEMS transducers is provided, the transducer assembly preferably defining either an omnidirectional or directional microphone. In addition to at least first and second MEMS transducers, the assembly includes a signal processing circuit electrically connected to the MEMS transducers, a plurality of terminal pads electrically connected to the signal processing circuit, and a transducer enclosure housing the first and second MEMS transducers. The MEMS transducers may be electrically connected to the signal processing circuit using either wire bonds or a flip-chip design. The signal processing circuit may be comprised of either a discrete circuit or an integrated circuit. The first and second MEMS transducers may be electrically connected in series or in parallel to the signal processing circuit. The first and second MEMS transducers may be acoustically coupled in series or in parallel.

An electric motor includes a rotor having a field permanent magnet, a board housing member fixed to a stator, and a magnetism detecting circuit that detects the magnetism of the field permanent magnet. The magnetism detecting circuit includes a circuit board that is discrete from the board housing member, a sensor case that is discrete from the circuit board and is supported on the circuit board, and a rotation sensor held by the sensor case. The board housing member has an engagement hole and a positioning surface. The sensor case has an engagement convexity corresponding to the engagement hole and an abutting surface corresponding to the positioning surface. When the circuit board has been located in the board housing member, the engagement convexity engages the engagement hole and the abutting surface abuts the positioning surface, resulting in that the rotation sensor is positioned relative to the board housing member.

Apparatus are described for a pair of MOSFET power transistors, a MOSFET driver, and an idealized circuit layout utilized in a power stage such as that of a power conversion system. The power stage comprises a pair of MOSFET transistors having substantially identical electrical characteristics and complementary package configurations for simplifying and optimizing the layout of the power stage on a single side or layer of a printed circuit board. The ideal layout effectively avoids parasitic circuit components, minimizes layout area and costs, and permits operation at higher switching frequencies. A new MOSFET transistor pin configuration is also described that is essentially a functional mirror or functional complement of an existing MOSFET transistor pin configuration to provide the complementary package configurations and the optimized PCB layout. A customized MOSFET driver pin configuration further optimizes the power stage layout by arranging the pins of the driver to coordinate with those of the MOSFET transistor pair.

A circuit to monitor ac line current through resistors employed to provide a ‘step start’ in a power supply, including means to monitor the current flowing through the step start resistors, comprising a peak detector, a sample and hold circuit, an analog to digital convertor and a microprocessor. The output of the current monitoring circuit may be employed to abort starting if abnormalities are sensed. The circuit may also be used to identify when the step start resistors need longer cooling time, and to continuously monitor current at times other than during starting. A timing circuit is also incorporated, which senses zero crossings of the voltage input to the power supply, so as to control the timing of the current monitoring circuit. The discrete circuits employed may be replaced by either a digital signal processor integrated circuit or a general-purpose computer implementing the same steps in a suitable algorithm.

The invention relates to a system and a method for identifying automation components, particularly sensors, actuators and wiring components. According to the invention, each component (sensor, actuator, cable, compensation box, etc.) that is to be identified is equipped with an identification unit in which a code for identifying the automation component is stored and which outputs said identification code when being activated. Preferably, the identification unit comprises an electronic circuit (e.g. an RFID chip or a discreet circuit) while being provided with galvanically insulating (inductive, capacitive, radio-based) or galvanically conducting coupling to the component that is to be identified. The identification unit can be subsequently mounted on a component or can be inseparably connected thereto already during the production of the component.

A ballast (20) for powering one or more gas discharge lamps (70,72,74,76) comprises an inverter (200), an output circuit (300), and an arc protection circuit (400). Arc protection circuit (400) monitors an electrical signal within the output circuit (300). When an arcing condition occurs at the ballast output connections (302,304,306,308,310), the electrical signal includes a high frequency component having a fundamental frequency that is much greater than the normal operating frequency of the inverter (200). In response to the high frequency component exceeding a predetermined threshold, arc protection circuit (400) disables the inverter (200) for a predetermined shutdown period. Arc protection circuit (400) also provides a restart function for periodically attempting to ignite and operate the lamps. Arc protection circuit (400) is preferably realized using a microcontroller integrated circuit (440) with associated discrete circuitry, and is especially well-suited for use in ballasts for powering multiple lamps via a current-fed self-oscillating inverter and an isolated parallel resonant output circuit.

A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted. A disclosed method for manufacturing camera modules includes providing a flexible circuit tape having a plurality of discrete circuit regions, providing a plurality of image capture devices, flip-chip mounting each image capture device on an associate one of the discrete circuit regions, providing a plurality of housings, and mounting each housing on an associate one of the discrete circuit regions.

An electronic circuit for protecting a field effect transistor from high voltage includes a switching device having a first state in which the switching device turns the field effect transistor ON, and a second state in which the switching device turns the field effect transistor OFF. A charging device is connected to the switching device and receives an electrical charge when an electrode of the field effect transistor is shorted to a voltage source. The charging device applies the electrical charge to the switching device to thereby place the switching device in the second state.