The invention discloses a heat dissipation structure of a
power module, belongs to the technical field of heat dissipation of the
power module, aims at achieving efficient heat dissipation and improving the output performance of the
power module on the basis of achieving
miniaturization of the power module, and provides a heat dissipation
structure based on a PCB, the power module based on the heat dissipation structure and an
inverter system based on the heat dissipation structure. The integrated
inverter system in a full-PCB mode can be achieved, the compact type is high, heat dissipation of the power
chip is good, three-dimensional packaging of the
inverter system and the power
chip is achieved through device embedding type design,
loop inductance is effectively reduced through lamination design of the PCB, the
electric stress in system operation is reduced, the safety and reliability of operation are improved, and the reliability of the inverter system is improved. Meanwhile, the improvement design of the system performance is also facilitated; meanwhile, the designed heat dissipation
structure based on the PCB is different from a traditional
metal heat dissipation structure, and a
driving circuit and a
control circuit in the inverter system can stretch across the structure for heat dissipation.