125 results about "Pin group" patented technology

The invention discloses a combination type power strip. The combination type power strip comprises a socket head and one or more socket bodies, wherein the socket head is provided with a power line connected with a mains supply and a slot group, the slot group comprises a clamping groove and a conducting strip slot, each socket body is provided with a socket aperture, a slot group and a clamping pin group, each clamping pin group comprises a conducting strip and a clamping hook, each conducting strip is matched with the conducting strip slot, and each clamping hook is matched with the clamping groove. According to the combination type power strip, jacks of the power strip can be combined in number according to specific requirements, the power strip is flexible in application and can meet different requirements for electric equipment numbers, and the space occupation caused by surplus socket apertures or access of another power strip due to insufficient socket apertures can be avoided. The combination type power strip is reasonable in structural design, safe, reliable, convenient to use, attractive in appearance and widely applicable to families, factories, public places and the like.

The invention discloses an industrial computer plug device driven by wheel gears and racks. The industrial computer plug device comprises a slot frame body (1), a slot (2) fixedly connected with the slot frame body (1), and a plug (12); a connector part (13) is arranged on the tail end of the plug (12), the coupling end surface of the connector part (13) is fixed with a contact pin group (14), an end panel (24) spliced with the coupling end surface is arranged on the tail end of the slot (2), and a jack group matching the contact pin group (14) is arranged in the slot (2).

The invention discloses an industrial computer plug device with an electrification indicating lamp. The industrial computer plug device comprises a slot rack body (1), a slot (2) and a plug (12), wherein the slot (2) is fixedly connected with the slot rack body; a connecting head part (13) is arranged at the tail end of the plug (12); a pin group (14) is fixedly arranged on the connecting end surface of the connecting head part (13); an end panel (24) which can be jointed with the connecting end surface is arranged at the tail end of the slot (2); a contact sensor (9) is arranged at an intermediate position of the end panel (24); a jack group which can be matched with the pin group (14) is arranged in the slot (2); and an LED indicating lamp (4) is arranged on the left upper side of the slot rack body (1) and is connected with the contact sensor (9).

The invention provides a circuit board plugging assembly with a cylindrical contact pin group. The circuit board plugging assembly comprises a circuit board device (9) and an interface device (8) arranged on the left side of the circuit board device (9). The interface device (8) comprises a housing formed by an upper contour portion (81) and a lower contour portion (82). The position of the plate body of the circuit board device (9), adjacent to the inner side of the housing, is provided with a contact pin group (99), used to join with a jack group (72) on a plug (7) which is inserted in the interface device (8) between the upper contour portion (81) and the lower contour portion (82). The number of contact pins (3) in the contact pin group (72) and the number of jacks (4) in the jack group (99) are seven. The contact pins (3) and the jacks (4) are in cylindrical shape. The diameter of the contact pin (3) is slightly smaller than the diameter of the jack (4), so that the contact pin (3) can be conveniently inserted into the jack (4) to join with the jack. The upper contour portion (81) and the lower contour portion (82) are respectively joined with rollers (80) on an upper sliding block assembly (83) and a lower sliding assembly (84).

A method of layout of a driving chip of an LCD, for reducing a size of the LCD, includes forming a first pin group including a plurality of pins utilized for outputting gate driving signals along a first direction, forming a second pin group including a plurality of pins utilized for outputting gate driving signals along the first direction, forming a first wire group including a plurality of wires each coupled between a pin of the first pin group and a panel of the LCD, and forming a second wire group including a plurality of wires each coupled between a pin of the second pin group and the panel, wherein each wire of the second wire group includes at least a bender formed inside the driving chip.

The invention provides an encapsulated structure which is provided with a multisection type bus bar and stacked in a staggered manner in a lead frame. The encapsulated structure comprises the lead frame which is composed of a plurality of oppositely arranged inner pin groups, a plurality of outer pin groups and a chip support plate, wherein, the chip support plate is disposed among the plurality of oppositely arranged inner pin groups, therefore, a height difference is produced between the plurality of oppositely arranged inner pin group and the chip support plate; a stack-type chip device is formed by stacking a plurality of chips, and disposed on the chip support plate; the plurality of chips are electrically connected with the plurality of oppositely arranged inner pin groups; and the encapsulating body is used for wrapping the stack-type chip device and the lead frame, wherein the lead frame includes at least a bus bar which is disposed between the plurality of oppositely arranged inner pin groups and the chip support plate, and formed in the manner of multiple sections.

A connector for connecting a host and a peripheral device is disclosed. The connector includes N pin groups and each of the N pin groups has different pin length, wherein N is a positive integer and is greater than or equal to 3. The first pin group consists of ground pins and has the longest pin length.

A heat exchanger comprises a plurality of plates (7, 9, 11, 13) each having first (15, 19) and second (17, 21) heat transfer surfaces on reverse sides. The plates are arranged in a stack with spacings between mutually facing heat transfer surfaces of adjacent plates. Alternate spacings in the stack providing respectively, a first fluid path (51, 52) for a first fluid and a second fluid path (57, 59) for a second fluid. The plates are arranged in a plurality of groups, each comprising at least two plates. Pin means are provided in the form of a plurality of groups of pins (23). The pins of each pin group are arranged to bridge plates of a respective plate group.

A method for eliminating noise interference and acoustic noise by a printed circuit board ground plane layout is disclosed. The method is applied to a circuit system having multiple outputs, wherein the circuit system has a first power converting module, a second power converting module and a printed circuit board. The first power converting module and the second power converting module respectively includes a first ground pin group and a second ground pin group. The method includes the steps of (a) connecting each ground pin of the first ground pin group to a respective solder point and connecting each solder point to a first node, and connecting each ground pin of the second ground pin group to a respective solder point and connecting each solder point to a second node, and (b) connecting the first node and the second node to a common node and connecting the common node to a solder point of a common ground terminal on the printed circuit board ground plane.

The invention discloses a sealant encapsulation structure of automotive electronic elements and a sealant sealing method thereof. The sealant encapsulation structure comprises a chip, a circuit board and a main body; the chip comprises a sensing element and a chip pin group; the circuit board comprises a substrate, a second connecting portion, a first connecting portion and the electronic elements; a pin group is formed inside the main body in an injection molding mode; a concaved chamber is formed in the main body; electronic element chambers and a chip chamber are formed in the concaved chamber; the chip is arranged in the chip chamber; the circuit board is arranged in the concaved chamber of the main body; the bottom surface of the substrate is attached to the bottom surface of the concaved chamber; every electronic element is inserted into the corresponding electronic element chamber; the second connecting portion is connected with the chip pin group; the first connecting portion is connected with the pin group of the main body; the sealant is injected into the concaved chamber twice, the sealant covers the circuit board and the natural high temperature curing is performed during first sealant injection, and the concaved chamber is filled with the sealant and the vacuum pumping high temperature curing is performed during second sealant injection. According to the sealant encapsulation structure of the automotive electronic elements and the sealant sealing method thereof, the damage to the electronic elements due to the high temperature curing due to the fact that the sealant flows into the electronic element chambers to cover the electronic elements can be effectively prevented, meanwhile the chip installation position is accurate, the sealing performance is good, the structure is simple, and the cost is low.

A pin-assignment method is provided for use on an IC package to arrange pin connections. The pin-assignment method can allow an improvement in the electro-static discharge (ESD) protection capability for the IC chip packed in the IC package. Specifically, the pin-assignment method organizes the no-connect pins of the IC package into groups and then assigns each of the two pins that bound each no-connect pin group to be connected to a power bus of the IC chip. This allows for an increased ESD protective capability for the no-connect pins. Moreover, the pin-assignment method can simplify the wiring complexity of the IC package.

The invention discloses an eye patch type eye massage device. The eye patch type eye massage device is characterized in that the left side and the right side of a first shell are symmetrically distributed, clamping slots are formed in the two sides of the interior of the first shell respectively, a circuit control panel is fixedly connected in each clamping slot, an EMS micro current control chipis fixed in each circuit control panel, and each EMS micro current control chip is connected with the corresponding circuit control panel by virtue of a signal; and a second shell is clamped and connected with the inner sides of the circuit control panels, the inner side of the second shell is fixedly connected with conductive adhesive, a positive conductive ejector pin group and a negative conductive ejector pin group are arranged on the circuit control panels, and the conductive ejector pins are connected with the conductive adhesive. The massage device disclosed by the invention has the advantages that an instruction is respectively conducted to respective EMS micro current control chips by virtue of the left circuit control panel and the right circuit control panel, the EMS micro current control chips conduct current at specific frequency and wave band onto the conductive adhesive, a micro current is formed after the conductive adhesive contacts skin, and a part contacted with theskin is designed by adopting silica gel and the conductive adhesive, so that the part fits the skin more flexibly, comfortableness during eye massage is greatly improved, the eyes are massaged by virtue of the micro current, and no physical damage is produced.

The invention relates to the technical field of transport devices, in particular to a shared bicycle transport device which comprises a transport vehicle. The shared bicycle transport device is characterized in that dampers which correspond to hydraulic cylinders are arranged on third fixing hinge pin groups, sliders are arranged on support frames, a fixing mechanism is jointly connected to the upper ends of rockers and the upper ends of the hydraulic cylinders and comprises side oblique plates, the side oblique plates are connected with the tops of the rockers and the tops of the hydraulic cylinders, the middles of the lower ends of the side oblique plates are slidably connected with the sliders, at least three handlebar fixing frames are arranged at the upper end of each side oblique plate, the middle handlebar fixing frame at the upper end of each side oblique plate is staggered from the other handlebar fixing frames at the upper end of the side oblique plate, shared bicycles are arranged on the handlebar fixing frames, and rear seat fixing blocks for constraining the shared bicycles are arranged on the side oblique plates. Compared with the prior art, the shared bicycle transport device has the advantages that transport management on the shared bicycles can be greatly improved, loading and unloading can be facilitated, accordingly, labor of workers can be relieved, the workefficiency can be improved, and the shared bicycle transport device is extremely high in practicality.

The invention provides a stacked chip encapsulation structure with a collecting bracket arranged on a lead frame, which includes a lead frame consisting of a plurality of inner pin groups arranged relatively, a plurality of outer pin groups and a chip bearing seat, wherein, the chip bearing seat is arranged among a plurality of inner pin groups arranged relatively and forms height difference withthe inner pin groups; the stacked chip device is formed by a plurality of chip stacks and arranged on the chip bearing seat and is electrically connected with the inner pin groups; and an encapsulation body, used to wrap the stacked chip device and the lead frame, wherein, the lead frame includes at least one collecting bracket and is arranged among the inner pin groups and the chip bearing seat.

The invention relates to an inclined pin structure which is used for shaping products with a large area of barbs inside. The inclined pin structure comprises a core that is provided with a plurality of inclined pin holes; an inclined pin group that comprises one or a plurality of inclined pins one-to-one corresponding to the inclined pin holes, and each inclined pin comprises an inclined pin lever and an inclined pin insert that is inserted and fixed near to the top of the inclined pin lever and is movably arranged in the corresponding inclined pin hole by the respective inclined pin lever. Excellently, the bottom of one or a plurality of inclined pin inserts is provided with one or a plurality of positioning parts respectively, and the core is provided with one or a plurality of positioning holes correspondingly. By adopting the inclined pin structure and the inclined pin insert that is inserted and fixed on the inclined pin lever, and a corresponding shape for barb shaping of products is formed by the inclined pin group formed by piecing together the inclined pins, thus achieving the purpose of shaping the products with a large area of barbs inside easily.

In one embodiment, the invention is a method for modeling electrical behavior of a packaged module having multiple integrated circuits (ICs), such as a multi-chip module (MCM). The method includes: (a) identifying one or more pin groups in the module, wherein a pin group comprises two or more buffers connected together and to a package-external pin, and (b) generating one or more corresponding unified behavioral models for the one or more pin groups based on the characteristics of the buffers of the one or more pin groups. The behavioral models are part of an integrated behavioral model file in accordance with the I/O buffer information specification (IBIS) standard.

The present invention belongs to the technical field of electronics, and discloses an interface. The interface comprises a plurality of base pins arranged in turn along a depth direction of the interface, the base pins comprise first base pin groups and second base pin groups, the first base pin groups are used for connection with an audio interface circuit while the second base pin groups are used for connection with a USB interface circuit, the first base pin groups and the second base pin groups also comprise public base pins, and the public base pins are connected with the audio interface circuit or the USB interface circuit through a switching circuit. A corresponding USB plug and a mobile terminal which are applied to the above interface are also provided. Plugged connection of the interface becomes simple and convenient, and size occupation of conventional USB interfaces is saved.