41results about How to "Reduce package size" patented technology

The application discloses a software development package compiling method and device, and relates to the technical field of computers. A specific implementation of the method comprises the following steps: performing encapsulation based on a second programming language on a first type of module of any core component in a software development package, extracting a header file of the first type of module and a header file of a second type of module after the encapsulation to generate a common umbrella header file of the core component; and after compiling core component source code and upper layer component source code in the software development package into an executable file, processing the common umbrella header file of any core component in the software development package, so that the common umbrella header file only contains declaration content configured in advance for the core component. The implementation can effectively reduce the risk of core code leakage.

The utility model discloses a bidirectional switch semiconductor packaging device, an AC / DC converter and an automobile, and relates to the technical field of power supplies, the device comprises a first switch chip, a second switch chip, a plastic package shell and a heat dissipation substrate; the drain electrode or the source electrode of the first switch chip is electrically connected with the drain electrode or the source electrode corresponding to the second switch chip through the same heat dissipation substrate, so that a bidirectional switch structure with the common drain electrode or the common source electrode is formed, and heat dissipation can be carried out on the two switch chips at the same time by utilizing a single heat dissipation substrate. Meanwhile, on the surface of the plastic package shell, a creepage path extension part used for increasing the creepage distance is arranged between the heat dissipation substrate and any group of pins located on the two sides of the plastic package shell. Through the structure, the packaging size of the bidirectional switch semiconductor packaging device can be kept as small as possible, and meanwhile, the problems of power output control, heat dissipation, electrical safety and the like caused by the too small packaging size can be prevented.

The application belongs to the technical field of switching power supply, and an auxiliary circuit is added between two branches of a traditional two-phase Dickson converter; in a dead time when all main power tubes are closed, the auxiliary circuit can transfer the charge of one branch to another branch, realizes zero-voltage turn-on of all main power tubes, and reduces switching loss.

This application discloses a waterproof multifunctional microphone, including a circuit board. The circuit board houses a microphone sensor, a pressure sensor, a first housing, and a second housing. The first housing and the circuit board form a first cavity to house the pressure sensor, and the second housing and the circuit board form a second cavity to house the first housing and the microphone sensor. The circuit board has a sound inlet corresponding to the microphone sensor, and a waterproof and breathable membrane is provided at the sound inlet. The first housing has a vent hole connecting the second cavity and the first cavity. This application achieves integrated packaging of the microphone sensor and the pressure sensor, reducing the packaging size and effectively avoiding interference between the microphone sensor and the pressure sensor during operation. Furthermore, it also features waterproof, dustproof, and corrosion-resistant properties.

The utility model discloses a packaging structure capable of improving substrate wiring space and reducing packaging size. The packaging structure comprises a substrate and a plurality of chip dies, the die is flatly laid on the top surface of the substrate and is connected with a contact finger on the substrate; and in the die, the power input end and the grounding input end of the main chip are connected with a power contact PWR finger and a ground contact GND finger on the top surface of the substrate. The front surface of the dummy die is a metal conductive layer, and the back surface of the dummy die is a non-metal insulating layer; the dummy die is divided into a PWR die and a GND die; the back surfaces of the PWR die and the GND die face downwards; the power input end and the grounding input end of the main chip are respectively connected with the front surfaces of the PWR die and the GND die; the PWR finger and the GND finger are respectively connected with the front surfaces of the PWR die and the GND die; a power supply and a grounding output end of the main chip are respectively connected with a power supply and a grounding input end of the auxiliary chip.

A packaging structure and a manufacturing method thereof, the packaging structure comprising: a first substrate, a second substrate, a first chip, a second chip, a heat sink and an inter-board connecting structure, wherein the second substrate has a first opening window penetrating through upper and lower surfaces of the second substrate; the first chip is attached to an upper surface of the first substrate, and the first chip is electrically connected to the first substrate; the second substrate is attached to the upper surface of the first substrate, the inter-board connecting structure is located between the lower surface of the second substrate and the upper surface of the first substrate, the second substrate is electrically connected to the first substrate through the inter-board connecting structure, and the first opening window in the second substrate exposes at least part of a back surface of the first chip; the second chip is attached to an upper surface of the second substrate; and the heat sink is attached to the back surface of the first chip through the first opening window. Heat dissipation of the first chip located in the lower layer of the packaging structure is improved.

The utility model provides a layout structure of a four-bit synchronous add-subtract binary counter, which comprises a first area, a second area and a third area, the second area surrounds the third area, and the first area surrounds the second area. The first area is provided with an input port and an output port; the second area comprises a first functional area, a second functional area and an addition and subtraction control module; and the third area comprises a third functional area and an overflow control module. The first functional area is provided with a multi-stage output driving module which is used for receiving an output signal from the third functional area and transmitting the output signal to the output port after enhancing the driving of the output signal; the second functional area is provided with an input stage module and a setting control module, and is used for receiving an input signal from the input port and transmitting the input signal to the third functional area; the third function area is provided with a counting module, a clock control module and a three-state control module. A counter product adopting the layout structure has a smaller chip size and a smaller packaging size, and the production and manufacturing cost is lower.

The application relates to a chip packaging structure, which comprises a first carrier substrate, a second carrier substrate and a chip assembly. The first carrier substrate is provided with a first mounting area and a second mounting area which are arranged at intervals along a first direction, and the second carrier substrate is provided with a third mounting area which is arranged at intervals with the first mounting area along a second direction. The chip assembly comprises a driving chip arranged on the second mounting area, a first power chip arranged on the first mounting area and a second power chip arranged on the third mounting area. The first direction is the extension direction of the center line of the first power chip and the driving chip, the second direction is the extension direction of the center line of the first power chip and the second power chip, and the angle between the two directions is less than 90 DEG. The relative position and the angle of the mounting areas on the carrier substrate are optimized, so that a more compact chip layout is realized, the packaging volume is effectively reduced, and the heat dissipation performance and the packaging reliability are improved.

This utility model discloses a dual-motor folding bed, comprising: a backrest board, a first hiprest board, a second hiprest board, a legrest board, a footrest board, a back frame, a leg frame, a back motor, and a leg motor; the backrest board and the first hiprest board are rotatably connected by hinges, and the second hiprest board, the legrest board, and the footrest board are sequentially rotatably connected by hinges; the back frame is disposed on the back of the backrest board and the first hiprest board, and the back motor is disposed within the back frame for driving the backrest board to lift or lower; the leg frame is disposed on the back of the second hiprest board, the legrest board, and the footrest board, and the leg motor is disposed within the leg frame for driving the legrest board to lift or lower; the back frame and the leg frame are rotatably connected.

The invention discloses a radio frequency chip integrated packaging structure and technology, and the structure comprises the following steps: carrying out the primary packaging of a first line which is parallel and is uniformly arranged at intervals, and forming a first packaging layer; holes are drilled in the surface of the first encapsulation layer to expose all end points of the first lines, metal is electroplated on the exposed end points to fill the drilled holes, wiring connecting columns are electroplated on a set of diagonal end points arranged on the two edge first lines, and first stand columns are electroplated on the other exposed end points; electroplating a wiring layer on one surface of the encapsulation layer, and electrically rearranging the wiring connecting columns; the electrical end of the bare chip is electrically connected and mounted with the corresponding wiring layer, and the bare chip and the wiring layer are encapsulated again to form an encapsulation layer II; drilling holes in the surface of the encapsulation layer II to expose the end points of the upright posts I, and electroplating upright posts II on the exposed end points to fill the drilled holes; the bare chip is located in the geometric center of the three-dimensional coil, the induction current and the signal intensity are optimal, the three-dimensional coil has the more omnidirectional induction characteristic, and stable coupling can be kept.

The application belongs to the technical field of switching power supply, and relates to a cascaded switching capacitor converter. An auxiliary circuit is added between two branches outside a traditional cascaded converter. In a dead time when all main power tubes are closed, the auxiliary circuit can transfer the charge of one branch to another branch, realize zero-voltage turn-on of all main power tubes, and reduce switching loss.

The utility model belongs to wireless charging technical field discloses a kind of wireless charging device, electric furniture operating platform and electric furniture, and wireless charging device includes base, wireless charging assembly and rotary connecting component.Rotary connecting component includes rotary connecting piece, first damping pivot and second damping pivot, rotary connecting piece is rotatably connected with base by first damping pivot, wireless charging assembly is connected with rotary connecting piece by second damping pivot, wireless charging assembly and rotary connecting piece can be rotated to with base adhere, wireless charging assembly can also rotate relative to rotary connecting piece around its rotation axis, the rotation axis of wireless charging assembly coincides with the axis of second damping pivot, the axis of second damping pivot and the axis of first damping pivot are included angle.The wireless charging device can be wirelessly charged to electronic equipment, and can be freely adjusted and positioned rotation angle, help to improve the operability of electronic equipment when charging, improve user experience.

This invention provides a dual-base island packaging unit and packaging structure with double-sided heat dissipation. The dual-base island packaging unit includes a frame body, a chip, a heat sink, and a package body. The frame body has base islands and first pins spaced apart. At least two base islands are provided, each base island is equipped with a first pin, and each base island has a working surface and a first heat dissipation surface arranged opposite each other. The chip is disposed on the working surface. The heat sink is located on the side of the chip away from the base islands, and the chip and the first pins are electrically connected through the heat sink. The side of the heat sink away from the chip has a second heat dissipation surface. The package body is used to cover the frame body, the chip, and the heat sink, and both the first and second heat dissipation surfaces are exposed outside the package body. By setting up dual base islands, it is beneficial to reduce the package volume, thereby reducing the board area occupied by the packaging unit. By setting the first and second heat dissipation surfaces on opposite sides of the chip, it is beneficial to improve the heat dissipation efficiency of the packaging unit.

The invention relates to the technical field of photoelectric devices, and discloses an optical engine packaging structure and a preparation method thereof. The structure comprises an adapter plate structure, an electrical module, a first rewiring layer, an optical module and a packaging substrate, a containing space of the adapter plate structure comprises at least part of the thickness of the adapter plate structure, and a conductive structure is arranged in a penetrating mode in the thickness direction; the electrical module is arranged in the accommodating space and the front surface of the electrical module is exposed; the first redistribution layer is arranged on the adapter plate structure and is electrically communicated with the conductive structure and the electrical module; the optical module is arranged on the first rewiring layer, the front side faces the first rewiring layer, and an optical port is exposed to the external space and connected with an external optical device; the packaging substrate is arranged on the back surface of the adapter plate structure and is suitable for being electrically connected with the electrical module. According to the invention, the optical module is stacked on the electrical module, so that the warping is reduced, the signal transmission is improved, the packaging size is reduced, and the process is simple.

This disclosure relates to the field of semiconductor technology, and addresses the technical problem of reduced performance despite smaller package size in radio frequency (RF) switching devices. Embodiments of this disclosure provide an RF switching device comprising an active region and a gate structure arranged along a first direction; the gate structure includes a plurality of first gate structures arranged along a second direction and a plurality of second gate structures arranged along a third direction; a first end of each second gate structure is aligned with a first first gate structure, and a second end of each second gate structure is located outside the last first gate structure, away from the first first gate structure; wherein the first direction, the second direction, and the third direction intersect each other. Thus, the RF switching device satisfies the requirement of reduced package size without reduced on-resistance.

This invention discloses a chip packaging structure and method, including a molding compound I, which encapsulates at least four layers of chips. Through-holes (TVMs) are fabricated on the molding compound I and metallized. Redistribution lines are provided on the molding compound I, and balls are placed on the redistribution lines. This invention achieves vertical interconnection of multiple layers of chips through staggered chip stacking combined with TMV technology, effectively utilizing space and reducing package size. The TMV vias employ a solid metallization scheme, which can effectively improve the power integrity and signal integrity of the product, enhance the read / write performance of the storage product, increase I / O density and bandwidth, and reduce power consumption. The packaging structure can include multiple stacked structure arrays, suitable for large-scale integration, increasing packaging density.

This application belongs to the field of switching power supply technology, specifically relating to a switched capacitor converter. An auxiliary circuit is added between the two branches to transfer the charge of one branch to the other branch during the dead time when all main power transistors are off, thereby achieving zero-voltage turn-on of all main power transistors and reducing switching losses.

The application discloses a packaging frame and an intelligent power module, and relates to the technical field of semiconductor packaging. The packaging frame comprises a body, four base islands which are arranged at intervals in the body, wherein the base islands comprise a first base island and a second base island which are used for carrying power switch chips, a third base island which is used for carrying a driving control chip, and a fourth base island which is used for carrying an auxiliary function chip; and each base island is connected with a pin which is led out of the body. The packaging frame significantly improves the integration degree, reduces the packaging volume and the heat dissipation thermal resistance, and further improves the reliability and safety of the packaging.

This invention provides a semiconductor side-mounted package structure and its fabrication method, relating to the field of semiconductor device packaging technology. The package structure includes a substrate, a planar chip, a side-mounted chip, and a molding compound. One side surface of the substrate has spaced-apart mounting areas and side-mounted recesses. The front or back side of the planar chip is mounted in the mounting areas and spaced apart from the side-mounted recesses, and the planar chip is electrically connected to the substrate. The side of the side-mounted chip is mounted in the side-mounted recesses, and the front side of the side-mounted chip is angled to one side surface of the substrate and is electrically connected to the substrate. The molding compound is disposed on the substrate and covers the planar chip and the side-mounted chip. Compared to existing technologies, this invention, compared to multi-chip planar arrangements, allows for differentiation of chip electrical connections and reduces signal interference between chips, thus solving the signal interference problem in terms of performance and reducing package size.

The utility model discloses a kind of structure based on frame and encapsulation design support inductance and main control chip stacking, comprising: S1, design base material frame, main control chip is inverted on base material frame;Base material frame includes first support layer, second support layer and multiple installation layers;Every top of first support layer and second support layer is respectively provided with every electroplating place;S2, lower film is pasted in bottom, upper film is pasted in top, filling plastic encapsulation material;S3, remove upper film and lower film, inductance is welded at every electroplating place, complete preparation.The utility model is welded inductance by the welding connection of NiPdAu electroplating layer, reduces cost and improves yield by frame integration design and realizes the 3D stacking of inductance and main control chip, effectively reduces package size;Traditional copper column grinding step is also cancelled, and in combination with the height difference and slope via hole of concave, it is convenient to use and plastic encapsulation filling is uniform, so that overall product reliability is high, and long-term use is suitable.

The embodiment of the present application relates to a kind of high-density optoelectronic co-packaging module and its preparation method, longitudinal extension network, the high-density optoelectronic co-packaging module, comprising: bare chip integrated circuit;Multiple optical communication chips, each of the optical communication chip at least shares a semiconductor functional layer, and the semiconductor functional layer is bonded with the bare chip integrated circuit by a bonding layer, each of the optical communication chip is configured to independently / collectively emit target modulation laser under the driving of the bare chip integrated circuit.The high-density optoelectronic co-packaging architecture provided in the application can solve the bottleneck problem of existing optoelectronic co-packaging technology in high-density integration, signal integrity, thermal management and manufacturing cost, etc., and provides a high-energy efficient, high-density, high-reliability optical communication solution for next-generation AI computing and data center interconnection.

The application discloses a hydrogen sensor with dustproof and heating functions, which comprises a substrate, a palladium-nickel alloy film arranged on the substrate, two first lead electrodes arranged on the substrate for connecting the palladium-nickel alloy film, a micro-nano dustproof cover which is bonded with the substrate to form a cavity, the palladium-nickel alloy film is located in the cavity, and a plurality of first through holes in the micron level are vertically arranged on the substrate corresponding to the micro-nano dustproof cover, and a heating assembly which is arranged on the micro-nano dustproof cover and corresponds to the palladium-nickel alloy film. According to the application, the palladium-nickel alloy film is packaged and dustproofed by the micro-nano dustproof cover, and the heating assembly is integrally arranged on the micro-nano dustproof cover, so that the hydrogen sensor is uniformly heated, the packaging volume is greatly reduced while the micron-level dustproofing is realized, and the beneficial effects of improving the dustproof effect, guaranteeing the heating effect and reducing the packaging volume are achieved.

This application proposes a multi-functional microphone, comprising: a first circuit board and a second circuit board, forming a cavity; a baffle wall, dividing the cavity into a first cavity and a second cavity; a microphone MEMS chip and a microphone ASIC chip, disposed on the first circuit board and located within the first cavity; a barometer MEMS chip and a barometer ASIC chip, disposed on the second circuit board and located within the second cavity; and a filler adhesive disposed within the second cavity, covering the barometer MEMS chip and the barometer ASIC chip. This application achieves integrated packaging of the microphone and barometer, which can reduce the package size and effectively avoid interference between the microphone and barometer during operation.

The application discloses a stress release cavity opening structure for air-tight packaging of a rectangular connector and relates to the technical field of microelectronic packaging. The stress release cavity opening structure comprises a cavity body, at least one mounting hole for mounting the rectangular connector is arranged on one side wall of the cavity body, the rectangular connector comprises a metal shell, a glass body arranged at one end of the metal shell and a pin inserted into the glass body, a welding area is arranged in the mounting hole along the wall thickness direction of the cavity body and is welded with the end of the metal shell away from the glass body, the metal shell corresponding to the glass body in the radial direction is a stress release area, a limiting structure for limiting the displacement of the metal shell is arranged in the mounting hole or the cavity body, and a welding ring placing groove for placing a welding ring is arranged on the side of the mounting hole away from the glass body. The application actively constructs a stress release structure through the design of a non-welding area, directly blocks the direct transmission of welding stress to the glass body in a physical path, and shows that the maximum residual stress of the glass body is reduced by more than 29% through finite element simulation.

This invention relates to the field of office and teaching equipment technology, and particularly to a writing board and its installation method. The writing board includes a fixed plate and a movable plate, the movable plate being combined with the fixed plate via a sliding mechanism to form the writing board. The sliding mechanism includes at least two guide rails and at least one connector, the guide rails being connected by the connector to form a split-type combinable guide rail. The two ends of the split-type combinable guide rail and the connector are fixedly installed, and the split-type combinable guide rail is located behind the fixed plate and the movable plate. The movable plate can slide along the split-type combinable guide rail. This writing board solves the logistical, handling, and installation problems caused by excessively long borders, reduces noise, has a more concise and aesthetically pleasing overall design, and improves the user experience.

This utility model relates to the field of cooking appliance technology and discloses an air fryer with a detachable handle. The utility model includes a pot body with a cooking cavity. A pot assembly is adapted to be arranged in the cooking cavity, and a handle is detachably connected to the pot assembly. The pot assembly has a locking cavity, and a portion of the handle is adapted to lock into the locking cavity. The handle is provided with a locking assembly, which includes an unlocking component, a lever assembly, and an elastic hook. The lever assembly is rotatably mounted on the handle. A locking position is provided in the locking cavity, and the elastic hook is adapted to the locking position. The lever assembly includes a horizontal arm and a vertical arm, with the lever arm of the horizontal arm being longer than that of the vertical arm. The unlocking component is located on the horizontal arm. When the unlocking component is moved downwards or upwards, it drives the lever assembly to rotate, causing the elastic hook to rotate and disengage from the locking position. This utility model has the advantages of easy handle disassembly and prevention of handle loss.

The application relates to the technical field of sensor packaging, and discloses a packaging structure of an optical sensor and electronic equipment, wherein the packaging structure of the optical sensor comprises an optical sensor chip, a lead frame and a cover body; the optical sensor chip is fixed on a base island of the lead frame through a first medium layer, and each pin of the optical sensor chip is connected with a first end of a corresponding pin of a pin group of the lead frame through a bonding wire; a second end of the pin group is bent outward from a side surface of the lead frame, and forms a seagull wing-shaped pin; a first groove is arranged on the lead frame, and the cover body is embedded in the first groove. The application realizes SOP packaging, ensures effective light transmission through the cover body, and improves the reliability of the device.

This application proposes a multifunctional microphone, including a base plate, a cavity plate, and a cover plate. The base plate, the cavity plate, and the cover plate enclose a first cavity and a second cavity. A pressure sensor is disposed on the base plate in the first cavity, and a microphone sensor is disposed on the base plate in the second cavity. A first acoustic hole corresponding to the position of the microphone sensor is provided on the base plate, and a second acoustic hole communicating with the first acoustic hole and the first cavity is also provided within the base plate. This application achieves integrated packaging of the microphone sensor and the pressure sensor, which can reduce the packaging volume and effectively avoid interference between the microphone sensor and the pressure sensor during operation.

This invention discloses a small-size BGA SSD packaging structure and method based on TMV and vertical wire bonding. The invention relates to the field of semiconductor packaging technology and includes: a substrate; an RDL layer disposed parallel above the substrate, the distance between the RDL layer and the substrate not exceeding a first predetermined distance; multiple chips stacked alternately on the substrate, with gold wires soldered to the chips perpendicularly upwards to the RDL layer; and a first component with its pads facing upwards on the substrate, the pads connected to the RDL layer via vertically upward-facing copper pillars. This invention ensures that the gold wires are perpendicular to the substrate or chips, avoiding the problems of uneven or interlaced wire bonding caused by safety distances. Furthermore, the use of TMV technology allows multiple components to be stacked, contributing to higher packaging density and further reducing package size.

Disclosed is an integrated thermal management system for a vehicle, which can include a refrigerant line, a first coolant line that circulates coolant and connects a first radiator, a high-temperature core, a heating core of an indoor air conditioner, and a high-voltage battery in parallel with each other, a second coolant line that circulates coolant and connects a second radiator, an electronic driving component, a low-temperature core, and a cooling core of the indoor air conditioner in parallel with each other, and a third coolant line that circulates coolant and connects a third radiator and the high-voltage battery in parallel to the second coolant line.