2327 results about "Electronic modules" patented technology

The invention provides a high-speed communication storage electric connector, which comprises an insulating body, the insulating body is provided with a lengthwise slot which is concavely arranged downwards from the top surface and is used for inserting an electronic module, and a plurality of terminal slots are respectively arranged in lengthwise side walls on two sides of the slot; the plurality of terminals are respectively accommodated in the corresponding terminal grooves in the two lengthwise side walls in a one-to-one correspondence manner, at least one part of the terminal grooves are internally provided with double-layer terminals, and the other terminal grooves are internally provided with single-layer terminals; the double-layer terminal comprises a lower-layer terminal and an upper-layer terminal, the upper-layer terminal of the double-layer terminal is downwards inserted and fixed in the terminal groove from the top of the insulating body, and the lower-layer terminal of the double-layer terminal is upwards inserted and fixed in the terminal groove from the bottom of the insulating body; the single-layer terminals are inserted and fixed in the terminal grooves upwards from the bottom of the insulation body or inserted and fixed in the terminal grooves downwards from the top of the insulation body. According to the high-speed communication storage electric connector, signal transmission channels can be increased, so that the signal transmission speed is greatly improved, and high-speed automatic plug end production can be realized.

The invention relates to an electronics module (102) for a ventricular assist device, wherein the ventricular assist device has a motor housing for accommodating a pump motor. The electronics module (102) comprises an electronics section (204) for accommodating at least one electronic component (206) and / or at least one electrically conductive contacting element (208), and a coupling section (202) designed as a joint between the motor housing (104) and the electronics section (204) or as a separate component to be joined, wherein the motor housing (104) and the electronics section (204) are combined or can be combined via the coupling section (202) with one another to form a fluid-tight module housing (104) to be arranged in a blood vessel.

A multi-functional module system for a mobile device includes a docketing station and housing attachable to the mobile device. The housing includes an integrated wireless charging coil, and a plug head integrally formed with or attached to the housing. The plug head establishes a direct electrical / data connection between the housing and a port of the mobile device. The charging coil aligns with and charges a wireless-enabled accessory placed adjacent to the housing. The docking station includes an electrical connection interface to transmit power and / or data between the housing, the mobile device and a removable electronic module (REM) connected to the docking station. At least one port of the housing transfers power / data between an external device plugged into the port and the housing and / or the mobile device and / or the connected REM. The docking station provides a docking interface between the REM and housing via a magnetic coupling.

The invention discloses a modular micro-nano satellite integrated power system suitable for batch production and an assembly method thereof. The integrated power system is composed of a semi-open type electric box structure and a modular circuit board. The electricity box structure comprises an electricity box upper cover and an electricity box lower cover, and a plurality of threaded holes are formed in the two sides of the electricity box upper cover and the two sides of the electricity box lower cover and used for being connected with a satellite structure cabin plate; the heat dissipation plate bodies are distributed on the two sides of the modular circuit board; the modularized circuit board is provided with a plurality of circuit boards which are respectively provided with electronic modules in a stacking arrangement. A plurality of electronic modules are integrated into an electronic system by adopting a mechanical-electrical-thermal integrated design method, the system breaks through the function limit of a traditional satellite subsystem, the defects of information exclusion and resource waste are eliminated, a satellite is used as a whole to be subjected to unified design and resource planning tradeoff from the system level, and the system performance is improved. The weight of cables and connectors between electronic modules is greatly reduced, and the effective load ratio is improved.

A circuit arrangement (10) for controlling an output voltage of the circuit arrangement (10). The circuit arrangement (10) comprises battery cells (121) forming a plurality of series-connectable cell modules (120, 120′). The cell modules (120, 120′) comprise: a first group of cell modules (150) comprising a first number of cell modules (150), Each cell module (120, 120′) of the first group has a first nominal cell module voltage in a range of 30-200 V, and at least one second group of cell modules (150′) comprising a second number of cell modules (150′). Each cell module (120, 120′) of said at least one second group has a second nominal cell module voltage that is less than the first nominal cell module voltage. The circuit arrangement (10) comprises a control unit (20) configured to: measure the output voltage of the circuit arrangement (10), and in order to control the measured output voltage towards the voltage target, control at least one respective electronic module (100, 100′) to adjust a respective contributing number of cell modules (120, 120′) of at least one of the first and second groups. Each cell module (120, 120′) of the respective contributing number of cell modules (120, 120′) is contributing, positively or negatively, to the output voltage of the circuit arrangement (10).

An electronic module can include a housing defining a housing cavity, the housing defining a first end and a second end positioned opposite from the first end, the housing defining a housing opening to the housing cavity at the first end; a lens at least partially defining a compartment within the housing cavity; an LED lamp board positioned within the housing cavity, the LED lamp board further defining the compartment, the LED lamp board including at least one light source configured to emit light through the housing opening, the at least one light source positioned within the compartment; a power supply driving module positioned within the housing cavity, the power supply driving module configured to control a light output of the LED lamp board; and a wireless communication component connected in electrical communication with the power supply driving module.

Cooling module includes a mounting element, a force application member, a lever, and a cold plate movably coupled to the mounting element. The mounting element having engagement members, is coupled to a receptacle of an electronic device that is configured to receive a removable electronic device at the receptacle. The force application member having spring fingers, is disposed between the mounting element and the cold plate, and movable relative to the mounting element. The lever is connected to the mounting element and the force application member and shiftable between actuated and unactuated states. In the actuated state, the lever pushes the force application member along a first direction causing the engagement members to move the force application member along a second direction perpendicular to the first direction and urge the cold plate to compress the spring fingers and establish thermal contact between the cold plate and the removable electronic module.

In a method of manufacturing a semiconductor module, a first die including a first die electrode, a second die including a second die electrode, a first connection section connected to the first die electrode, and a second connection section connected to the second die electrode are sealed by a sealing body, and then, a bridge including a first bridge electrode and a second bridge electrode is mounted on a structure sealed by the sealing body. The first die and the second die are electrically connected via the bridge.

A lamp module including a housing including a light holder portion and a shaft portion, the light holder portion configured to tilt relative to the shaft portion; an LED lamp board positioned within the light holder portion; a power supply driving module connected in electrical communication with the LED lamp board; and a first concentric terminal positioned at least partially within the shaft portion, the first concentric terminal connected in electrical communication with the power supply driving module, the first concentric terminal configured to rotatably connect in electrical communication with a second concentric terminal to supply power to the power supply driving module.

The invention provides a chip assembly and a consumable box set, and relates to the technical field of printing imaging. The consumable box set is used for being in contact with contact pins of printing equipment and receiving printing signals, the printing equipment is provided with at least one first contact pin set and at least one second contact pin set, the first contact pin set and the second contact pin set are not overlapped, a first consumable box of the consumable box set is matched with the first contact pin set, the first consumable box is provided with a first electronic module, and the second consumable box is provided with a second electronic module. The first electronic module is electrically connected with at least one first contact part, and the first contact part is in contact with the first contact pin group to receive a first electric signal; the second consumable box is matched with the second contact pin group and is provided with a second electronic module, the second electronic module is electrically connected with the first electronic module, and the second electronic module receives the first electric signal through the first contact part. According to the invention, the risk of short circuit can be reduced, and normal use of the chip assembly is ensured.

An electronic module can include a housing defining a housing cavity with a first opening and a second opening; an LED lamp board positioned within the housing cavity, the LED lamp board configured to emit light through the first opening; a first electrical terminal positioned within the second opening; and a first mounting plate positioned within the housing cavity, the first electrical terminal coupled to the first mounting plate, the first mounting plate configured to couple to a second mounting plate by engaging at least one claw with at least one radial lug to connect the first electrical terminal in electrical communication with a second electrical terminal coupled to the second mounting plate.

The invention provides a high-speed communication memory card edge connector, which comprises an insulating body provided with a lengthwise slot which is concavely arranged downwards from the top surface and is used for inserting an electronic module, and a plurality of terminal slots are respectively arranged in lengthwise side walls on two sides of the slot; the plurality of terminals are respectively accommodated in the corresponding terminal grooves in the two lengthwise side walls in a one-to-one correspondence manner, at least one part of the terminal grooves are internally provided with double-layer terminals, the rest of the terminal grooves are internally provided with single-layer terminals, and each single-layer terminal is fixed in the corresponding terminal groove in a plug-in mounting manner; at the position of the double-layer terminal, two terminals in each terminal groove and a plug piece are formed together in an embedded manner, and the plug piece is inserted and fixed in the terminal groove; according to the high-speed communication memory card edge connector, the assembly error rate can be reduced, the manufacturing cost can be reduced, and signal transmission channels can be increased, so that the signal transmission speed is greatly improved.

An acoustic wave device, a radio frequency filter and an electronics module are provided. The acoustic wave device, comprises a layer of piezoelectric material, a pair of interdigital transducer electrodes disposed on an upper surface of the layer of piezoelectric material, each interdigital transducer electrode including a bus bar and a plurality of electrode fingers extending from the bus bar through a central region of the interdigital transducer electrode towards an edge region of the interdigital transducer electrode, each of the plurality of electrode fingers having a width in a direction perpendicular to the extension of the electrode fingers that is smaller in the edge regions than in the central regions, and trench portions located in the upper surface of the layer of piezoelectric material, the trench portions overlapping with the edge regions of the interdigital transducer electrodes. The acoustic wave device provides effective suppression of transverse modes.

A work glove including a dorsal section, a strap section, a trigger and a holder for an electronic module. The dorsal section includes a first opening on the side-of-the-hand edge and the strap section extends from the thumb-side edge or the dorsal section includes a first opening on the thumb-side edge and the strap section extends from the side-of-the-hand edge of the dorsal section. The strap section passes through the first opening and a portion of the strap section that passed through the first opening fastens the dorsal section detachably. Moreover, a wearable sensor device is shown.

A flexible wiring board includes a plurality of signal lines, a shielding layer disposed to overlap with the plurality of signal lines in a planar view, and an insulating member disposed on a side opposite to a side where the shielding layer for the plurality of signal lines is disposed. The shielding layer is provided with openings. The shielding layer includes a first region having an opening ratio higher than a predetermined value and a second region having an opening ratio lower than the opening ratio of the first region. The second region is disposed at a position where the second region overlaps with the insulating member and the plurality of signal lines in a planar view. A boundary between the first region and the second region is disposed via a space to the insulating member in a planar view.

The invention provides an electronic assembly and electronic equipment, the electronic assembly comprises an electronic module and a structural member, a welding layer is arranged between the electronic module and the structural member, and the welding layer is used for connecting the electronic module and the structural member. Wherein the welding layer comprises a thinning area and a thickening area, and the thickness of the thickening area is larger than that of the thinning area, so that the stress of the welding layer is reduced, the connection reliability between the electronic module and the structural part is improved, and the temperature cycle fatigue life of the welding structure is prolonged. The thickening area is located in the edge area of the welding layer, the stress of the edge area of the welding layer is usually large, and the thickening area is arranged in the edge area of the welding layer, so that the stress of the welding layer is reduced. According to the scheme, the thickness of the thinning area in the middle of the welding layer is small, the distance between the electronic module and the structural part is small, and miniaturization of the electronic assembly can be achieved. And when the structural member is the radiator, the thermal resistance between the radiator and the electronic module is relatively small, so that the heat conduction efficiency between the radiator and the electronic module can be improved.

A chassis includes a base and a modular panel section having vertical support members, a horizontal support structure, partition brackets, and bracket mounting locations. The vertical support members are coupled to the base to define an opening therebetween. The horizontal support structure extends between and coupled to the vertical support members to divide the opening into a first region and a second region. The bracket mounting locations are defined in the first and / or second regions, and each bracket mounting location includes mounting elements configured to connect one of the partition brackets to the base and / or the horizontal support structure. The partition brackets are disposed at respective bracket mounting locations and removably coupled to the base and / or to the horizontal support structure and divide the first and / or second regions into bays. Each bay is configured to receive and allow an electronic module to be electrically connected to an information processing device.

A power electronics module and a method of installation are presented. The power electronics module has: a first circuit board having an uppermost layer, an intermediate layer, and a lowermost layer; a second circuit board having an uppermost layer, an intermediate layer, and a lowermost layer; a high-side line having a power semiconductor formed as a high-side switch; and a low-side line having a power semiconductor formed as a low-side switch, the first circuit board and the second circuit board being arranged opposite each other such that the uppermost layers face each other, the uppermost layer of the first circuit board serving as an AC coupling portion, the uppermost layer of the second circuit board being structured such that it serves as a DC negative coupling portion and a DC positive coupling portion, the power semiconductors formed as high-side switches and the power semiconductors formed as low-side switches are arranged such that their AC connections point to and are in contact with the uppermost layer of the first circuit board, and the DC connections of the power semiconductors point to and are in contact with the uppermost layer of the second circuit board.

A shielding device is suitable for applying in an electronic module arranged on a mainboard of an electronic device having a housing baseboard. The mainboard is provided with a connector. The shielding device includes a fixing frame and a shielding cover. The fixing frame is provided with an accommodating space suitable for accommodating the connector and the electronic module. The fixing frame includes two first side walls, two second side walls, and a press plate connecting to one of the two first side walls and covering the connector. A part of the press plate is covered by the housing baseboard. The shielding cover is pivotally connected to one side, away from the press plate, of the fixing frame and may be opened or closed relative to the fixing frame. The electronic module is exposed through opening of the shielding cover and is shielded through closing of the shielding cover.

A seat post assembly includes a seat post that is electrically adjustable in height. The adjustability may be based on one or more pressures sensed by one or more sensors within the seat post assembly, respectively. The disclosed seat post assembly includes an electronics module. The electronics module may be carried under the seat or saddle and may include a pressure sensor or pressure sensor circuitry.

Certain aspects of the present disclosure provide a monitoring system comprising a continuous analyte sensor configured to penetrate a skin of a patient and generate a sensor current indicative of analyte levels of the patient, and a sensor electronics module coupled to the continuous analyte sensor. The sensor electronics module comprises an analog to digital converter configured to receive the sensor and convert the sensor current generated by the continuous analyte sensor into digital signals, one or more processors configured to convert the digital signals to a set of analyte measurements indicative of the analyte levels of the patient, and a Bluetooth antenna configured to transmit the set of analyte measurements wirelessly to a wireless communications device using Bluetooth or BLE communications protocols.

The invention relates to a quick dismounting device of an electronic module and a dismounting method thereof, belongs to the technical field of module installation, and solves the problems of inconvenient installation and unreliable fixation of a vehicle-mounted electronic module in the prior art. The quick release device of the electronic module comprises a mounting plate, a seat plate, a guide strip, a locking assembly, an unlocking assembly, a guide block and a limiting block, wherein the seat plate and the guide strip are arranged on the mounting plate, and the guide block and the limiting block are arranged on a module shell. Two parallel guide strips are arranged on the mounting plate; a guide groove is formed in the guide strip; the guide block is in sliding fit with the guide groove, when the limiting block makes contact with the base plate, the locking assembly is used for limiting the guide block, the module shell is locked to the mounting plate, and the unlocking assembly is used for relieving the locking effect of the locking assembly. According to the invention, rapid mounting and dismounting of the electronic module are realized, and the stability in a mounting state is ensured.

An electronic rodent trap and monitoring method is provided. Each trap has at least one entrance, and preferably two entrances in opposed relationship to create a longitudinal tunnel, with a pair of lower plates extending longitudinally and oriented in spaced substantially parallel relationship, and a triggering element, such as a third plate, positioned above the lower plates, and preferably adjacent the ceiling of the trap on a center baffle that also shields a bait cup. The trap is activated when the rodent, with its left and right feet on the parallel lower plates, which are preferably raised above the floor, contacts the triggering element on the center baffle. The trap is preferably modular in design with an electronics module and a tunnel module removably secured within and protected by an outer housing. The trap also has improved features for more accurate remote monitoring of rodent dispatch and kill verification.

An intelligent electric drill includes a case which has an MCU control unit, a drive unit, a power unit, and a data unit. The MCU control unit controls the power, speed, and torque of the drive unit. A mechanical speed mode recognition module group is electrically connected to the MCU control unit and includes a speed mode recognition electronic module and a plastic speed mode module within the case. The mechanical speed mode recognition module group determines the switching position of the plastic speed mode module, and the speed mode recognition electronic module inputs the determined signal to the MCU control unit. This allows users to automatically recognize the positions of mechanical speed mode and function mode while driving with the electric drill. Users can drive with accurate and appropriate power, achieving precise output of speed, torque, and workload.

Embodiments of the present disclosure are directed to miniature insulin patch pump, assistance devices (e.g., for reservoir filling and / or cannula insertion), and methods related thereto. For example, in some embodiments, a substance / drug-delivery patch pump is provided and includes a reusable part (RP) including a power source, a driving mechanism, and an electronic module, and a disposable part (DP), where the disposable part can include at least a plurality of an adhesive base, a reservoir, a dosing mechanism, and a cannula.

The invention relates to a pouring sealant pouring device and method applied to PCBA electronic module sealing, a preheating bin is used for preheating pouring sealant and a to-be-poured PCBA electronic module, so that the flowability of the pouring sealant after pouring is improved, it is ensured that the pouring sealant can completely wrap all electronic elements of the PCBA electronic module, and meanwhile due to the good flowability, the pouring sealant can be prevented from falling off due to the good flowability. The pouring sealant can effectively discharge gas generated in the pouring process, in the normal-temperature environment between the preheating bin and the drying bin, the PCBA electronic module subjected to pouring is slowly cooled, meanwhile, the pouring sealant continues to discharge gas and finally enters the drying bin, the pouring sealant is rapidly cured through high temperature, the curing speed of the pouring sealant is shortened, and the production efficiency of the PCBA electronic module is improved. And finally, the technical effects of improving the encapsulation exhaust effect and the encapsulation speed of the PCBA electronic module are achieved. The technical problem that the curing speed and the exhaust effect are difficult to consider in the pouring sealant curing process is effectively solved.

The invention provides an embedded evaluation system based on a rule engine and virtual simulation, which comprises a simulation model module used for simulating behaviors of embedded equipment and a circuit system thereof and providing a virtual test environment to simulate different hardware conditions, input signals and fault conditions; the rule engine module is used for triggering an action or making an intelligent decision according to a preset rule; wherein data in the simulation process are monitored in real time through the rule engine module, and whether a circuit system is in a normal working state or not is judged according to a rule; the user front-end module is used for configuring a simulation model through the user front-end module, defining an evaluation rule, displaying a simulation phenomenon and outputting an evaluation result; before simulation is started, the simulation model module sends all basic rules of the microcontroller and the electronic module involved in simulation to the rule engine module, and a rule base is formed. According to the invention, the problems of high evaluation cost, long period, poor flexibility and the like of an embedded system in the prior art can be solved.