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366results about How to "Solve the slow scanning speed" patented technology

Production method of navigation template for positioning the pediculus arcus vertebrae

The invention relates to a method for fabricating a navigation templet used in pedicle positioning, including the following steps: firstly, collecting the original data and building up a three-dimensional vertebra model; wherein focusing on the location of a pedicle (1); then, conducting three-dimensional analysis to a screw entry passage of the pedicle and building up a virtual screw entry templet(3) which includes the screw entry passage(2); wherein the screw entry templet(3) is a reverse navigation templet which matches with the outline of the rear part of a vertebral lamina; and then, fabricating the reverse navigation templet through quick molding technique. The increases of CT or MRI scanning velocity and precision provide a precise sectional image for acquiring a three-dimensional model in reverse engineering, and the necessary organs can be quickly reconstructed through a three-dimensional reconstruction software and can be transformed and bored freely on the virtual model so as to figure out an optimal pedicle screw entry route. On the basis of the virtual model, the pedicle screw entry direction and depth can be guided by using the reverse navigation templet fabricated through quick molding technique during an operation so as to quickly and accurately finish the operation.
Owner:陆声

Attachment of a high-Z focal track layer to a carbon-carbon composite substrate serving as a rotary anode target

The present invention refers to hybrid anode disk structures for use in X-ray tubes of the rotary anode type and is concerned more particularly with a novel light weight anode disk structure (RA) which comprises an adhesion promoting protective silicon carbide (SiC) interlayer (SCI) deposited onto a rotary X-ray tube's anode target (AT), wherein the latter may e.g. be made of a carbon-carbon composite substrate (SUB′). Moreover, a manufacturing method for robustly attaching a coating layer (CL) consisting of a high-Z material (e.g. a layer made of a tungsten-rhenium alloy) on the surface of said anode target is provided, whereupon according to said method it may be foreseen to apply a refractory metal overcoating layer (RML), such as given e.g. by a tantalum (Ta), hafnium (Hf), vanadium (V) or rhenium (Re) layer, to the silicon carbide interlayer (SCI) prior to the deposition of the tungsten-rhenium alloy. The invention thus leverages the tendency for cracking of the silicon carbide coated carbon composite substrate (SUB′) during thermal cycling and enhances adhesion of the silicon carbide / refractory metal interlayers to the carbon-carbon composite substrate (SUB′) and focal track coating layer (CL) by an interlocking mechanism. Key aspects of the proposed invention are: a) controlled formation of coating cracks (SC) in the silicon carbide layer (SCI) and b) conformal filling of SiC crack openings with a refractory metal.
Owner:KONINKLIJKE PHILIPS ELECTRONICS NV
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