5results about How to "Reduce stray inductance" patented technology

The utility model relates to a semiconductor device and its packaging technical field, specifically disclose a kind of module terminal and HPD packaging module using laminated busbar structure, including DC terminal, DC terminal includes: two ends and chip and direct current power supply intercommunication's first component and second component, first component and second component current is opposite;First component and second component form laminated busbar structure to offset reverse current magnetic field, the partial area of first component and the overall area of second component overlap to expand magnetic field offset effective area.The utility model forms laminated busbar structure by setting first component and second component, offset the magnetic field generated by reverse current, secondly, the projection area of second component is the effective overlapping area of first component and second component, to expand the effective area of magnetic field offset as far as possible, to reduce total magnetic flux without affecting laser welding, to reduce stray inductance, improve system reliability.

This utility model discloses an integrated full-bridge silicon carbide module, including a mounting base. Three base plates are disposed within the mounting base. Each base plate includes a bottom substrate and a top substrate arranged in a stacked configuration. The bottom substrate has an output area and a processing area, both of which have chip boards and connection boards. The top substrate has two terminal portions. Six silicon carbide chips are disposed on the chip boards, each divided into two cooperating chip groups. The gate and source terminals of the silicon carbide chips are connected to the terminal portions. The chip groups on the chip boards in the output area are connected to the connection boards in the output area and the chip boards in the processing area, while the chip groups on the chip boards in the processing area are connected to the connection boards in the processing area. This stacked design significantly improves the space utilization of the power device, reduces the device size, and increases power density.

The utility model belongs to the field of wind power generation technology, concretely relates to a kind of air cooling power module for reconstruction, including power unit frame, laminated busbar, IGBT module assembly, IGBT radiator, support capacitor array, IGBT drive board and alternating copper bar;IGBT radiator is fixed in power unit frame, and independent heat dissipation air cavity is formed by being respectively equipped with air inlet, air outlet air duct plate in upper and lower ends, IGBT module assembly is arranged in radiator base surface, and support capacitor array is fixed in heat inlet air cavity immediately adjacent to radiator air inlet entrance.This utility model can be compatible with installation net side, machine side different model IGBT device by optimizing structure layout, realize module generalization, reduce spare parts type and operation and maintenance cost;Support capacitor array is arranged at radiator air inlet, and the efficient heat dissipation of IGBT module and capacitor is realized simultaneously, reduce component temperature, prolong service life, simultaneously optimize laminated busbar and circuit layout, reduce stray inductance and electromagnetic interference, improve module operating stability and power density.

The utility model relates to a kind of multifunctional inverter brick, it includes: metal shell (1), the metal shell has top wall (11), side wall and the accommodating cavity (10) defined by the top wall and the side wall;Thin film capacitor module (2), the thin film capacitor module is housed in the accommodating cavity (10);EMC filter (3), the EMC filter is partially housed in the accommodating cavity (10) and is electrically connected to the thin film capacitor module;And power module (4) and drive board (5) fixedly connected to the top wall of the metal shell, wherein the power module (4) is located between the top wall and the drive board.This kind of multifunctional inverter brick compact structure, reduce the overall height of product, improve the performance of power module.

The application discloses a power board, a motor driver and a brushless direct current motor driving system, and relates to the technical field of motor drivers, and aims at solving the problem that the motor driver is large in size and weight and cannot meet the requirements of the fields of aviation and spaceflight. The power board comprises a negative electrode connecting terminal, a three-phase inverter assembly and a current sensor assembly which are uniformly surrounded by the negative electrode connecting terminal. The motor driver comprises the power board provided in the technical scheme. The power board, the motor driver and the brushless direct current motor driving system are used for driving a brushless direct current motor.