Novel high heat conduction and heat dissipation coating and manufacturing method thereof

Abstract

The invention provides a novel high heat conduction and heat dissipation coating and a manufacturing method thereof. The coating is applied in the heat dissipation field of electronic products, and comprises basic resin and filler, wherein the basic resin is coating resin, and the filler comprises one or more of graphite, nanographite, flake graphite, graphene, pyrolytic carbon, pyrolytic graphite, graphite powder, carbon nano tube, carbon fiber, graphite fiber, ceramic fiber, quartz fiber, metal fiber, zirconia, boron nitride, silicon nitride, boron carbide, carborundum, magnesium oxide powder, metasilicic acid fiber, calcium silicate aluminum fiber, alumina fiber, and copper, aluminum, silver, tungsten and molybdenum metal powders. The coating prepared according to the material and the method disclosed by the invention is directly coated or sprayed on the surface of a heat dissipater, heat is transmitted onto the coating, and then the heat is dissipated to the space by the coating so as to accelerate the dissipation of heat generated by an electronic device and avoid the problems of performance reduction or instability, service life shortening and the like of the electronic device due to insufficient heat dissipation.

Description

technical field [0001] The invention relates to the application of a polymer composite material, in particular to a novel high thermal conductivity and heat dissipation paint made of a polymer composite material and a processing and manufacturing method for the novel high heat conduction heat dissipation paint. Background technique [0002] Thermally conductive and heat-dissipating coatings are widely used in fields that require heat dissipation, such as computers, notebook computers, LED lighting, communications, rectifiers, medical and industrial equipment, and are mainly coated on the surface of radiators. However, with the expansion and popularization of the application range of electronic and electrical equipment, the performance and structure requirements of electronic and electrical equipment are becoming more and more stringent and complex, including higher processing speed, higher processing frequency, smaller Smaller size, lighter weight, higher power and other tec...

AI Technical Summary

Problems solved by technology

[0007] In view of the above defects, the purpose of the present invention is to provide a new type of high thermal conductivity coating to solve the problem of large volume, heavy weight, high cost and non-adjustable thermal conductivity or heat dissipation coefficient caused by the use of non-ferrous metals in the prior art. The technical problem that the adjustable space is extremely small cannot meet the demand

[0008] Another object of the present invention is to provide a new method of manufacturing a high thermal conductivity coating to solve the problem of large volume, heavy weight, high cost and non-adjustable thermal conductivity or heat dissipation caused by the use of non-ferrous metals in the prior art. The technical problem that the coefficient adjustable space is too small to meet the demand

Images