647 results about "Interdigital transducer" patented technology

An acoustic wave device is disclosed. The acoustic wave device can include a multilayer piezoelectric substrate and an interdigital transducer electrode over the multilayer piezoelectric substrate. The interdigital transducer electrode includes a first layer and a second layer over the first layer. The interdigital transducer electrode has a tilt angle of at least 12 degrees. The acoustic wave device being configured to generate a surface acoustic wave having a wavelength L.

A surface acoustic wave resonator comprises a multi-layer piezoelectric substrate including a carrier substrate, a layer of a first dielectric material disposed on the carrier substrate, and a layer of piezoelectric material disposed on the layer of the first dielectric material, interdigital transducer electrodes disposed on the layer of piezoelectric material and including interleaved electrode fingers, and a layer of a second dielectric material disposed on a central interleaved region of the interleaved electrode fingers, gap regions of the interdigital transducer electrodes being either free of the layer of the second dielectric material or having a thinner layer of the second dielectric material than the central interleaved region to reduce spurious signals in an admittance curve of the surface acoustic wave resonator.

An acoustic wave device, a radio frequency filter and an electronics module are provided. The acoustic wave device, comprises a layer of piezoelectric material, a pair of interdigital transducer electrodes disposed on an upper surface of the layer of piezoelectric material, each interdigital transducer electrode including a bus bar and a plurality of electrode fingers extending from the bus bar through a central region of the interdigital transducer electrode towards an edge region of the interdigital transducer electrode, each of the plurality of electrode fingers having a width in a direction perpendicular to the extension of the electrode fingers that is smaller in the edge regions than in the central regions, and trench portions located in the upper surface of the layer of piezoelectric material, the trench portions overlapping with the edge regions of the interdigital transducer electrodes. The acoustic wave device provides effective suppression of transverse modes.

The invention relates to the technical field of fault detection, in particular to a high-voltage connector loosening fault detection method and device and an automobile, and the method comprises the following steps: forming a surface acoustic wave resonator array based on an interdigital transducer array, an acoustic wave resonator and a flexible waveguide; butting a signal source radio frequency cable with the pin interdigital electrode chip, triggering data acquisition, performing Fourier transform on original data, and judging the loosening risk of the connector according to each parameter threshold value; carrying out three-dimensional modeling on the connector plugging interface, carrying out modal analysis on the model, and obtaining surface acoustic wave frequencies, group velocities and phase distribution under different pre-tightening forces so as to identify a contact force abnormal region; based on a multi-stage early warning mechanism, rapid locking is achieved through electrorheological fluid, and displacement is finely adjusted through a magnetostrictive rod. According to the invention, the loosening hidden danger can be quickly and accurately locked, a tight protection system is constructed by multi-stage early warning and mechanical self-locking, and the loosening risk of the high-voltage connector can be greatly reduced from early warning to active intervention.

An acoustic wave device includes a piezoelectric film and an IDT electrode on the piezoelectric film. The IDT electrode includes first and second busbars, at least one first electrode finger, and at least one second electrode finger. When an overlap region is defined as a region in which the first and second electrode fingers overlap each other in an acoustic wave propagation direction, points A2, B2, C2, and D2, defined as follows, are all outside the cavity when, at the points A2, B2, C2, and D2, xa>about 25 μm, ya>about 25 μm, xb>about 25 μm, yb>about 25 μm, xc>about 25 μm, yc>about 25 μm, xd>about 25 μm, and yd>about 25 μm.

The utility model discloses a surface acoustic wave device and a radio frequency front-end module. The surface acoustic wave device comprises an interdigital transducer, wherein the interdigital transducer comprises a first bus bar and a second bus bar which are oppositely arranged, an electrode finger and a plurality of gap electrodes; in the extending direction of the electrode fingers, an overlapping area is formed between the first bus bar and the second bus bar, a first area is formed between the overlapping area and the first bus bar, a second area is formed between the overlapping area and the second bus bar, and the first area and the second area are adjacent to the first bus bar and the second bus bar respectively; the plurality of gap electrodes are arranged in at least one of the first area and the second area, and the plurality of gap electrodes, the bus bars and the electrode fingers are arranged at intervals; wherein the plurality of gap electrodes form a first curve in the arrangement direction of the electrode fingers. According to the invention, the Q value near the anti-resonance point can be improved while the inhibition effect of the transverse mode is improved.

An acoustic wave device includes a support, a piezoelectric layer, an IDT electrode including first and second busbars and first and second electrode fingers, and a dielectric film provided on the piezoelectric layer so as to overlap at least a portion of the IDT electrode in plan view. When a thickness of the piezoelectric layer is d and a center-to-center distance between centers of adjacent ones of the electrode fingers is p, d / p is less than or equal to about 0.5. A cavity that opens on a side of the piezoelectric layer is provided in the support. The IDT electrode includes an intersection region, and first and second gap regions. The dielectric film is provided at at least a portion of the first and second gap regions, and a thermal conductivity of the dielectric film is higher than a thermal conductivity of the piezoelectric layer.

The invention relates to the technical field of filters, and discloses a resonator and a surface acoustic wave filter, and the resonator comprises an interdigital transducer and a transverse strip structure. The interdigital transducer comprises a first bus bar, a second bus bar, a plurality of first finger bars and a plurality of second finger bars; the first bus bar and the second bus bar are oppositely arranged, the same ends of the plurality of first finger bars are connected with one side, close to the second bus bar, of the first bus bar, and the same ends of the plurality of second finger bars are connected with one side, close to the first bus bar, of the second bus bar; the transverse strip structure is arranged in a target area of the interdigital transducer; the transverse strip structure comprises a plurality of first transverse strips and a plurality of second transverse strips, the first transverse strips and the second transverse strips are arranged in a crossed mode, the adjacent first transverse strips and second transverse strips are distributed in a staggered mode, and the first ends, in the first direction, of the first transverse strips are connected with the third ends, in the first direction, of the second transverse strips. According to the resonator provided by the invention, the Q value of the resonator can be improved while a transverse mode is effectively suppressed.

The invention relates to a laser radar on-chip integrated chip based on acousto-optic modulation, an on-chip acousto-optic scanning method and a laser radar system. A plurality of groups of interdigital transducers are arranged on the lithium niobate film, two groups of chirp IDTs respectively work at a low-frequency band and a high-frequency band, and sound waves at the low-frequency band correspondingly generate a relatively large Bragg deflection angle; and the high-frequency-band sound waves correspondingly generate a relatively small Bragg deflection angle. The two groups of IDTs work cooperatively, so that two-dimensional vector scanning of a dual-frequency broadband can be realized in a chip plane; the pair of focusing IDTs can form a focusing sound field in an action area, so that the light beam subjected to two-dimensional deflection is controllably deflected in the Z direction, and the chip is endowed with the three-dimensional scanning capability. The device is high in diffraction efficiency and low in power consumption; unification of large-range search and high-precision scanning is realized; z-axis deflection is realized by integrating a special focusing type interdigital transducer, a three-dimensional scanning function is realized on a monolithic integrated acousto-optic chip, and the structure is extremely compact.

A multilayer piezoelectric substrate acoustic wave device including an active region having a center region and a border region is disclosed. The acoustic wave device can include a support substrate, a piezoelectric layer over the support substrate, and an interdigital transducer electrode in electrical communication with the piezoelectric layer. The interdigital transducer electrode includes a bus bar and a finger extending from the bus bar. The finger in the border region has a first portion, a second portion between the center region and the first portion, and a third portion between the center region and the second portion. The first portion and the third portion have liner densities greater than liner densities of the second portion and the finger in the center region.

An acoustic wave device includes a silicon single crystal baseplate including a main surface, a piezoelectric layer directly or indirectly on the main surface of the silicon single crystal baseplate, and an IDT electrode on the piezoelectric layer and including electrode fingers. The piezoelectric layer is a lithium niobate layer. In the main surface of the silicon single crystal baseplate, a plane orientation is (111). When Euler angles in the main surface of the silicon single crystal baseplate are (φ, θ, ψ), the ψ in the Euler angles of the silicon single crystal baseplate is about −30 degrees <ψ< about 30 degrees.

A multilayer piezoelectric substrate acoustic wave device including an active region having a center region and a border region is disclosed. The acoustic wave device can include a support substrate, a piezoelectric layer over the support substrate, and an interdigital transducer electrode in electrical communication with the piezoelectric layer. The piezoelectric layer has a trench in the border region. The interdigital transducer electrode includes a bus bar and a finger extending from the bus bar. The finger in the border region has a first portion with a first width, a second portion with a second width between the center region and the first portion, and a third portion with a third width between the center region and the second portion. The second width is narrower than the first width and the third width.

An acoustic wave device includes a piezoelectric layer and an interdigital transducer electrode disposed over the piezoelectric layer. The interdigital transducer electrode is thicker in a center region of the interdigital transducer electrode than in a gap region of the interdigital transducer electrode to thereby reduce a mass loading of the interdigital transducer electrode in the gap region. The interdigital transducer electrode has a layer of more dense material disposed of a layer of less dense material.

The invention discloses a surface acoustic wave resonator and a filter. The surface acoustic wave resonator comprises a substrate; the interdigital transducer is positioned on one side of the substrate; the reflecting grating and the interdigital transducer are arranged on the same layer, and the reflecting grating is located on the two sides of the interdigital transducer in the first direction; the plurality of reflecting gratings are arranged along a first direction and extend along a second direction; in the first direction, a reflecting grating gap is formed between any two adjacent reflecting gratings; the first direction and the second direction intersect and are parallel to the plane where the substrate is located; the orthographic projection of the acoustic impedance structure on the plane where the substrate is located is at least overlapped with the orthographic projection of the reflecting grating gap on the plane where the substrate is located; the acoustic impedance of the acoustic impedance structure is different from the acoustic impedance of the reflecting grating. By adopting the technical means, the acoustic impedance structure is arranged, and the acoustic impedance of the acoustic impedance structure is different from that of the reflecting grating, so that a stray mode in the resonator can be inhibited, and the performance of the surface acoustic wave resonator is further improved.

The invention discloses a digital acoustic fluidic chip, a preparation method and a multi-dimensional sample processing method, the digital acoustic fluidic chip comprises an upper polar plate and a lower polar plate, and the upper polar plate comprises a glass layer, a coating layer and an upper hydrophobic layer which are arranged in sequence; the lower polar plate comprises a lower hydrophobic layer, a dielectric layer, an electrode layer and a substrate which are arranged in sequence; the electrode layer comprises an EWOD pin electrode, a driving electrode, a sound wave pin electrode and an interdigital transducer; the interdigital transducer comprises a sound field and electric field multiplexing module, a sound standing wave field and thermal field module, a focusing sound field and thermal field module and a sound vortex enrichment module; each driving electrode is connected with one EWOD pin electrode, the two sides of the sound field and electric field multiplexing module, the two sides of the sound standing wave field and thermal field module, the two sides of the focusing sound field and thermal field module and the two sides of the sound vortex enrichment module are all connected with the two sound wave pin electrodes, and one side of the sound field and electric field multiplexing module is further connected with one EWOD pin electrode. The method has the advantages of multi-dimensional sample treatment and high-flexibility treatment.

A method for fabricating a sensor device that includes an integrated sensor assembly having a surface acoustic wave (SAW) sensor disposed on a piezoelectric substrate. The SAW sensor is adapted to measure an environmental condition of an environment in response to an RF signal. The SAW sensor includes an interdigitated transducer (IDT) formed on a substrate having at least a layer of a piezoelectric material. The SAW sensor includes either one or more SAW reflectors of a second IDT formed on the piezoelectric material. The SAW sensor further includes an RF antenna, a matching circuit and a waveguide are formed on the piezoelectric material. The SAW sensor and the RF antenna are integrated with one another on the piezoelectric material.

A surface acoustic wave device and a method of forming the surface acoustic wave device are disclosed. The surface acoustic wave device can include a piezoelectric layer with a bus bar region having a first thickness and a finger region having a second thickness less than the first thickness. The surface acoustic wave device can include an interdigital transducer electrode in electrical communication with the piezoelectric layer. The interdigital transducer electrode includes a bus bar and fingers that extend from the bus bar. The bus bar is positioned in the bus bar region and the fingers are positioned in the finger region.

Aspects of this disclosure relate to an acoustic wave device with transverse mode suppression. The acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode, a temperature compensation layer, and a mass loading strip. The mass loading strip can overlap edge portions of fingers of the interdigital transducer electrode. The mass loading strip can have a sidewall that is tapered inwardly from a bottom side of the mass loading strip to a top side of the mass loading strip. The top side can be shorter than the bottom side.

Aspects and embodiments disclosed herein include a surface acoustic wave resonator comprising a multilayer piezoelectric substrate and interdigital transducer (IDT) electrodes disposed on an upper surface of the multilayer piezoelectric substrate, the IDT electrodes having at least partially rounded upper sides.

The invention relates to the field of electronic component preparation processes, in particular to a high-performance temperature compensation surface acoustic wave filter and a manufacturing method thereof. An interdigital transducer, wherein the interdigital transducer is located at one side of the piezoelectric substrate; the transition layer is located on the side, away from the piezoelectric substrate, of the interdigital transducer, and the transition layer covers the interdigital transducer and prevents metal elements of the interdigital transducer from diffusing outwards; the functional layer is located on the side, away from the interdigital transducer, of the transition layer, the functional layer covers an active area of a metal finger strip of the interdigital transducer to form a high-sound-velocity area, the end, away from the active area, of the metal finger strip of the interdigital transducer forms a low-sound-velocity area, and a sound velocity difference is formed between the high-sound-velocity area and the low-sound-velocity area; therefore, transverse mode clutters are suppressed; the temperature compensation layer is located on the side, away from the transition layer, of the functional layer, and the temperature compensation layer covers the functional layer and the piezoelectric substrate; lateral mode clutters in TC-SAW are suppressed, and metal diffusion is suppressed at the same time.

Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a surface. A back surface of a single-crystal piezoelectric plate is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on a front surface of the piezoelectric plate with interleaved IDT fingers of the IDT disposed on the diaphragm. Back-side fingers are formed the back surface of the diaphragm.

An acoustic wave device has a substrate, an optional functional layer disposed over at least a portion of the substrate, a piezoelectric layer disposed over at least a portion of the functional layer and / or substrate, and an interdigital transducer electrode disposed on the piezoelectric layer. The piezoelectric layer has an outer edge spaced inward of an outer edge of the substrate, the outer edge of the piezoelectric layer being tapered at an angle relative to a surface of the substrate to thereby reduce an acoustic reflection magnitude at said outer edge of the piezoelectric layer.

An acoustic wave device includes a support substrate, a first high acoustic velocity film on the support substrate, a low acoustic velocity film on the first high acoustic velocity film, a second high acoustic velocity film on the low acoustic velocity film, a piezoelectric layer on the second high acoustic velocity film, and an IDT on the piezoelectric layer. Bulk waves propagate in the low acoustic velocity film more slowly than bulk waves propagate in the piezoelectric layer, bulk waves propagate in the first high acoustic velocity film faster than acoustic waves propagate on the piezoelectric layer, and bulk waves propagate in the second high acoustic velocity film faster than or as fast as bulk waves propagate in the first high acoustic velocity film.

An acoustic wave device includes a support with a thickness in a first direction, a piezoelectric layer in the first direction, and an interdigital transducer electrode in the first direction with first electrode fingers in a second direction, a first busbar electrode connected to the first electrode fingers, second electrode fingers in the second direction and facing corresponding ones of the first electrode fingers in a third direction, and a second busbar electrode connected to the second electrode fingers. The support has a hollow adjacent to the piezoelectric layer and at least partially overlapping the interdigital transducer electrode. The piezoelectric layer has a first through hole penetrating the piezoelectric layer between at least one first electrode finger and the second busbar electrode. The first through hole communicates with the hollow, has a length in the third direction, and overlaps a portion of a second electrode finger.

An acoustic wave resonator includes a piezoelectric layer and an IDT electrode. Electrode fingers of the IDT electrode are arranged in a first direction along a main surface of the piezoelectric layer. A region where the IDT electrode is provided includes split regions in a matrix in the first direction and a second direction in which the electrode fingers extend. The split region includes some of the electrode fingers and a portion of the electrode fingers in the longitudinal direction. The split regions include one split region and another split region adjacent to each other in the second direction. A duty in the one split region is larger than a duty in the another split region, and an electrode finger pitch in the one split region is smaller than an electrode finger pitch in the another split region.

The utility model relates to a sound field and electric field regulated biochemical liquid drop sample preparation device which comprises a base, a first support is fixedly mounted on the base, a first driving motor is fixedly mounted on the first support, a first driving wheel is rotatably mounted at the output end of the first driving motor, and a first toothed belt is fixedly connected with a Y-axis moving platform; a first driving motor rotates, and a first driving wheel drives a first toothed belt, so that the Y-axis moving platform moves in the Y direction; the two sides of the base are each provided with a supporting arm, the top ends of the two supporting arms are connected through an upper supporting arm, and second driving motors are fixedly installed on the two supporting arms. Sound waves generated by the Archimedes spiral interdigital transducer are adopted, the sound waves are focused at the nozzle when being transmitted to the tail end of the spray head, liquid drops are promoted to be broken and generated, the printing speed of the liquid drops at the nozzle is adjustable by adjusting sine alternating-current voltage parameter values, the size of the printing liquid drops is effectively controlled, and the printing efficiency is improved. The preparation of various biochemical liquid drop samples can also be realized.

A micro-acoustic filter includes a piezoelectric layer having a crystalline structure that may be laterally excited in a plate mode. The piezoelectric layer is formed on a layer stack that reflects acoustic energy back toward the piezoelectric layer. Acoustic waves are excited in the piezoelectric layer by voltages provided in interdigital transducers (IDTs) on an exposed surface of the piezoelectric layer. The electrode fingers of the IDTs are spaced from the exposed surface rather than being in contact with the exposed surface of the piezoelectric layer to avoid losses and spurious modes. In some examples, the electrode fingers may be supported on one end in a cantilevered configuration to maintain a first distance from the exposed surface of the piezoelectric layer. In some examples, the electrode fingers may also be supported on a second end by a pillar extending the first distance to the exposed surface.

An acoustic wave device includes a support substrate, a multilayer body, and an IDT electrode. The multilayer body includes a lithium tantalate piezoelectric layer and a lithium niobate piezoelectric layer that are laminated, and is on the support substrate. The IDT electrode is on the multilayer body, and includes electrode fingers. When a wavelength of an acoustic wave determined by a pitch of the electrode fingers is denoted as λ, a thickness of the multilayer body is about 0.66λ or less.

A laterally excited bulk acoustic wave device is disclosed. The laterally excited bulk acoustic wave device can include a first solid acoustic mirror, a second solid acoustic mirror, a piezoelectric layer that is positioned between the first solid acoustic mirror and the second solid acoustic mirror, an interdigital transducer electrode on the piezoelectric layer, and a support substrate arranged to dissipate heat associated with the bulk acoustic wave. The interdigital transducer electrode is arranged to laterally excite a bulk acoustic wave. The first solid acoustic mirror and the second solid acoustic mirror are arranged to confine acoustic energy of the bulk acoustic wave. The first solid acoustic mirror is positioned on the support substrate.

An acoustic wave device includes a first IDT electrode on a first main surface of a piezoelectric layer, and a second IDT electrode on a second main surface of the piezoelectric layer. The first IDT electrode includes first and second electrode fingers. The second IDT electrode includes third and fourth electrode fingers. The first and fourth electrode fingers overlap each other with the piezoelectric layer interposed therebetween. The second and third electrode fingers overlap each other with the piezoelectric layer interposed therebetween. A potential of the first electrode finger and that of the fourth electrode finger are opposite to each other. A potential of the second electrode finger and that of the third electrode finger are opposite to each other.