2208 results about "Piezoelectric substrate" patented technology

A piezoelectric substrate is fixed to the movable plate or the support substrate directly or through a drive electrode of the piezoelectric substrate. When a pressure on an input operation surface is detected, a drive voltage is impressed on the drive electrodes of the piezoelectric substrate. In response, the piezoelectric substrate vibrates the movable plate or the support substrate, thereby providing tactile feedback to an operator. Because the movable plate or the support substrate directly vibrates without an independent vibrating source, there is no energy loss or transmission delay caused by transmitting the vibration, and finely control of the contraction and expansion of the piezoelectric substrate allows fine control of the vibration. In one embodiment, the drive voltage is modulated with signals dependent on the location of the pressure. In another embodiment, the drive voltage is modulated with audio frequencies to create a speaker.

A SAW transducer includes a pair of opposing bus bars formed on a surface of a piezoelectric substrate with a plurality of interdigital electrodes extending from each of the opposing bus bars. A center region and opposing edge regions are formed, wherein each edge region is proximate each bus bar and includes free end portions of the electrodes such that a wave velocity in each edge region is substantially lower than a wave velocity in the bus bars and in the center region, and wherein electro-acoustic sources extend into the edge regions for providing a SAW transducer having the piezoelectrically excited strongest mode is a piston mode with an amplitude distribution generally flat across most of the resonator area.

A gyroscope comprises a piezoelectric substrate having a surface. Disposed on the surface are a resonator transducer, a pair of reflectors, a structure such as a metallic dot, and a sensor transducer. The resonator transducer creates a first surface acoustic wave on the surface. The pair of reflectors reflects the first surface acoustic wave to form a standing wave within a region of the surface between the pair of reflectors. The structure is disposed on the surface within the region, wherein a Coriolis force acting upon the structure creates a second surface acoustic wave. The sensor senses the second surface acoustic wave and provides an output indicative thereof.

A method for manufacturing a composite piezoelectric substrate is capable of forming an ultra-thin piezoelectric film having a uniform thickness by efficiently using a piezoelectric material. A piezoelectric substrate and a supporting substrate are prepared, ions are implanted from a surface of the piezoelectric substrate to form a defective layer in a region at a predetermined depth from the surface of the piezoelectric substrate, impurities that are adhered to at least one of the surface of the piezoelectric substrate in which the defective layer is formed and a surface of the supporting substrate are removed to directly expose the constituent atoms of the surfaces and to activate the surfaces, the supporting substrate is bonded to the surface of the piezoelectric substrate to form a bonded substrate body, the bonded substrate body is separated at the defective layer formed in the piezoelectric substrate so that a separation layer between the surface of the piezoelectric substrate and the defective layer is separated from the piezoelectric substrate and bonded to the supporting substrate to form a composite piezoelectric substrate, and the surface of the separation layer of the composite piezoelectric substrate is smoothed.

A piezoelectric device is manufactured in which the material of a supporting substrate can be selected from various alternative materials. Ions are implanted into a piezoelectric substrate to form an ion-implanted portion. A temporary supporting substrate is formed on the ion-implanted surface of the piezoelectric substrate. The temporary supporting substrate includes a layer to be etched and a temporary substrate. The piezoelectric substrate is then heated to be divided at the ion-implanted portion to form a piezoelectric thin film. A supporting substrate is then formed on the piezoelectric thin film. The supporting substrate includes a dielectric film and a base substrate. The temporary supporting substrate is made of a material that produces a thermal stress at the interface between the temporary supporting substrate and the piezoelectric thin film less than the thermal stress at the interface between the supporting substrate and the piezoelectric thin film.

PCT No. PCT/JP97/03807 Sec. 371 Date Dec. 21, 1998 Sec. 102(e) Date Dec. 21, 1998 PCT Filed Oct. 22, 1997 PCT Pub. No. WO98/38736 PCT Pub. Date Sep. 3, 1998In a piezoelectric vibrator which has excitation electrodes respectively disposed on the top surface and undersurface of a piezoelectric substrate, at least one of the excitation electrodes being an inverted-mesa electrode that has a recess formed in the opposite side of the electrode from the side which contacts the piezoelectric substrate. Thus, an AT-cut quartz resonator in which the capacitance ratio gamma is reduced to a value below the limit value can be provided as a result of use of the inverted-mesa electrodes as excitation electrodes.

Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.

A small and highly reliable acoustic wave device and a method for production of the same will be provided. The acoustic wave device has a piezoelectric substrate 1; a SAW element 2 on one main surface of the piezoelectric substrate 1; an outside connection-use conductor 3 formed on the one main surface of the piezoelectric substrate 1 and electrically connected to the SAW element 2; a columnar electrode 10 on the outside connection-use conductor 3; and a protective cover 6 defining inner walls of a vibration space 7 for vibration of the SAW element 2 and planarly surrounding a side surface of the columnar electrode 10.

A touch panel of the present invention in which a piezoelectric substrate is fixed to a movable plate or a supporting substrate has a reduced weight, size, and thickness by providing simpler wiring. The touch panel comprises: a movable plate having an input manipulation surface; a supporting substrate, disposed with a slight insulation gap from the movable plate, for supporting the movable plate from a back surface thereof; conductive layers on the movable plate and the supporting substrate on their respective opposing surfaces; and a piezoelectric substrate fixed to the movable plate or the supporting substrate. A pair of driving electrodes on the piezoelectric substrate are fixed to respective opposing surfaces of the piezoelectric substrate. A conductive layer electrode of the movable plate, a conductive layer electrode of the supporting substrate, and the pair of driving electrodes of the piezoelectric substrate are withdrawn integrally using a single connector tail.

Various aspects of the present invention relate to the control and manipulation of fluidic species, for example, in microfluidic systems. In one set of embodiments, droplets may be sorted using surface acoustic waves. The droplets may contain cells or other species. In some cases, the surface acoustic waves may be created using a surface acoustic wave generator such as an interdigitated transducer, and/or a material such as a piezoelectric substrate. The piezoelectric substrate may be isolated from the microfluidic substrate except at or proximate the location where the droplets are sorted, e.g., into first or second microfluidic channels. At such locations, the microfluidic substrate may be coupled to the piezoelectric substrate (or other material) by one or more coupling regions. In some cases, relatively high sorting rates may be achieved, e.g., at rates of at least about 1,000 Hz, at least about 10,000 Hz, or at least about 100,000 Hz, and in some embodiments, with high cell viability after sorting.

An acoustic wave device fabrication method includes: forming on a piezoelectric substrate a comb-shaped electrode and a wiring layer coupled to the comb-shaped electrode; forming on the piezoelectric substrate a first dielectric film having a film thickness greater than those of the comb-shaped electrode and the wiring layer, covering the comb-shaped electrode and the wiring layer, and being made of silicon oxide doped with an element or undoped silicon oxide; forming on the first dielectric film a second dielectric film having an aperture above the wiring layer; removing the first dielectric film exposed by the aperture of the second dielectric film by wet etching using an etching liquid causing an etching rate of the second dielectric film to be less than that of the first dielectric film so that the first dielectric film is left so as to cover an end face of the wiring layer and the comb-shaped electrode.

Provided is a highly reliable acoustic wave device wherein deterioration of electrical characteristics due to deformation of a protective cover is suppressed. A method for manufacturing such acoustic wave device is also provided. The acoustic wave device has a piezoelectric substrate 1 propagating an acoustic wave; an excitation electrode arranged on a first main surface of the piezoelectric substrate 1; a columnar outside connection-use electrode 10 electrically connected to the excitation electrode; a protective cover 17 having a hollow accommodating space 8 in which the excitation electrode is accommodated on the first main surface; and a conductive layer 18 connected to the electrode 10 on the protective cover 17.

A surface acoustic wave device includes a piezoelectric substrate made of LiNbO₃ having an electromechanical coupling coefficient k whose square is at least about 0.025, at least one electrode that is made of a metal whose density is greater than that of Al or an alloy primarily including the metal or that is composed of laminated films made of a metal whose density is greater than that of Al or an alloy primarily including the metal and another metal, the electrode being disposed on the piezoelectric substrate, a first insulating layer disposed in a region other than a region where the at least one electrode is disposed, the thickness of the first insulating layer being substantially equal to that of the electrode, and a second insulating layer covering the electrode and the first insulating layer. The density of the electrode is at least about 1.5 times greater than that of the first insulating layer.

An elastic boundary wave device includes a first piezoelectric substrate, IDTs arranged thereon, a first dielectric film having a smoothed surface that covers the IDTs, a second substrate that is a silicon-based substrate, and a second dielectric film provided on a main surface of the second substrate. The smoothed surface of the first dielectric surface and a surface of the second dielectric film are joined together.