359results about How to "Good thermal contact" patented technology

A system for thermal cycling a plurality of samples. The system includes a case having a fluid-tight cavity defining an interior volume. A microfluidic array is disposed in the interior volume, the array including a sheet of material having a pair of opposed surfaces, a thickness, and a plurality of through-holes running through the thickness between the surfaces. A thermal cycler having at least one thermally controlled surface is adapted to thermally contact the case.

An optical illuminator using Vertical Cavity Surface Emitting Laser (VCSEL) is disclosed. Optical modules configured using single VCSEL and VCSEL arrays bonded to a thermal submount to conduct heat away from the VCSEL array, are suited for high power and high speed operation. High speed optical modules are configured using single VCSEL or VCSEL arrays connected to a high speed electronic module on a common thermal submount or on a common Printed Circuit Board (PCB) platform including transmission lines. The electronic module provides low inductance current drive and control functions to operate the VCSEL and VCSEL array. VCSEL apertures are designed for a desired beam shape. Additional beam shaping elements are provided for VCSELs or VCSEL arrays, for desired output beam shapes and / or emission patterns. VCSEL arrays may be operated in continuous wave (CW) or pulse operation modes in a programmable fashion using a built-in or an external controller.

A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively connected, as by forming solder bridges, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses. The individual units desirably are thin and directly abut one another so as to provide a low-height assembly with good heat transfer from chips within the stack.

Embodiments of the invention include a method and a device for increasing blood flow and controlling the temperature of a mammal by applying a desired pressure to extremities of a mammal. The device generally includes one or more collapsible and pliant body elements, capable of expanding from a first volume into an expanded second volume so the device can receive a portion of an extremity of the mammal therein and then be reduced from the expanded second volume into a pressurized third volume to conformably enclose the portion of the extremity. One or more thermal exchange units can be positioned in the one or more collapsible and pliant body elements. Accordingly, the temperature of the extremity of a mammal can be regulated by providing a heated or cooled fluid medium or electric thermal energy to the one or more thermal exchange units. Next, by evacuating the region in which the extremity is enclosed the contact surface area between the extremity of a mammal and the one or more thermal exchange units is increased, due to the external atmospheric pressure acting on the pliant body elements against the skin of the extremity of the mammal. The application of pressure assures that sufficient contact and thermal heat transfer (heating or cooling) is provided to the extremity of the mammal.

A system and method for the production of radioisotopes by the transmutation of target isotopic material bombarded by a continuous wave particle beam. An ion source generates a continuous wave ion beam, irradiating an isotope target, which is cooled by transferring heat away from the target at heat fluxes of at least about 1 kW / cm2.

A cooling fluid distribution assembly for a plurality of electronic modules, using a composite cold plate structure. One cold plate is associated with each electronic module requiring liquid cooling. Each cold plate includes a high thermal conductivity base sealably fastened to a cover, the cover having at least one fluid inlet and at least one fluid outlet. Cover fluid inlets and outlets are connected via a plurality of flexible, nonmetallic conduits, the conduits being bonded to the cover inlets and outlets. Each cold plate cover is formed of a material that is capable of being bonded to the flexible, nonmetallic conduits, covers are therefore formed of a different material than the material comprising the cold plate base. Cold plate structures preferably include internal fluid distribution structures. The resulting cooling fluid distribution assembly provides reliable fluid connections and is sufficiently flexible to adjust for variances in module height etc.

An assembly for receiving and transmitting millimeter (mm) waves, including at least one mm wave reflector (84, 86, 88)and at least one mm transmission wave feed (72) configured in a transmission feed location (34) within the at least one mm wave reflector. The assembly also includes a plurality of receiving mm wave feeds (72) configured in respective receiving feed locations (36) within the at least one mm wave reflector; and a radio frequency (RF) module (38). The RF module is coupled to the at least one mm transmission wave feed and to the plurality of the receiving mm wave feeds, so as to drive the at least one mm transmission wave feed to transmit outgoing mm waves and to simultaneously receive incoming mm waves from all of the plurality of the receiving mm wave feeds.

A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively interrupted, as by breaking the individual branches, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses. The individual units desirably are thin and directly abut one another so as to provide a low-height assembly with good heat transfer from chips within the stack.

A method and device for increasing blood flow by applying positive pressure to extremities of a mammal and / or controlling the temperature of the mammal. The device includes one or more collapsible and pliant body elements capable of expanding and flexibly applying pressurized compression forces to the extremity of the mammal by attaching one or more pressure-applying gas plenums as close to the extremity as possibly. The flexible extremity device can be used independently or can be used in conjunction with thermal pads disposed to the one or more collapsible and pliant body elements. Alternatively, the one or more collapsible and pliant body elements can be manufactured into thermal pads.

Mounting systems are provided for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from an electronics server. An engaging force is applied to the two heat exchangers to create thermal communication there between. A mounting mechanism is configured to isolate the engaging force applied to the two heat exchangers. The mounting mechanism may include an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server to lessen the possibility of disconnecting the electrical connections between the electronics server and the rack, and / or lessening mechanical stresses transferred to the electronics server and the rack chassis. The mounting mechanism also may be coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact.

A system for thermal cycling a plurality of samples. The system includes a case having a fluid-tight cavity defining an interior volume. A microfluidic array is disposed in the interior volume, the array including a sheet of material having a pair of opposed surfaces, a thickness, and a plurality of through-holes running through the thickness between the surfaces. A thermal cycler having at least one thermally controlled surface is adapted to thermally contact the case.

A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and / or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.

A thermal management for EMI shielded circuit packs having one or more high-power components, i.e. heat sources. More particularly, a heat transfer device or assembly for EMI shielded circuit packs is provided whereby multiple components (e.g., high-power components) are cooled by individual heat sinks (i.e., each component has its own individual heat sink) which protrude into an external airflow through individual openings in the lid of the EMI shield. Mechanically-compliant, electrically-conductive gaskets are used to seal the base plates of the individual heat sinks against the lid of the EMI shield enclosure. As such, in accordance with the various embodiments, the conductive gaskets establish a compliance layer which accommodates any variation in the heights of the individual components, thereby, allowing optimum thermal contact between the components and their respective heat sinks without compromising the EMI shielding.

This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.

Disclosed is a method and device to increase the cooling load that can be provided by a refrigerant-based thermal energy storage and cooling system with an improved arrangement of heat exchangers. This load increase is accomplished by circulating cold water surrounding a block of ice, used as the thermal energy storage medium, through a secondary heat exchanger where it condenses refrigerant vapor returning from a load. The refrigerant is then circulated through a primary heat exchanger within the block of ice where it is further cooled and condensed. This system is known as an internal / external melt system because the thermal energy, stored in the form of ice, is melted internally by a primary heat exchanger and externally by circulating cold water from the periphery of the block through a secondary heat exchanger.

A packaging system for a high current, low voltage power supply. The power supply uses bare die power FETs which are directly mounted to a thermally conductive substrate by a solder attachment made to the drain electrode metallization on the back side of the FETs. The source electrode and gate electrode of each FET are coupled to the circuitry on an overhanging printed circuit board, using CSP solder balls affixed to the front side of the FET die. The heat generated by the FETs is effectively dissipated by the close coupling of the FETs to the thermally conductive underlying substrate. High interconnect densities are achieved through the use of a multilayer printed circuit board. This high interconnect density, with the addition of a magnetic core element, allows the power supply packaging system to incorporate transformer windings for an isolation transformer or an inductor.

A heat spreader for an emissive display device, such as a plasma display panel or a light emitting diode, comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater than the surface area of that part of a discharge cell facing the back surface of the device.

In order to improve the heat-conducting connection between a contact element (3) and a ceiling panel (1) which are adhesively bonded to one another, the contact panel (5) of the contact element (3) is provided with an adhesive depression (10) in the contact surface (6), said depression taking up only part of said contact surface, while the remaining part of the latter rests directly against the upper side of the ceiling panel (1). The contact panel (5) may be elastically or plastically deformable, e.g. along a bending groove (9), with the result that it adapts more easily to irregularities, such as those caused, for example, by slight sagging of the ceiling panel (1). This permits larger widths of the contact panel (5) without impairing the thermal contact. In order to ensure close abutment of the parts of the contact surface (6) which are not adhesively bonded to the upper side of the ceiling panel (1), the contact panel (5) can be appropriately prestressed.

A double oven crystal oscillator (DOCXO) is disclosed which is highly stable by incorporating means to reduce the effects of ambient pressure changes on the frequency of the oscillator. The oscillator crystal is mounted in a temperature controlled inner oven to reduce the effects on the frequency stability of the oscillator. The oscillator circuitry and all circuitry associated with the inner oven is mounted in good thermal contact with the inner oven. A Faraday shield at ground potential is placed over the oscillator circuitry to minimize the effects of stray capacitance between the oscillator components and the case wall of the inner oven. The effects of minor deformations in the case walls within the oscillator caused by ambient pressure changes and other factors causing pressure changes are thereby greatly minimized. To further reduce effects on oscillator frequency stability the ovens of the DOCXO are temperature controlled, cases are hermetically sealed, the case walls are rigid, and ovens and cases may be evacuated.

Nanostructures provide increased surface area to augment heat-exchange surfaces of various devices or structures. In one embodiment, an article of manufacture has a body having a heat-exchanging surface and nanostructures disposed on the heat-exchanging surface. The nanostructures are arranged to enhance thermal transfer between the body and a region of fluid and may be spaced apart from each other to permit flow of a fluid between the nanostructures. Examples of suitable nanostructures include carbon and / or boron nitride nanotubes, which may be grown on the heat-exchanging surface.

An external combustion engine having an exhaust flow diverter for directing the flow of an exhaust gas. The external combustion engine has a heater head having a plurality of heater tubes through which a working fluid is heated by conduction. The exhaust flow diverter is a cylinder disposed around the outside of the plurality of heater tubes and includes a plurality of openings through which the flow of exhaust gas may pas. The exhaust flow diverter directs the exhaust gas past the plurality of heater tubes. The external combustion engine may also include a plurality of flow diverter fins coupled to the plurality of heater tubes to direct the flow of the exhaust gas. The heater tubes may be U-shaped or helical coiled shaped.

A liquid warming device for heating sterile fluids in a removable basin is described with emphasis on the properties of the basin interaction with the liquid warming device and with a drape that works with the basin to maintain a sterile field above the drape and the top of the basin. The interactions between a temperature sensor and a temperature well integrated in the removable basin are disclosed. Also disclosed are various desirable aspects for a control system for a liquid warming device are provided.

This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.

An apparatus for providing a light output to an optical guide for illumination of an imaged object including a plurality of solid state light-emitting sources each of which are independently powered and independently controlled, each light-emitting source emitting light at a wavelength which is different from the wavelength emitted by the other light-emitting sources. The apparatus also includes a heat sink configured to thermally couple the plurality of solid state light-emitting sources and provide conduction of heat generated by the plurality of solid state light-emitting sources. The apparatus further includes an optical elements to collect, collimate, and combine the emissions from the plurality of solid state light-emitting sources into a combined beam of light to be optically coupled to the light guide.

Various embodiments of a heat sink assembly are disclosed. In one embodiment, the heat sink assembly includes a processor mounted onto a circuit board; a heat sink located in thermal contact with the processor at the side of the processor opposite circuit board; and an electromagnetic shielding member located between the circuit board and the heat sink. The electromagnetic shielding member is releasably attached to the circuit board. Additionally, or in the alternative, the heat sink is biased toward the processor by a load spring and the electromagnetic shielding member is configured to provide a spring force between the circuit board and the heat sink, counter directional to the bias from the load spring.

A thermally conductive paste including porous agglomerates of carbon particles dispersed in a paste-forming vehicle is disclosed. The paste is useful as a thermally conductive interface material between a heat or cold source and an object. The paste is particularly useful as a thermally conductive interface material between a heat source and a heat sink. Apparatus and a method of removing heat from a heat source utilizing thermally conductive pastes of the present invention are also disclosed.