In an LED device, an opening portion of a
package in which a plurality of five light-emitting elements are mounted is filled with a transparent
epoxy resin and sealed with the resin. The transparent
epoxy resin is shrunk when cured. Hence, the surface of the transparent
epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a
single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and
luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the
package. Hence, when the LED device is soldered onto a
mount board, solder is deposited even on the up-bent tips of the leads, so that
surface tension of solder is balanced on the front and rear of the
package. As a result, the LED device can be mounted in a predetermined position while prevented from sliding. In an LED
lead frame, hanger leads are provided so as to be extended in three directions of a package. Hence, the
electrically conductive leads can be bent stably and accurately without tottering of the package in the process of bending the
electrically conductive leads.