1211 results about "Thermal transfer" patented technology

The invention relates to the technical field of chip testing, and provides a chip temperature characteristic testing method, system and equipment, and the method comprises the steps: obtaining transient thermal response data and steady-state thermal distribution data of a chip, carrying out the feature extraction of the transient thermal response data, obtaining a feature thermal mode set, and carrying out the feature extraction of the feature thermal mode set; performing heat transfer analysis on the steady-state heat distribution data by utilizing the characteristic heat mode set to obtain a long-term temperature drift curve; and evaluating the long-term temperature drift curve to obtain a thermal reliability score and a thermal degradation prediction parameter, and generating life prediction data of the chip based on the thermal reliability score and the thermal degradation prediction parameter. By combining the analysis of transient thermal response data and steady-state thermal distribution data, the accuracy and reliability of temperature characteristic test are improved, and the problem that the traditional method is difficult to accurately capture the transient change characteristic of the chip temperature and identify the long-term temperature drift trend under a dynamic working condition or a complex load condition, and the test accuracy is insufficient is solved.

The invention discloses an electromechanical composite transmission IGBT junction temperature prediction method based on a NODE reduced-order model. A thermal simulation model is constructed according to a real physical model mechanism, a material and a thermal transfer principle of an IGBT; in the constructed thermal simulation model, performing simulation calculation according to the monitored time sequence data to obtain the junction temperature of the IGBT corresponding to the time change, jointly establishing a data set for training and testing with the monitored data, establishing a NODE neural network order reduction model comprising an input layer, a hidden layer and an output layer, and training the NODE neural network order reduction model by using the data set; and inputting the IGBT related time sequence data into the constructed NODE neural network reduced-order model for prediction to obtain the time sequence data of the junction temperature. According to the method, the IGBT junction temperature can be predicted in real time, the calculation efficiency is high, the interpretability is high, the long-term dependence problem can be better solved, and the method is suitable for complex working conditions.

The invention discloses a modeling and optimizing method for a thermal resistance network of a high-power semiconductor module. The method is based on an electricity-heat-fluid field dynamic coupling simulation technology, the turbulence state is judged through Reynolds numbers, and the enhancement effect of fluid flow on heat transfer is quantified in combination with a standard k-epsilon model and a Navier-Stokes equation; a module thermal resistance curve is extracted through transient simulation, thermal resistance parameters are fitted through a high-order Foster model, a thermal resistance network model containing self-heating impedance and coupling thermal impedance is constructed, and matrix representation of temperature distribution in a multi-chip heat source coupling scene is achieved. Loss parameters are further corrected through iteration in combination with experimental data. Experimental results show that the model has high precision in the aspect of junction temperature prediction, and the calculation efficiency is remarkably improved compared with a traditional finite element method. The invention provides a high-precision and low-complexity solution for the thermal management design of the high-power semiconductor module, and can be widely applied to the fields of new energy automobile electric control systems and high-density power electronic equipment.

The disclosure describes a screen window liquid metal pad disposed between two opposing elements of an electronic device so as to provide a thermal pathway for an efficient heat transfer from one element to the other, comprising: a screen window and a liquid metal, wherein the screen window includes a frame with a window and a thermal conductive mesh; wherein the frame includes a top piece and a bottom piece, a peripheral portion of the thermal conductive mesh is fixed between the top and bottom pieces through an adhesive and the remaining portion forms a window screen covering the window of the frame; and wherein the liquid metal fills in and covers at least part of a middle portion of the window screen.

The invention relates to the field of process optimization, in particular to a steelmaking process optimization method and system based on a digital twin model. A steelmaking process optimization system based on a digital twin model comprises a converter digital twin model construction module, a physical parameter adjustment module, a converter wear model construction module and a steelmaking process optimization module. By establishing the high-precision converter digital twinning model, heat transfer, flow field change and chemical reaction in the steelmaking process can be accurately described, a physical rule basis is provided for analogue simulation, and then component information of input materials and converter process parameters are optimized and adjusted by utilizing analogue simulation, so that the converter process parameters are optimized and adjusted, and the converter process parameters are optimized and adjusted. During the period, the flame image is used as a process quality evaluation index, so that the accuracy and efficiency of the steelmaking process are remarkably improved, and the dependence on experience of operators is reduced.

Methods and apparatuses for drying and charging electronic devices are disclosed. An exemplary method comprises: generating a first air flow, using a first pressure-generating device, through a first air path connecting a drying chamber, the first pressure-generating device, a first heat sink, and a moisture-collecting device; activating a thermoelectric system thermally connected to a thermal transfer device, wherein the thermoelectric system has a first polarity; generating a second air flow, using a second pressure-generating device, through a second air path connecting the second pressure-generating device and a second heat sink; generating an electrical current, by engaging the portable electronic device and a power source; generating a third air flow, using the first pressure-generating device, through the first air path; activating the thermoelectric system, wherein the thermoelectric system has a second polarity; and generating a fourth air flow, using the second pressure-generating device, through the second air path.

The invention discloses a method for controlling multi-color printing of a thermal transfer printer. The method comprises the following steps: visually editing and typesetting, displaying a separated preview page according to preset color layer decomposition parameters, performing color separation processing on an original design page according to the preset color layer decomposition parameters, and supporting synchronous printing, asynchronous printing and cross-medium printing. An original design page is decomposed into single-color printing instruction sequences according to color layers through a color separation processing module. Based on the medium position real-time tracking technology, the main control circuit board dynamically coordinates all the single-color printing units to execute color separation printing when the medium moves to the corresponding position, and three modes of same-medium multi-color synchronous printing, asynchronous printing and cross-medium parallel printing are supported. The problems that a traditional heat transfer printing machine is low in multi-color overprinting precision and poor in efficiency are solved, and the flexibility and production efficiency of color mark printing are remarkably improved.

The invention relates to the technical field of data simulation processing, in particular to a thermal simulation method and system for a circuit board and a medium. The method comprises the following steps: acquiring circuit board layer data; extracting board layer material thermal resistance parameters of the circuit board layer data, wherein the board layer material thermal resistance parameters comprise copper foil thermal resistance parameters and insulating medium thermal resistance parameters; identifying the layered structure of the circuit board layer data, and recording as layered structure data; component layout characteristics are determined according to the layered structure data, interlayer thermal resistance distribution calculation is carried out on the board layer material thermal resistance parameters based on the component layout characteristics, and layered structure thermal resistance distribution data are generated. Through a data processing technology and an analogue simulation technology, heat transfer interaction analysis is carried out on the copper foil layer and the insulating medium layer of the circuit board, and the heat transfer direction and the heat accumulation effect of the circuit board are evaluated so as to construct a heat simulation model of the circuit board.

The invention discloses a relief touch heat transfer film and a preparation process thereof, and relates to the technical field of transfer film preparation, the heat transfer film comprises the following structural layers from bottom to top: a substrate layer, which is composed of a polyester film PET; the release layer is positioned above the base material layer and is composed of modified silicone oil, and nano silicon dioxide particles are added into the modified silicone oil; the transfer printing layer is positioned above the release layer and comprises a pattern layer and an embossment texture layer; according to the scheme, a spring pressing plate-sand grain grinding bin is additionally arranged at the front printing section of the heat transfer printing film preparation process, the film surface penetrates through a sand layer in the bin along a guide plate and a guide shaft with constant tension, micron-sized grooves are formed in the film surface through sand grains in a ploughing mode, and high-frequency polarization coarsening of corona discharge is replaced; the spring pressing plate is automatically pressed down along with the fluctuation of the film thickness, the sand layer is kept compact, the depth of the grooves is consistent, the water-based ink is spread and cured along the grooves during subsequent water-based ink printing, mechanical locking is formed, the ink is prevented from being pulled up during embossment embossing, and corona-free and ozone-free film surface coarsening is achieved.

The invention relates to a thermal transfer printing head with a semiconductor chilling plate and a thermal transfer printer, the thermal transfer printing head comprises a printing head body and a printing head back plate, and one side face of the printing head back plate is provided with an assembly through groove in the length direction of the printing head back plate; a limiting through groove extending in the length direction of the printing head back plate is formed in the groove bottom of the assembling through groove, a copper pipe is embedded in the limiting through groove, and the copper pipe is provided with a contact face flush with the groove bottom of the assembling through groove. An assembling through groove is formed in the printing head back plate, a plurality of semiconductor chilling plates are arranged in the assembling through groove, the printing head body is installed on one side face of the printing head back plate and fixedly connected with the printing head back plate, and the printing head body covers the assembling through groove and makes contact with the semiconductor chilling plates. The thermal transfer printing head with the semiconductor chilling plate has the advantages that high-precision linear adjustment of the temperature can be achieved, and inertia-free rapid adjustment can be achieved.

The invention relates to the technical field of preparation of heat transfer films, in particular to a preparation process of a UV process heat transfer film, which comprises the following steps: base film selection, base film surface treatment, release agent selection, release agent coating, UV paint coating, bridging agent selection, printing, photocuring and film stripping: stripping the photocured transfer film from the base film to form the final UV heat transfer film. According to the UV heat transfer film prepared by the process, the adhesive force of the pattern layer and the UV coating layer is better, the compactness is higher, the product quality is improved, and the service life of the UV heat transfer film is prolonged; in addition, the efficiency is improved more quickly during curing, the residual adhesive rate is low after demolding and stripping, and the product quality is further improved.

The invention discloses a multi-physics coupling modeling method based on nanosecond laser etching microgroove resistance reduction simulation, relates to the technical field of laser processing, and is used for solving the problem of optimization of a microgroove resistance reduction effect in a laser etching process. According to the method, the drag reduction effect of the microgroove in the laser etching process is simulated by establishing a coupling model of a plurality of physical fields such as heat transfer, fluid dynamics and material removal. Specifically, an adaptive grid technology is adopted to accurately calculate a temperature field and a flow field in an etching process, and meanwhile, a pulse laser equivalent processing method is introduced to model influences of different scanning times and laser power, so that etching process parameters are optimized. According to the method, the drag reduction effect under different parameters can be efficiently predicted, a theoretical basis is provided for microgroove design and laser etching process optimization, and the method has a wide application prospect.

The invention relates to a heat transfer printing receiving sheet and a preparation method thereof, and belongs to the technical field of soft label printing. The heat transfer printing receiving piece comprises a printing layer, a heat insulation layer, a base material and a back coating layer which are sequentially arranged from top to bottom. The back coating is prepared from the following raw materials in parts by weight: 13 to 16 parts of first resin, 2 to 3 parts of filler, 0.1 to 0.5 part of polyethylene glycol and 0.01 to 0.05 part of lithium chloride; the heat insulation layer comprises the following raw materials in parts by weight: 9-11 parts of an adhesive and 4-7 parts of hollow particles; the printing layer is prepared from the following raw materials in parts by weight: 19 to 22 parts of second resin, 0.1 to 1 part of aromatic hydrocarbon modified polysiloxane, 0.1 to 1 part of polyethylene glycol and 0.1 to 1 part of polyisocyanate curing agent. The invention also discloses a preparation method of the thermal transfer receiving sheet, and the thermal transfer receiving sheet can prevent thermal fusion between the thermal transfer sheet and the thermal sublimation ribbon even under the condition of high printing speed, is good in demolding property with the thermal sublimation ribbon, is aging-resistant, and can improve the optical density of a printed image.

The electronic device includes a display including a first area and a second area, a first housing configured to support the first area and to form a first space, a second housing configured to support the second area and to form a second space, a hinge structure configured to foldably connect the first housing and the second housing based on a folding axis to be in a first state in which the first and second areas form substantially a same plane or in a second state in which the first and second areas face each other, and a heat transfer member provided to extend from the first space to the second space through the hinge structure and configured to perform a heat transfer between the first space and the second space.

The invention relates to the field of electrochemical energy storage, and discloses a vanadium redox flow battery stack optimization and performance prediction method, which comprises the following steps: constructing a high-precision reaction kinetic model, and accurately describing the kinetic behavior of an electrode reaction based on a multi-step reaction mechanism, a surface adsorption-desorption process and heterogeneous surface reaction distribution; based on the output of the reaction kinetic model, constructing a multi-physical field coupling model, including ion mass transfer, fluid dynamics and heat transfer models, to cooperatively simulate the ion concentration, fluid flow and temperature field distribution in the galvanic pile; and based on the state variables of the multi-physics field coupling model, constructing a dynamic prediction model of chemical reaction-heat-fluid coupling, and predicting the future performance of the galvanic pile in real time through a long and short term memory network model. According to the method, the energy efficiency, the power density and the service life of the vanadium redox flow battery can be improved, and support is provided for intelligent management and optimization of the vanadium redox flow battery.

Some implementations described herein provide a shutter disc for use during a conditioning process within a processing chamber of a deposition tool. The shutter disc described herein includes a material having a wave-shaped section to reduce heat transfer to the shutter disc and to provide relief from thermal stresses. Furthermore, the shutter disc includes a deposition of a thin-film material on a backside of the shutter disc, where a diameter of the shutter disc causes a spacing between an inner edge of the thin-film material and an outer edge of a substrate support component. The spacing prevents an accumulation of material between the thin film material and the substrate support component, reduces tilting of the shutter disc due to a placement error, and reduces heat transfer to the shutter disc.

1. The name of the design product: heat transfer printer. 2. The use of the design product: the design product is used for printing products, such as printing identification products. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: design 1 perspective view. 5. Design 1 is designated as the basic design.

An image capture device is disclosed that includes: a body; first and second image capture devices supported within the body so as to define respective, overlapping first and second fields-of-view; and a thermal spreader. The first image capture device includes a first integrated sensor-lens assembly (ISLA) with a first image sensor and a first lens, and the second image capture device includes a second ISLA with a second image sensor and a second lens. The first lens faces in a first direction, and is positioned to receive and direct light onto the first image sensor, and the second lens faces in a second direction, and is positioned to receive and direct light onto the second image sensor, wherein the second direction is generally opposite to the first direction. The thermal spreader extends between, and is connected to, the first and second ISLAs, and is configured to transfer heat therebetween.

The invention relates to the field of ink, in particular to bio-based elastomer heat transfer printing ink and a low-temperature microwave curing method thereof. The bio-based elastomer heat transfer printing ink at least comprises the following raw materials in parts by mass: 50-75 parts of a bio-based prepolymer, 5-10 parts of a cross-linking agent, 15-30 parts of an anti-pinhole agent, 0.5-1.5 parts of a curing catalyst, 5-15 parts of a pigment and 15-30 parts of a solvent. The bio-based elastomer thermal transfer printing ink finally prepared by the invention not only has an excellent transfer printing effect, but also can greatly improve the bio-based carbon content in the printing ink, and avoids the problems of environmental pollution and discontinuity; and on the other hand, compared with the traditional petroleum-based TPU ink, the required energy consumption is lower, the flexibility and the washability are also obviously improved, the pinhole defect is reduced, and the probability of secondary printing blooming caused by solvent migration is greatly reduced.

The utility model belongs to the technical field of thermal transfer printing, and discloses a thermal transfer printer. The thermal transfer printer comprises two reels, a printing mechanism, a first driving assembly, a bearing frame and a guiding assembly, the two reels can rotate around the axes of the reels, a colored tape is wound on one reel, the free end of the colored tape is fixed to the other reel, the printing mechanism comprises a first installation part and a wide printing assembly, and the wide printing assembly is arranged on the first installation part. The wide-width printing assembly extends in the Y-axis direction and is movably arranged on a first mounting part in the Z-axis direction, the first mounting part is connected with a first driving assembly, the first driving assembly is configured to drive the printing mechanism to move in the X-axis direction, the bearing frame comprises two bearing plates arranged in the Y-axis direction, and guide assemblies are arranged on the bearing plates; the two ends of the first mounting part are correspondingly arranged on the upper side faces of the two bearing plates in a sliding mode through guide assemblies, and the guide assemblies can provide guidance for movement of the printing mechanism in the X-axis direction.

Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

The utility model discloses a wear-resistant heat transfer lettering film, which belongs to the field of film technology, and sequentially comprises a release film layer one, a light-transmitting connecting layer, an adhesive layer one, a supporting layer, a hot melt adhesive layer and a release film layer two, wherein a printing layer is provided on the side of the light-transmitting connecting layer facing the adhesive layer, the supporting layer is formed with a plurality of air ducts perpendicular to the thickness direction of the lettering film, the supporting layer is formed with a plurality of ventilation ports consistent with the thickness direction of the lettering film, the ventilation ports are connected to the air ducts, and the hot melt adhesive layer is provided along the edge of the ventilation ports. With the wear-resistant heat transfer lettering film of the utility model, when the surrounding air flows, the lettering film will absorb air through the clothing, thereby accelerating the ventilation effect there, reducing the airtight effect at the place where the lettering film blocks, and ensuring comfort.

The invention provides a circuit board, a layout optimization method and device thereof and prefabricated vegetable quick-freezing refrigeration equipment, and relates to the technical field of computers.The layout optimization method of the circuit board comprises the steps that grid division is conducted on the circuit board based on a finite difference method, and a temperature field model of a heat transfer equation containing a plurality of position nodes is established; taking the temperature data of all electronic components on the circuit board in the temperature field model as an objective function of layout optimization; and performing iterative optimization on the target function by using a simulated annealing algorithm, and outputting a corresponding electronic component layout and a temperature condition of the electronic component layout. The problems of inaccurate temperature field modeling, insufficient vibration heat source quantization and lack of local hot spot optimization in a traditional method are solved, and the method has the advantages of improving the temperature field modeling precision and optimizing the heat management effect in the vibration environment, so that the stability and durability of a circuit board are improved, and efficient operation of quick-freezing refrigeration equipment is ensured.

The invention discloses a standard modular energy storage thermal runaway early warning method and system based on digital twinning, and relates to the technical field of energy storage system safety monitoring. The method comprises the following steps: deploying multiple types of sensors in an energy storage unit to form a network, and collecting multi-dimensional data such as temperature, voltage and gas concentration; transmitting the data to the digital twin platform, and performing format conversion on the data for thermal runaway prediction; the platform is combined with the LSTM-GBDT hybrid model through physical modeling, and the risk probability is output; and comparing the risk threshold to trigger early warning. The system comprises a sensing module, a data acquisition and transmission module, a digital twinborn prediction module and an early warning execution module. According to the method, physical simulation and historical data training are fused through the digital twin platform, the heat transfer and out-of-control propagation process can be accurately simulated, virtual simulation optimization is supported, the early warning accuracy and reliability are improved, and the operation and maintenance burden and accident potential are reduced.

The invention relates to the technical field of compressive strength detection of thermal transfer printing films for pens, in particular to a compressive strength detection device for production of thermal transfer printing films for pens, which comprises a mounting box, a mounting frame, a multi-stage hydraulic cylinder, a connecting plate, a pressure sensor I and the like, and is characterized in that the mounting frame is connected to the mounting box, and the multi-stage hydraulic cylinder is mounted on the mounting frame; a connecting plate is connected to the lower end of a telescopic rod of the multi-stage hydraulic cylinder, and a first pressure sensor is installed at the bottom of the connecting plate. The thermal transfer film for the pen can be pressed through the pressing plate, the compressive strength of the thermal transfer film for the pen is detected, the thermal transfer film for the pen can be supported through the supporting plate, the thermal transfer film for the pen does not need to be manually supported and flattened by a worker, the detection efficiency can be improved, the thermal transfer film for the pen can be smoother, and the working efficiency is improved. The problems of uneven tension distribution and inconsistent pre-stretching degree of the thermal transfer film for the pen are avoided, and the accuracy of a detection result is improved.

The present invention discloses a grinding wheel containing linear cooling channels and a double-wire 3D printing preparation method thereof, wherein the grinding wheel is composed of a working layer and a metal matrix, a plurality of linear cooling channels are evenly distributed on the surface of the working layer in the circumferential direction, the width of the linear cooling channels is 1 to 5 mm, and the spacing between any two adjacent linear cooling channels is 1 to 10 mm; the working layer is composed of an alloy matrix and abrasive particles, and the abrasive particles are selected from diamond particles or CBN particles. The present invention adopts double-wire 3D printing technology to accurately print out the designed miniature linear cooling channels, ensure the uniformity of powder distribution in the diamond or CBN grinding wheel of the linear cooling channel, and the linear cooling channels can not only improve the chip removal efficiency, but also cut off the heat transfer route when the grinding wheel is working to reduce the thermal damage to the diamond, improve the temperature field of the working layer and the workpiece interface, and improve the service life of the grinding wheel and the processing quality of the workpiece surface.

A thermal transfer sheet includes a substrate and a transfer layer, in which the transfer layer after transfer has a reduced peak height (Spk) of 0.6 μm or more. A method for producing a printed material using a thermal transfer sheet including a particle layer disposed on a substrate and an image-receiving sheet including a thermal protrusion-and / or-recess forming layer and a receiving layer stacked in that order on a second substrate, the receiving layer including an image that has been formed, includes the steps of heating the image-receiving sheet to form a protrusion and / or a recess at the image-receiving sheet, and heating the thermal transfer sheet to transfer the particle layer to at least part of the protrusion of the image-receiving sheet.

The utility model relates to an RFID (Radio Frequency Identification Device) printer for a single hang tag, which comprises a thermal transfer ribbon printer and an RFID reader-writer, a hang tag stacking and conveying device is arranged in a hang tag stacking area, a plurality of hang tags are stacked on a conveying surface of a conveying belt in the hang tag stacking and conveying device, and an RFID tag is embedded in each hang tag; the thermal transfer ribbon printing head can conduct online thermal transfer printing on passing hangtags through a walking thermal transfer ribbon, a hangtag one-by-one output device is arranged at the output end of the hangtag stacking and conveying device, and an RFID read-write antenna is installed in the hangtag printing area and located between the hangtag one-by-one output device and the thermal transfer ribbon printing head. And the RFID reader-writer can write data into the hang tags which pass one by one through the RFID read-write antenna. The system has the advantages that firstly, the printer can perform online printing and data entry on a single hang tag embedded with an RFID tag at the same time, the printer can ensure that the single hang tag is printed one by one and data is entered one by one, and the hang tag is not easy to be stuck; and thirdly, the printer can print hang tags with different thicknesses, and is good in printing applicability and convenient to adjust.

The invention discloses a printing equipment detection method and device, printing equipment, a storage medium and a program product. The printing equipment comprises a driving part, a printing rubber roller, a first rotating part, a second rotating part, a code disc and a sensor. The method comprises the steps that in the process of executing a printing task, a driving part is controlled to complete one-time driving according to a preset time interval, and a detected area entering a detection area is determined after each-time driving is finished; the detected area is a light-transmitting area or a light-shielding area; if it is detected that the detected area does not change continuously for preset times, it is determined that the conveying channel of the printing medium is blocked or the thermal transfer ribbon is used up. By adopting the scheme, the abnormity of the printing equipment in the process of executing the printing task can be found in time, so that the problems that a motor is blocked due to the fact that a conveying channel of the printing medium is blocked, or the printing medium is wasted due to the fact that printing is still continued after a thermal transfer ribbon is used up are solved.

The invention relates to the technical field of heat transfer printing ink, and discloses a heat transfer printing technology-based temperature-variable color formula which comprises the following components in percentage by mass: 30%-40% of a thermoplastic polymer carrier, 5%-10% of a temperature-sensitive color-variable pigment, 1%-3% of a dispersing agent, 5%-8% of a connecting material, 0%-5% of an ultraviolet light absorber and the balance of a solvent, the invention further discloses a printing technology of the temperature-variable color formula based on the heat transfer printing technology. The printing technology comprises the following steps that S1, the temperature-sensing color-variable ink is printed on transfer printing paper through digital printing equipment. By adopting the liquid crystal microcapsule pigment, the thermoplastic polymer carrier with narrow molecular weight distribution, the efficient dispersant and the improved preparation process, accurate color change, smooth transition and excellent aging resistance of the ink in a specific temperature range are realized, and meanwhile, the light stability, the storage stability and the definition of a printed pattern are improved; the method is suitable for multiple indoor and outdoor scenes, and meets the high-quality requirements of personalized customization of commodities.