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Fingerprint identification apparatus, manufacturing method for fingerprint identification apparatus, array substrate and display apparatus

A technology for fingerprint identification and array substrate, which is used in character and pattern identification, acquisition/organization of fingerprints/palmprints, detection of live fingers, etc., and can solve the problem of large thickness of fingerprint identification devices.

Active Publication Date: 2016-05-04
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a fingerprint identification device and its manufacturing method, an array substrate, and a display device, which can solve the problem of relatively large thickness of the existing optical fingerprint identification device

Method used

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  • Fingerprint identification apparatus, manufacturing method for fingerprint identification apparatus, array substrate and display apparatus
  • Fingerprint identification apparatus, manufacturing method for fingerprint identification apparatus, array substrate and display apparatus
  • Fingerprint identification apparatus, manufacturing method for fingerprint identification apparatus, array substrate and display apparatus

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Embodiment 1

[0075] In this embodiment, the above-mentioned fingerprint recognition device is disposed in the above-mentioned display area 40 .

[0076] For example, it can be found in Figure 6 As shown in each sub-pixel 01, set a figure 2 Fingerprint recognition unit 02 is shown. Specifically, such as Figure 7 As shown, the first transistor T1 and the photosensitive device 20 in the fingerprint identification unit 02 are arranged in one sub-pixel 01 .

[0077] In this way, fingerprint identification can be realized in the display area 40 .

[0078] In addition, since the second gate line G2 and the data line D can cross to define the sub-pixel 01 , and the first gate line G1 and the reading signal line RL can define the fingerprint identification unit 02 . Therefore, in order to make the wiring structure on the entire array substrate neat, preferably, the first gate line G1 can be parallel to the second gate line G2, and the read signal line RL can be parallel to the data line D. ...

Embodiment 2

[0080] In this embodiment, the above-mentioned fingerprint recognition device is also arranged in the display area 40 . The difference from the first embodiment is that not every sub-pixel 01 in this embodiment is provided with the above-mentioned fingerprint recognition unit 02 .

[0081] Specifically, the above-mentioned fingerprint identification unit 02 may be set in a sub-pixel in the reconfigured pixel unit. For example, when the sub-pixels constituting the pixel unit include the first color sub-pixel 110, the second color sub-pixel 111, and the third color sub-pixel 112, the fingerprint recognition unit 02 can be arranged on the first color sub-pixel 110, the second color sub-pixel In the sub-pixel 111 or the sub-pixel 112 of the third color. Wherein, the above-mentioned first color, second color and third color constitute three primary colors.

[0082] Alternatively, when the display area 40 includes pixel units such as Figure 8 As shown, when the first color sub-pi...

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Abstract

Embodiments of the invention provide a fingerprint identification apparatus, a manufacturing method for the fingerprint identification apparatus, an array substrate and a display apparatus, which relate to the technical field of display and can solve the problem of relatively large thickness of an existing optical fingerprint identification apparatus. The fingerprint identification apparatus comprises a first gate line and a signal reading line, wherein the first gate line and the signal reading line crossly define a plurality of fingerprint identification units; a photosensitive device and a first transistor are arranged in each fingerprint identification unit; the photosensitive device comprises a first electrode layer as well as a first doped semiconductor layer, a second doped semiconductor layer and a second electrode layer that are located on the surface of the first electrode layer in sequence; an electric field is formed between the first electrode layer and the second electrode layer; a PN junction is formed between the first doped semiconductor layer and the second doped semiconductor layer; the gate of the first transistor is connected with the first gate line; a first pole of the first transistor is connected with the signal reading line; and a second pole of the first transistor is connected with the second electrode layer.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a fingerprint identification device and a manufacturing method thereof, an array substrate, and a display device. Background technique [0002] With the progress of modern society, the importance of personal identification and personal information security has gradually attracted people's attention. Due to the uniqueness and invariance of human fingerprints, fingerprint identification technology has the characteristics of good security, high reliability, and simple and convenient use, which makes fingerprint identification technology widely used in various fields to protect personal information security, especially mobile terminals. Fields, such as mobile phones, notebook computers, tablet computers, digital cameras, etc., have a more prominent demand for information security. The fingerprint identification function is one of the commonly used functions of electronic devices at...

Claims

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Application Information

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IPC IPC(8): G06K9/00H01L27/12
CPCH01L27/12H01L27/1222G06V40/1388G06V40/1318H01L27/14678H01L31/1055H01L27/124H01L27/1255H01L27/127H01L29/78669
Inventor 李昌峰董学陈小川王海生刘英明杨盛际丁小梁赵卫杰刘伟王鹏鹏王磊卢鹏程龙君
Owner BOE TECH GRP CO LTD
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