4899results about How to "Simplify the manufacturing process" patented technology

A method of manufacturing a thin film transistor (“TFT”) substrate includes forming a first conductive pattern group including a gate electrode on a substrate, forming a gate insulating layer on the first conductive pattern group, forming a semiconductor layer and an ohmic contact layer on the gate insulating layer by patterning an amorphous silicon layer and an oxide semiconductor layer, forming a second conductive pattern group including a source electrode and a drain electrode on the ohmic contact layer by patterning a data metal layer, forming a protection layer including a contact hole on the second conductive pattern group, and forming a pixel electrode on the contact hole of the protection layer. The TFT substrate including the ohmic contact layer formed of an oxide semiconductor is further provided.

Provided is a semiconductor memory device including cylinder type storage nodes and a method of fabricating the semiconductor memory device. The semiconductor memory device includes: a semiconductor substrate including switching devices; a recessed insulating layer including storage contact plugs therein, wherein the storage contact plugs are electrically connected to the switching devices and the recessed insulating layer exposes at least some portions of upper surfaces and side surfaces of the storage contact plugs. The semiconductor device further includes cylinder type storage nodes each having a lower electrode. The lower electrode contacting the at least some portions of the exposed upper surfaces and side surfaces of the storage node contact plugs.

A non-volatile memory includes a substrate, a number of isolation layers, a number of active layers, a number of floating gates, a number of control gates and a number of doped regions. The active layers are disposed in the substrate between the isolation layers, and the top surface of the active layer is higher than that of the isolation layer. The active layers and the isolation layers are arranged in parallel to each other and extend in the first direction. The control gates are disposed in the substrate. The control gates are arranged in parallel and extend in the second direction which crosses the first direction. The floating gates are disposed between the active layers and the control gates. The doped regions are disposed in the active layers between the control gates.

A dust collection assembly of a vacuum cleaner is provided. The dust collection assembly includes a dust collecting box, a filter, a flow guide unit, an exhaust guider, and an upper cover. The dust collecting box and the flow guide unit are integrally formed in a single body. The dust collecting box includes a first and second dust collecting spaces for collecting foreign objects. The filter is disposed in the inside of the dust collecting space to primarily filter foreign objects during operation of a cyclone. The flow guide unit guides airflow and has small cyclones integrally formed therein, for secondarily filtering the foreign objects in air. The exhaust guider guides airflow and has a plurality of discharge holes through which air filtered by the small cyclone flows. The upper cover is disposed on the upper side of the exhaust guider.

The invention relates to an auxiliary material for casting a mould, in particular to a casting mould water-based coating formulation for a sand mould or an expendable pattern casting (EPC), and a process for preparing the same. The casting mould water-based coating formulation consists of refractory powder, a suspending agent, a bonding agent, a surfactant, a defoaming agent, a corrosion remover and water. The process comprises the following steps: adding the suspending agent to the water directly, and mixing and dispersing the mixture in a high speed dispersion machine; adding auxiliary agents including the defoaming agent, the surfactant, the corrosion remover, and the like to the water, and mixing the auxiliary agents; adding the refractory powder to the mixture to be mixed; and adding the bonding agent to the mixture to be mixed, and then adding water to adjust the coating until the coating has the thickness in a using state to obtain the finished product. The coating prepared by the process has the effects that the coating ensures that a high-density low-viscosity coating has excellent suspension property and storage stability, a coating layer is not easy to crack after drying, the coating is advantageous to improve the capacity of the coating to resist high temperature metal corrosion, and the like.

The present invention discloses a novel transistor structure employing semiconductive metal oxide as the transistor conductive channel. By replacing the silicon conductive channel with a semiconductive metal oxide channel, the transistors can achieve simpler fabrication process and could realize 3D structure to increase circuit density. The disclosed semiconductive metal oxide transistor can have great potential in ferroelectric non volatile memory device with the further advantages of good interfacial properties with the ferroelectric materials, possible lattice matching with the ferroelectric layer, reducing or eliminating the oxygen diffusion problem to improve the reliability of the ferroelectric memory transistor. The semiconductive metal oxide film is preferably a metal oxide exhibiting semiconducting properties at the transistor operating conditions, for example, In2O3 or RuO2. The present invention ferroelectric transistor can be a metal-ferroelectric-semiconductive metal oxide FET having a gate stack of a top metal electrode disposed on a ferroelectric layer disposed on a semiconductive metal oxide channel on a substrate. Using additional layer of bottom electrode and gate dielectric, the present invention ferroelectric transistor can also be a metal-ferroelectric-metal (optional)-gate dielectric (optional)-semiconductive metal oxide FET.

A touch sensing color filter including a substrate, a black matrix, a color filter layer and a second sensing electrode layer is provided. The black matrix is disposed on the substrate to define a plurality of sub-pixel areas. The black matrix includes a first sensing electrode layer, and the first sensing electrode layer has a plurality of openings corresponding to the sub-pixel areas. The color filter layer includes a plurality of color filter units disposed in the sub-pixel areas respectively. The second sensing electrode layer is disposed on the substrate, and the second sensing electrode layer includes a plurality of sub patterns corresponding to the sub-pixel areas. A method for fabricating the touch sensing color filter and a display panel using the same are further provided.

An electronic cigarette is provided, which includes: a housing, a liquid reservoir, and an atomizer assembly. The housing has a chimney formed therein; the liquid reservoir is used for storing liquid; the atomizer assembly received in the housing. The atomizer assembly includes a heating plate capable of absorbing liquid. An outer surface of the heating plate is in contact with the air in the chimney.

A method of forming a color filter touch sensing substrate integrates touch-sensing structures / elements of a touch panel into the inner side of the color filter substrate, which faces a thin film transistor substrate, and forms patterned assistant electrodes on the surfaces of the transparent sensing pads for decreasing the equivalent resistance of the touch-sensing structures / elements. Moreover, since an adjacent transparent conductive layer and an assistant electrode layer are patterned to form the transparent sensing pads and the patterned assistant electrodes, a simplified pattern-transferring process can be applied to the transparent sensing pads and the patterned assistant electrodes, or bridge structures can be formed from the assistant electrode layer for electrically connecting between some transparent sensing pads. Therefore, the forming process is simplified.

A capacitive fingerprint sensor is fabricated on a plastic substrate (363) with an embedded integrated circuit chip (380). The invention describes a way to create two or three dimensional forms for electrode structures (321, 322, 325, 365, 366) that can be used to optimize the performance of the sensor. When the three dimensional structure is designed to follow the shape of a finger, a very small pressure is required when sliding the finger along the sensor surface. This way the use of the sensor is ergonomic and the measurement is made very reliable. The inventive fabrication method describes the way, how to connect and embed an integrated circuit containing measurement electronics with a batch processed larger scale electrode configuration that is used for capturing the capacitive image of the fingerprint.

A thermally enhanced semiconductor package with EMI (electric and magnetic interference) shielding is provided in which a chip is mounted on and electrically connected to a surface of a substrate, and a thermally conductive member is stacked on the chip and electrically coupled to the surface of the substrate by bonding wires. An encapsulant is formed and encapsulates the chip, thermally conductive member, and bonding wires. A plurality of solder balls are implanted on an opposite surface of the substrate. The thermally conductive member is grounded via the bonding wires, substrate, and solder balls, and provides an EMI shielding effect for the chip to protect the chip against external electric and magnetic interference. The thermally conductive member has a coefficient of thermal expansion similar to that of the chip, and reduces thermal stress exerted on the chip and enhances mechanical strength of the chip to thereby prevent chip cracks.

An image sensor packaging structure with a low transmittance encapsulant is provided. The image sensor packaging structure includes a substrate, a chip, a transparent lid, and the low transmittance encapsulant. The chip is combined with the substrate. The transparent lid is adhered to the chip and cover above a sensitization area of the chip to form an air cavity. The low transmittance encapsulant is formed on the substrate and encapsulates the chip and the transparent lid so as to accomplish the package of the image sensor packaging structure. Due to the feature of prohibiting from light passing through the low transmittance encapsulant, the arrangement of the low transmittance encapsulant can avoid the light from outside interfere the image sensing effect of the image sensor. Therefore, the quality of the image sensing can be ensured.

A planar coil including and insulating substrate, and a coil conductive filament having a thickness of 20 to 400 mum and formed on at least one surface of the insulating substrate, the coil conductive filament having a gap whose aspect ratio (H / G) is at least 1. The coil conductive filament has a cross-section in a substantially mushroom shape having a head and a neck, the head has a width (L) which is a least twice as large as a width (l) of the neck thereof, at most 1.5 times as large as a height of the head, and at least twice as large as a minimum spacing (G) between adjacent coil conductive filaments.

A dust collection assembly of a vacuum cleaner is provided. The dust collection assembly includes a dust collecting box, a filter, a flow guide unit, an exhaust guider, and an upper cover. The dust collecting box and the flow guide unit are integrally formed in a single body. The dust collecting box includes a first and second dust collecting spaces for collecting foreign objects. The filter is disposed in the inside of the dust collecting space to primarily filter foreign objects during operation of a cyclone. The flow guide unit guides airflow and has small cyclones integrally formed therein, for secondarily filtering the foreign objects in air. The exhaust guider guides airflow and has a plurality of discharge holes through which air filtered by the small cyclone flows. The upper cover is disposed on the upper side of the exhaust guider.

Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high luminance LED. The manufacturing process is convenient and the cost is reduced. The LED package includes a substrate, an electrode, an LED, and a heatsink hole. The electrode is formed on the substrate. The LED is mounted in a side of the substrate and is electrically connected to the electrode. The heatsink hole is formed to pass through the substrate, for emitting out heat generated from the LED.

A method for forming a self aligned pattern on an existing pattern on a substrate comprising applying a coating of a solution containing a masking material in a carrier, the masking material having an affinity for portions of the existing pattern; and allowing at least a portion of the masking material to preferentially assemble to the portions of the existing pattern. The pattern may be comprised of a first set of regions of the substrate having a first atomic composition and a second set of regions of the substrate having a second atomic composition different from the first composition. The first set of regions may include one or more metal elements and the second set of regions may include a dielectric. The first and second regions may be treated to have different surface properties. Structures made in accordance with the method. Compositions useful for practicing the method.

Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high luminance LED. The manufacturing process is convenient and the cost is reduced. The LED package includes a substrate, an electrode, an LED, and a heatsink hole. The electrode is formed on the substrate. The LED is mounted in a side of the substrate and is electrically connected to the electrode. The heatsink hole is formed to pass through the substrate, for emitting out heat generated from the LED.

A method for cutting a tempered glass includes the following steps. First, a shielding layer is formed on a part of a surface of a glass substrate, and a predetermined cutting path passes through the part of the surface. Then, a glass substrate is given an ion-exchange strengthening treatment, and the part of the surface covered by the shielding layer substantially does not undergo ion-exchange. Finally, the glass substrate is cut along the predetermined cutting path.

A solid-state transducer is disclosed. The transducer comprises a semi-conductor substrate forming a support structure and having an opening. A thin-film structure forming a diaphragm responsive to fluid-transmitted acoustic pressure is disposed over the opening. The transducer further includes a plurality of semi-conductor supports and tangential arms extending from the diaphragm edge for connecting the periphery of the diaphragm to the supports. The tangential arms permit the diaphragm to rotate relative to the supports to relieve film stress in the diaphragm. The transducer still further includes a plurality of stop bumps disposed between the substrate and the diaphragm. The stop bumps determine the separation of the diaphragm from the substrate when the transducer is biased.

A plurality of patterns respectively having different area factor of dot formation area are formed by forward and reverse scanning printing of a print head, and then optical characteristics of the plurality of formed patterns are measured. A function representing the relationship between the printing position offset between the forward and reverse printings is determined from the optical characteristics. Then, respective pattern having a predetermined area factor of dot formation area is formed by means of forward and reverse scanning where the speed is differentiated according to the mode of a printing apparatus, and then the optical characteristics of this pattern is measured. By applying this measured optical characteristics to the function, an adjustment value of the dot formation position conditions between the forward and reverse scans is obtained for each mode. This makes it easy to perform printing registration in a printing apparatus in the case of printing by a forward and reverse scan of a printing head or in the case of printing by means of a plurality of printing heads. In this case, operations by a user etc. are also unnecessary and are easily performed.

A pressure sensing apparatus including a thin disc of a metal having a ceramic material layer and piezoresistive elements formed thereon. A surface of the disc is bonded to a diaphragm assembly on a pressure port base constructed of a low cost metal. The bonding process is performed at low temperatures, (<700° C.), so that the diaphragm assembly and pressure port do not require high temperature corrosion resistance, and can thus be formed of less expensive materials. The inventive apparatus provides a lower cost alternative to conventional high pressure sensors since less material is used, less expensive materials are used, and fabrication is less complex. The inventive apparatus is also more reliable and exhibits greater thermal stability than conventional high pressure sensors.

Novel structural configurations of a TFT-LCD (Thin Film Transistor Liquid Crystal Display) which results in both fast response to input data and provides wide-viewing-angles. The structure of the device is comprised of one pixel electrode layer and two common electrode layers. The structure of the invention can be used with liquid crystal display television (LCD-TV) monitors that require both fast-response as well as wide-viewing-angle. In addition, other liquid crystal technologies which require high speed response would benefit from the TFT-LCD of the present invention.

An improved catheter system having an ultrasonic imaging transducer coupled to a drive cable disposed within a lumen of a flexible tubular catheter body. An improvement including a reconfiguration of the ferrites in the hub assembly, such that the need for the gap between the ferrites is removed. A strain relief member is provide to increase the strength of the electrical transmission lines to enable them to withstand the tensile forces caused by either flushing and / or pull-back operations. A device which allows the electrical transmission lines to extend their length when placed in tension may also be employed to provide strain relief to the electrical transmission lines. Another improvement includes a counter-wound coil structure, which may either expand or contract as the drive cable is being rotated to strengthen the drive cable. The distal tip of the catheter body may be redesigned to provide a lumen which allows for the release of flushing fluids through a distal port in the guidewire lumen.

Disclosed is an antenna assembly including a substrate, and a wireless charge antenna pattern on the substrate. The wireless charge antenna pattern has a sectional surface including a plurality of inner angles in which two inner angles are different from each other. The antenna assembly includes a wireless communication antenna pattern formed on the substrate and provided at an outside of the wireless charge antenna pattern. The wireless communication antenna pattern has a plurality of inner angles at a sectional surface thereof, and a plurality of angle values of the inner angles provided at the sectional surface of the wireless communication antenna pattern correspond to a plurality of angle values of the inner angles provided at the sectional surface of the wireless charge antenna pattern, respectively.

The present invention describes a hybrid integrated circuit comprising both CMOS and III-V devices, monolithically integrated in a single chip. It allows the almost complete elimination of the contamination issues related to the integration of different technologies, maintaining at the same time a good planarization of the structure. It further simplifies the fabrication process, allowing the growth of high quality III-V materials on (100) silicon substrates lowering the manufacturing cost. Moreover, differently from many prior art attempts, it does not require silicon on insulator technologies and / or other expensive process steps. This invention enables the consolidation on the same integrated circuit of a hybrid switching power converter that takes advantage of the established circuit topologies of CMOS circuitries and of the higher mobility and voltage withstanding of III-V HEMT devices.

In the structure of a semiconductor device of the present invention, a first source electrode is connected to a conductive substrate through a via hole, and a second source electrode is formed. Thus, even if a high reverse voltage is applied between a gate electrode and a drain electrode, electric field concentration likely to occur at an edge of the gate electrode closer to the drain electrode can be effectively dispersed or relaxed. Moreover, the conductive substrate is used as a substrate for forming element formation layers, so that a via hole penetrating the substrate to reach the backside thereof does not have to be formed in the conductive substrate. Thus, with the strength necessary for the conductive substrate maintained, the first source electrode can be electrically connected to a backside electrode.

An electronic cigarette is provided, which includes: a housing, a liquid reservoir, and an atomizer assembly. The housing has a chimney formed therein; the liquid reservoir is used for storing liquid; the atomizer assembly received in the housing. The atomizer assembly includes a heating plate capable of absorbing liquid. An outer surface of the heating plate is in contact with the air in the chimney.

An improved catheter system having an ultrasonic imaging transducer coupled to a drive cable disposed within a lumen of a flexible tubular catheter body. An improvement including a reconfiguration of the ferrites in the hub assembly, such that the need for the gap between the ferrites is removed. A strain relief member is provide to increase the strength of the electrical transmission lines to enable them to withstand the tensile forces caused by either flushing and / or pull-back operations. A device which allows the electrical transmission lines to extend their length when placed in tension may also be employed to provide strain relief to the electrical transmission lines. Another improvement includes a counter-wound coil structure, which may either expand or contract as the drive cable is being rotated to strengthen the drive cable. The distal tip of the catheter body may be redesigned to provide a lumen which allows for the release of flushing fluids through a distal port in the guidewire lumen.