534results about How to "Easy to flatten" patented technology

A method of forming, in or on a Si substrate, planar micro-coils with coil windings of high aspect ratio (>3) and a wide variety of geometric shapes. The micro-coils may be formed on a Si substrate and be embedded in a dielectric, or they may be formed in trenches within a Si substrate. The micro-coils may have field enhancing ferromagnetic pillars rising above the micro-coil plane, formed at positions of maximum magnetic field strength and the micro-coils may also include magnetic layers formed beneath the substrate and contacting the pillars to form a substantially closed pathway for the magnetic flux. The substrate may be thinned to membrane proportions. These micro-coils produce strong magnetic fields with strong field gradients and can be used in a wide variety of processes that involve the exertion of strong magnetic forces at small distances or the creation of magnetic wells for trapping and manipulating small particles.

A container comprises a knockdown carton made from a flat blank of corrugated material, and a knockdown lid. The carton comprises a center panel, foldable end panels, foldable side panels, and foldable corner panels. A pair of diametrically opposed corner panels are folded inwardly into contact with opposed end panels. The end panels comprise rectangular cutout holes surrounding foldable flaps. The lid has a central panel that is divided from integral end panels and integral side panels. A lid side panel extending vertically downwardly is coupled to the carton. Lid end panels have elliptical orifices that register with carton cutout regions and adjoining slots that align with handle anchor orifices. An alternative lid has flaps comprising major and minor segments separated by a diagonal fold line. The minor segment has an apex that releasably biases the flap in engagement with the end panel, yieldably locking the lid.

A communication cable is provided that satisfies the requirement of Cat.6 for near-end cross talk wherein the difference between the maximum and minimum values of delay time among the four twisted wire pairs constituting the cable is within 25 ns / 100 m. The communication cable is made by entwining four twisted wire pairs (T1), (T2), (T3), (T4) made by twisting pairs of insulated wires made by covering electrically conductive wires by polyolefin thermoplastic resin with each pair being twisted with a twist pitch different from the others (pitch: P1<P2<P3<P4) and the inter-pair interposer (6) made of polyolefin thermoplastic resin, while being entwined with each wire pair, around a central interposer (2) made of polyolefin thermoplastic resin having cross sectional area of S1. Cross sectional area S1 of the central interposer (2) satisfies the relationship of inequality S1>=[{4.1 d / (1+{square root over (2)})}.0.35]2xpi, while the inter-pair interposer (6) that is entwined with the twisted wire pairs is located at such a position as adjoins the twisted wire pair (T1) having the least pitch P1 and does not adjoin the twisted wire pair (T4) having the largest pitch P4.

A container comprises a knockdown carton made from a flat blank of corrugated material, and a knockdown lid. The carton comprises a center panel, foldable end panels, foldable side panels, and foldable corner panels. A pair of diametrically opposed corner panels are folded inwardly into contact with opposed end panels. The end panels comprise rectangular cutout holes surrounding foldable flaps. The lid has a central panel that is divided from integral end panels and integral side panels. A lid side panel extending vertically downwardly is coupled to the carton. Lid end panels have elliptical orifices that register with carton cutout regions and adjoining slots that align with handle anchor orifices. An alternative lid has flaps comprising major and minor segments separated by a diagonal fold line. The minor segment has an apex that releasably biases the flap in engagement with the end panel, yieldably locking the lid.

The present invention describes a hybrid integrated circuit comprising both CMOS and III-V devices, monolithically integrated in a single chip. It allows the almost complete elimination of the contamination issues related to the integration of different technologies, maintaining at the same time a good planarization of the structure. It further simplifies the fabrication process, allowing the growth of high quality III-V materials on (100) silicon substrates lowering the manufacturing cost. Moreover, differently from many prior art attempts, it does not require silicon on insulator technologies and / or other expensive process steps. This invention enables the consolidation on the same integrated circuit of a hybrid switching power converter that takes advantage of the established circuit topologies of CMOS circuitries and of the higher mobility and voltage withstanding of III-V HEMT devices.

The object of the present invention is to provide a method and apparatus for manufacturing an EL layer of uniform thickness, causing effective light emission of pixel openings and manufacturing an organic EL display showing sufficient brightness and excellent in practicability, by an ink jet method. Further object is to provide a method and apparatus for manufacturing a color filter excellent in practicability by an ink jet method, in which a dye layer with uniform thickness is formed and optical coloring of uniform tone is conducted at pixel openings. In order to achieve the above object, the present invention is a method for manufacturing an organic EL display by an ink jet method, wherein an uniform organic EL layer is formed by sequentially continuously carrying out: a process of discharge-placing at least an organic EL material in the form of solution on a substrate; and a process of drying the organic EL material in the form of ink placed on the substrate by heating, and the organic EL material is dried by heating over thereof. Further, the placing of the organic EL material on the substrate and drying by heating are sequentially continuously carried out by relatively moving the substrate to a nozzle which discharges the organic EL material and to a device which heats the organic EL material over thereof.

A method to improve the resin sealing reliability in the manufacturing of a wafer-level CSP. The method for manufacturing a semiconductor device of the present invention includes a process that forms wiring 14 and conductive supports 16, which electrically connect electrode pads 10a and corresponding external terminals, on a wafer 10 on which semiconductor elements are formed. In subsequent processes, a groove 18 (preferably V shaped) is formed in the surface of the above-mentioned wafer along the boundary lines of the respective semiconductor elements. Next, the end surfaces of the above-mentioned conductive supports 16 are exposed, and the above-mentioned wafer surface is covered with a resin 19 so that external terminals 20 are arranged on the end surfaces of the conductive supports. In the final process, along the boundary lines of the above-mentioned semiconductor elements, packaged semiconductor devices 32 are obtained by dicing the above-mentioned wafer.

A semiconductor device has a semiconductor layer of silicon which has a plurality of element formation regions, and a trench isolation region for isolating the plurality of element formation regions from each other. The trench isolation region is formed by filling a trench formed in an upper part of the semiconductor layer with an insulating metal nitride. A thermal expansion coefficient of the insulating metal nitride is closer to that of silicon than a thermal expansion coefficient of silicon oxide is to that of silicon.

Ion-beam based deposition technique are provided for the planarization of pit and scratch defects in conjunction with particle defects. One application of this planarization technique is to mitigate the effects of pits and scratches and particles on reticles for extreme ultraviolet (EUV) lithography. In the planarization process, thin Si layers are successively deposited and etched away where the etching is directed at angles well away from normal incidence to the substrate to planarize pits and scratches without causing the particle defects to get too large; this is followed by a normal incidence etching process sequence designed primarily to planarize the particles but which will also planarize the pits and scratches to completion. The process also shows significant promise for planarizing substrate roughness.

An electrostatic chuck is provided having a plurality of small electrostatic structures for holding an electrically conductive workpiece forming a plate of a capacitor. Each electrostatic structure includes a first thermally conductive single-crystal dielectric sheet, and a first electrode in sheet form sandwiched between the first dielectric sheet and a second dielectric surface. The workpiece, typically a conductive or semiconductive wafer, is juxtaposed to the first dielectric sheet of each electrostatic structure and forms a second electrode. The second dielectric sheet, if thick, is used as a thermally conducting base plate which can be attached to a low pressure reactor. If the second dielectric is a thin sheet, then it is mounted to a thermally conductive metal base plate through which heat can be controllably conducted. The resultant electrostatic structure may be brazed to the metal base plate if the thermal expansion characteristics of the two elements are sufficiently matched. The first thermally conductive dielectric sheet is preferably formed of sapphire (Al2O3), which is sufficiently thermally conductive to allow for rapid heat transfer between the base plate and the workpiece. The first electrodes of different electrostatic structures are held at different electrical potentials (typically of several thousand volts difference) and a charge is maintained by this potential difference between selected electrostatic structures.

A circuit board includes a substrate having a heat exhausting function. A wiring layer of a metal composite material is provided on the substrate with an insulating layer in between. The metal composite material has a coefficient of thermal expansion that is greater than a coefficient of thermal expansion of a silicon semiconductor chip and less than a coefficient of thermal expansion of copper. Accordingly, a circuit board that is suitable for mounting power devices, requires no heat sink or heat spreader is provides. Further, the number of components for assembling a module is reduced.

It is an object of the present invention to alleviate unevenness due to an opening for making a contact with the lower layer even when the opening has a large diameter (1 μm or more). Thus, it is a further object of the invention to reduce defects caused by the unevenness due to the contact hole. It is a feature of the invention to form a wiring by filling the contact hole with conductive fine particles. The conductive fine particles can be easily dispersed into a wiring material by using conductive fine particles having high wettability with the wiring material, thereby making a contact. Thus, planarization of a contact hole can be achieved without performing a reflow process. Further, more planarity can be obtained by performing a reflow process in addition, and the reliability is improved accordingly.

An MTJ pattern layout for a memory device is disclosed that includes two CMP assist features outside active MTJ device blocks. A first plurality of dummy MTJ devices is located in two dummy bands formed around an active MTJ device block. The inner dummy band is separated from the outer dummy band by the MTJ ILD layer and has a MTJ device density essentially the same as the MTJ device block. The outer dummy band has a MTJ device density at least 10% greater than the inner dummy band. The inner dummy band serves to minimize CMP edge effect in the MTJ device block while the outer dummy band improves planarization. A second plurality of dummy MTJ devices is employed in contact pads outside the outer dummy band and is formed between a WL ILD layer and a BIT ILD layer thereby minimizing delamination of the MTJ ILD layer.

A polishing pad having a polishing layer which has specific composition and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 60° C. of 2 to 15 and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 90° C. of 4 to 20 and is made of a polyurethane or polyurethane-urea. This polishing pad suppresses the scratching of the surface to be polished and planarizes the surface efficiently. A polishing pad having a polishing layer containing water-soluble particles can achieve a higher removal rate.

The present invention relates to the field of printing equipment technodlogy. The gluing and binding machine includes page distributing mechanism, cover page conveying mechanism, vibrating and tidying mechanism and gluing and binding formation mechanism combined by a conveying belt into an integral and controlled by a programmed controller. The page distributing mechanism comsists of one or more page distributing conveying belts and several paper suckers; the cover page conveying mechanism consists of paper sucking and impressing wheel; the vibrating and tidying mechanism consists of vibrating cylinder driven paper sucking disc; and the gluing and binding formation mechanism consists of chain driven by chain wheel, support board, paper preheater, glue sprayer and setter.

Disclosed is an in-plane switching mode liquid crystal display, in which a pixel electrode and a common electrode are formed on the same substrate. The display includes a first substrate having a first conductive layer and second conductive layer, the first conductive layer and second conductive layer formed on each surface of the first substrate; a second substrate has a transparent pixel electrode and a transparent common electrode formed on one surface of the second substrate, facing the second conductive layer; an electrical connection part is installed to electrically connect the second conductive layer to the transparent common electrode, wherein a common voltage applied to the transparent common electrode is applied to the second conductive layer through the electrical connection part. This arrangement prevents generation of static electricity to suppress a whitening phenomenon due to liquid crystal polarization in a liquid crystal layer, thereby improving display image quality.

A boundary acoustic wave device includes a LiNbO3 substrate having a plurality of grooves provided in the upper surface thereof, electrode layers which are defined by a metal material filled in the grooves and which include IDT electrodes, and a dielectric layer, such as a SiO2 layer, provided over the upper surface of the piezoelectric substrate and the electrodes. The upper surface of the dielectric layer is flat or substantially flat. The thickness of the electrodes, θ of the Euler angles (0°, θ, −45° to +45°) of the LiNbO3 substrate, and the thickness of the dielectric layer are within any of the ranges shown in Table 1.

One first aspect of the invention relates to a connection device for the bottom (1) and lid (3) of a box with side-panels (2). The device comprises one or more first attachment means (5) firmly connected to the bottom (1) and lid (3) and one or more attachment means (6) firmly connected to at least one side panel (2). Connection means (7) are also provided for connecting the bottom (1) and lid (3) to the side panel (2) ny interaction with the attachment means (5, 6). Each connection means (7) consists of a clamp with a resilient body (7.1), a first hook (7.2) being arranged at one end and a second hook (7.3) being arranged at the other end. The first attachment means consists of a first rail (5), arranged along an edge on the bottom (1) and lid (3) respectively, equipped with connection means consisting of one or more slots (5.4). The second attachment means consists of a second rail (6) arranged on a side panel (2) essentially parallel to the edge of the side panel (2). The first hook (7.2) is devised to hook into a slot (5.4) in the first rail (5). According to the invention, the clamp is equipped with a third hook (7.7). The first rail's (5) connection means also has receptor means (5.5) for the third hook (7.7). The receptor means (5.5) is arranged to receive the third hook (7.7) in a reception direction differing from the application direction of the first hook (7.2) into the slot (5.4). This prevents the clamp (7) from falling off the first rail (5). The invention also relates to a box equipped with this connection device and a clamp (7) intended for use in such a connection device.

The present invention discloses one kind of cold crack pouring asphalt emulsion and its preparation process. The cold crack pouring asphalt emulsion is prepared with asphalt 50-60 weight portions, solvent oil 3-5 weight portions, vegetable oil 3-5 weight portions, anionic or cationic asphalt emulsifier 1-2 weight portions, ethylene glycol or glycerin 8-10 weight portions, and water 20-30 weight portions. The preparation process includes the following steps: 1. heating asphalt to 110-120 deg.c; 2. mixing vegetable oil and solvent oil, and adding the mixture oil into the hot asphalt through stirring; 3. adding ethylene glycol or glycerin into water through stirring and heating to 55-60 deg.c; 4. adding the asphalt emulsifier into water at 55-60 deg.c through stirring to form emulsion; and 5. mixing the emulsion and asphalt mixture. The asphalt emulsion is poured to crack in highway, and has lowered highway maintenance cost.

A brush including removable plates with tines that can be inserted into a complementary handle. The plates, made up of tines connected to a manifold at one end, are retained by the handle. Removable flat plates can be of a unitary construction and can be rolled, stacked or folded upon one another to form layers of tines. The plates are designed to be easily separated from a brush after use to allow for cleaning or replacement. The plates may also be interconnected by a set of hinges. The tines may include a plurality of flutes or ribs that increase the surface area of the tines and aid in increasing liquid retention when the brush is being used. After use, the individual plates can be removed from the handle and easily cleaned.

A light-emitting device is disclosed comprising an organic light-emitting diode structure and an encapsulation comprising a light-transmitting window with at least a first inorganic layer, an organic layer and a second inorganic layer, the organic layer comprising domains of a dispersed first organic component embedded by a second component, the first and the second component having a mutually different refractive index, the organic layer being sandwiched between the first and the second inorganic layer.

An information presenting device. The device is arranged to be capable of assuming a first flattened configuration, for transport or storage, and of assuming a second extended and hence self-supporting configuration. The device comprises at least two panels joined together along the respective edges of at least two of the panels such that the device, having assumed the second configuration, forms a hollow cylinder, and at least one locking member, arranged between the panels 4, for continuously adjustable locking of the device in the first or second configuration, the locking member comprising a first part and a second part, the first part being slidably connected to the second part and the locking member being self-locking by a friction band coupling formed between contact surfaces of the first part and the second part of the locking member.

A probe card on which micro probe needles are arranged at high density and with high precision with neither the need of a complicated structure or variation in needle height. A probe card 1 installed in a wafer tester comprises a board 2 having a wiring pattern for transmitting a test signal to be impressed on a wafer under test, a built-up board 10 formed on the surface of the board 2, a comb-shaped silicon-made probe needle 20 arranged on the built-up board 10 and connected to the surface wiring pattern 11, and a flat portion 12 formed by plating on the surface wiring pattern 11 on the built-up board 10 and having a surface flattened by polishing. The probe needle 20 is loaded on the flat portion 12 and thus mounted on the board 2.

A device for the storage of a corneal specimen has means for the reception and entrapment of a corneal specimen, connected to the means for the creation of a pressure gradient with overpressure on the endothelial side and to the preservation medium circulation means in the layouts that present the means for the reception and entrapment of the cornea specimen. The means for the reception and entrapment of the corneal specimen entrap the sclera ciliary zone surrounding the cornea in an airtight manner to delimit a separate endothelial chamber and epithelial chamber in which the preservation medium can circulate with an overpressure in the endothelial chamber; The intermediate component and the endothelial lid comprise inlet and outlet orifices for the preservation medium which are connected to the means for the circulation of the preservation medium and the creation of a pressure gradient between the endothelial chamber and the epithelial chamber with overpressure in the endothelial chamber.

Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.