916 results about "Thermal transfer" patented technology

The invention discloses an electromechanical composite transmission IGBT junction temperature prediction method based on a NODE reduced-order model. A thermal simulation model is constructed according to a real physical model mechanism, a material and a thermal transfer principle of an IGBT; in the constructed thermal simulation model, performing simulation calculation according to the monitored time sequence data to obtain the junction temperature of the IGBT corresponding to the time change, jointly establishing a data set for training and testing with the monitored data, establishing a NODE neural network order reduction model comprising an input layer, a hidden layer and an output layer, and training the NODE neural network order reduction model by using the data set; and inputting the IGBT related time sequence data into the constructed NODE neural network reduced-order model for prediction to obtain the time sequence data of the junction temperature. According to the method, the IGBT junction temperature can be predicted in real time, the calculation efficiency is high, the interpretability is high, the long-term dependence problem can be better solved, and the method is suitable for complex working conditions.

The invention discloses a modeling and optimizing method for a thermal resistance network of a high-power semiconductor module. The method is based on an electricity-heat-fluid field dynamic coupling simulation technology, the turbulence state is judged through Reynolds numbers, and the enhancement effect of fluid flow on heat transfer is quantified in combination with a standard k-epsilon model and a Navier-Stokes equation; a module thermal resistance curve is extracted through transient simulation, thermal resistance parameters are fitted through a high-order Foster model, a thermal resistance network model containing self-heating impedance and coupling thermal impedance is constructed, and matrix representation of temperature distribution in a multi-chip heat source coupling scene is achieved. Loss parameters are further corrected through iteration in combination with experimental data. Experimental results show that the model has high precision in the aspect of junction temperature prediction, and the calculation efficiency is remarkably improved compared with a traditional finite element method. The invention provides a high-precision and low-complexity solution for the thermal management design of the high-power semiconductor module, and can be widely applied to the fields of new energy automobile electric control systems and high-density power electronic equipment.

The disclosure describes a screen window liquid metal pad disposed between two opposing elements of an electronic device so as to provide a thermal pathway for an efficient heat transfer from one element to the other, comprising: a screen window and a liquid metal, wherein the screen window includes a frame with a window and a thermal conductive mesh; wherein the frame includes a top piece and a bottom piece, a peripheral portion of the thermal conductive mesh is fixed between the top and bottom pieces through an adhesive and the remaining portion forms a window screen covering the window of the frame; and wherein the liquid metal fills in and covers at least part of a middle portion of the window screen.

The invention discloses a method for controlling multi-color printing of a thermal transfer printer. The method comprises the following steps: visually editing and typesetting, displaying a separated preview page according to preset color layer decomposition parameters, performing color separation processing on an original design page according to the preset color layer decomposition parameters, and supporting synchronous printing, asynchronous printing and cross-medium printing. An original design page is decomposed into single-color printing instruction sequences according to color layers through a color separation processing module. Based on the medium position real-time tracking technology, the main control circuit board dynamically coordinates all the single-color printing units to execute color separation printing when the medium moves to the corresponding position, and three modes of same-medium multi-color synchronous printing, asynchronous printing and cross-medium parallel printing are supported. The problems that a traditional heat transfer printing machine is low in multi-color overprinting precision and poor in efficiency are solved, and the flexibility and production efficiency of color mark printing are remarkably improved.

The invention discloses a relief touch heat transfer film and a preparation process thereof, and relates to the technical field of transfer film preparation, the heat transfer film comprises the following structural layers from bottom to top: a substrate layer, which is composed of a polyester film PET; the release layer is positioned above the base material layer and is composed of modified silicone oil, and nano silicon dioxide particles are added into the modified silicone oil; the transfer printing layer is positioned above the release layer and comprises a pattern layer and an embossment texture layer; according to the scheme, a spring pressing plate-sand grain grinding bin is additionally arranged at the front printing section of the heat transfer printing film preparation process, the film surface penetrates through a sand layer in the bin along a guide plate and a guide shaft with constant tension, micron-sized grooves are formed in the film surface through sand grains in a ploughing mode, and high-frequency polarization coarsening of corona discharge is replaced; the spring pressing plate is automatically pressed down along with the fluctuation of the film thickness, the sand layer is kept compact, the depth of the grooves is consistent, the water-based ink is spread and cured along the grooves during subsequent water-based ink printing, mechanical locking is formed, the ink is prevented from being pulled up during embossment embossing, and corona-free and ozone-free film surface coarsening is achieved.

The invention relates to a thermal transfer printing head with a semiconductor chilling plate and a thermal transfer printer, the thermal transfer printing head comprises a printing head body and a printing head back plate, and one side face of the printing head back plate is provided with an assembly through groove in the length direction of the printing head back plate; a limiting through groove extending in the length direction of the printing head back plate is formed in the groove bottom of the assembling through groove, a copper pipe is embedded in the limiting through groove, and the copper pipe is provided with a contact face flush with the groove bottom of the assembling through groove. An assembling through groove is formed in the printing head back plate, a plurality of semiconductor chilling plates are arranged in the assembling through groove, the printing head body is installed on one side face of the printing head back plate and fixedly connected with the printing head back plate, and the printing head body covers the assembling through groove and makes contact with the semiconductor chilling plates. The thermal transfer printing head with the semiconductor chilling plate has the advantages that high-precision linear adjustment of the temperature can be achieved, and inertia-free rapid adjustment can be achieved.

1. The name of the design product: heat transfer printer. 2. The use of the design product: the design product is used for printing products, such as printing identification products. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: design 1 perspective view. 5. Design 1 is designated as the basic design.

The invention relates to the field of ink, in particular to bio-based elastomer heat transfer printing ink and a low-temperature microwave curing method thereof. The bio-based elastomer heat transfer printing ink at least comprises the following raw materials in parts by mass: 50-75 parts of a bio-based prepolymer, 5-10 parts of a cross-linking agent, 15-30 parts of an anti-pinhole agent, 0.5-1.5 parts of a curing catalyst, 5-15 parts of a pigment and 15-30 parts of a solvent. The bio-based elastomer thermal transfer printing ink finally prepared by the invention not only has an excellent transfer printing effect, but also can greatly improve the bio-based carbon content in the printing ink, and avoids the problems of environmental pollution and discontinuity; and on the other hand, compared with the traditional petroleum-based TPU ink, the required energy consumption is lower, the flexibility and the washability are also obviously improved, the pinhole defect is reduced, and the probability of secondary printing blooming caused by solvent migration is greatly reduced.

The utility model belongs to the technical field of thermal transfer printing, and discloses a thermal transfer printer. The thermal transfer printer comprises two reels, a printing mechanism, a first driving assembly, a bearing frame and a guiding assembly, the two reels can rotate around the axes of the reels, a colored tape is wound on one reel, the free end of the colored tape is fixed to the other reel, the printing mechanism comprises a first installation part and a wide printing assembly, and the wide printing assembly is arranged on the first installation part. The wide-width printing assembly extends in the Y-axis direction and is movably arranged on a first mounting part in the Z-axis direction, the first mounting part is connected with a first driving assembly, the first driving assembly is configured to drive the printing mechanism to move in the X-axis direction, the bearing frame comprises two bearing plates arranged in the Y-axis direction, and guide assemblies are arranged on the bearing plates; the two ends of the first mounting part are correspondingly arranged on the upper side faces of the two bearing plates in a sliding mode through guide assemblies, and the guide assemblies can provide guidance for movement of the printing mechanism in the X-axis direction.

Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

The invention provides a circuit board, a layout optimization method and device thereof and prefabricated vegetable quick-freezing refrigeration equipment, and relates to the technical field of computers.The layout optimization method of the circuit board comprises the steps that grid division is conducted on the circuit board based on a finite difference method, and a temperature field model of a heat transfer equation containing a plurality of position nodes is established; taking the temperature data of all electronic components on the circuit board in the temperature field model as an objective function of layout optimization; and performing iterative optimization on the target function by using a simulated annealing algorithm, and outputting a corresponding electronic component layout and a temperature condition of the electronic component layout. The problems of inaccurate temperature field modeling, insufficient vibration heat source quantization and lack of local hot spot optimization in a traditional method are solved, and the method has the advantages of improving the temperature field modeling precision and optimizing the heat management effect in the vibration environment, so that the stability and durability of a circuit board are improved, and efficient operation of quick-freezing refrigeration equipment is ensured.

The invention discloses a standard modular energy storage thermal runaway early warning method and system based on digital twinning, and relates to the technical field of energy storage system safety monitoring. The method comprises the following steps: deploying multiple types of sensors in an energy storage unit to form a network, and collecting multi-dimensional data such as temperature, voltage and gas concentration; transmitting the data to the digital twin platform, and performing format conversion on the data for thermal runaway prediction; the platform is combined with the LSTM-GBDT hybrid model through physical modeling, and the risk probability is output; and comparing the risk threshold to trigger early warning. The system comprises a sensing module, a data acquisition and transmission module, a digital twinborn prediction module and an early warning execution module. According to the method, physical simulation and historical data training are fused through the digital twin platform, the heat transfer and out-of-control propagation process can be accurately simulated, virtual simulation optimization is supported, the early warning accuracy and reliability are improved, and the operation and maintenance burden and accident potential are reduced.

The invention relates to the technical field of compressive strength detection of thermal transfer printing films for pens, in particular to a compressive strength detection device for production of thermal transfer printing films for pens, which comprises a mounting box, a mounting frame, a multi-stage hydraulic cylinder, a connecting plate, a pressure sensor I and the like, and is characterized in that the mounting frame is connected to the mounting box, and the multi-stage hydraulic cylinder is mounted on the mounting frame; a connecting plate is connected to the lower end of a telescopic rod of the multi-stage hydraulic cylinder, and a first pressure sensor is installed at the bottom of the connecting plate. The thermal transfer film for the pen can be pressed through the pressing plate, the compressive strength of the thermal transfer film for the pen is detected, the thermal transfer film for the pen can be supported through the supporting plate, the thermal transfer film for the pen does not need to be manually supported and flattened by a worker, the detection efficiency can be improved, the thermal transfer film for the pen can be smoother, and the working efficiency is improved. The problems of uneven tension distribution and inconsistent pre-stretching degree of the thermal transfer film for the pen are avoided, and the accuracy of a detection result is improved.

A thermal transfer sheet includes a substrate and a transfer layer, in which the transfer layer after transfer has a reduced peak height (Spk) of 0.6 μm or more. A method for producing a printed material using a thermal transfer sheet including a particle layer disposed on a substrate and an image-receiving sheet including a thermal protrusion-and / or-recess forming layer and a receiving layer stacked in that order on a second substrate, the receiving layer including an image that has been formed, includes the steps of heating the image-receiving sheet to form a protrusion and / or a recess at the image-receiving sheet, and heating the thermal transfer sheet to transfer the particle layer to at least part of the protrusion of the image-receiving sheet.

The utility model relates to an RFID (Radio Frequency Identification Device) printer for a single hang tag, which comprises a thermal transfer ribbon printer and an RFID reader-writer, a hang tag stacking and conveying device is arranged in a hang tag stacking area, a plurality of hang tags are stacked on a conveying surface of a conveying belt in the hang tag stacking and conveying device, and an RFID tag is embedded in each hang tag; the thermal transfer ribbon printing head can conduct online thermal transfer printing on passing hangtags through a walking thermal transfer ribbon, a hangtag one-by-one output device is arranged at the output end of the hangtag stacking and conveying device, and an RFID read-write antenna is installed in the hangtag printing area and located between the hangtag one-by-one output device and the thermal transfer ribbon printing head. And the RFID reader-writer can write data into the hang tags which pass one by one through the RFID read-write antenna. The system has the advantages that firstly, the printer can perform online printing and data entry on a single hang tag embedded with an RFID tag at the same time, the printer can ensure that the single hang tag is printed one by one and data is entered one by one, and the hang tag is not easy to be stuck; and thirdly, the printer can print hang tags with different thicknesses, and is good in printing applicability and convenient to adjust.

The present invention discloses a superhydrophobic anti-icing surface based on a super-elliptical topological structure and a preparation method thereof. The superhydrophobic anti-icing surface includes a super-elliptical topological structure substrate and a superhydrophobic coating; the micro-structure of the super-elliptical topological structure substrate has a protection function, protecting the internal superhydrophobic coating from being damaged by impact or worn by friction and becoming ineffective; the superhydrophobic coating has a nanostructure with intrinsic superhydrophobicity, which can reduce the solid-liquid contact area and weaken the solid-liquid heat transfer, thereby delaying icing and reducing ice adhesion, and having anti-icing performance. The superhydrophobic anti-icing surface of the present invention has long-lasting and mechanically robust superhydrophobicity. By using the super-elliptical topological micro-structure to protect the superhydrophobic nanostructure, the problems of poor mechanical robustness and non-abrasion resistance of the superhydrophobic surface are solved, and the long-lasting property and durability of the superhydrophobic surface are enhanced, and it can be applied to fields such as aerospace, energy, and transportation.

A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.

A method of fabricating a multiphase heat exchanger for thermal coupling to a heat source is provided. The method includes submerging a build plate having a deposition surface into an electrolyte, the deposition surface comprising at least one of an evaporator base, a condenser base, or a liquid-return base. A printhead comprising pixelated electrodes and electrode-array drivers is submerged proximate to the deposition surface. A subset of the pixelated electrodes is selectively activated to generate an ionic flow through the electrolyte between the electrode subset and a portion of the deposition surface, thereby electrochemically depositing wicking structures on the base surface. Any two adjacent wicking structures positioned on the evaporator base are spaced apart by an average pitch selected to maintain a heat-transfer fluid, in a liquid phase, in contact with the evaporator base during operation of the multiphase heat exchanger.

An information handling system includes a hardware processor, a memory device, and a PMU to provide power to the hardware processor and memory device. A TEC chip refrigeration liquid cooling system to cool a heat-generating component device includes a cold plate thermally coupled to the heat-generating component device to transfer heat from the heat-generating component device into a cold side tank thermally coupled between the cold tank and a hot side tank, a TEC chip to, when a voltage is applied to the TEC chip increase a rate of thermal transfer of heat from the cold side tank of a first liquid cooling loop to the hot side tank of a second liquid cooling loop, and a radiator thermally coupled to the hot side tank in the second liquid cooling loop to dissipate heat transferred to the radiator out of the information handling system.

A heat dissipation device for use in a semiconductor technology system, comprising a surface component (31) and a heat sink (63) connected to the surface component (31). The surface component (31) is designed to reduce heat transfer from a heat source (22) located on one side of the surface component (31) to a region of the semiconductor technology system located on the other side of the surface component (31). According to the invention, the surface component (31) has at least one thermally conductive layer (62) extending along the surface component (31) made of a material with anisotropic thermal conductivity, wherein the anisotropic thermal conductivity along a surface extension of the thermally conductive layer (62) is more than 10 times greater than along a direction perpendicular to the surface extension, and wherein the thermally conductive layer (62) is vacuum-tightly shielded from the surroundings of the surface component (31).The heat dissipation device enables very effective thermal shielding of the heat source, especially when limited installation space is available.

The invention provides a multi-color printing control method, device and system of a thermal transfer printer, which are applied to a system comprising an editing and typesetting terminal and a thermal transfer printing mechanism, and the thermal transfer printing mechanism is provided with at least two printing heads which are respectively provided with colored tapes with different colors. The method comprises the following steps: acquiring a design page containing images and texts with various colors at an editing and typesetting terminal; identifying the color of each currently available color tape of the thermal transfer printing mechanism to form an available color set, and establishing a corresponding relationship between each printing head and the color of the color tape of the printing head; analyzing the design page pixel by pixel, matching the color of each pixel with the available color set to determine the target available color of the pixel, and merging the pixels with the same or similar target available colors into a corresponding printing object; distributing the printing objects to printing heads corresponding to the target available colors of the printing objects, and generating printing data of the printing heads based on distribution; and the printing data are sent to a thermal transfer printing mechanism, so that a multi-color printing task is completed.

The invention discloses a cooperative control method and system for thermal transfer ribbons of a thermal transfer printer, and relates to the technical field of thermal transfer printers. The surface wear coefficient of each thermal transfer ribbon is determined according to identification of a thermal transfer ribbon area of the thermal transfer printer; and determining the state coefficient of each thermal transfer ribbon according to the surface wear coefficient of each thermal transfer ribbon and the corresponding tensioning distance, and further cooperatively controlling the state of each thermal transfer ribbon. Therefore, a dynamic cooperation scheme of each thermal transfer ribbon is determined based on the state coefficient of each thermal transfer ribbon and the printing load capacity and the service life of the thermal transfer printer; predicting tension conditions among the thermal transfer ribbons based on the dynamic cooperation scheme and the rotation events of the thermal transfer ribbons; the abnormal printing areas are determined according to detection of the printing content output by the thermal transfer printer, and the optimization scheme of each thermal transfer ribbon is determined according to the plurality of abnormal printing areas, the printing event of the thermal transfer printer and the tension condition between the thermal transfer ribbons, so that the accuracy of the optimization scheme of each thermal transfer ribbon is improved.

The invention relates to the technical field of printing ink, and particularly discloses UV curing printing ink, a heat transfer printing colored tape and a preparation method thereof.The printing ink comprises nanometer color paste and a connecting material, and the connecting material is prepared from, by weight, 35-45 parts of urethane acrylate, 12-18 parts of isobornyl acrylate, 8-12 parts of tetrahydrofurfuryl acrylate, 4-6 parts of acryloylmorpholine and 1-10 parts of photoinitiator; the photoinitiator comprises 184, TPO (thermoplastic polyolefin) and 819. The prepared printing ink is clear and stable in image after transfer printing, can achieve a good full-printing full-color effect, is resistant to water and alcohol, and can achieve clear and stable heat transfer printing of the image on different materials.

The invention provides an intelligent temperature control system and method based on chip heat energy guiding. The method comprises the steps of obtaining running state information of a target chip set; the working mode of the loop heat pipe is determined according to the operation state information of the target chip set, and stepped energy recovery is conducted on conduction heat of the loop heat pipe through the recovery heat pump; thermal state information of the target chipset and energy recovery information of the recovery heat pump in different historical time windows are obtained, correlation verification analysis is carried out according to the thermal state information and the energy recovery information, and an intermittent boiling threshold value of the loop heat pipe is determined; acquiring operation instruction stream data of the chip, and performing dynamic power consumption prediction according to the operation instruction stream data to obtain a dynamic power consumption prediction value; when the dynamic power consumption predicted value is higher than the intermittent boiling threshold value, the liquid return rate of the loop heat pipe is adjusted based on the dynamic power consumption predicted value, the liquid return rate in the heat transfer process can be controlled according to dynamic power consumption prediction, and the heat energy guiding and recycling efficiency is improved.

The invention provides a composite material plate with patterns, a preparation method of the composite material plate and an electronic product shell. The preparation method comprises the steps that a release film, a glass fiber prepreg and a heat transfer printing film are sequentially stacked and integrally formed in a hot pressing mode; and after hot pressing is finished, removing the release film, and meanwhile, removing the base material layer of the heat transfer printing film to obtain the composite material plate with the patterns. According to the integrated forming process of the composite material substrate and the heat transfer printing membrane, namely the preparation method of the composite material plate with the patterns, provided by the invention, the glass fiber prepreg and the heat transfer printing membrane can be integrally formed; the steps of cutting and the like are included, so that precise operation such as precise alignment is not needed, the production process is greatly simplified, and the machining period is shortened; meanwhile, the heat transfer printing membrane and the glass fiber prepreg are attached in a hot-pressing mode, the binding force of the heat transfer printing membrane and the glass fiber prepreg is improved, and the problems of stripping and the like cannot occur in the long-term use process.

The utility model discloses printing paper and heat transfer printing label, the printing paper includes at least one printing unit, the printing unit includes first release paper, label layer and film layer, the first release paper includes first area and second area, and a fold line is formed between the first area and the second area, the label layer is stacked on the first release paper layer and arranged in a first area, the film laminating layer is stacked on the first release paper layer and arranged in a second area, a first bonding layer is further arranged on the side, away from the first release paper, of the film laminating layer and used for being bonded with the label layer and the film laminating layer, and the edge of the first bonding layer is separated from the edge of the first release paper. And the laminating layer can be adhered to the label layer through the first adhesive layer when the first release paper is folded along the folding line. According to the utility model, the problem that the effect of protecting the printing area by the laminating area is reduced because the viscidity of the glue is influenced and the bonding effect between the laminating area and the printing area is further influenced due to the fact that fingers are very easy to contact with the glue can be effectively solved.

A carbon tape box drive structure is characterized by comprising a base, a winding motor, a transmission gear set, a winding shaft, a first connecting sleeve, a winding shaft, a second connecting sleeve, a constant torque mechanism and a damping mechanism, the constant torque mechanism is arranged on the winding shaft, and the carbon tape is always in a taut state; the damping mechanism is arranged on the winding shaft, and the winding shaft generates damping when rotating. The application discloses a thermal transfer printer. At the beginning and end of the rotation of the carbon tape, the constant torque mechanism and the damping mechanism cooperate to make the carbon tape supplied by the winding core always in a taut state, has a certain tension, and does not appear loose and collapsed, ensures that the printing points are more regular and uniform, and guarantees the printing quality.

An electronic label for thermal transfer printing, characterized in that it comprises: a carrier material; a first ink layer, wherein one side of the first ink layer is connected to one side of the carrier material; a second ink layer, wherein one side of the second ink layer is connected to another side of the first ink layer, such that the first ink layer is located between the carrier material and the second ink layer; a third ink layer, wherein one side of the third ink layer is connected to the other side of the second ink layer, such that the second ink layer is located between the first ink layer and the third ink layer; an antenna layer, wherein one side of the antenna layer is connected to another side of the third ink layer, such that the third ink layer is located between the second ink layer and the antenna layer;and a chip, wherein one side of the chip is connected to another side of the antenna layer, such that the antenna layer is located between the third ink layer and the chip.;

The present invention relates to the technical field of data simulation processing, and particularly to a thermal simulation method, system and medium for a circuit board. The method includes the following steps: obtaining circuit board layer data; extracting the thermal resistance parameters of the board layer materials of the circuit board layer data, including copper foil thermal resistance parameters and insulating medium thermal resistance parameters; identifying the hierarchical structure of the circuit board layer data and recording it as hierarchical structure data; determining the component layout characteristics according to the hierarchical structure data, and performing an interlayer thermal resistance distribution calculation on the thermal resistance parameters of the board layer materials based on the component layout characteristics to generate layer structure thermal resistance distribution data. The present invention realizes the heat transfer interaction analysis of the copper foil layer and the insulating medium layer of the circuit board through data processing technology and simulation technology, and realizes the evaluation of the heat transfer direction and heat accumulation effect of the circuit board to construct a thermal simulation model of the circuit board.

The utility model provides a printer anti-offset mechanism, which relates to the technical field of thermal transfer printing, and comprises a middle frame, one side surface of the middle frame is hinged with a flip cover, a first rack and a second rack are respectively arranged in the middle frame, one side surface of the first rack and one side surface of the second rack are connected with baffle plates through screws, and the baffle plates are connected with the flip cover through screws. A transmission gear is installed in the middle frame, and the side faces, close to each other, of the first rack and the second rack are engaged with the outer surface of the transmission gear. According to the anti-deviation mechanism of the printer, the shifting wheel body with the large diameter is arranged outside the middle frame, so that the operation mode better conforms to human engineering, operation is conducted on the side face of the printer, whether paper is stably placed and clamped in place or not can be more accurately confirmed through cooperation of hands and eyes, the user experience can be improved, the operation mode is simplified, and the operation efficiency is improved. The locking mechanism does not need manual operation, and locking of the shifting wheel body can be completed while the turning cover and the middle frame are closed.