171results about How to "Solve the thicker" patented technology

The invention discloses a two-dimensional black phosphorus/transitional metal chalcogenide heterojunction based device. The heterojunction adopts a laminated structure of two-dimensional black phosphorus nanometer slices and two-dimensional transitional metal chalcogenide nanometer slices; the number of the two-dimensional black phosphorus layers is 1-50; the two-dimensional transitional metal chalcogenide comprises 1-50 layers in terms of thickness; the two kinds of two-dimensional materials are prepared and synthesized through chemical vapor deposition, mechanical stripping, liquid phase stripping and the like; and the device can be used for preparing a bipolar transistor, a field effect transistor or a photoelectric detector/photoelectric diode. The two-dimensional black phosphorus/transitional metal chalcogenide heterojunction device has the advantages as follows: a combination of the two kinds of two-dimensional materials of black phosphorus and the transitional metal chalcogenide is adopted to form the brand new pn type heterojunction structure; the heterojunction is combined based on natural van der Waals forces among materials; compared with the conventional heterojunction epitaxial growth process, the heterojunction device provided by the invention is easier to prepare; and compared with the existing bulk material, the heterojunction device provided by the invention is smaller in size, thinner, higher in flexibility and higher in the integration degree, so that the two-dimensional black phosphorus/transitional metal chalcogenide heterojunction device has the potential to be applied to the wearable equipment in the future.

A clip-less packaged semiconductor device includes at least one semiconductor die having bottom and top surfaces each having at least one electrode. A leadframe comprising a sheet of conductive material having top and bottom surfaces, the top surface being substantially planar, the bottom surface having a recessed region having a thickness less than the thickness of the sheet of conductive material formed in the sheet and defining a plurality of planar lead contacts, is electrically coupled to the top surface of the die at its bottom surface in the recessed region. An encapsulating layer partially encloses the leadframe and die, wherein the encapsulating layer occupies portions of the recessed region not occupied by the die, wherein the bottom surface of the die and the plurality of leadframe contacts are exposed through the encapsulating layer at least at the bottom surface of the packaged semiconductor device.

Embodiments of the invention provide a fingerprint identification apparatus, a manufacturing method for the fingerprint identification apparatus, an array substrate and a display apparatus, which relate to the technical field of display and can solve the problem of relatively large thickness of an existing optical fingerprint identification apparatus. The fingerprint identification apparatus comprises a first gate line and a signal reading line, wherein the first gate line and the signal reading line crossly define a plurality of fingerprint identification units; a photosensitive device and a first transistor are arranged in each fingerprint identification unit; the photosensitive device comprises a first electrode layer as well as a first doped semiconductor layer, a second doped semiconductor layer and a second electrode layer that are located on the surface of the first electrode layer in sequence; an electric field is formed between the first electrode layer and the second electrode layer; a PN junction is formed between the first doped semiconductor layer and the second doped semiconductor layer; the gate of the first transistor is connected with the first gate line; a first pole of the first transistor is connected with the signal reading line; and a second pole of the first transistor is connected with the second electrode layer.

A packaging system for a high current, low voltage power supply. The power supply uses bare die power FETs which are directly mounted to a thermally conductive substrate by a solder attachment made to the drain electrode metallization on the back side of the FETs. The source electrode and gate electrode of each FET are coupled to the circuitry on an overhanging printed circuit board, using CSP solder balls affixed to the front side of the FET die. The heat generated by the FETs is effectively dissipated by the close coupling of the FETs to the thermally conductive underlying substrate. High interconnect densities are achieved through the use of a multilayer printed circuit board. This high interconnect density, with the addition of a magnetic core element, allows the power supply packaging system to incorporate transformer windings for an isolation transformer or an inductor.

Disclosed are a LED package, a method of fabricating the same, and a backlight unit having the same. The light emitting diode package comprises a light emitting diode, a printed circuit board provided with a circuit pattern used for driving the light emitting diode and a through hole formed in an area where the light emitting diode is mounted, and a heat sink provided in the through hole and contacted with a bottom surface of the light emitting diode.

The invention discloses a display device and a method for controlling the same, and belongs to the field of display technologies. The display device comprises a display panel and a plurality of ultrasonic assemblies. The ultrasonic assemblies are arranged on the same layer; each ultrasonic assembly comprises a piezoelectric layer and two electrodes, and the two electrodes of each ultrasonic assembly are respectively arranged on two sides of the piezoelectric layer of the ultrasonic assembly. The display device is provided with the ultrasonic assemblies which are positioned on the same layer, ultrasonic waves can be transmitted and received by the ultrasonic assemblies without ultrasonic receiving assemblies or ultrasonic generating assemblies, accordingly, the problem of thick display panels in the prior art can be solved, and effects of reducing the thickness of the display panel can be realized.

The invention discloses a heat preservation and decoration integrated facing tile and a production method thereof. The heat preservation and decoration integrated facing tile comprises a soft porcelain decorative face layer and a heat preservation layer. The soft porcelain decorative face layer is composed of, by weight part, 8-15 parts of emulsion, 15-25 parts of mineral powder, 5-15 parts of cement, 40-60 parts of silica sand, 5-15 parts of flame retardant, 0.5-2 parts of inorganic pigment and 10-25 parts of water; the heat preservation layer is composed of the following components containing glass fiber gridding cloth and including, by weight part, 8-15 parts of emulsion, 15-25 parts of mineral powder, 15-25 parts of cement, 20-50 parts of heat preserving materials, 5-15 parts of flame retardant, 0.5-2 parts of inorganic pigment and 10-25 parts of water. The soft porcelain decorative face layer is good in hydrophobicity and stain-resistance and is connected with the heat preservation layer into a whole through mortar materials. The heat preservation and decoration integrated facing tile is light in weight and achieves both decorative and heat preservation functions, thereby being a heat preservation and decorative building material with excellent comprehensive performance.

A turbine housing for exhaust gas turbochargers includes an outlet pipe and an external housing connected therewith. A rotor housing is disposed in the external housing and has a pipe-shaped neck operably coupled with the outlet pipe and axially displaceable relative to the same. A separate sealing ring is positioned operably between the neck and the outlet pipe, supported by the outlet pipe, and has an inwardly turned sealing portion sealingly and slidingly engaging the neck to form a secure gas seal therebetween.

The invention provides a photographing control method, a camera module and a mobile terminal. The camera module comprises a first lens group; a second lens group; an image sensor arranged at the imaging side of the first lens group and the second lens group; and multiple reflection elements of which reflection states are adjustable. The multiple reflection elements are arranged between the first lens group and the lens group, and the image sensor. Light rays of the second lens group and/or first lens group for photographing an image are reflected by the multiple reflection elements and then are projected on the image sensor for imaging. In this way, the problems that the cost is relatively high and the thickness of the module is relatively high due to the fact that independent image sensors are employed for double cameras in an existing camera module are solved; the beautiful appearance is ensured; and the user experience is improved.

The invention relates to a surface treating agent applied to the technical field of the electronic-grade glass fiber cloth and an electronic-grade glass fiber cloth produced by using the surface treating agent. The surface treating agent comprises the following ingredients in weight percentage: 0.2 to 0.8% of silane coupling agent having general formula of (Y(CH2)nSiX3), 0.3 to 1.0% of acetic acid, 0.05 to 0.1% of surfactant I, 0.02 to 0.05% of surfactant II, and the balance of de-ionized water. The invention is applicable to the surface treating technology of the electronic-grade glass fiber cloth of the high-precision, high-uniformity and high performance printing circuit board; the electronic-grade glass cloth processed by the surface treating agent and the surface treating process has the advantages of thinness, homogenization and faster resin soakage and is suitable for the insulation reinforcing material of the printing circuit board; furthermore, the invention can be widely applied to the high-end products including mobile phone boards, notebook computers, navigation, automobiles, servers and the like.

The invention discloses a metal photovoltaic tile. The metal photovoltaic tile comprises a metal tile base plate and a flexible solar photovoltaic cell component, wherein the flexible cell component and the outer surface of the metal tile base plate are stuck to form an integral structure through a binder; the metal tile base plate is a highly anti-corrosion Al-Zn alloy-coated steel sheet; an interface agent for improving a bonding force is coated on the surface of the metal tile base plate; the binder is a flame-retardant polymer rapid-hardening binder. The flexible solar photovoltaic cell component comprises a flexible film cell component, a film layer and a coating layer sequentially from inside to outside. The metal photovoltaic tile disclosed by the invention has multiple use functions such as fire prevention, water resistance, impact resistance, roof decoration and photovoltaic power generation, is applied to the newly-built photoelectric buildings and the existing buildings with energy-saving reconstruction, realizes high efficiency and energy conservation of the buildings, and realizes self-sufficient electric power.

A spring mattress is described, comprising a plurality of strings interconnected side by side, each string comprising a continuous casing material with a plurality of pockets, said pockets being defined by at least one longitudinal connecting line extending parallel to the longitudinal direction of the string and a plurality of transverse connecting lines extending transversely to the longitudinal direction of the string, and coil springs arranged in the pockets of the string. For at least one of the springs, casing material portions arranged at the ends of the spring are moved towards each other, through the spring, and connected to each other. Moreover “the connecting lines are arranged at the side of the springs and, thus, between neighbouring springs. Preferably, the interconnected casing material portions are thus at the ends of the springs essentially free of other connections. Also a method and a device for manufacturing such a mattress are disclosed.

The invention discloses a chip packaging structure, a manufacturing method and electronic equipment, relates to the technical field of electronic packaging, and solves the problem that the thickness of the chip packaging structure is relatively high. Through the specific scheme, the chip packaging structure comprises a main chip, a first re-wiring layer, a second re-wiring layer, a first electronic connecting piece and an overlaying chip, wherein the first re-wiring layer is arranged on the active surface of the main chip, and is electrically connected with the main chip; the second re-wiringlayer is arranged on the back surface of the main chip, and is in contact with the back of the main chip; the first electric connecting piece is arranged between the first re-wiring layer and the second re-wiring layer, and the first electric connecting piece is used for electrically connecting the first re-wiring layer and the second re-wiring layer; and the overlaying chip is arranged on the side, away from the main chip, of the second re-wiring layer, and is electrically connected with the second re-wiring layer. The chip packaging structure provided by the invention is used for being connected with a circuit board inside the electronic equipment.

The invention discloses an X-band high-gain broadband lens antenna based on a phase gradient multilayer super-surface structure. The antenna exhibits a broadband characteristic by using a microstrip antenna based on H-type slot coupling as a feed source. Furthermore, a super-surface structural unit having a phase gradient variation feature is designed and arranged in accordance with a parabolic focusing equation. Therefore, good low profile characteristics are obtained. A combined super-surface transmission array can convert a normally incident quasi-spherical wave into a plane wave, thereby obtaining a high-gain antenna. The lens antenna operates in the X-band with a center frequency of 10 GHz and the relative bandwidth reaches 20.6%. The antenna gain can be increased from 8.25 dB to 18.98 dB, and the side-lobe level of the super-surface focusing is less than -14.3dB. The simple three-dimensional structure and compact size provide a new method for implementing high-gain antennas, andthe antenna is good in application prospect in field of long-distance wireless communication.

A multi-zone, proximate-air oven using air delivered from the shelves provides a compact height through the use of low profile shelves. Intercavity heat leakage is managed by active insulation techniques making use of the oven feedback temperature control and controlled cavity loading.

The invention provides an electromagnetic wave shielding material for FPC. The electromagnetic wave shielding material is flexible and thin. Even the electromagnetic wave shielding material is bent repeatedly and severely, the electromagnetic wave shielding performance does not degrade and thus the bending property is excellent. The electromagnetic wave shielding material (5) for FPC is characterized in that a base material (1) formed by coated dielectric thin resin film, a filmy adhesive layer (2), and an electrical conductivity layer (3) are laminated on a single face of a support body film (6), wherein the base material (1) is made of polyimide film formed by polyimide which is soluble through a solvent and is 1-9 microns thick.

An object of the present invention is to provide a light emitting device that shows high adhesion between a sealing member and a package member. A light emitting device 100 of the present invention comprises a package 20 with a recess 60 having a bottom face 20a and a side wall 20b, a light emitting element 10 mounted on the bottom face 20a of the recess 60 of the package 20, and a sealing member 40 filled in the recess 60 of the package 20, with which the light emitting element 10 is coated, wherein the package 20 contains, against the entire monomer component, from 5 to 70% by weight of potassium titanate fibers and/or wollastonite, from 10 to 50% by weight of titanium oxide, and from 15 to 85% by weight of a semiaromatic polyamide containing 20 mol % or more of an aromatic monomer, a part of the side wall 20b of the recess 60 of the package 20 has a thickness of 100 μm or less, and the sealing member 40 is made of silicone.

The present invention provides an electromagnetic wave-shielding film which includes a transparent substrate, an electromagnetic wave-shielding layer which includes a conductive pattern formed in at least a portion of the transparent substrate, and an adhesive transparency layer which is formed on the electromagnetic wave-shielding layer to fill a groove of the conductive pattern and contains a near infrared-absorbing dye, and an optical filter and a plasma display panel including the electromagnetic wave-shielding film.

The invention discloses a circular polarizer and a preparation method thereof. In the invention, the surface of a base material is coated with a first orientation layer and a second orientation layer respectively; a phase difference layer is formed on the surface of the second orientation layer; the surface of the first orientation layer is coated with a polarization layer mixture; the polarization layer mixture comprises multiple polymerizable liquid crystal monomers, a dichroic pigment and an ultraviolet absorber; under ultraviolet irradiation, the polymerizable liquid crystal monomers with more polymerizable groups on the side close to the ultraviolet light source are enriched, and the polymerizable liquid crystal monomers with fewer polymerizable groups on the side far from the ultraviolet light source are enriched; the polymerizable liquid crystal monomers with more polymerizable groups are in a nematic phase, the viscosity of the nematic phase is relatively low, and a continuous and perfect cured film is formed; the polymerizable liquid crystal monomers with fewer polymerizable groups are in a smectic phase, and the smectic phase is an ideal two-dimensional ordered structure and realizes a polarization effect to form a polarization layer; and the circular polarizer has a thinning property and a good flexural property as well as a good anti-reflection property in the whole visible light range.

The invention provides a double-screen display payment terminal which comprises a host computer, a first touch display screen device and a second touch display screen device. Two dual-core mainboards provided with Android systems are arranged in the host computer and are a first dual-core mainboard and a second dual-core mainboard respectively. A power supply module is further arranged in the host computer and respectively connected with power interfaces of the first dual-core mainboard and the second dual-core mainboard through power lines, the second dual-core mainboard is connected with the first dual-core mainboard through an RS 232 serial port to achieve information share, the first dual-core mainboard is in signal connection with the first touch display screen device, and the second dual-core mainboard is in signal connection with the second touch display screen device. The double-screen display payment terminal has the advantages that a cashier party and the payment party can see detailed account statement information in the payment process, the terminal is very convenient, payment terminals in the market are thin, the terminal has various functions, adopts a WINDOWS operating system and is low in power consumption, low in heat productivity and high in performance utilization rate.

An adhesively mountable image using a highly tacky reusable adhesive surface is provided. The image carrier is removable from the adhesive carrier, and it subsequent image carrier may be releasably bound to the same adhesive carrier. Kits for this system are also provided.

The invention discloses a method for manufacturing a three-dimensional flexible stacked encapsulating structure of an embedded ultrathin chip. The method comprises choosing a flexible substrate with a single-layer metal layer, etching the single-layer metal layer on the flexible substrate to form a plurality of metal electrodes, conducting laser grooving on one side of the flexible substrate without the single-layer metal layer to form a plurality of grooves, conducting flipped thermocompression bonding with a plurality of chips on one side of the flexible substrate, provided with the plurality of grooves, thermally compressing the side of the flexible substrate, provided with the plurality of chips through thermocompression bonding and a flexible medium layer to embed the plurality of chips into the flexible medium layer, thinning one side of flexible medium layer embedded with the plurality of chips of the flexible substrate to obtain a thinned flexible medium module embedded with the plurality of chips, bending a part of the flexible medium module without the chips to stack the chips, encapsulating and curing a three-dimensional flexible encapsulating module with the plurality of stacked chips, and routing or reballing the encapsulated three-dimensional flexible encapsulating module.

A connector with a switch comprises a housing for defining a terminal accommodation chamber opened through a plug pin insertion hole. A fixed terminal and a switch terminal are held by the housing. The switch terminal comprises a U-shaped section opened toward the plug pin insertion hole in the terminal accommodation chamber. The U-shaped section is elastically deformable in a direction crossing the direction of plug pin insertion. The switch terminal is switched from a state in which it is brought into contact with the fixed terminal to a state in which the contact thereof with the fixed terminal is cut off as the U-shaped section is deformed in the direction crossing the direction of plug pin insertion.

An imaging device has a zoom lens system having a plurality of lens units and forming an optical image of an object so as to continuously optically zoom by varying distances between the lens unit; and an image sensor converting the optical image formed by the zoom lens system to an electric signal. The zoom lens system comprises, from an object side a first lens unit being overall negative and including a reflecting surface that bends a luminous flux substantially 90 degrees; and a second lens unit disposed with a variable air distance from the first lens unit, and having a negative optical power.

A PTC SIP compound comprising an electrically insulating matrix essentially consisting of a siloxane polymer in addition to first and second electrically conductive particles having different properties with respect to surface energies and electrical conductivities. A multi-layered, ZPZ, foil comprising a PTC SIP compound of the invention present between two metal foils, thereby forming a conductive composite body. A multi-layered device, comprising an essentially flat composite body made up from a PTC SIP compound according to the invention, two electrode layers adhering to the surfaces of the composite body, the electrode layers being metal foils prepared to connect to electrodes.

A thin electronic input device has a film layer, a conducting layer, a covering layer, character display layer, an IC control unit and a connecting unit. The film layer is made of a flexible material. The conducting layer is mounted on the film layer for sensing a human pulse wave. The covering layer is mounted on the conducting layer. The character display layer is mounted on the covering layer; furthermore, the character display layer also has a plurality of keyboard characters printed thereon. The IC control unit is electrically connected to the conducting layer. The connecting unit is electrically connected to the conducting layer. When a user touches the character display layer to provide a human pulse wave, the conducting layer receives a touch signal for inputting information.