127 results about "Pin group" patented technology

A memory chip includes a plurality of pins. The plurality of pins are divided into two rows for arrangement on the opposite sides of the memory chip. All data I / O pins are arranged on one side surface (in the same row) of a package. In the case of forming a memory module, each chip is arranged such that the data I / O pins may be nearest to a center line of a module substrate parallel to a connect pin group. Thereby, interconnections between the respective memory chips and the connect pins have substantially equal lengths.

The invention discloses a combination type power strip. The combination type power strip comprises a socket head and one or more socket bodies, wherein the socket head is provided with a power line connected with a mains supply and a slot group, the slot group comprises a clamping groove and a conducting strip slot, each socket body is provided with a socket aperture, a slot group and a clamping pin group, each clamping pin group comprises a conducting strip and a clamping hook, each conducting strip is matched with the conducting strip slot, and each clamping hook is matched with the clamping groove. According to the combination type power strip, jacks of the power strip can be combined in number according to specific requirements, the power strip is flexible in application and can meet different requirements for electric equipment numbers, and the space occupation caused by surplus socket apertures or access of another power strip due to insufficient socket apertures can be avoided. The combination type power strip is reasonable in structural design, safe, reliable, convenient to use, attractive in appearance and widely applicable to families, factories, public places and the like.

The invention discloses an industrial computer plug device driven by wheel gears and racks. The industrial computer plug device comprises a slot frame body (1), a slot (2) fixedly connected with the slot frame body (1), and a plug (12); a connector part (13) is arranged on the tail end of the plug (12), the coupling end surface of the connector part (13) is fixed with a contact pin group (14), an end panel (24) spliced with the coupling end surface is arranged on the tail end of the slot (2), and a jack group matching the contact pin group (14) is arranged in the slot (2).

The invention discloses an industrial computer plug device with an electrification indicating lamp. The industrial computer plug device comprises a slot rack body (1), a slot (2) and a plug (12), wherein the slot (2) is fixedly connected with the slot rack body; a connecting head part (13) is arranged at the tail end of the plug (12); a pin group (14) is fixedly arranged on the connecting end surface of the connecting head part (13); an end panel (24) which can be jointed with the connecting end surface is arranged at the tail end of the slot (2); a contact sensor (9) is arranged at an intermediate position of the end panel (24); a jack group which can be matched with the pin group (14) is arranged in the slot (2); and an LED indicating lamp (4) is arranged on the left upper side of the slot rack body (1) and is connected with the contact sensor (9).

A connector for connecting a host and a peripheral device is disclosed. The connector includes N pin groups and each of the N pin groups has different pin length, wherein N is a positive integer and is greater than or equal to 3. The first pin group consists of ground pins and has the longest pin length.

The invention efficiently mounts substrates to back planes and accomplishes high quality signal transfer. Connectors to which N adaptor substrates are fitted and connectors to which M bus switch substrates are fitted are provided to a multi-layered back plane. Signal pin groups of the connector on the adaptor substrate side are grouped into M data paths. Signal pins of the connector on the adaptor substrate side and corresponding signal pins of the connector on the bus switch substrate side are arranged horizontally in such a fashion as to exist on the same plane (with positions in a Z direction being substantially equal). Therefore, wiring patterns for connecting corresponding signal pins can be formed substantially linearly and a large number of substrates can be efficiently mounted to a limited area.

The objective of this invention is to transport substrate to avoid coating film uneven on the glass substrate. In front and back of the support for resist coating processing components, the first transporter and the second transporter is arranged. The second transporter comprises plural rollers arrange at Y direction, holder for supporting rollers and track board for fixing holder. A rotary driver part makes rollers rotated and a horizontal driver part makes the holder advanced and retreated along Y direction is arranged on the holder. Lift pin groups lift free and independent for each other are arranged on the support. In the station of the glass substrate uplifted by lift pin groups, rollers enter under the glass substrate and take over it. The roller rotates and transports the glass substrate to back at low speed and recedes at the same time.

A driver integrated circuit chip adapted to electrically couple with a fan-out wiring area includes a side and a plurality of output pins formed at the side. The output pins includes a first pin group and a second pin group. The first pin group is electrically coupled to the fan-out wiring area. The second pin group is located at at least one side of the first pin group and opened. The present invention also provides display substrates of flat panel display each adapted to electrically couple with a plurality of driver integrated circuit chips.

The invention provides a circuit board plugging assembly with a cylindrical contact pin group. The circuit board plugging assembly comprises a circuit board device (9) and an interface device (8) arranged on the left side of the circuit board device (9). The interface device (8) comprises a housing formed by an upper contour portion (81) and a lower contour portion (82). The position of the plate body of the circuit board device (9), adjacent to the inner side of the housing, is provided with a contact pin group (99), used to join with a jack group (72) on a plug (7) which is inserted in the interface device (8) between the upper contour portion (81) and the lower contour portion (82). The number of contact pins (3) in the contact pin group (72) and the number of jacks (4) in the jack group (99) are seven. The contact pins (3) and the jacks (4) are in cylindrical shape. The diameter of the contact pin (3) is slightly smaller than the diameter of the jack (4), so that the contact pin (3) can be conveniently inserted into the jack (4) to join with the jack. The upper contour portion (81) and the lower contour portion (82) are respectively joined with rollers (80) on an upper sliding block assembly (83) and a lower sliding assembly (84).

A method of layout of a driving chip of an LCD, for reducing a size of the LCD, includes forming a first pin group including a plurality of pins utilized for outputting gate driving signals along a first direction, forming a second pin group including a plurality of pins utilized for outputting gate driving signals along the first direction, forming a first wire group including a plurality of wires each coupled between a pin of the first pin group and a panel of the LCD, and forming a second wire group including a plurality of wires each coupled between a pin of the second pin group and the panel, wherein each wire of the second wire group includes at least a bender formed inside the driving chip.

The invention provides an encapsulated structure which is provided with a multisection type bus bar and stacked in a staggered manner in a lead frame. The encapsulated structure comprises the lead frame which is composed of a plurality of oppositely arranged inner pin groups, a plurality of outer pin groups and a chip support plate, wherein, the chip support plate is disposed among the plurality of oppositely arranged inner pin groups, therefore, a height difference is produced between the plurality of oppositely arranged inner pin group and the chip support plate; a stack-type chip device is formed by stacking a plurality of chips, and disposed on the chip support plate; the plurality of chips are electrically connected with the plurality of oppositely arranged inner pin groups; and the encapsulating body is used for wrapping the stack-type chip device and the lead frame, wherein the lead frame includes at least a bus bar which is disposed between the plurality of oppositely arranged inner pin groups and the chip support plate, and formed in the manner of multiple sections.

A connector for connecting a host and a peripheral device is disclosed. The connector includes N pin groups and each of the N pin groups has different pin length, wherein N is a positive integer and is greater than or equal to 3. The first pin group consists of ground pins and has the longest pin length.

A heat exchanger comprises a plurality of plates (7, 9, 11, 13) each having first (15, 19) and second (17, 21) heat transfer surfaces on reverse sides. The plates are arranged in a stack with spacings between mutually facing heat transfer surfaces of adjacent plates. Alternate spacings in the stack providing respectively, a first fluid path (51, 52) for a first fluid and a second fluid path (57, 59) for a second fluid. The plates are arranged in a plurality of groups, each comprising at least two plates. Pin means are provided in the form of a plurality of groups of pins (23). The pins of each pin group are arranged to bridge plates of a respective plate group.

A heat exchanger comprises a plurality of plates (7, 9, 11, 13) each having first (15, 19) and second (17, 21) heat transfer surfaces on reverse sides. The plates are arranged in a stack with spacings between mutually facing heat transfer surfaces of adjacent plates. Alternate spacings in the stack providing respectively, a first fluid path (51, 52) for a first fluid and a second fluid path (57, 59) for a second fluid. The plates are arranged in a plurality of groups, each comprising at least two plates. Pin means are provided in the form of a plurality of groups of pins (23). The pins of each pin group are arranged to bridge plates of a respective plate group.

An electronic connector includes a transmission conductor group including two rows of plate-like contacts for insertion of a connector male portion in normal and reverse directions, a transmission conductor pin group, which is formed at a rear side of the transmission conductor group and arranged in a single row, a shielding housing, which receives therein the transmission conductor group, and an inclined cover section, which extends from the shielding housing to shield the transmission conductor pin group. As such, contacts of the transmission conductor group of the connector are provided in an arrangement of two rows so that mating between a male portion and a female portion can be made in a directionless manner, allowing for insertion in both normal and reverse directions. The transmission conductor pin group extending rearward from the transmission conductor group is set in an arrangement of a single row to maintain the convenience of manufacturing.

A lane jumper for transmitting at least one lane from a first interface to a second interface is disclosed. The at least one lane is connected with the first interface. The first interface defines a first pin group and a second pin group, and the second interface defines a third pin group connected with the second pin group. The lane jumper includes a fourth pin group and a fifth pin group, wherein the fourth pin group and the fifth pin group of the lane jumper are configured for being respectively connected with the first pin group and the second pin group. The at least one lane is transmitted from the first interface to the second interface sequentially through the first pin group, the fourth pin group, the fifth pin group, the second pin group, and the third pin group.

A method for eliminating noise interference and acoustic noise by a printed circuit board ground plane layout is disclosed. The method is applied to a circuit system having multiple outputs, wherein the circuit system has a first power converting module, a second power converting module and a printed circuit board. The first power converting module and the second power converting module respectively includes a first ground pin group and a second ground pin group. The method includes the steps of (a) connecting each ground pin of the first ground pin group to a respective solder point and connecting each solder point to a first node, and connecting each ground pin of the second ground pin group to a respective solder point and connecting each solder point to a second node, and (b) connecting the first node and the second node to a common node and connecting the common node to a solder point of a common ground terminal on the printed circuit board ground plane.

A memory module includes a plurality of ranks that each include a first pin group and a second pin group for receiving external pin signals, and a rank selecting unit included in each of the plurality of ranks, the rank selecting unit configured to output different rank pin signals to each rank by using signals of the first pin group.

A stack structure of a high frequency printed circuit, mainly includes a transmission conductor pin group in a form of single row, where each signal pair and each transmission pair of the transmission conductor pin group respectively have a through hole portion thereon, and the inner layer of the circuit board has a trace portion in electric connection with the through hole portion, allowing each four terminals to be formed into one group. Utilizing the clever arrangement of the through hole portions and trace portions separates each terminal properly, thereby increasing the property of transmitted signals, and, at the same time, reducing noise interferences such as EMI and RFI.

The invention discloses a sealant encapsulation structure of automotive electronic elements and a sealant sealing method thereof. The sealant encapsulation structure comprises a chip, a circuit board and a main body; the chip comprises a sensing element and a chip pin group; the circuit board comprises a substrate, a second connecting portion, a first connecting portion and the electronic elements; a pin group is formed inside the main body in an injection molding mode; a concaved chamber is formed in the main body; electronic element chambers and a chip chamber are formed in the concaved chamber; the chip is arranged in the chip chamber; the circuit board is arranged in the concaved chamber of the main body; the bottom surface of the substrate is attached to the bottom surface of the concaved chamber; every electronic element is inserted into the corresponding electronic element chamber; the second connecting portion is connected with the chip pin group; the first connecting portion is connected with the pin group of the main body; the sealant is injected into the concaved chamber twice, the sealant covers the circuit board and the natural high temperature curing is performed during first sealant injection, and the concaved chamber is filled with the sealant and the vacuum pumping high temperature curing is performed during second sealant injection. According to the sealant encapsulation structure of the automotive electronic elements and the sealant sealing method thereof, the damage to the electronic elements due to the high temperature curing due to the fact that the sealant flows into the electronic element chambers to cover the electronic elements can be effectively prevented, meanwhile the chip installation position is accurate, the sealing performance is good, the structure is simple, and the cost is low.

A pin-assignment method is provided for use on an IC package to arrange pin connections. The pin-assignment method can allow an improvement in the electro-static discharge (ESD) protection capability for the IC chip packed in the IC package. Specifically, the pin-assignment method organizes the no-connect pins of the IC package into groups and then assigns each of the two pins that bound each no-connect pin group to be connected to a power bus of the IC chip. This allows for an increased ESD protective capability for the no-connect pins. Moreover, the pin-assignment method can simplify the wiring complexity of the IC package.

An adapter board includes a PCB, a first gold finger mounted on the PCB, and a plurality of first connectors mounted on the PCB. The first gold finger includes a first ground pin and a plurality of power pin groups. Each first connector includes a load connection pin and a second ground pin electronically connected to the first ground pin, the load connecting pin of each first connector is electronically connected to a load, a oscilloscope, and a corresponding power pin group.

The invention discloses an eye patch type eye massage device. The eye patch type eye massage device is characterized in that the left side and the right side of a first shell are symmetrically distributed, clamping slots are formed in the two sides of the interior of the first shell respectively, a circuit control panel is fixedly connected in each clamping slot, an EMS micro current control chipis fixed in each circuit control panel, and each EMS micro current control chip is connected with the corresponding circuit control panel by virtue of a signal; and a second shell is clamped and connected with the inner sides of the circuit control panels, the inner side of the second shell is fixedly connected with conductive adhesive, a positive conductive ejector pin group and a negative conductive ejector pin group are arranged on the circuit control panels, and the conductive ejector pins are connected with the conductive adhesive. The massage device disclosed by the invention has the advantages that an instruction is respectively conducted to respective EMS micro current control chips by virtue of the left circuit control panel and the right circuit control panel, the EMS micro current control chips conduct current at specific frequency and wave band onto the conductive adhesive, a micro current is formed after the conductive adhesive contacts skin, and a part contacted with theskin is designed by adopting silica gel and the conductive adhesive, so that the part fits the skin more flexibly, comfortableness during eye massage is greatly improved, the eyes are massaged by virtue of the micro current, and no physical damage is produced.

The invention provides a stacked chip encapsulation structure with a collecting bracket arranged on a lead frame, which includes a lead frame consisting of a plurality of inner pin groups arranged relatively, a plurality of outer pin groups and a chip bearing seat, wherein, the chip bearing seat is arranged among a plurality of inner pin groups arranged relatively and forms height difference withthe inner pin groups; the stacked chip device is formed by a plurality of chip stacks and arranged on the chip bearing seat and is electrically connected with the inner pin groups; and an encapsulation body, used to wrap the stacked chip device and the lead frame, wherein, the lead frame includes at least one collecting bracket and is arranged among the inner pin groups and the chip bearing seat.

The invention relates to an inclined pin structure which is used for shaping products with a large area of barbs inside. The inclined pin structure comprises a core that is provided with a plurality of inclined pin holes; an inclined pin group that comprises one or a plurality of inclined pins one-to-one corresponding to the inclined pin holes, and each inclined pin comprises an inclined pin lever and an inclined pin insert that is inserted and fixed near to the top of the inclined pin lever and is movably arranged in the corresponding inclined pin hole by the respective inclined pin lever. Excellently, the bottom of one or a plurality of inclined pin inserts is provided with one or a plurality of positioning parts respectively, and the core is provided with one or a plurality of positioning holes correspondingly. By adopting the inclined pin structure and the inclined pin insert that is inserted and fixed on the inclined pin lever, and a corresponding shape for barb shaping of products is formed by the inclined pin group formed by piecing together the inclined pins, thus achieving the purpose of shaping the products with a large area of barbs inside easily.

An electronic connector includes a transmission conductor group including two rows of spring contacts for insertion into a connector female portion in normal and reverse directions, a transmission conductor pin group, which is formed at a rear side of the transmission conductor group and arranged in a single row, a circuit substrate, which is electrically connected to the transmission conductor pin group, a shielding housing, which receives therein the transmission conductor group, and an inclined cover section, which extends from the shielding housing to shield the transmission conductor pin group. As such, contacts of the transmission conductor group are provided in two rows so that mating between a male portion and a female portion can be made in a directionless manner, allowing for insertion in both normal and reverse directions. The transmission conductor pin group is set in an arrangement of a single row to maintain the convenience of manufacturing.

In one embodiment, the invention is a method for modeling electrical behavior of a packaged module having multiple integrated circuits (ICs), such as a multi-chip module (MCM). The method includes: (a) identifying one or more pin groups in the module, wherein a pin group comprises two or more buffers connected together and to a package-external pin, and (b) generating one or more corresponding unified behavioral models for the one or more pin groups based on the characteristics of the buffers of the one or more pin groups. The behavioral models are part of an integrated behavioral model file in accordance with the I / O buffer information specification (IBIS) standard.

The present invention belongs to the technical field of electronics, and discloses an interface. The interface comprises a plurality of base pins arranged in turn along a depth direction of the interface, the base pins comprise first base pin groups and second base pin groups, the first base pin groups are used for connection with an audio interface circuit while the second base pin groups are used for connection with a USB interface circuit, the first base pin groups and the second base pin groups also comprise public base pins, and the public base pins are connected with the audio interface circuit or the USB interface circuit through a switching circuit. A corresponding USB plug and a mobile terminal which are applied to the above interface are also provided. Plugged connection of the interface becomes simple and convenient, and size occupation of conventional USB interfaces is saved.

The present invention provides a package of line frame on stacked chips, and includes: a line frame consisted of several pairs of outer pins and several pairs of inner pins formed by several lines, and the several inner pins are divided into first inner pins group and second inner pins group, of which length of the first group is much longer than it of the second group; several semiconductor chip devices, and active surface of each chip is placed forward and interval to form offset-stack arrangement; the semiconductor chip device on top of the stack is fixed under the first inner pins group, and several semiconductor chip devices are electrically connected by the first inner pins group and the second inner pins group on small side.