Light-emitting device
assembly (100; 102) comprising: a substrate (120; 220); a plurality of light-emitting device chips (110; 210) arranged linearly and spatially separated from one another on the substrate (120; 220); and a plurality of
wavelength conversion units (130; 230) on surfaces of the plurality of light-emitting device chips (110; 210), wherein the plurality of
wavelength conversion units (130; 230) each have regions extending over regions between the plurality of light-emitting device chips (110; 210), wherein each of the plurality of
wavelength conversion units (110; 210) has: a longer side extending in a first direction in which the light-emitting device chips (110; 210) are arranged;and a shorter side that is shorter than the longer side, wherein shorter sides of
wavelength conversion units adjacent in the first direction of the plurality of
wavelength conversion units (110; 210) are spaced apart from each other, wherein side faces of the shorter sides are exposed, wherein each of the plurality of
wavelength conversion units (130; 230) has several
phosphor layers (131, 132, 133; 134, 135; 231, 232, 233; 234, 235), and wherein the
phosphor layers (131, 132, 133; 134, 135; 231, 232, 233; 234, 235) are stacked sequentially according to the lengths of wavelengths such that a light-emitting
phosphor layer with a shorter wavelength is located at one bottom and a Light-emitting phosphor
layers with a longer wavelength are arranged on a surface.