10results about How to "Reduce stray inductance" patented technology

The utility model relates to a semiconductor device and its packaging technical field, specifically disclose a kind of module terminal and HPD packaging module using laminated busbar structure, including DC terminal, DC terminal includes: two ends and chip and direct current power supply intercommunication's first component and second component, first component and second component current is opposite;First component and second component form laminated busbar structure to offset reverse current magnetic field, the partial area of first component and the overall area of second component overlap to expand magnetic field offset effective area.The utility model forms laminated busbar structure by setting first component and second component, offset the magnetic field generated by reverse current, secondly, the projection area of second component is the effective overlapping area of first component and second component, to expand the effective area of magnetic field offset as far as possible, to reduce total magnetic flux without affecting laser welding, to reduce stray inductance, improve system reliability.

This utility model discloses an integrated full-bridge silicon carbide module, including a mounting base. Three base plates are disposed within the mounting base. Each base plate includes a bottom substrate and a top substrate arranged in a stacked configuration. The bottom substrate has an output area and a processing area, both of which have chip boards and connection boards. The top substrate has two terminal portions. Six silicon carbide chips are disposed on the chip boards, each divided into two cooperating chip groups. The gate and source terminals of the silicon carbide chips are connected to the terminal portions. The chip groups on the chip boards in the output area are connected to the connection boards in the output area and the chip boards in the processing area, while the chip groups on the chip boards in the processing area are connected to the connection boards in the processing area. This stacked design significantly improves the space utilization of the power device, reduces the device size, and increases power density.

The invention relates to a high-integration-level and high-power-density module compatible with Econodual3 packaging. The high-integration-level and high-power-density module comprises a shell, two substrates arranged in the shell, a DC positive terminal, a DC negative terminal and an AC terminal. By overlapping the positive and negative terminals, the two connection regions on the substrate are adjacent and opposite in current, a proximity effect is generated to counteract a magnetic field, and stray inductance is reduced. And a wavy water channel is designed in the bottom plate, so that the cooling liquid is easier to generate vortex, and the heat dissipation efficiency is greatly improved. A driving signal loop is optimized to obtain low switching loss, heat resistance is reduced through copper paste sintering on the back faces of the chips and the substrate and DTS sintering connection on the front faces of the chips, parallel connection of 10 chips with the size of 6 mm * 7 mm and the total area of 420 mm < 2 > sic is achieved, a current sensor is further integrated in a shell, nanosecond-level overcurrent protection can be achieved, and the heat dissipation and control requirements of high-current and high-power-density application scenes are met. The overall structure is symmetrically designed, the high-voltage part is located on the outer side, the low-voltage signal control and acquisition part is located on the inner side, the wiring design of a PCB is facilitated, and the size of the module can be compatible and matched with Econodual3 packaging.

The utility model belongs to the field of wind power generation technology, concretely relates to a kind of air cooling power module for reconstruction, including power unit frame, laminated busbar, IGBT module assembly, IGBT radiator, support capacitor array, IGBT drive board and alternating copper bar;IGBT radiator is fixed in power unit frame, and independent heat dissipation air cavity is formed by being respectively equipped with air inlet, air outlet air duct plate in upper and lower ends, IGBT module assembly is arranged in radiator base surface, and support capacitor array is fixed in heat inlet air cavity immediately adjacent to radiator air inlet entrance.This utility model can be compatible with installation net side, machine side different model IGBT device by optimizing structure layout, realize module generalization, reduce spare parts type and operation and maintenance cost;Support capacitor array is arranged at radiator air inlet, and the efficient heat dissipation of IGBT module and capacitor is realized simultaneously, reduce component temperature, prolong service life, simultaneously optimize laminated busbar and circuit layout, reduce stray inductance and electromagnetic interference, improve module operating stability and power density.

The invention discloses a voltage conversion device and a power supply system. The device comprises at least three-phase first voltage conversion units; each phase of first voltage conversion unit corresponds to a first bus capacitor and a second bus capacitor; a first end of the first voltage conversion unit is connected with the first bus, a second end of the first voltage conversion unit is connected with the second bus, and a third end of the first voltage conversion unit is an input end or an output end of the first voltage conversion unit; the first bus capacitor and the second bus capacitor are connected in series between the first bus and the second bus, the first bus capacitor and the second bus capacitor are connected in parallel with the first voltage conversion unit after being connected in series, and the first voltage conversion unit is used for conversion between direct current voltage and alternating current voltage. According to the technical scheme, the reliability of the three-level topological structure is improved.

This invention provides a liquid-cooled heat dissipation assembly, including a power unit and a liquid-cooled plate for dissipating heat from the power unit. Each converter unit has a circuit structure forming a midpoint-clamped three-level topology. The switching transistors and diodes of each converter unit are combined to form several converter groups spaced apart along the X-axis and extending along the Y-axis. The cooling liquid channel of the liquid-cooled plate has branch channels connected in parallel to each converter group. This invention can reduce the stray inductance of the power unit and improve its heat dissipation efficiency.

The utility model relates to a kind of multifunctional inverter brick, it includes: metal shell (1), the metal shell has top wall (11), side wall and the accommodating cavity (10) defined by the top wall and the side wall;Thin film capacitor module (2), the thin film capacitor module is housed in the accommodating cavity (10);EMC filter (3), the EMC filter is partially housed in the accommodating cavity (10) and is electrically connected to the thin film capacitor module;And power module (4) and drive board (5) fixedly connected to the top wall of the metal shell, wherein the power module (4) is located between the top wall and the drive board.This kind of multifunctional inverter brick compact structure, reduce the overall height of product, improve the performance of power module.

This application discloses a method for manufacturing a power module and a power module thereof. The manufacturing method includes: providing a first substrate, the first substrate including three electrically isolated first metal layers; disposing an upper bridge chip assembly on the first metal layers, wherein the upper bridge chip in the upper bridge chip assembly is electrically connected to the first metal layers; providing a second substrate, the second substrate including three electrically isolated second metal layers; disposing a lower bridge chip assembly on the second metal layers, wherein the lower bridge chip in the lower bridge chip assembly is electrically connected to the second metal layers; connecting the upper bridge chip to the second metal layers using a first conductive buffer, and connecting the lower bridge chip to the first metal layers using a second conductive buffer. This application integrates three half-bridge structures into one unit, adopts double-sided packaging, and utilizes conductive buffer blocks to conduct current between the chip and the metal layers, shortening the current conduction distance, reducing stray inductance, and improving heat dissipation. This allows for the manufacture of a power module with simple process, small size, compact structure, and high reliability.

The application discloses a power board, a motor driver and a brushless direct current motor driving system, and relates to the technical field of motor drivers, and aims at solving the problem that the motor driver is large in size and weight and cannot meet the requirements of the fields of aviation and spaceflight. The power board comprises a negative electrode connecting terminal, a three-phase inverter assembly and a current sensor assembly which are uniformly surrounded by the negative electrode connecting terminal. The motor driver comprises the power board provided in the technical scheme. The power board, the motor driver and the brushless direct current motor driving system are used for driving a brushless direct current motor.

The invention discloses a solid-state pulse power supply system of a field anti-configuration device and a time sequence control method of the solid-state pulse power supply system. The solid-state pulse power supply system comprises a multiplex load coil, and a bias branch, an ionization branch, an anti-field branch and a steady-state branch which are connected to the two ends of the coil in parallel. A main switch of each branch circuit adopts a solid-state switch element, natural follow current is realized by using a diode or a bidirectional structure in the branch circuit, and an independent follow current branch circuit is thoroughly canceled. Meanwhile, in cooperation with a microsecond time sequence control method, a steady-state branch circuit is conducted in advance to excite the reactor to form virtual impedance, and pure physical series voltage division protection is achieved. According to the invention, full time sequence multiplexing of the coil function is realized, the stray inductance, the size and the cost of the system are reduced, kHz-level repetition frequency operation can be supported, and the reliability and the stability of the field inversion configuration device are obviously improved.