The invention provides a novel high heat conduction and heat dissipation coating and a manufacturing method thereof. The coating is applied in the heat dissipation field of electronic products, and comprises basic resin and filler, wherein the basic resin is coating resin, and the filler comprises one or more of graphite, nanographite, flake graphite, graphene, pyrolytic carbon, pyrolytic graphite, graphite powder, carbon nano tube, carbon fiber, graphite fiber, ceramic fiber, quartz fiber, metal fiber, zirconia, boron nitride, silicon nitride, boron carbide, carborundum, magnesium oxide powder, metasilicic acid fiber, calcium silicate aluminum fiber, alumina fiber, and copper, aluminum, silver, tungsten and molybdenum metal powders. The coating prepared according to the material and the method disclosed by the invention is directly coated or sprayed on the surface of a heat dissipater, heat is transmitted onto the coating, and then the heat is dissipated to the space by the coating so as to accelerate the dissipation of heat generated by an electronic device and avoid the problems of performance reduction or instability, service life shortening and the like of the electronic device due to insufficient heat dissipation.