23 results about "Mems microphone" patented technology

A MEMS microphone according to the present embodiment comprises: a first substrate; a second substrate disposed on the first substrate; an adhesive layer disposed between the first and second substrates; a MEMS structure disposed on the second substrate; a signal processing device disposed on the second substrate and spaced apart from the MEMS structure; and a capacitor disposed to be spaced apart from the MEMS structure and the signal processing device, wherein the capacitor comprises a first external electrode and a second external electrode disposed at opposite ends thereof, and a plurality of internal electrodes and dielectric layers disposed between the first external electrode and the second external electrode, and the first substrate, the second substrate, and the MEMS structure are stacked in a first direction, while the plurality of internal electrodes are stacked in a second direction perpendicular to the first direction.

Disclosed are a micro-electromechanical system (MEMS) structure and an MEMS microphone comprising same. The MEMS structure comprises a back plate; and a diaphragm located on one side of the back plate, wherein the diaphragm and the back plate forms a variable capacitor, the diaphragm comprises multiple first through holes and air release structures respectively corresponding to the first through holes, and the diaphragm further comprises one or more second through holes penetrating through the diaphragm.

The application provides a MEMS microphone, comprising a substrate and a MEMS chip, an ASIC chip, a pressure sensing module and a pressure data tuning processing module arranged on the substrate; wherein the pressure sensing module is arranged at the bottom of the MEMS chip. The pressure sensing module is used for sensing the pressure at the bottom of the MEMS chip and outputting a first pressure signal; the ASIC chip is used for converting the pressure signal output by the MEMS chip into a second pressure signal and outputting the second pressure signal to the pressure data tuning processing module; and the pressure data tuning processing module is used for compensating the second pressure signal according to the first pressure signal and outputting the compensated second pressure signal as a target pressure signal. The MEMS microphone can sense the pressure of different use interfaces through the pressure sensing module, compensate the output of the MEMS chip, and thus keep the pressure sensitivity of the MEMS microphone consistent in different use scenarios.

A MEMS microphone according to the present embodiment comprises: a first substrate; a second substrate disposed on the first substrate; a MEMS structure disposed on the second substrate; and a signal processing device disposed on the second substrate and spaced apart from the MEMS structure, wherein the first substrate comprises a plurality of first front-surface pads provided on one surface thereof, each of the plurality of first front-surface pads has a via formed therein, and the signal processing device is wire-connected to the vias.

The present invention relates to the technical field of transformers. Disclosed is a method for detecting acoustic anomalies of a transformer, the method comprising: collecting acoustic signals during operation of a transformer by using a plurality of high-sensitivity acoustic sensors; preprocessing the collected acoustic signals; extracting time-domain features, spectral features and deep features of the acoustic signals; performing fusion on the time-domain features, frequency-domain features and deep-learning features to form a composite feature vector; and constructing an anomaly detection model by using a support vector mechanism, and introducing an attention mechanism into the model. The method for detecting acoustic anomalies of a transformer ensures the high resolution and high signal-to-noise ratio of acoustic signals by means of a multi-sensor layout and a high-sensitivity MEMS microphone. The multi-sensor arrangement can cover different positions of the transformer, thereby more comprehensively capturing the operating state of the transformer. The extracted time-domain features and spectral features describe characteristics of the acoustic signals from different perspectives.

The utility model discloses a single shell bone conduction MEMS microphone structure belongs to bone conduction MEMS microphone technical field. A single shell bone conduction MEMS microphone structure, including shell and PCB, the shell is installed at the top of PCB, and the bottom of PCB is provided with PAD, the outer surface of PCB is provided with MEMS, one side of MEMS is provided with ASIC, wherein, ASIC is connected with MEMS and PCB through gold wire respectively. To solve the existing bone conduction MEMS microphone when receiving the broadcast is susceptible to external air pressure, thereby appearing the problem of resonance peak, and the diaphragm appears the tailing effect, finally leads the problem of voice fuzzy, the inner air vent solves the static pressure balance problem, protects the diaphragm and guarantees long -term stability, and the design of the air vent of extending to the support ring and mass block gap, through the accurate control of air release, can optimize the low frequency response, and suppress unnecessary resonance peak.

The present invention relates to a MEMS microphone module including a dual case and, more specifically, to a MEMS microphone module having a dual protection structure by incorporating a second case for protecting a first case which forms an inner space including a transducer and a semiconductor unit disposed on a base substrate, the module thus being capable of preventing noise from entering the inside of a set and external pressure from causing deformation.

This utility model discloses a MEMS microphone assembly and audio system, including a middle ring, a MEMS assembly, and a cap. The middle ring has a cavity extending through both ends, and a first connecting portion with a positioning structure is provided at the first end of the middle ring. The MEMS assembly includes a connected flexible circuit board module and a reinforcing plate. The reinforcing plate is connected to the positioning structure and has a first sound receiving hole. Electrical connecting portions are provided at both ends of the flexible circuit board module and pass through the cavity of the middle ring. The cap has an opening and a cover plate at both ends, respectively. The cover plate has a second sound receiving hole adapted to the first sound receiving hole. The opening of the cap connects to the first connecting portion, and the cover plate abuts against the reinforcing plate. This utility model enables miniaturization and improves the compactness of the internal structure.

The application relates to the technical field of monitoring, and particularly discloses a self-sensing and early-warning seamless expansion joint based on a flexible MEMS sensing array, which comprises a flexible sensing array module and a data concentrator; the flexible sensing array module is composed of a high-performance elastomer base body, a MEMS sensor array embedded in the base body and a flexible printed circuit; the MEMS sensor array is composed of a plurality of sensing nodes distributed in a grid-shaped dot matrix form, each sensing node is integrated with a three-axis MEMS accelerometer, a MEMS temperature sensor, a MEMS strain gauge and a MEMS microphone; the application endows the seamless expansion joint with real-time, multi-dimensional and self-diagnostic intelligent monitoring capability through the cooperation of hardware integration and algorithm innovation; the integrated module of the flexible base body and the multi-parameter MEMS sensing array solves the problem of long-term reliable cooperative work of the sensor and the flexible deformation body, and realizes the synchronous intensive sensing of multiple physical fields such as temperature, strain, vibration and sound.

The present application relates to a kind of transformer fault diagnosis device and method based on segmented adaptive processing, it is related to fault diagnosis technical field.The composite sensing array module of the present application adopts frequency complementary piezoelectric ceramic sensor and MEMS microphone to obtain full-band voiceprint / vibration signal;Wide-band signal acquisition module is through hardware anti-interference and algorithm denoising cooperation, the high-precision signal of acquisition full-band is anti-interference processing and digitization;Segmented adaptive processing module includes frequency band adaptive division unit, segmented sampling optimization unit and sub-domain feature extraction unit, realize dynamic frequency division, sampling frequency and the adaptive adjustment of quantization accuracy and sub-domain feature extraction obtain characteristic vector, on the premise of retaining high-precision feature, using adaptive quantization accuracy gives consideration to identification accuracy and processing efficiency.Data fusion diagnosis module is through feature weighting, PCA dimension reduction and the diagnosis of SVM model, realizes transformer fault type, position, severity identification.

The utility model discloses a kind of double-shell type bone conduction MEMS microphones, it relates to bone conduction MEMS microphone technical field, to solve the problem that the existing bone conduction microphone has insufficient in structural strength and protective performance, assembly convenience and use stability are improved, its technical scheme main point includes PCB board, first shell and second shell are installed on the outer surface of the PCB board, the second shell is located in the inside of first shell, diaphragm assembly is provided on the outer surface of the second shell, the diaphragm assembly is located between first shell and second shell, MEMS chip and ASIC chip are provided on the outer surface of the PCB board, the MEMS chip and ASIC chip are located in the inside of second shell, a plurality of PAD connecting structures are provided on the outer surface of the side of the PCB board. Reach the effect that can be conveniently assembled, while protective performance is strong, structural connection firmness is strong, can carry out more stable work.

The present application relates to a kind of sensing device for directional MEMS microphone, including at least two sensing units, wherein: at least two sensing units include the first sensing unit with the first resonant frequency and the second sensing unit with the second resonant frequency, the first resonant frequency is different from the second resonant frequency;There is phase difference between the output signal of first sensing unit and the output signal of second sensing unit in the frequency range between the first resonant frequency and the second resonant frequency.The present application also relates to a kind of directional MEMS microphone, which includes the sensing device described above.The present application also proposes an electronic device, which includes the directional MEMS microphone described above.

The present application relates to a kind of MEMS microphone device and its manufacturing method, wherein the MEMS microphone device includes: substrate with back cavity, first support part formed on the upper surface of substrate and with the through hole being communicated with back cavity, cut-off ring formed on the upper surface of substrate inside through hole, lower plate formed on the upper surface of first support part and cut-off ring, and upper plate;Cut-off ring is used to block the lateral etching of first support part when etching through hole;Lower plate includes lower plate main part and lower plate lead-out part connected with each other;Upper plate is formed above lower plate main part and forms cavity between lower plate main part.The present application stops wet release process in cut-off ring by using cut-off ring, avoids the risk of lower plate falling off caused by over-etching, and can also release the stress of diaphragm for diaphragm structure, to reduce the occurrence of diaphragm breakage.

This improves the characteristics of microphones equipped with MEMS microphones or similar electroacoustic conversion elements. [Solution] The shape of the microphone holder 211 that fixes the MEMS microphone unit 22 to the front end surface is a truncated cone shape that narrows from back to front with the front-to-back direction as the axis, and the side surface is tapered, approaching the axis from back to front. By making the structure around the MEMS microphone unit 22 smaller, the peak value of the resonant frequency can be reduced, and the reflection of acoustic signals (sound waves) arriving from the front towards the MEMS microphone unit 22 can be suppressed.

A MEMS microphone according to the present embodiment comprises: a first substrate; a second substrate disposed on the first substrate; an adhesive layer disposed between the first substrate and the second substrate; a photo solder resist (PSR) layer disposed on the second substrate; and a MEMS structure disposed on the second substrate, wherein the PSR layer comprises an open region in which the second substrate is exposed, and the open region comprises a first edge part formed along the outer edge of the MEMS structure.

This invention relates to the field of acoustic and electronic technology, and provides a MEMS microphone chip, including a substrate with a back cavity and a capacitor system. The capacitor system includes a diaphragm and a backplate arranged at relatively intervals. The diaphragm includes an effective vibrating part, a diaphragm fixing part, and an elastic connecting part. The elastic connecting part has a plurality of through holes arranged at intervals. The diaphragm also includes an independent diaphragm located in each of the through holes and a support post fixing the independent diaphragm to at least one of the substrate or the backplate. A venting slot is formed between the elastic connecting part and the independent diaphragm, surrounding the independent diaphragm. This invention improves the reliability and durability of the MEMS microphone chip by providing multiple through holes on the elastic connecting part and placing independent diaphragms in the through holes, so that when the diaphragm vibrates, the elastic connecting part contacts the independent diaphragm or the support post, thereby dispersing the stress of the elastic connecting part by the independent diaphragm or the support post.

The utility model discloses a three -layer board type bone conduction MEMS microphone relates to bone conduction MEMS microphone technical field, aims at solving the existing bone conduction microphone assembly complex, the structural strength after assembly needs to be improved, the whole assembly efficiency needs to be improved, its technical scheme main points include first PCB board, second PCB board, third PCB board, the second PCB board is located between first PCB board and third PCB board, between first PCB board and second PCB board, between second PCB board and third PCB board passes through the tin cream and connects fixed, the second PCB board is printed with the through circuit, the outer surface of third PCB board is provided with the diaphragm subassembly, the diaphragm subassembly is located the inboard of second PCB board, and the diaphragm subassembly contains the support ring. Reach the effect of the current assembly process can effectively simplify, improve assembly efficiency, improve the structural firmness and stability of after assembly simultaneously.

This invention relates to the field of acoustic and electronic technology, and provides a MEMS microphone chip, including a substrate with a back cavity and a capacitor system. The capacitor system includes a diaphragm and a backplate. The diaphragm includes an effective vibrating part, a diaphragm fixing part, and an elastic connecting part. The elastic connecting part includes a plurality of spaced elastic elements. Each elastic element includes a connecting arm connected to the diaphragm fixing part and elastic arms that bend and extend to both sides from the connecting arm and connect to the effective vibrating part. A hollow part is formed between the elastic arms and the effective vibrating part. The diaphragm also includes an independent diaphragm located within the hollow part and a support column that fixes the independent diaphragm to at least one of the substrate or the backplate. Venting slits are provided on the inner and outer sides of the elastic elements. By setting an independent diaphragm, this invention allows the elastic arms to contact the independent diaphragm or the support column when the diaphragm vibrates, thereby dispersing the stress of the elastic elements and improving the reliability and durability of the MEMS microphone chip.

This specification relates to the field of printed circuit board manufacturing technology, specifically disclosing a vacuum suction cup and vacuum printing fixture for printing adhesive pads. The vacuum suction cup is used to adsorb printed circuit boards, on which multiple MEMS microphone units are disposed, and each MEMS microphone unit has a sound hole. The vacuum suction cup includes a suction cup body, and a vacuum adsorption structure is disposed on the adsorption area of ​​the suction cup body. The vacuum adsorption structure includes at least one vacuum groove. The position of the at least one vacuum groove in the adsorption area corresponds to the blank area on the corresponding printed circuit board where no MEMS microphone unit is disposed. Each vacuum groove is a non-through vacuum groove, and the bottom of each vacuum groove is provided with multiple groove bottom through holes penetrating the suction cup body. Each groove bottom through hole is connected to a vacuum generating device. The above-mentioned vacuum suction cup can effectively reduce the probability of adhesive being sucked into the sound hole and groove bottom through holes while ensuring adsorption stability.

The application provides a lithium battery thermal runaway early warning method based on a thermal sound-producing material, and belongs to the technical field of battery safety monitoring; first, a thermal acoustic response layer containing thermal expansion microcapsules is covered on the surface of a battery monomer; when local abnormal temperature rise reaches a preset threshold, the microcapsules are instantaneously brittlely broken, and specific high-frequency pulse sound waves are released; second, a monomer gap is used as a parallel plate acoustic waveguide, and a MEMS microphone array is used to collect mixed sound waves in real time; audio is converted into a Log-Mel spectrogram and input into a lightweight convolutional neural network; deep separable convolution is used to extract voiceprint features, and an adaptive loss function is combined to accurately separate weak signals from complex background noise; finally, time density integration logic is used for confirmation, and BMS linkage is triggered to cut off. The application deeply integrates passive physical phase change and AI recognition, and realizes "extremely early, high-precision and full-coverage" active early warning before the critical point of thermal runaway.

The application discloses a MEMS waterproof microphone, comprising: a substrate comprising a first area provided with a sound hole; a waterproof air-permeable film attached to the first area and covering the sound hole; a metal pad provided with a through hole and stacked above the waterproof air-permeable film; and a MEMS chip stacked above the metal pad; wherein the aperture of the sound hole is larger than the aperture of the through hole. The application uses the metal pad as a transfer intermediate, which can increase the size of the sound hole of the substrate and the air-permeable area of the waterproof air-permeable film without being affected by the size of the chip. The larger sound hole and air-permeable area can reduce the obstruction to the sound signal, provide a higher signal-to-noise ratio, and achieve good waterproof performance, thereby improving the comprehensive performance of the MEMS microphone.

According to the present embodiment, a MEMS microphone comprises: a first substrate; a second substrate stacked on the first substrate; a housing coupled to the first substrate to form an accommodation space therein; a MEMS structure disposed on the second substrate in the accommodation space; and a signal processing element spaced apart from the MEMS structure and disposed on the second substrate in the accommodation space, wherein the second substrate includes a plurality of bridges protruding from a side surface thereof.

This utility model discloses a microphone, a sound pickup device, and an electronic device, relating to the field of sound acquisition technology. The MEMS microphone includes a housing, a substrate, and a MEMS chip. The substrate has a first side and a second side on opposite sides. The housing covers the first side of the substrate and forms a cavity with the substrate. The substrate has a pickup hole communicating with the cavity. An ASIC chip is integrated within the substrate, with the pickup hole and the ASIC chip spaced apart. A first blind hole is provided on the substrate, extending from the first side to the ASIC chip. The MEMS chip is located within the cavity, mounted on the first side of the substrate, and covers the pickup hole. The MEMS chip and the ASIC chip are connected by a metal lead passing through the first blind hole. This utility model reduces the overall package thickness and meets the miniaturization requirements of MEMS microphones through the design of integrating the ASIC chip on the substrate and the internal first blind hole.