299 results about "Thermal transfer" patented technology

The utility model relates to an RFID (Radio Frequency Identification Device) printer for a single hang tag, which comprises a thermal transfer ribbon printer and an RFID reader-writer, a hang tag stacking and conveying device is arranged in a hang tag stacking area, a plurality of hang tags are stacked on a conveying surface of a conveying belt in the hang tag stacking and conveying device, and an RFID tag is embedded in each hang tag; the thermal transfer ribbon printing head can conduct online thermal transfer printing on passing hangtags through a walking thermal transfer ribbon, a hangtag one-by-one output device is arranged at the output end of the hangtag stacking and conveying device, and an RFID read-write antenna is installed in the hangtag printing area and located between the hangtag one-by-one output device and the thermal transfer ribbon printing head. And the RFID reader-writer can write data into the hang tags which pass one by one through the RFID read-write antenna. The system has the advantages that firstly, the printer can perform online printing and data entry on a single hang tag embedded with an RFID tag at the same time, the printer can ensure that the single hang tag is printed one by one and data is entered one by one, and the hang tag is not easy to be stuck; and thirdly, the printer can print hang tags with different thicknesses, and is good in printing applicability and convenient to adjust.

A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.

A method of fabricating a multiphase heat exchanger for thermal coupling to a heat source is provided. The method includes submerging a build plate having a deposition surface into an electrolyte, the deposition surface comprising at least one of an evaporator base, a condenser base, or a liquid-return base. A printhead comprising pixelated electrodes and electrode-array drivers is submerged proximate to the deposition surface. A subset of the pixelated electrodes is selectively activated to generate an ionic flow through the electrolyte between the electrode subset and a portion of the deposition surface, thereby electrochemically depositing wicking structures on the base surface. Any two adjacent wicking structures positioned on the evaporator base are spaced apart by an average pitch selected to maintain a heat-transfer fluid, in a liquid phase, in contact with the evaporator base during operation of the multiphase heat exchanger.

An electronic label for thermal transfer printing, characterized in that it comprises: a carrier material; a first ink layer, wherein one side of the first ink layer is connected to one side of the carrier material; a second ink layer, wherein one side of the second ink layer is connected to another side of the first ink layer, such that the first ink layer is located between the carrier material and the second ink layer; a third ink layer, wherein one side of the third ink layer is connected to the other side of the second ink layer, such that the second ink layer is located between the first ink layer and the third ink layer; an antenna layer, wherein one side of the antenna layer is connected to another side of the third ink layer, such that the third ink layer is located between the second ink layer and the antenna layer;and a chip, wherein one side of the chip is connected to another side of the antenna layer, such that the antenna layer is located between the third ink layer and the chip.;

The invention relates to a recording material for thermal dye sublimation printing, comprising a base paper (1) having a front side and a back side, at least one synthetic resin layer (4) located at least on the back side of the base paper (1), a dye receiving layer (2) arranged on the front side of the base paper (1), at least one plastic film (3) arranged between the base paper (1) and the dye receiving layer (2), and optionally a barrier layer arranged between the plastic film (3) and the dye receiving layer (2), wherein the synthetic resin layer (4) has an E modulus of at least 0.8 GPa.

The present invention relates to equipment for cooling an electronic component (21), comprising a thermally conductive substrate (23) seated on the one hand against the surface of said electronic component (21) and on the other hand against a heat transfer element which is connected to a cooling means, characterized in that the heat transfer element is constituted by a vapour chamber (16b) thermally connecting the electronic component (21) to the base of the heat sink and the fins (16a) thereof, which are immersed in a chamber (11) filled with a cooling liquid.

The invention relates to the technical field of printing equipment, and discloses a control method of thermal printing or thermal transfer printing equipment, a storage medium and a system, and the method comprises the steps that the printing equipment obtains model parameters of a printing medium; the printing equipment obtains environment parameters around the printing equipment; the printing equipment sends the model parameters to the cloud service platform; if the hit item of the model parameter exists in the cloud database of the cloud service platform, the cloud service platform returns a cloud printing parameter corresponding to the model parameter to the printing equipment; if the printing equipment receives the cloud printing parameters, the printing equipment inputs the cloud printing parameters and the environment parameters into an individual correction model to obtain corrected printing parameters, and the individual correction model is obtained by training correction behaviors, collected by the printing equipment, of the user on the cloud printing parameters under different environment parameters; and the printing equipment sets the corrected printing parameters as actual printing parameters of the printing equipment. According to the method, the printing parameters conforming to user preferences can be automatically configured, and the printing experience is improved.

The utility model discloses a heat transfer printing colored tape assembly for label printing, and relates to the technical field of label printing. Internal reinforcing ribs are arranged on the periphery of an inner cavity of a shaft core at equal intervals; a center rod is transversely arranged at the center of an inner cavity of the shaft core, a right connecting rod is arranged on the right side of the front end face of the inner cavity of the shaft core, a left connecting rod is arranged on the left side of the rear end face of the inner cavity of the shaft core, the right connecting rod and the left connecting rod are connected with the left side and the right side of the center rod respectively, and a flexible electric heating plate is arranged on the periphery of the center rod. A plurality of groups of internal reinforcing ribs are arranged in the inner cavity of the shaft core, and the internal reinforcing ribs are transversely arranged on the inner wall of the inner cavity of the shaft core at equal intervals, so that the structural strength of the shaft core can be improved, the service life of the shaft core can be prolonged, and the phenomena of deformation and damage are avoided; the inner cavity of the shaft core can be heated through the flexible electric heating plate, so that the shaft core can be heated from inside to outside, the preheating effect is achieved, and the effect of improving the working efficiency is achieved.

Methods of manufacturing semiconductor devices and corresponding semiconductor devices are disclosed. A semiconductor die is disposed on a region of laser direct structuring (LDS) material of a layered substrate. The semiconductor die has a front active area facing the layered substrate and a metallized back surface facing away from the layered substrate. An encapsulation of the LDS material on the layered substrate encapsulates the semiconductor die with the metallized back surface of the semiconductor die exposed at an outer surface of the encapsulation of the LDS material. Conductive wires and first vias are constructed in the region of the LDS material to electrically connect to the front active area of the semiconductor die. A thermally conductive layer in contact with the metallized back surface of the semiconductor die is plated on the outer surface of the encapsulation of the LDS material. A heat extractor body made of a thermally conductive material is coupled in thermal transfer relationship with the thermally conductive layer.

A cupholder temperature control system including a pressure sensor for detecting an object within a cupholder, a temperature sensor for detecting a current object temperature of the object, an optical sensor for capturing an image of the object, a processor to perform an image recognition algorithm to detect at least one of a logo, a bar code and a quick response code on the object, to determine the object is a beverage container in response to a detection of the at least one of the logo, the bar code and the quick response code, to generate a control signal in response to the current object temperature differing from an ambient temperature by a threshold amount and the object being a beverage container, and a heat transfer system configured to maintain the current object temperature of the object in response to the control signal.

The invention discloses a self-repairing radio frequency induction washing label thermal transfer ribbon based on a silver nanowire / polyurethane microcapsule composite structure, the thermal transfer ribbon is composed of a base film, a back coating layer and a thermal transfer printing layer, the back coating layer and the thermal transfer printing layer are respectively coated on two sides of the base film, and the thermal transfer printing layer is a gradient conductive-self-repairing ink layer. The composite material is mainly prepared from silver nanowires (the diameter is 25-30 nm, the length-diameter ratio is 500-800, and the resistivity is 1.5-2.0 * 10 omega.m) coated with polydopamine, polyurethane microcapsules, an epoxy acrylate prepolymer, carbon black and the like according to a specific proportion, wherein the silver nanowires (the diameter is 25-30 nm, the length-diameter ratio is 500-800, and the resistivity is 1.5-2.0 * 10 omega.m). Through the synergistic enhancement effect of the silver nanowires and the polyurethane microcapsules, the problems that a traditional thermal transfer ribbon is prone to being blurred and a conductive network is fractured during printing under repeated bending are solved, after the ink layer is bent for 1000 times, a printed pattern can still rapidly recover the initial integrity, high conductivity and environmental adaptability are achieved, and the thermal transfer ribbon can be widely applied to the field of thermal transfer printing. The method is suitable for flexible electronic identification systems of intelligent textiles and the like, and has good popularization and application values.

A substrate support assembly includes: a clamp comprising one or more plates; a cooling plate or facility plate attached to a bottom surface of the clamp, the cooling plate or facility plate including a groove on a top surface of the cooling plate or facility plate, wherein the groove extends along a periphery of the cooling plate or facility plate; an O-ring disposed in the groove; and a spacer disposed in the groove, wherein the spacer forms an airtight seal between the clamp and the O-ring, wherein the spacer comprises a first metal alloy.

The utility model discloses an anti-scald printer, and relates to the technical field of printers. A printing opening is formed in a printer main body, a printing head module is movably arranged on the printer main body and comprises a printing head, a driving module is arranged on the printer main body, and the driving module is in transmission connection with the printing head module; when printing is needed, the driving module drives the printing head module to move to the lifting position, at the moment, the printing head is exposed out of the printing opening, the printing head can heat a thermal transfer ribbon to achieve printing, printing paper can shield the printing head, and a user can be prevented from being scalded; the driving module can drive the printing head module to move to the putting-down position, at the moment, the printing head module is located in the printer body, namely, the printing head retracts into the printer body, a user can be prevented from being scalded when taking printing paper, and the risk that the user is scalded can be reduced.

The utility model discloses a liquid crystal display screen and a tablet personal computer capable of preventing the touch screen from being hot, the liquid crystal display screen capable of preventing the touch screen from being hot comprises a backlight module, a display module, the touch screen and a cover plate, the backlight module comprises a lower iron frame, the lower iron frame extends outwards to form an iron stand ear, a PCB is fixed on the upper surface of the iron stand ear, and the touch screen is fixed on the PCB. At least one heating component is fixed on the PCB; the display module is arranged above the backlight module; the touch screen is arranged above the display module, and a cooling fin is arranged on the lower surface of the touch screen at the PCB; and the cover plate is arranged above the touch screen. Due to the fact that the cooling fins are arranged on the lower surface of the touch screen located on the PCB, heat emitted by the PCB firstly passes through the cooling fins when being transmitted upwards, the cooling fins can enhance the heat transmission efficiency, the rapid heat dissipation effect is achieved, local heating and hot burning of the touch screen and the cover plate are avoided, it is guaranteed that the temperature is normal when a hand touches the cover plate, and the service life of the touch screen is prolonged. And the heat influence of the heating circuit is reduced, so that the phenomenon of local heating and hot is solved.

Hot press (10), characterized in that it comprises a housing (100) and a printed circuit board (200), a thermal insulation layer (300) and a heating plate assembly (400) which are provided from top to bottom within the housing (100), wherein the printed circuit board (200) is electrically connected to the heating plate assembly (400), wherein the heating plate assembly (400) is used to generate the heat required for thermal transfer printing, wherein a heating surface of the heating plate assembly (400) is exposed to the housing (100), and that the hot press (10) further comprises a limiting element (500) which is provided between the printed circuit board (200) and the thermal insulation layer (300), such that the printed circuit board (200) and the thermal insulation layer (300) are spaced apart from each other.

Typically, electric power sources, such as batteries and fuel cells, require cooling to temperatures near or below ambient temperature for safe and efficient operation. Traditional cooling systems are not be able or practical to cool the components to the required temperatures, due to the lack of temperature differential between the required cooling temperature and the ambient temperature, which drives the heat transfer. Disclosed embodiments optimize the efficiency of a cooling system based on ambient conditions. In particular, embodiments determine input parameters from one or more sensed parameters, such as ambient temperature and ambient pressure, and utilize these input parameters in a process that maximizes the operation of cooling units in the most efficient mode.

Described herein are methods of operating ECAM systems comprising modular cartridge assemblies. A modular cartridge assembly comprises a base, a cover, an ECAM printhead, a support unit, and a control board. The base has an opening providing access to the support unit (e.g., for heat transfer and fluidic connections), which is sealed against the base around this opening. The cover also has an opening exposing the electrode array of the ECAM printhead. The ECAM printhead is also sealed against the cover around this opening. The control board selectively activates the electrode of the array and is positioned within a cavity formed by the base and cover. The modular cartridge assembly allows replacing the ECAM printhead when the electrode array is damaged (e.g., dissolved during the ECAM process), while other assembly components can be reused. Furthermore, the support unit provides alignment and heat transfer for the ECAM printhead.

This application relates to the integration of microdevices into a system substrate. In the microdevice integration process, a donor substrate is provided, on which initial fabrication and pixellation steps will be performed to define microdevices, which include a functional layer, such as a light-emitting layer, sandwiched between a top conductive layer and a bottom conductive layer. The microdevices are then transferred to a system substrate for finalization and electronic control integration. The transfer can be facilitated in various ways, including providing a continuous light-emitting functional layer, breakable anchors on the donor substrate, a temporary intermediate substrate that enables thermal transfer techniques, or a temporary intermediate substrate with a breakable substrate bonding layer.

A heat transfer device includes a hollow spacer between opposed substrates, defining an enclosure, at least one of the substrates adapted to be secured to at least one heat source. A non-permeable barrier is in the enclosure between the substrates. A first chamber inside the enclosure is defined by the spacer, the substrates, and the barrier, the first chamber in fluid communication with at least one first inlet and first outlet. A second chamber inside the enclosure and outside the first chamber and is defined by the spacer, the substrates, and the barrier, the second chamber in fluid communication with at least one second outlet. A wick structure is secured to at least one substrate, a first portion of the wick structure in the first chamber, and a second portion of the wick structure in the second chamber and interconnecting in passive liquid communication with the first portion.

The invention relates to the technical field of printers, and particularly discloses a printer core and a printer.The printer core comprises a rack, a printing head module, a cam, a first elastic part and a pushing mechanism, the printing head module is movably arranged on the rack, the cam is rotationally arranged on the rack, and the first elastic part is connected with the rack and the printing head module; the printing head module abuts against the outer edge face of the cam, the pushing mechanism is connected with the cam, and the pushing mechanism is configured to push the cam to rotate, so that a printing head in the printing head module is close to or away from the printing roller; according to the scheme, the cam is pushed to rotate through the pushing mechanism, the printing head can be made to be close to the printing roller, the pressure between the printing head and the printing roller is increased, the contact between the printing medium and the thermal transfer ribbon is more sufficient through the large pressure, and the surface of the printing medium can be more evenly covered with powdered ink; and the problem of blurred printing or infirm adhesion of powdered ink caused by insufficient pressure is avoided, so that the printing quality is ensured.

Hot press (10), characterized in that it comprises the following: an outer housing (100) comprising a housing body (110) and a handle (120) connected to each other, wherein the housing body (110) comprises an upper housing (111) and a lower housing (112), wherein the upper housing (111) has a recessed section (113) extending in a direction towards the lower housing (112), wherein the handle (120) is provided above the recessed section (113); a heating plate assembly (200) connected to the lower housing (112), wherein the heating plate assembly (200) is used to generate the heat required for thermal transfer printing; a support element (300) which is connected to the recess section (113) and the lower housing (112).

The application provides an RFID anti-metal electronic tag and a preparation method thereof, which comprises a plastic base plate, a plastic cover plate, an RFID electronic tag and a thermal transfer paper, wherein: a first end surface of the plastic base plate is sequentially and spacedly provided with a first groove and a second groove from inside to outside, the RFID electronic tag is embedded in the first groove, the second groove is filled with glue, and the plastic cover plate is covered with the first end surface of the plastic base plate through the glue; and the second end surface of the plastic base plate is provided with the thermal transfer paper. The application can keep the surface of the thermal transfer paper flat when the RFID electronic tag is naturally bent, can avoid the problem of the pressing crease caused by the sudden change and the gap due to the insufficient glue, and can realize the anti-displacement of the electronic tag and the thermal expansion and cold shrinkage buffer, thereby improving the surface flatness and stability of the RFID anti-metal electronic tag.

An electronic package is provided. The electronic package comprises an electronic component, a substrate, a ground plane, a thermally conductive pathway and at least one thermally conductive member. The ground plane is enclosed in or supported by the substrate. The electronic component includes a non-groundable thermal output and is mounted to the substrate. The thermally conductive pathway extends within the substrate between an interface exposed on a surface of the substrate and the ground plane. The thermally conductive pathway is configured to electrically isolate the interface from the ground plane. The thermally conductive member couples the output to the interface. An electronic device comprising such an electronic package is also provided.

The utility model discloses a multi-dimensional constant-temperature control system of a high-power digital optical image processor. The multi-dimensional constant-temperature control system comprises a circulating water system, a heat dissipation assembly and a processor module, the circulating water system is used for providing cooling water for the heat dissipation assembly; the heat dissipation assembly comprises a first refrigeration sheet, a second refrigeration sheet, a first liquid cooling plate and a second liquid cooling plate. The first refrigeration sheet is arranged on the front side or the back side of the processor module, the second refrigeration sheet is arranged on the outer side of the processor module in a sleeving mode, the first liquid cooling plate is arranged on the outer side of the first refrigeration sheet, and the second liquid cooling plate is arranged on the outer side of the second refrigeration sheet in a sleeving mode; at least five surfaces of the processor module are cooled through the first refrigeration sheet and the second refrigeration sheet, heat transfer is carried out through the first liquid cooling plate and the second liquid cooling plate, the effect of rapidly cooling the processor module is achieved, the heat transfer efficiency can be improved by adding the heat conduction layer between the liquid cooling plates and the refrigeration sheets, and the service life of the processor module is prolonged. The cooling effect is improved.

A substrate support assembly includes a shaft and a base disposed on the shaft. The susceptor is configured to support a substrate in a processing chamber during a substrate processing operation. The substrate support assembly includes a cooling feature configured to cool the susceptor at a cooling rate of greater than 2 degrees Celsius per minute after the substrate processing operation.

To provide a heat-pressing machine capable of appropriately performing a thermal transfer process. A heat-pressing machine includes: a base member on which a transfer object and a thermal transfer sheet are placed, a rotating member that is attached to the base member via a rotating shaft, and a pressing member that rotates together with the rotating member to press the base member. The base member includes a base body and a placement plate movably attached to the base body. The pressing member includes a pressing body movably attached to the rotating member, and a heater unit. When the rotating member rotates relative to the base member, the pressing member presses the base member while the heater unit faces the placement plate. The placement plate and the pressing body are movable so that a placement surface of the placement plate and a heater surface of the heater unit are aligned.

We provide a heat transfer sheet with excellent durability and heat resistance. [Solution] A heat transfer sheet comprising a base material and a transfer layer, wherein the transfer layer comprises a colorant layer, and the colorant layer comprises a colorant and a resin component that forms urethane bonds by heating and hardens by ultraviolet irradiation, or an acrylic resin containing acryloyl groups and carboxyl groups that forms ester bonds by heat curing, wherein the ultraviolet transmittance of the transfer layer at a wavelength of 365 nm and the ultraviolet transmittance at a wavelength of 395 nm are 20% or more.

The invention relates to a thermal management system in an electronic device. Specifically, the systems described herein provide a microfluidic channel between a first die and a second die that acts as an insulating layer between the first die and the second die to prevent heat transfer between the two dies. The system described herein also provides a first inlet for a first die configured to receive a first working fluid at a first temperature; and a second inlet for a second die configured to receive a second working fluid at a second temperature to provide heterogeneous cooling for each die in the integrated chip package.

The utility model belongs to the technical field of biological reagent detection, and particularly relates to biological reagent detection equipment. The utility model provides biological reagent detection equipment and aims to solve the problem of low temperature control efficiency of biological reagent detection equipment in the prior art. Biological reagent detection equipment comprises a reagent loading assembly used for loading a thin film chip with a built-in reagent; the temperature control assembly is used for heating or cooling the reagent; the light analysis component is used for analyzing light emitted by the reagent; and the optical assembly is used for guiding the light emitted by the reagent to the light analysis unit. The reagent loading assembly is used for loading the thin film chip with the reagent inside, and the thin film chip is thin and high in heat exchange efficiency, so that the biological reagent detection equipment is high in temperature control efficiency, the thin film chip is low in heat transfer loss, and the temperature increasing and decreasing speed is high.

The present application provides an acrylic water-soluble pattern film, which comprises a printing carrier layer, a pattern layer and a pattern protection layer in sequence; the carrier layer is a gel reversible polyvinyl alcohol film; and the pattern layer is printed by a pattern layer slurry. The acrylic water-soluble pattern film solves the problems existing in the current water printing technology, the current'skin' technology and the thermal transfer printing technology, and can be widely applied to various camouflage patterns on large military instruments in the military industry and has excellent water resistance and adhesion. The solvent used is water (deionized water). Moreover, it is used at room temperature, naturally dried, and has no pollution and carbon emission in the application process. The present application also provides a preparation method and application of the acrylic water-soluble pattern film.