5044results about "Rack/frame construction" patented technology

System and method for automatically obtaining the connectivity status, or map, of a cabling system in data and / or voice networks are disclosed. A suitable retrofit kit for this purpose comprises a plurality of upgraded patch cords for replacement of respective used patch cords through which scanning signals are forwarded by a scanning system and a plurality of adapter panels attached to a respective patch panel that includes for a connectivity status indicator and an electrical contact for mating with the corresponding electrical scanning contact of an upgraded patch cord. Scanning signals received by an electrical contact are processed to generate data that represents the current connectivity status, or map, of the cabling system. A plurality of adapter plugs for initializing the scanning system by a first connectivity status, or map, is also provided. Cabling system management is effected with the first and current connectivity status, or map.

A computer subassembly aspect is disclosed comprising a case defining an interior, a primary circuit board located in the interior of the case, and a BIOS chip socket mounted on the primary circuit board. The case has an opening formed therein that is aligned with a position of the BIOS chip socket on the primary circuit board to permit insertion of a BIOS chip into the BIOS chip socket through the opening. A method of assembling a computer is also disclosed that comprises assembling a subassembly of a laptop computer in a first location, with the subassembly including a BIOS chip socket for receiving a BIOS chip but lacking a BIOS chip, transporting the subassembly from the first location to a second location, and installing a BIOS chip into the BIOS chip socket of the subassembly when the subassembly is in the second location.

An integrally molded rack-mountable manager for managing the routing of cables along a network rack supporting electrical components having distinct rows of ports. The manager includes an integrally molded channel having a base portion and a pair of slotted side wall portions for retaining cables therein and managing the routing of the cables by providing optional routing through the channel and through slots defined by the slotted sidewalls. The integrally molded manager includes a rack-mounting portion configured for being connected to the network rack.

A rack for holding on its inside multiple electronic devices, which have fans for drawing outside air to inside the devices and exhaust ports for discharging air, including two pairs of support columns, the columns of each pair being placed parallel to one another in the front and the back at a pre-determined distance apart from one another, and air ducts for directing exhaust air from the above-mentioned exhaust ports of these electronic devices positioned between at least one pair of the two pairs of support columns, having a structure wherein there are side covers that cover the side surfaces, and the air ducts are installed between the pair of support columns between the side covers and the inside of the rack and are substantially formed from multiple panels adjacent to one another inside of the rack.

An SFP module includes a housing (1) and an ejector (70). An ejector seat (111) is formed in the housing for receiving the ejector. A triangular latch (114) is formed on the housing behind the ejector seat. The ejector includes a push bar (79) exposed forward of a front end (17) of the housing, and a tongue board (74). Two ejecting protrusions (741) are formed at a rear end of the tongue board, corresponding to a spring tab (611) of an SFP cage (6). The spring tab defines a retaining hole (613) for retaining the latch of the housing. When the SFP module is withdrawn from the cage, the push bar is pressed until the protrusions of the ejector have released the spring tab from the latch of the housing. The SFP module is then ejected from the cage by conventional spring means located in a rear of the cage.

A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.

A ground pad structure for preventing solder extrusion and a semiconductor package having the ground pad structure are disclosed, wherein the ground pad structure has the ground pads located along the circumference of its ground plane be formed in a non-solder mask defined manner. Accordingly, a good grounding quality is maintained, and the occurrence of the electrical bridging among the adjacent conductive traces can be avoided as the extrusion of the molten solder bumps from the ground pads located along the ground pad structure's circumference toward their adjacent conductive traces is effectively prevented.

A patch panel mountable to a network rack includes a patch panel frame and rack mounting plates. The frame forms a central section having a longitudinal width sized to fit within the network. The rack mounting plates are provided on opposite longitudinal ends of the central section and allow the panel to be mounted to a network rack. The central section includes two panel sections angled outwardly in an inverted V-Shape, and the central section has mounted thereon a plurality of cable connectors that receive cabling on the front side and the rear side of the patch panel frame. Each connector has a horizontal axis.

A monitor apparatus includes a monitor main body displaying a picture; a base member supporting the monitor main body; a connecting member combined to the base member, and supporting the monitor main body to be pivoted; a first guide plate having a first side pivotably combined to the connecting member, and a second side to be slidably combined to the monitor main body; a sliding unit provided between the first guide plate and the monitor main body and supporting the first guide plate to be slidable on the monitor main body; and a link unit having a first side combined to a rear side of the monitor main body and a second side combined with the connecting member, so that the monitor main body moves up and down with respect to the base member by sliding on the first guide plate when the first guide plate pivots with respect to the connecting member.

An anchoring member and related method are disclosed for substantially parallel assembly of two additional daughter printed circuit boards (PCB) and heat sink on each side of main of mother PCB, and to retain a predetermined mating distance thereto to retain a predetermined mating distance thereto. The anchoring member comprises an elongated body extending in a longitudinal direction and having a first coupling member on one end for coupling the first daughter board in a substantially perpendicular orientation to the longitudinal direction on a first side of the mother board. The elongated body also comprises a second coupling member at the opposite end from the elongated body from the first coupling member for coupling the second daughter board in a substantially perpendicular orientation to the longitudinal direction on a second side of the mother board. The elongated body also has a positioning flange for positioning the elongated body in an aperture of the mother board at an inserted position and a friction fit surface for interacting with the aperture of the mother board to secure the elongated body in the inserted position.