This invention discloses an insulating encapsulation structure and connection method for a probe temperature sensor, relating to the field of temperature sensor technology. The insulating connection bracket has an outer insulating and thermally conductive protective layer, and contains insulating
adhesive and a temperature-sensing component. The specific implementation is as follows: an insulating layer
assembly, a built-in snap-fit structure within the insulating connection bracket, and an eccentric cavity for housing the temperature-sensing component. A
thermistor glass body is used as the insulator. In the insulation process, direct contact between the glass body and the inner wall of the bracket reduces one useless insulating layer. The cavity formed by the end of the insulating connection bracket and the insulating layer
assembly houses the temperature-sensing component. The cavity contains a clearance structure for the
thermistor pins and multiple
layers of insulation between the pins and the conductive
copper wires. A fluid insulating
adhesive is used, and then the insulating connection is cured. Finally, the encapsulation is placed inside a
metal shell containing insulating
adhesive and cured, thus forming multiple
layers of effective insulation and sufficient safe insulation thickness between the
thermistor conductive pins and the
metal shell.