The invention relates to the field of
semiconductor packaging, in particular to high-precision bonding equipment and a bonding method thereof.The high-precision bonding equipment comprises a left
machine base, a right
machine base and a
handover module, the left
machine base is provided with a
wafer table, an ejector pin module, an overturning
pickup module, a transfer module, a first camera and a
transplanting suction
nozzle module, and the first camera is arranged above the
wafer table; the ejector pin module is arranged below the
wafer table, the turnover
pickup module adsorbs a
chip on the wafer table, turns over by 180 degrees and transfers the
chip to the transfer module, the
transplanting suction
nozzle module is arranged below the right side of the transfer module, a movable
workbench, a third camera, a fourth camera and a near-
infrared camera are arranged on the right machine base, the third camera is arranged at the left end of the movable
workbench, and the fourth camera is arranged at the right end of the near-
infrared camera. The fourth camera and the near-
infrared camera are arranged above the movable
workbench, the
handover module comprises a driving module, a bonding head and a second camera, the bonding head is arranged on the driving module, the second camera is arranged on the left side of the right machine base, and the requirements for measurement and calibration, compensation and positioning precision of the
hybrid bonding technology are met.