235results about How to "Improve thermal characteristics" patented technology

Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. A substrate has a surface, wherein the surface has an opening therein. A stiffener has a surface coupled to the surface of the substrate. An area of the surface of the stiffener can be greater than, equal to, or less than an area of the surface of the substrate. A thermal connector is coupled to the surface of the stiffener through the opening. A surface of the thermal connector is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB. The thermal connector can have a height such that the thermal connector extends into a cavity formed in a surface of the PCB when the BGA package is mounted to the PCB. Alternatively, the stiffener and thermal connector may be combined into a single piece stiffener, wherein the stiffener has a protruding portion. The protruding portion extends through the opening when the stiffener is coupled to the substrate, and is capable of attachment to the PCB.

A light emitting module with improved optical functionality and reduced thermal resistance is described, which comprises a light emitting device (LED), a wavelength converting (WC) element and an inorganic optically-transmissive thermally-conductive (OTTC) element. The WC element is capable of absorbing light generated from the LED at a specific wavelength and re-emitting light having a different wavelength. The re-emitted light and any unabsorbed light exits through at least one surface of the module. The OTTC is in physical contact with the WC element and at least partially located in the optical path of the light. The OTTC comprises one or more layers of inorganic material having a thermal conductivity greater than that of the WC element. As such, a compact unitary integrated module is provided with excellent thermal characteristics, which may be further enhanced when the OTTC provides a thermal barrier for vertical heat propagation through the module but not lateral propagation.

An electric fluid pump includes an upper housing having a fluid inlet and outlet. An impeller is seated within the upper housing for pumping fluid between the inlet and the outlet. The impeller includes at least one magnet secured thereto. A lower housing mates with the upper housing. The lower housing has an upper wall for closing the upper housing and a shaft extending from the upper wall for rotatably supporting the impeller. A stator is seated within the lower housing and spaced from the impeller by the upper wall. The stator includes a plurality of pillars supporting a winding of coils for producing a magnetic field to energize the magnet and rotate the impeller, and a plurality of top plates covering each of the coils and spaced apart by a predetermined gap for maintaining the magnetic field between the stator and the impeller. An end cap closes the stator within the lower housing.

A fiber laser thermal coil form and related manufacturing techniques that are substantially suitable for automation. The fiber laser thermal coil form including a thermally conductive substrate to support a fiber placed thereon and to dissipate a heat of the fiber, and a fiber guide groove defined in a surface of the substrate to guide the fiber and dimensioned to partially enclose the fiber and to enhance a thermal contact of the fiber and the substrate.

In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insultive fuse body is provided to further decouple the fuse element from its surroundings.

The technical scheme discloses high brightness LED structure with graphic surface and microstructure. Using Nano pressing technique prepares each graphic film from organic material on luminous surface of LED so as to form microstructure on LED surface in favor of transgression of emitting light from active region, for example micrographics with structure or coarsening, and photon crystal structure. Introducing the said micrographics on surface makes interfacial area of light emergence medium increase. The increased surface presents great lot small areas unordered arranged. Emergence of light from active region and interface of medium is at random in a certain extent. The invention improves directions of emergence light, increases probability of emergence so as to raise light extraction efficiency and external quantum efficiency of LED.

This invention discloses a manufacturing method for slice thermal resistors, which prints a back electrode on the back of a marked slot side of an insulated ceramic chip, prints a face electrode on the slot side, then prints a thermal resisting layer and a protection layer with a thick film silk screen, which can reduce the processing time of slice thermal resistors effectively.

The LBD of current transmission reflection reducing window layer and high reflecting graph transfer underlay configuration belongs to field of semiconductor photoelectron technique. It includes upper electrode (100), current transmission reflection reducing window layer (111) which comprises conducting reflection reducing light layer (130), current barrier layer (110) and current expansion layer (201), upper limit layer (300), source area (500), lower limit layer (400), graphic current expansion layer (202), conducting high glisten layer (140), conducting linkage layer (150) and transfer underlay (160) or rack constructed by the upper current expansion layer (200), conducting linkage layer (150), conducting high glisten layer (140) and graphic transfer underlay (161), lower electrode (800). The invention increases the current expansion and light output, and can increase the light efficiency greatly, it can realize the high efficiency, high brightness LED lightening; the heat property and reliability are high.

A transmit/receive filter includes a substrate, an antenna terminal, a transmit filter assembly arranged on a first substrate portion, an output of the transmit filter assembly being connected to the antenna terminal, a receive filter assembly arranged on a second substrate portion, and a discrete phase shifter arranged on a third substrate portion, the discrete phase shifter being formed of discrete circuit elements and an input of the receive filter assembly being connected to the antenna terminal via the discrete phase shifter, the discrete phase shifter being formed to set a predetermined phase relation to decouple the receive filter assembly from the transmit filter assembly.

An optically pumped semiconductor laser and an optical pumping method are disclosed. The optically pumped semiconductor laser includes first and second reflective bodies forming a resonant region therebetween, a gain medium disposed between the first and second reflective bodies; and a light source for applying a source light to the resonant region in a lateral direction with regard to the gain medium for generating a basic wavelength. The laser further comprising an output mirror and a nonlinear crystal disposed between the output mirror and the second reflective body to generate a predetermined wavelength as a second harmonic of the basic wavelength.

Provided is an article of cookware and a method of making the same. The cookware has a multi-layer bonded composite wall structure having an inner metal layer and an outer metal layer, and a core layer between the inner layer and the outer layer. The core layer has at least two perforated graphite plates, each plate having a plurality of spaced-apart holes formed therethrough, and at least one intermediate metal element disposed between the at least two perforated graphite plates and extending through the plurality of spaced-apart holes of each of the at least two perforated graphite plates. The at least one intermediate metal element is metallurgically bonded to the inner layer and the outer layer at least through the plurality of spaced-apart holes.

The present invention relates to a weight compensating device comprising a carrier and a component which is supported on the carrier and is displaceable particularly in vertical direction by means of a drive, characterized in that the carrier and the component have arranged thereinbetween at least one negative pressure body of a variable length which is connected to a negative pressure source for compensating the weight acting on the component.

In a control device for a three-phase rotating machine with first and second winding sets, a current feedback computing section includes a current sum controller and a current difference controller. The current sum controller multiplies, by a sum gain, an error between a sum of current command values for alternating currents output from first and second inverters and a sum of sensed current values and computes a sum of voltage command values. The current difference controller multiplies, by a difference gain, an error between a difference of the current command values and a difference between the sensed current values, and computes a difference of voltage command values. In a variable-responsiveness mode, a gain ratio between the sum gain and the difference gain is varied according to a reference frequency such that the current sum controller and the current different controller are different in responsiveness.

The invention discloses a high temperature resistant electrical soft composite material and a manufacturing method thereof. The invention is characterized in that: the high temperature resistant electrical soft composite material is a two-, three- or four-layer high temperature resistant electrical soft composite material comprised of a thin film layer, an adhesive layer and a synthetic fiber paper layer; the adhesive layer is prepared by mixing 115 to 230 weight parts of hydroxy-terminated prepolymer, 30 to 83 weight parts of multifunction isocyanate prepolymer, 70 weight parts of polyglycerol-modified ureido-ene resin, 150 to 300 weight parts of solvent; after an adhesive is applied on a thin film or synthetic fiber paper, the thin film or synthetic fiber paper is delivered to a drying channel to pass through an area, an area II at and an area II at 50 to 120 DEG C respectively and at a vehicle speed of 2 to 20 m/min to remove the solvent; then the thin film or synthetic fiber paper is cooled first to room temperature and then to 80 DEG C and is combined with the synthetic fiber paper or the thin film by hot rolling; the combined product is wounded and heated to 140 DEG C from room temperature for aging for 8 to 72 hours; and thus, the product is obtained. The product of the invention, which has high performance, can be used for motor element insulation, inter-winding insulation, gasket insulation and air-immersed transformer interlayer insulation.

A coil of elastic material can be wrapped around the handle of a utensil to thereby provide an enhanced grip. An ideal material for this application is a food grade or medical grade silicone rubber because this material is relatively inert both chemically and biologically. Other advantageous properties include a wide range of working temperatures and the availability of a variety of grades, colors, and firmness. Material of different grades can be combined to provide rigidity to the coil shape while also providing a compliant surface. Texturing of the inner and/or outer coil surfaces can also provide for better handholds and for a more positive contact between the grip enhancer and the utensil handle.

The invention provides a polyolefin-based conductive master batch based on a carbon nano tube and graphene compounded system and a preparation method thereof. The preparation method comprises the following steps: firstly respectively uniformly dispersing carbon nano tubes and graphene into a volatile inert solvent, respectively treating for 1 hour by virtue of an ultrasonic treatment device, thenstirring the treated dispersion liquid with raw materials in a high-speed stirring machine in proportion, then mixing with a compatilizer in a certain ratio at room temperature, and then carrying outmelt extrusion by virtue of a twin screw, so that the conductive master batch is prepared. The prepared composite material has excellent conductivity, is easy to add and can be widely applied to the fields of injection molding, extrusion and modification.

The invention provides an LED (light-emitting diode) epitaxial wafer which comprises a substrate, a first porous structure layer formed on the top layer of the substrate, a second porous structure layer formed on the first porous structure layer and an LED structure layer formed on the second porous structure layer, wherein the porosity and aperture of the second porous structure layer are smaller than those of the first porous structure layer, and the LED structure layer at least comprises a first-type semiconductor layer, a luminous layer and a second-type semiconductor layer. An LED structure which has the characteristics of large porosity and great thermal mismatch between an epitaxy on porous silicon and a Si (silicon) material is adopted, thereby enabling a weak porous silicon layer to deform partially, releasing thermal mismatch stress, ensuring the integrity of the epitaxial LED structure, forming the large-size epitaxial LED structure, and improving the quality of an epitaxial crystal of the LED structure layer through the second porous structure layer.

The present invention relates to a vanadium phosphorus oxide catalyst, and mainly solves the problem that the catalytic performance of a catalyst in the prior art in preparing maleic anhydride by selective oxidation of a hydrocarbon is poor. For well solving the aforementioned technical problem, according to the technical scheme of the present invention, a preparation method of the vanadium phosphorus oxide catalyst comprises the following steps of: 1) mixing tungsten carbide powder with a phosphoric acid solution, raising the temperature of the mixture to 50-100 DEG C and enabling the mixture to react for 1-10 hours, and carrying out filtering and drying to obtain tungsten-carbide subjected to phosphate processing; 2) after mixing a vanadium compound, and the tungsten-carbide subjected to phosphate processing with an organic solvent, carrying out stirring and slowly adding 85wt%-110wt% of phosphoric acid, and performing heating reflux for 8-32 hours; 3) filtering and washing the obtained catalyst precursor solution after cooling, and carrying out drying at 100-150 DEG C to obtain a catalyst precursor; and 4) obtaining an active catalyst by performing calcination activation on the catalyst precursor. The prepared catalyst can be used in the industrial production of maleic anhydride.

The invention relates to an electrostatic suppressing element and a production method thereof. The electrostatic suppressing element comprises a ceramic substrate (1), a left outer electrode (2) and a right outer electrode (2'), wherein the left outer electrode (2) and the right outer electrode (2') are arranged at two ends of the ceramic substrate (1) respectively, and the electrostatic suppressing element is characterized in that the ceramic substrate (1) consists of an upper protective layer (112), at least one through hole layer (42) and a lower protective layer (111), the through hole layer (42) is provided with at leas one through hole, the upper surface and the lower surface of the through hole are covered by a printing electrode layer, a voltage-sensitive ceramic functional phase (41) is filled in the through hole in the through hole layer (42), the printing electrode layer is alternately led out from two ends of a product, and each printing electrode layer is only electrically connected with the outer electrode on one side. The voltage of the electrostatic suppressing element is stable under an over-temperature condition, the response time is shortened, the weaknesses of a piezoresistor are overcome, and the electrostatic suppressing element has the characteristics of low electric capacity and small leaked current.