606 results about "Thermal transfer" patented technology

The invention discloses a method for controlling multi-color printing of a thermal transfer printer. The method comprises the following steps: visually editing and typesetting, displaying a separated preview page according to preset color layer decomposition parameters, performing color separation processing on an original design page according to the preset color layer decomposition parameters, and supporting synchronous printing, asynchronous printing and cross-medium printing. An original design page is decomposed into single-color printing instruction sequences according to color layers through a color separation processing module. Based on the medium position real-time tracking technology, the main control circuit board dynamically coordinates all the single-color printing units to execute color separation printing when the medium moves to the corresponding position, and three modes of same-medium multi-color synchronous printing, asynchronous printing and cross-medium parallel printing are supported. The problems that a traditional heat transfer printing machine is low in multi-color overprinting precision and poor in efficiency are solved, and the flexibility and production efficiency of color mark printing are remarkably improved.

The invention discloses a relief touch heat transfer film and a preparation process thereof, and relates to the technical field of transfer film preparation, the heat transfer film comprises the following structural layers from bottom to top: a substrate layer, which is composed of a polyester film PET; the release layer is positioned above the base material layer and is composed of modified silicone oil, and nano silicon dioxide particles are added into the modified silicone oil; the transfer printing layer is positioned above the release layer and comprises a pattern layer and an embossment texture layer; according to the scheme, a spring pressing plate-sand grain grinding bin is additionally arranged at the front printing section of the heat transfer printing film preparation process, the film surface penetrates through a sand layer in the bin along a guide plate and a guide shaft with constant tension, micron-sized grooves are formed in the film surface through sand grains in a ploughing mode, and high-frequency polarization coarsening of corona discharge is replaced; the spring pressing plate is automatically pressed down along with the fluctuation of the film thickness, the sand layer is kept compact, the depth of the grooves is consistent, the water-based ink is spread and cured along the grooves during subsequent water-based ink printing, mechanical locking is formed, the ink is prevented from being pulled up during embossment embossing, and corona-free and ozone-free film surface coarsening is achieved.

The invention relates to a thermal transfer printing head with a semiconductor chilling plate and a thermal transfer printer, the thermal transfer printing head comprises a printing head body and a printing head back plate, and one side face of the printing head back plate is provided with an assembly through groove in the length direction of the printing head back plate; a limiting through groove extending in the length direction of the printing head back plate is formed in the groove bottom of the assembling through groove, a copper pipe is embedded in the limiting through groove, and the copper pipe is provided with a contact face flush with the groove bottom of the assembling through groove. An assembling through groove is formed in the printing head back plate, a plurality of semiconductor chilling plates are arranged in the assembling through groove, the printing head body is installed on one side face of the printing head back plate and fixedly connected with the printing head back plate, and the printing head body covers the assembling through groove and makes contact with the semiconductor chilling plates. The thermal transfer printing head with the semiconductor chilling plate has the advantages that high-precision linear adjustment of the temperature can be achieved, and inertia-free rapid adjustment can be achieved.

1. The name of the design product: heat transfer printer. 2. The use of the design product: the design product is used for printing products, such as printing identification products. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: design 1 perspective view. 5. Design 1 is designated as the basic design.

The invention relates to the field of ink, in particular to bio-based elastomer heat transfer printing ink and a low-temperature microwave curing method thereof. The bio-based elastomer heat transfer printing ink at least comprises the following raw materials in parts by mass: 50-75 parts of a bio-based prepolymer, 5-10 parts of a cross-linking agent, 15-30 parts of an anti-pinhole agent, 0.5-1.5 parts of a curing catalyst, 5-15 parts of a pigment and 15-30 parts of a solvent. The bio-based elastomer thermal transfer printing ink finally prepared by the invention not only has an excellent transfer printing effect, but also can greatly improve the bio-based carbon content in the printing ink, and avoids the problems of environmental pollution and discontinuity; and on the other hand, compared with the traditional petroleum-based TPU ink, the required energy consumption is lower, the flexibility and the washability are also obviously improved, the pinhole defect is reduced, and the probability of secondary printing blooming caused by solvent migration is greatly reduced.

The invention provides a circuit board, a layout optimization method and device thereof and prefabricated vegetable quick-freezing refrigeration equipment, and relates to the technical field of computers.The layout optimization method of the circuit board comprises the steps that grid division is conducted on the circuit board based on a finite difference method, and a temperature field model of a heat transfer equation containing a plurality of position nodes is established; taking the temperature data of all electronic components on the circuit board in the temperature field model as an objective function of layout optimization; and performing iterative optimization on the target function by using a simulated annealing algorithm, and outputting a corresponding electronic component layout and a temperature condition of the electronic component layout. The problems of inaccurate temperature field modeling, insufficient vibration heat source quantization and lack of local hot spot optimization in a traditional method are solved, and the method has the advantages of improving the temperature field modeling precision and optimizing the heat management effect in the vibration environment, so that the stability and durability of a circuit board are improved, and efficient operation of quick-freezing refrigeration equipment is ensured.

The invention discloses a standard modular energy storage thermal runaway early warning method and system based on digital twinning, and relates to the technical field of energy storage system safety monitoring. The method comprises the following steps: deploying multiple types of sensors in an energy storage unit to form a network, and collecting multi-dimensional data such as temperature, voltage and gas concentration; transmitting the data to the digital twin platform, and performing format conversion on the data for thermal runaway prediction; the platform is combined with the LSTM-GBDT hybrid model through physical modeling, and the risk probability is output; and comparing the risk threshold to trigger early warning. The system comprises a sensing module, a data acquisition and transmission module, a digital twinborn prediction module and an early warning execution module. According to the method, physical simulation and historical data training are fused through the digital twin platform, the heat transfer and out-of-control propagation process can be accurately simulated, virtual simulation optimization is supported, the early warning accuracy and reliability are improved, and the operation and maintenance burden and accident potential are reduced.

The utility model relates to an RFID (Radio Frequency Identification Device) printer for a single hang tag, which comprises a thermal transfer ribbon printer and an RFID reader-writer, a hang tag stacking and conveying device is arranged in a hang tag stacking area, a plurality of hang tags are stacked on a conveying surface of a conveying belt in the hang tag stacking and conveying device, and an RFID tag is embedded in each hang tag; the thermal transfer ribbon printing head can conduct online thermal transfer printing on passing hangtags through a walking thermal transfer ribbon, a hangtag one-by-one output device is arranged at the output end of the hangtag stacking and conveying device, and an RFID read-write antenna is installed in the hangtag printing area and located between the hangtag one-by-one output device and the thermal transfer ribbon printing head. And the RFID reader-writer can write data into the hang tags which pass one by one through the RFID read-write antenna. The system has the advantages that firstly, the printer can perform online printing and data entry on a single hang tag embedded with an RFID tag at the same time, the printer can ensure that the single hang tag is printed one by one and data is entered one by one, and the hang tag is not easy to be stuck; and thirdly, the printer can print hang tags with different thicknesses, and is good in printing applicability and convenient to adjust.

A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.

A method of fabricating a multiphase heat exchanger for thermal coupling to a heat source is provided. The method includes submerging a build plate having a deposition surface into an electrolyte, the deposition surface comprising at least one of an evaporator base, a condenser base, or a liquid-return base. A printhead comprising pixelated electrodes and electrode-array drivers is submerged proximate to the deposition surface. A subset of the pixelated electrodes is selectively activated to generate an ionic flow through the electrolyte between the electrode subset and a portion of the deposition surface, thereby electrochemically depositing wicking structures on the base surface. Any two adjacent wicking structures positioned on the evaporator base are spaced apart by an average pitch selected to maintain a heat-transfer fluid, in a liquid phase, in contact with the evaporator base during operation of the multiphase heat exchanger.

A heat dissipation device for use in a semiconductor technology system, comprising a surface component (31) and a heat sink (63) connected to the surface component (31). The surface component (31) is designed to reduce heat transfer from a heat source (22) located on one side of the surface component (31) to a region of the semiconductor technology system located on the other side of the surface component (31). According to the invention, the surface component (31) has at least one thermally conductive layer (62) extending along the surface component (31) made of a material with anisotropic thermal conductivity, wherein the anisotropic thermal conductivity along a surface extension of the thermally conductive layer (62) is more than 10 times greater than along a direction perpendicular to the surface extension, and wherein the thermally conductive layer (62) is vacuum-tightly shielded from the surroundings of the surface component (31).The heat dissipation device enables very effective thermal shielding of the heat source, especially when limited installation space is available.

The invention provides a multi-color printing control method, device and system of a thermal transfer printer, which are applied to a system comprising an editing and typesetting terminal and a thermal transfer printing mechanism, and the thermal transfer printing mechanism is provided with at least two printing heads which are respectively provided with colored tapes with different colors. The method comprises the following steps: acquiring a design page containing images and texts with various colors at an editing and typesetting terminal; identifying the color of each currently available color tape of the thermal transfer printing mechanism to form an available color set, and establishing a corresponding relationship between each printing head and the color of the color tape of the printing head; analyzing the design page pixel by pixel, matching the color of each pixel with the available color set to determine the target available color of the pixel, and merging the pixels with the same or similar target available colors into a corresponding printing object; distributing the printing objects to printing heads corresponding to the target available colors of the printing objects, and generating printing data of the printing heads based on distribution; and the printing data are sent to a thermal transfer printing mechanism, so that a multi-color printing task is completed.

The invention discloses a cooperative control method and system for thermal transfer ribbons of a thermal transfer printer, and relates to the technical field of thermal transfer printers. The surface wear coefficient of each thermal transfer ribbon is determined according to identification of a thermal transfer ribbon area of the thermal transfer printer; and determining the state coefficient of each thermal transfer ribbon according to the surface wear coefficient of each thermal transfer ribbon and the corresponding tensioning distance, and further cooperatively controlling the state of each thermal transfer ribbon. Therefore, a dynamic cooperation scheme of each thermal transfer ribbon is determined based on the state coefficient of each thermal transfer ribbon and the printing load capacity and the service life of the thermal transfer printer; predicting tension conditions among the thermal transfer ribbons based on the dynamic cooperation scheme and the rotation events of the thermal transfer ribbons; the abnormal printing areas are determined according to detection of the printing content output by the thermal transfer printer, and the optimization scheme of each thermal transfer ribbon is determined according to the plurality of abnormal printing areas, the printing event of the thermal transfer printer and the tension condition between the thermal transfer ribbons, so that the accuracy of the optimization scheme of each thermal transfer ribbon is improved.

The invention relates to the technical field of printing ink, and particularly discloses UV curing printing ink, a heat transfer printing colored tape and a preparation method thereof.The printing ink comprises nanometer color paste and a connecting material, and the connecting material is prepared from, by weight, 35-45 parts of urethane acrylate, 12-18 parts of isobornyl acrylate, 8-12 parts of tetrahydrofurfuryl acrylate, 4-6 parts of acryloylmorpholine and 1-10 parts of photoinitiator; the photoinitiator comprises 184, TPO (thermoplastic polyolefin) and 819. The prepared printing ink is clear and stable in image after transfer printing, can achieve a good full-printing full-color effect, is resistant to water and alcohol, and can achieve clear and stable heat transfer printing of the image on different materials.

The invention provides an intelligent temperature control system and method based on chip heat energy guiding. The method comprises the steps of obtaining running state information of a target chip set; the working mode of the loop heat pipe is determined according to the operation state information of the target chip set, and stepped energy recovery is conducted on conduction heat of the loop heat pipe through the recovery heat pump; thermal state information of the target chipset and energy recovery information of the recovery heat pump in different historical time windows are obtained, correlation verification analysis is carried out according to the thermal state information and the energy recovery information, and an intermittent boiling threshold value of the loop heat pipe is determined; acquiring operation instruction stream data of the chip, and performing dynamic power consumption prediction according to the operation instruction stream data to obtain a dynamic power consumption prediction value; when the dynamic power consumption predicted value is higher than the intermittent boiling threshold value, the liquid return rate of the loop heat pipe is adjusted based on the dynamic power consumption predicted value, the liquid return rate in the heat transfer process can be controlled according to dynamic power consumption prediction, and the heat energy guiding and recycling efficiency is improved.

The invention provides a composite material plate with patterns, a preparation method of the composite material plate and an electronic product shell. The preparation method comprises the steps that a release film, a glass fiber prepreg and a heat transfer printing film are sequentially stacked and integrally formed in a hot pressing mode; and after hot pressing is finished, removing the release film, and meanwhile, removing the base material layer of the heat transfer printing film to obtain the composite material plate with the patterns. According to the integrated forming process of the composite material substrate and the heat transfer printing membrane, namely the preparation method of the composite material plate with the patterns, provided by the invention, the glass fiber prepreg and the heat transfer printing membrane can be integrally formed; the steps of cutting and the like are included, so that precise operation such as precise alignment is not needed, the production process is greatly simplified, and the machining period is shortened; meanwhile, the heat transfer printing membrane and the glass fiber prepreg are attached in a hot-pressing mode, the binding force of the heat transfer printing membrane and the glass fiber prepreg is improved, and the problems of stripping and the like cannot occur in the long-term use process.

A carbon tape box drive structure is characterized by comprising a base, a winding motor, a transmission gear set, a winding shaft, a first connecting sleeve, a winding shaft, a second connecting sleeve, a constant torque mechanism and a damping mechanism, the constant torque mechanism is arranged on the winding shaft, and the carbon tape is always in a taut state; the damping mechanism is arranged on the winding shaft, and the winding shaft generates damping when rotating. The application discloses a thermal transfer printer. At the beginning and end of the rotation of the carbon tape, the constant torque mechanism and the damping mechanism cooperate to make the carbon tape supplied by the winding core always in a taut state, has a certain tension, and does not appear loose and collapsed, ensures that the printing points are more regular and uniform, and guarantees the printing quality.

An electronic label for thermal transfer printing, characterized in that it comprises: a carrier material; a first ink layer, wherein one side of the first ink layer is connected to one side of the carrier material; a second ink layer, wherein one side of the second ink layer is connected to another side of the first ink layer, such that the first ink layer is located between the carrier material and the second ink layer; a third ink layer, wherein one side of the third ink layer is connected to the other side of the second ink layer, such that the second ink layer is located between the first ink layer and the third ink layer; an antenna layer, wherein one side of the antenna layer is connected to another side of the third ink layer, such that the third ink layer is located between the second ink layer and the antenna layer;and a chip, wherein one side of the chip is connected to another side of the antenna layer, such that the antenna layer is located between the third ink layer and the chip.;

The utility model provides a printer anti-offset mechanism, which relates to the technical field of thermal transfer printing, and comprises a middle frame, one side surface of the middle frame is hinged with a flip cover, a first rack and a second rack are respectively arranged in the middle frame, one side surface of the first rack and one side surface of the second rack are connected with baffle plates through screws, and the baffle plates are connected with the flip cover through screws. A transmission gear is installed in the middle frame, and the side faces, close to each other, of the first rack and the second rack are engaged with the outer surface of the transmission gear. According to the anti-deviation mechanism of the printer, the shifting wheel body with the large diameter is arranged outside the middle frame, so that the operation mode better conforms to human engineering, operation is conducted on the side face of the printer, whether paper is stably placed and clamped in place or not can be more accurately confirmed through cooperation of hands and eyes, the user experience can be improved, the operation mode is simplified, and the operation efficiency is improved. The locking mechanism does not need manual operation, and locking of the shifting wheel body can be completed while the turning cover and the middle frame are closed.

The invention relates to a recording material for thermal dye sublimation printing, comprising a base paper (1) having a front side and a back side, at least one synthetic resin layer (4) located at least on the back side of the base paper (1), a dye receiving layer (2) arranged on the front side of the base paper (1), at least one plastic film (3) arranged between the base paper (1) and the dye receiving layer (2), and optionally a barrier layer arranged between the plastic film (3) and the dye receiving layer (2), wherein the synthetic resin layer (4) has an E modulus of at least 0.8 GPa.

The present invention relates to equipment for cooling an electronic component (21), comprising a thermally conductive substrate (23) seated on the one hand against the surface of said electronic component (21) and on the other hand against a heat transfer element which is connected to a cooling means, characterized in that the heat transfer element is constituted by a vapour chamber (16b) thermally connecting the electronic component (21) to the base of the heat sink and the fins (16a) thereof, which are immersed in a chamber (11) filled with a cooling liquid.

The utility model relates to the technical field of data processing equipment, in particular to an industrial data automatic access dimension reduction decoupling converter convenient for heat dissipation, which comprises a bottom shell, the bottom shell comprises a bottom plate, the center of the top surface of the bottom plate is used for installing a main board, the upper part of the main board is wrapped by a shell, and a heat conduction assembly is arranged between the inside of the shell and the main board. According to the utility model, the heat of the mainboard is transferred to the second heat-conducting fin through the heat-conducting pipe, the third heat-conducting fin is cooled through the air flow generated by the operation of the third fan, hot air is blown among the heat-dissipating fins, and the heat is transferred to the shell body through the heat-dissipating fins, so that the heat transfer efficiency is improved; the third fan works to increase internal air flow and improve the heat transfer efficiency of the air; the first fan works to suck cold air, the air is blown into the first heat dissipation groove through the flow guide cover, heat dissipation of the bottom plate is improved, and the heat dissipation efficiency of the bottom of the device is improved.

An apparatus and method for thermal management of electronic devices are disclosed. A magnetic heatsink includes a thermally conductive base with vertical fins and one or more shielded magnet units having an exposed attachment face. A subset of fins form fan-receiving groups with inwardly curved extensions and a bottom slot bent upward to create a protruding lip, cooperating to provide lateral guidance and three-way mechanical locking of a micro fan module that also magnetically couples to the heatsink. A Smart Power Stage (SPS) board carries embedded magnet units and a board-to-board interface to magnetically and electrically engage a designated motherboard zone having a metal pad and connector, enabling tool-less installation, self-alignment and efficient heat transfer. Methods of configuring, servicing, and replacing the fan and SPS board are also described.

The invention relates to the technical field of printing equipment, and discloses a control method of thermal printing or thermal transfer printing equipment, a storage medium and a system, and the method comprises the steps that the printing equipment obtains model parameters of a printing medium; the printing equipment obtains environment parameters around the printing equipment; the printing equipment sends the model parameters to the cloud service platform; if the hit item of the model parameter exists in the cloud database of the cloud service platform, the cloud service platform returns a cloud printing parameter corresponding to the model parameter to the printing equipment; if the printing equipment receives the cloud printing parameters, the printing equipment inputs the cloud printing parameters and the environment parameters into an individual correction model to obtain corrected printing parameters, and the individual correction model is obtained by training correction behaviors, collected by the printing equipment, of the user on the cloud printing parameters under different environment parameters; and the printing equipment sets the corrected printing parameters as actual printing parameters of the printing equipment. According to the method, the printing parameters conforming to user preferences can be automatically configured, and the printing experience is improved.

The label printer comprises a host, a thermal transfer ribbon box and a flip cover, the host is provided with a thermal transfer ribbon box installation cavity with one open side, the thermal transfer ribbon box installation cavity is suitable for installing the thermal transfer ribbon box, and a first positioning structure is arranged in the thermal transfer ribbon box installation cavity; the thermal transfer ribbon box is mounted in the thermal transfer ribbon box mounting cavity, a second positioning structure is arranged on the thermal transfer ribbon box, and the second positioning structure and the first positioning structure are matched to enable the thermal transfer ribbon box to be positioned and mounted in the thermal transfer ribbon box mounting cavity; the flip cover is rotatably connected with the host and can open and close the open side of the thermal transfer ribbon box mounting cavity, a pressing piece is arranged on the flip cover, when the flip cover closes the thermal transfer ribbon box mounting cavity, the pressing piece abuts against the surface of the thermal transfer ribbon box so as to limit movement of the thermal transfer ribbon box in the open direction of the thermal transfer ribbon box mounting cavity, and when the flip cover opens the thermal transfer ribbon box mounting cavity, the pressing piece is separated from the thermal transfer ribbon box so as to limit movement of the thermal transfer ribbon box in the open direction of the thermal transfer ribbon box mounting cavity. According to the structure, stable installation of the thermal transfer ribbon box can be achieved, the thermal transfer ribbon box is prevented from moving up and down in the printing process, and the stability of the thermal transfer ribbon box in the printing process is improved.

The utility model discloses a heat transfer printing colored tape assembly for label printing, and relates to the technical field of label printing. Internal reinforcing ribs are arranged on the periphery of an inner cavity of a shaft core at equal intervals; a center rod is transversely arranged at the center of an inner cavity of the shaft core, a right connecting rod is arranged on the right side of the front end face of the inner cavity of the shaft core, a left connecting rod is arranged on the left side of the rear end face of the inner cavity of the shaft core, the right connecting rod and the left connecting rod are connected with the left side and the right side of the center rod respectively, and a flexible electric heating plate is arranged on the periphery of the center rod. A plurality of groups of internal reinforcing ribs are arranged in the inner cavity of the shaft core, and the internal reinforcing ribs are transversely arranged on the inner wall of the inner cavity of the shaft core at equal intervals, so that the structural strength of the shaft core can be improved, the service life of the shaft core can be prolonged, and the phenomena of deformation and damage are avoided; the inner cavity of the shaft core can be heated through the flexible electric heating plate, so that the shaft core can be heated from inside to outside, the preheating effect is achieved, and the effect of improving the working efficiency is achieved.

Methods of manufacturing semiconductor devices and corresponding semiconductor devices are disclosed. A semiconductor die is disposed on a region of laser direct structuring (LDS) material of a layered substrate. The semiconductor die has a front active area facing the layered substrate and a metallized back surface facing away from the layered substrate. An encapsulation of the LDS material on the layered substrate encapsulates the semiconductor die with the metallized back surface of the semiconductor die exposed at an outer surface of the encapsulation of the LDS material. Conductive wires and first vias are constructed in the region of the LDS material to electrically connect to the front active area of the semiconductor die. A thermally conductive layer in contact with the metallized back surface of the semiconductor die is plated on the outer surface of the encapsulation of the LDS material. A heat extractor body made of a thermally conductive material is coupled in thermal transfer relationship with the thermally conductive layer.

A cupholder temperature control system including a pressure sensor for detecting an object within a cupholder, a temperature sensor for detecting a current object temperature of the object, an optical sensor for capturing an image of the object, a processor to perform an image recognition algorithm to detect at least one of a logo, a bar code and a quick response code on the object, to determine the object is a beverage container in response to a detection of the at least one of the logo, the bar code and the quick response code, to generate a control signal in response to the current object temperature differing from an ambient temperature by a threshold amount and the object being a beverage container, and a heat transfer system configured to maintain the current object temperature of the object in response to the control signal.

The invention discloses a self-repairing radio frequency induction washing label thermal transfer ribbon based on a silver nanowire / polyurethane microcapsule composite structure, the thermal transfer ribbon is composed of a base film, a back coating layer and a thermal transfer printing layer, the back coating layer and the thermal transfer printing layer are respectively coated on two sides of the base film, and the thermal transfer printing layer is a gradient conductive-self-repairing ink layer. The composite material is mainly prepared from silver nanowires (the diameter is 25-30 nm, the length-diameter ratio is 500-800, and the resistivity is 1.5-2.0 * 10 omega.m) coated with polydopamine, polyurethane microcapsules, an epoxy acrylate prepolymer, carbon black and the like according to a specific proportion, wherein the silver nanowires (the diameter is 25-30 nm, the length-diameter ratio is 500-800, and the resistivity is 1.5-2.0 * 10 omega.m). Through the synergistic enhancement effect of the silver nanowires and the polyurethane microcapsules, the problems that a traditional thermal transfer ribbon is prone to being blurred and a conductive network is fractured during printing under repeated bending are solved, after the ink layer is bent for 1000 times, a printed pattern can still rapidly recover the initial integrity, high conductivity and environmental adaptability are achieved, and the thermal transfer ribbon can be widely applied to the field of thermal transfer printing. The method is suitable for flexible electronic identification systems of intelligent textiles and the like, and has good popularization and application values.

To enable implementation of a printing mode of performing printing with the same electric energy and at a high speed with respect to a first printing mode.SOLUTION: A thermoelectric printer performs printing by a thermal head and at least has: a first printing mode of performing printing with a first electric power; a second printing mode of performing printing with a second electric power larger than the first electric power and at a higher speed than the first printing mode; and a third printing mode of performing printing with the first electric power and at a higher speed than the first printing mode.SELECTED DRAWING: Figure 7