93 results about "Thermal emittance" patented technology

The invention discloses fluororesin radiating paint and a preparation method thereof. The paint mainly comprises an electron transfer type organic compound, graphene, a carbon nanotube, titanium white, other additives and fluororesin, wherein the fluororesin is a paint brand having the highest comprehensive property at present; the electron transfer type organic compound can greatly enhance the thermal radiation rate of the paint; the graphene and the carbon nanotube can further accelerate thermal conduction; and the electron transfer type organic compound, the carbon nanotube and the graphene finally form a full three-dimensional network distribution of granules (electron transfer type organic compound), wires (carbon nanotube) and planes (graphene) in a fluid. The fluororesin radiating paint disclosed by the invention has high thermal radiation rate, high thermal conductivity and low thermal resistance, can realize radiation cooling, and simultaneously has the effects of self cleaning, acid / alkali resistance and super high insulativity, thereby having high practical value.

An electrical connector is disclosed for enhancing the thermal emissivity of an electrical connection. An electrical connector, such as a typical C-member and wedge style connector, is provided that is constructed of electrically conductive material and has a surface treatment on the exterior surfaces of the connector that increases emissivity of the connector. Contact surfaces are provided on the connector that are electrically conductive for ensuring electrical continuity within the connector. The surface treatment operates to increase the thermal transfer efficiency within the connector and thereby lower the operating temperature of the connector.

Disclosed is a heat-dissipating resin composition which is used for forming a substrate for LED mounting or a reflector provided on the substrate for LED mounting, and excellent in heat dissipation, electrical insulation, heat resistance and light resistance during the time when an LED element emits light. Also disclosed are a substrate for LED mounting and a reflector respectively containing such a heat-dissipating resin composition. Specifically disclosed is a composition containing a thermoplastic resin such as a modified PBT and a thermally conductive filler such as a flake boron nitride. The composition has a heat distortion temperature of not less than 120 DEG C, a thermal conductivity of not less than 2.0 W / (m K) and a thermal emissivity of not less than 0.7.

The invention provides heat dissipation coating based on graphene and a preparation method thereof. The heat dissipation coating based on the graphene, is mainly prepared from a component A and a component B at the mass ratio of (4 to 12) to 1; the component A is prepared from the following components in parts by mass: 15 to 25 parts of resin, 20 to 45 parts of a solvent, 2 to 5 parts of an auxiliary agent, 0.01 to 5 parts of graphene powder and 30 to 50 parts of filling; the component B is prepared from a solvent, an accelerant and a curing agent; the mass ratio of the solvent to the accelerant to the curing agent is (6 to 14) to (0.6 to 1.4) to (25 to 40). According to the heat dissipation coating based on the graphene, provided by the invention, the heat conductivity and the heat radiation rate are improved and the rapid heat dissipation effect is realized.

An organic electroluminescent element comprises a supporting substrate, a sealing substrate, and a layered body including a pair of electrodes and an organic light-emitting layer located between the electrodes, in which the layered body is mounted on the supporting substrate and is surrounded by the supporting substrate and the sealing substrate to be isolated from the external environment, a highly thermally radiative layer is provided on at least one face of the supporting substrate and at least one face of the sealing substrate, or the highly thermally radiative layer has a thermal emissivity of equal to or more than 0.7.

The Ni-Cr spinel type infrared radiation powder material is prepared by using Cr2O3 and NiO with stable high performance as main components and TiO2, Nb2O5, TiN and TiB2, or Fe2O3 and MnO2, or SiO2 and ZrO2 as supplementary material, and through the steps of mixing powdered solid materials, adding adhesive and water to compound slurry, spray drying to form aggregate powder, and final plasma nodulizing or sintering to densify. The Ni-Cr spinel type infrared radiation powder material has heat radiation factor as high as 0.89-0.93, and may be molten and sprayed via plasma spraying, oxygen-acetylene flame spraying or fuel gas expansion spraying to surface of base body to form firm mechanically combined coating, which has controllable thickness, chemical performance stable in 500-700 deg.c, high heat shock resistance and low heat radiation factor attenuation in long term use.

A topographic optical infrared tomography system for biophysical imaging includes a thermal camera operably disposed adjacent a body part equipped for obtaining thermal data readings from the body part and apparatus operably connected to the thermal camera for correcting thermal emissivity variations in the thermal data readings to provide corrected thermal data. A method for obtaining physiological data using the thermally corrected data is also provided.

A topographic optical infrared tomography system for biophysical imaging includes a thermal camera operably disposed adjacent a body part equipped for obtaining thermal data readings from the body part and apparatus operably connected to the thermal camera for correcting thermal emissivity variations in the thermal data readings to provide corrected thermal data. A method for obtaining physiological data using the thermally corrected data is also provided.

An electronic control unit installed on a high temperature heat source or in its vicinity exhibits an improved heat dissipation ability within its installation environment. The electronic control unit has a chassis incorporating a printed circuit board where electronic devices are mounted. The outer surface of the chassis on the side of the high temperature heat source has a coating for lowering infrared absorption, while the outer surface of the chassis on the side away from the high temperature heat source has a coating for enhancing heat emissivity. Preferably, the inner surfaces of the chassis are subject to a surface treatment for increasing infrared absorption.

A mechanism and method for directly observing data from which the thermal emissivity or absorptivity of a surface can be calculated. The invention teaches the use of a substantially planar heat-flux or heat-flow sensor employing a thermopile, to measure the rate of heat dissipation from a radiating surface thermally attached to one side of the heat-flux sensor where the radiating surface is exposed to a first temperature and where the second side of the heat flux sensor is in thermal contact with a heat source at a second higher temperature.

The invention relates to ceramic paint and a preparation method thereof. The ceramic paint contains ceramic powder, transition metal oxide, rare earth metal oxide and an adhesive. Relative to 100 parts by weight of the ceramic powder, the ceramic paint comprises 20-150 parts by weight of the transition metal oxide, 5-50 parts by weight of the rare earth metal oxide and 5-80 parts by weight of the adhesive, wherein the ceramic powder is a compound of calcium hydrogen phosphate and calcium carbonate; and the rare earth metal oxide is a combination of yttrium oxide, lanthanum oxide and cerium oxide. The invention also relates to a heating furnace tube with a ceramic coating formed by the ceramic paint. The ceramic coating formed by the ceramic paint has obviously improved wear resistance, corrosion resistance and fouling and slag-bonding resistance, a high thermal radiation rate and better thermal shock resistance stability.

The invention discloses a p-CuO-n-ZnO solar cell. An indium-tin-oxide (ITO) substrate, a vertically oriented ZnO nanorod array, a CuO film and an Au electrode are superposed in sequence from the bottom layer to the top layer, wherein the vertically oriented ZnO nanorod array is used as an n-type semiconductor absorption layer, and the CuO film is used as a p-type semiconductor light absorption layer and a hole transporting layer. The preparation method of the p-CuO-n-ZnO solar cell comprises the following steps of: preparing a ZnO seed crystal layer on ITO by utilizing a sol-gel method; preparing the vertically oriented ZnO nanorod array by utilizing a chemical bath deposition method; preparing the CuO film on the ZnO nanorod array by utilizing an in-situ growth method; and sputtering the Au electrode by using an ion beam sputtering system. The invention has the advantages that the equipment adopted by the preparation method is simple, and the cost is low; as CuO is adopted to serve as the light absorption layer and the hole transporting layer, compared with organic materials, the CuO has higher electromigration capacity; and by combining with the electrical conduction characteristic of inorganic ZnO with high light absorption and low thermal emittance of the CuO, the photoelectric conversion efficiency of the solar cell can be effectively increased.

A beam manipulating arrangement for a multi beam application using charged particles comprises a multi-aperture plate having plural apertures traversed by beams of charged particles. A frame portion of the multi-aperture plate is heated to reduce temperature gradients within the multi-aperture plate. Further, a heat emissivity of a surface of the multi-aperture plate may be higher in some regions as compared to other regions in view of also reducing temperature gradients.

A circuit board is hermetically-sealed and housed in a steel case that is composed of a metal base (30) and a metal cover (20), the cover disposed opposite to a first board surface (43) has a tall flat portion disposed opposite to a connector housing (41) and a short flat portion (22) disposed opposite to a heating component (43a), and the heat generated from the heating component is directly transferred to a heat transfer base portion (35) of the base via a heat transfer mechanism (12) and a heat transfer filling material (13). Surface finishing in which the coefficients of heat radiation are mutually 0.7 to 1.0 is applied to the surface of the heating component (43a) and the opposite inner surface of the cover (20), and radiation and heat transfer are efficiently performed to the short flat portion (21) of the cover.

The invention relates to an anticorrosion and energy saving paint based on infrared radiation body. The weight ratio of the invention is 15-25% randomly two or more oxide particles selected from zirconium dioxide, titanium dioxide, alumina, ferric oxide, ceria, manganese dioxide or calcium oxide,35-45% randomly two or more particles selected from carborundum, silicon nitride, kaolin or nm titanium dioxide, 35-45% one or two solution selected from silicate solution, PVA, or CMC. The invention has good heat endurance, and anticorrosion.

The invention discloses a device for measuring IR (infrared ray) normal emittance. The device comprises a measurement module, a storage module and a calculation module which are connected with each other in sequence, wherein the measurement module is used for measuring a to-be-measured signal data and preset signal data of a standard blackbody with a known IR normal emittance, and transmitting the to-be-measured signal data and the preset signal data to the storage module; the storage module is used for storing the to-be-measured signal data, the preset signal data and the IR normal emittance of the standard blackbody; and the calculation module is used for calculating the IR normal emittance of a sample to be measured according to the to-be-measured signal data, the preset signal data and the IR normal emittance of the standard blackbody. The IR normal emittance measurement device and the method provided by the invention can be used for directly measuring the IR normal emittance of the sample and measurement accuracy is high.

The invention discloses a thermal barrier coating with thermal radiation property. The thermal barrier coating is a SiO2 plugging surface layer which is prepared by on the surface of a ZrO2 coating after sol-gel by using a dipping-pull method and is high in finishing degree and low in roughness. On one hand, a function of increasing the thermal radiation rate of the surface of the coating is achieved, on the other hand, a function of filling pores of the thermal resisting coating is achieved, and the pores in the surface of the coating are made up. The composite coating of a novel structure can be used for improving the thermal protection property of the surface of a titanium alloy at high temperature, and has important values on protection of high-speed aircraft shells.

A thermal insulation method more an internal surface of an injection molding casting die includes forming a thermal insulation blanket on the internal surface using laser cladding. One or more layers of a metal material having suitable thermal emittance and melting point characteristics is applied to the internal surface using laser cladding. Because the impact area of the injected molten metal is subject to greater stress and temperature gradients than the remainder of the surface, laser cladding can be used to apply the thermal insulation blanket only to areas that require additional protection.

Disclosed is an organic electroluminescent device comprising a supporting substrate, a sealing substrate, and a laminate including a pair of electrodes and an organic light-emitting layer sandwiched between the electrodes. The laminate is mounted on the supporting substrate and blocked off from the outside by being enclosed with the supporting substrate and the sealing substrate. At least one side of the supporting substrate or at least one side of the sealing substrate is provided with a highly heat-dissipating layer, and the highly heat-dissipating layer has a thermal emissivity of not less than 0.7.

A high voltage bushing for transferring AC or DC high voltage and current. The bushing includes an electrically connectable electrical conductor, an insulator housing enclosing the conductor, and a space filled with an electrically insulating gas in between said insulator housing and said conductor. The electrical conductor is coated with a surface layer of a material having a thermal emissivity substantially larger than a thermal emissivity of the conductor.

A coated structure is provided that has a highly concentrated coating of carbon nanotubes so as to provide integrated thermal emissivity, atomic oxygen (AO) shielding and tailorable conductivity to the underlying surface, such as the surface of an aerospace vehicle, a solar array, an aeronautical vehicle or the like. A method of fabricating a coated structure is also provided in which a surface is coated with a coating having a relative high concentration of carbon nanotubes that is configured to provide integrated thermal emissivity, AO shielding and tailorable conductivity to the surface.

The invention relates to the technical field of a heat-conducting device, in particular to an yttrium alloy super heat-conducting material and a super heat-conducting device. The yttrium alloy super heat-conducting material comprises the main components by weight percent: 1%-15% of yttrium, 1%-15% of scandium and 60%-90% of aluminum. The heat-conducting properties of the yttrium alloy super heat-conducting material and the super heat-conducting device are mainly embodied as follows: 1) yttrium, scandium, titanium, molybdenum, vanadium, strontium, beryllium and the like belong to transition metal elements, have high temperature resistance and low heat resistance and are high temperature superconductors, the heat transfer rate of aluminum is high and the heat transfer rates of yttrium, scandium, titanium, molybdenum and aluminum alloys are high; 2) as the heat radiation rates of yttrium, scandium, titanium, molybdenum, vanadium, strontium beryllium and other metals are high, the absorbed heat energy can be fast sent out through radiation; and 3) the super heat-conducting device does not adopt to a seal design, and a through hole is arranged to enhance air convection between the hot end and the cold end and further enhance heat dissipation.

The invention belongs to the field of spectrum thermal radiance representation, and specifically relates to a method for calculating the spectrum thermal radiance of a multilayer optical film. The method is simple and feasible. For a determined multilayer film-substrate-multilayer film system structure, the method can completely express the spectrum directional radiance, directional radiance, spectrum radiance and integral spatial radiance of an optical multilayer film with only one need to determine the thermo-optical coefficients of a substrate and a film material. The method can avoid the tedious operation of direct measurement and a complex structure design of a measuring instrument, and has a certain scientific and application value.

The invention provides a heating element with a porous ceramic coating. The heating element with the porous ceramic coating comprises a metal base body and the porous ceramic coating composited on thesurface of the metal base body; the porous ceramic coating comprises a metal phase and a ceramic phase; the mass percentage of the metal phase in the porous ceramic coating is 0-50%; the metal phaseis composed of one or more of tungsten, molybdenum, tantalum, zirconium, niobium and hafnium; and the ceramic phase is one or more of carbide of rare metal, nitride of rare metal, oxide of rare metal,carbide of boron, nitride of boron, oxide of boron, aluminum oxide and magnesium oxide. The coating body in the heating element is ceramic powder, metal powder serves as an adhesion agent, and the porous ceramic coating is prepared. The coating with the ceramic material as the body can increase the heat radiation rate of the element, meanwhile, due to the fact that the ceramic coating is of a loose porous structure, the heat stress generated due to the heat expanding coefficient difference of the base body and the coating can be effectively reduced, and the coating is not prone to cracking orfalling.

The invention relates to a ceramic coating and its preparation method and use. The ceramic coating comprises ceramic powder, titanium nitride, zirconium nitride, rare-earth oxides and a binder. Based on 100 weight parts of the ceramic powder, in the ceramic coating, the content of titanium nitride is in a range of 10-80 weight parts, the content of zirconium nitride is in a range of 10-80 weight parts, the content of the rare-earth oxides is in a range of 5-50 weight parts, and the content of the binder is in a range of 5-80 weight parts. The ceramic powder is a calcium hydrogen phosphate-calcium carbonate compound. The rare-earth oxides comprise yttrium oxide, lanthanum oxide and cerium oxide. The invention also relates to a use of the ceramic coating in forming of a coating layer on an inner wall of a heating furnace. The ceramic coating layer prepared from the ceramic coating has obviously improved wear resistance, corrosion resistance and contamination and slag-bonding resistance, and also has a high thermal radiation rate and thermal shock resistance.

The invention provides a graphene film. The graphene film comprises the following components by mass: 100 parts of modified graphene, 250-450 parts of solvent, 15-0 parts of film former, 0.5-1.5 partsof curing agent, 0.25-15 parts of modifier and 3-10 parts of auxiliary agent. The thickness of the graphene film is 10-80 Mum. The graphene film is directionally arranged and large in heat dissipating area, has high thermal conductivity, thermal emissivity and good flexibility, bending resistance, impact resistance and processability and is not prone to powder drop. A composite heat dissipating film is further provided. The composite heat dissipating film sequentially comprises ultra-thin thermal conductive silica gel pad and the directionally arranged graphene film from bottom to top. The composite heat dissipating film can directly contact a heat source without double-sided adhesive. The contact thermal resistance is greatly reduced. The composite heat dissipating film has good thermalconductivity and mechanical properties, and can be widely used in the field of heat dissipation of electronic products.