Disclosed in the present application are a heating device and method for a
vacuum coating apparatus, and a
coating apparatus, belonging to the field of
vacuum coating. The heating device for a
vacuum coating apparatus comprises a heating plate, the heating plate comprising a
peripheral area and a central area. The
peripheral area and the central area have different thermal
emissivity values, so as to heat corresponding areas of a
coating substrate to enable temperature differences of all portions of the
coating substrate to be within a preset range. After being subjected to surface treatment, the
peripheral area and the central area obtain different thermal
emissivity values, surface treatment
modes being at least one of oxidation, wet treatment, coating coverage,
film coating,
sand blasting roughening,
wire drawing, melt-blowing and
polishing. The present application can perform differentiated heating on different positions of large-size coating substrates, so as to effectively reduce the temperature differences between
silicon wafers on the same substrate, thus improving coating uniformity.