The invention discloses a sonic wave resonator and a processing method thereof. The sonic wave resonator comprises a substrate provided with an air cavity, a first passivation layer, a seeding layer, a multilayer structure, and a second passivation layer, wherein the first passivation layer is formed on the substrate and is above the air cavity, the seeding layer is formed on the first passivation layer which prevents the interaction between the seeding layer and the ambient environment of the resonator, the multilayer structure is formed on the seeding layer, and the second passivation layeris formed on the multilayer structure. The processing method comprises the steps of: providing the substrate with a sacrifice layer, forming the first passivation layer on the sacrifice layer and extending the first passivation layer to the whole substrate, forming the seeding layer on the first passivation layer, forming the multilayer structure on the seeding layer, forming the second passivation layer on the upper surface of the multilayer structure, and removing the sacrifice layer from the substrate to form the air cavity. The processing method can alleviate the adsorption of materials on the surface of the resonator, eliminate or alleviate the resonator frequency shift generated due to the influence of ambient air or a damp environment, lowers the requirements on the sealing packaging of the resonator to a great extent, and greatly reduces the manufacturing cost of the device.