31results about "Circuit security details" patented technology

A secured control unit (100) for a system in a vehicle, wherein the control unit (100) comprises a control electronics (110) and a housing (120) enclosing the control electronics (110), and the control electronics (110) is configured to detect an opening of the housing (120) and to perform a security function based on this.

Electronic component comprising a printed circuit board (30) and an electronic component (10), in which - the electronic component (10) comprises a substrate (11), an encapsulation layer (13), an electronic structure (12) arranged between the substrate (11) and the encapsulation layer (13), and at least one first electrically conductive contact layer (14) arranged next to the encapsulation layer (13) on the substrate (11) and electrically connected to the electronic structure (12), - the printed circuit board (30) comprises a carrier layer (32) and at least one second electrically conductive contact layer (31), - the printed circuit board (30) is arranged next to the encapsulation layer (13) on the substrate (11), - the first electrically conductive contact layer (14) and the second electrically conductive contact layer (31) are electrically connected to each other, and - the carrier layer (32) and the encapsulation layer (13) each have at least one alignment structure (20) which interlock and define the position of the printed circuit board (30) to the electronic component (10) in at least one spatial direction, wherein - the encapsulation layer (13) and the support layer (32) have mutually facing end faces (231, 232) on which the at least one alignment structure (20) is formed, wherein the at least one alignment structure (20) on the encapsulation layer (13) has the contour of a recess (211, 212) or a tab (221, 222) and the at least one alignment structure (20) on the support layer (32) has the contour of a tab (221, 222) or a recess (211, 212), wherein the at least one alignment structure (20) on the encapsulation layer (13) extends in a principal extent plane of the encapsulation layer (13) and wherein the at least one alignment structure (20) on the support layer (32) extends in a principal extent plane of the support layer (32), and wherein the at least one alignment structure (20) on the carrier layer (32) and at least one alignment structure (20) on the encapsulation layer (13) are formed in such a way thatthat the tab (221, 222) can be inserted into the recess (211, 212), and , - the tab (221, 222) and / or the recess (211, 212) are designed in such a way that the tab (221, 222) at least partially releases itself from the recess (211, 212) under a predetermined tensile or compressive load.

According to non-limiting embodiments, a method is provided for forming a security barrier for an electronic device (104) under protection. The method includes depositing a deformable dielectric material layer (102) on the electronic device (104) under protection, and converting a portion of the deformable dielectric material layer into at least one electrical circuit structure (110, 111) having at least one measurable electrical property. The method further includes depositing a thermally stabilized material layer (112) on the deformable dielectric material layer (102).

A wired circuit board (1) is provided with a wiring section (2) and a first support section (3A) that supports one end of the wiring section (2). The wiring section (2) has a metal support layer (11), a conductor layer (12), a first insulating layer (13), and a wiring (143A). The ratio (T1 / W1) of the thickness (T1) of the metal support layer (11) to the width (W1) of the metal support layer (11) is less than 1. The conductor layer (12) is disposed on one surface (S1) of the metal support layer (11) in the thickness direction of the metal support layer (11).

The present application relates to the technical field of LED display, and discloses an LED module having through channels and conforming to certification standards of DCI and a display screen. The LED module includes a printed circuit board, the printed circuit board being provided with a plurality of first through channels, an inner peripheral side wall of the first through channel being provided with a first conductive layer, both sides of the printed circuit board being respectively provided with a conductive edge corresponding to the first through channel one to one, the conductive edge being disposed around a peripheral side of the first through channel and connected to the first conductive layer, and the first conductive layer being disposed in a grounding manner; and a supporting structure, which is disposed opposite to the printed circuit board and tightly connected to the printed circuit board, and has a plurality of second through channels, the supporting structure having a second conductive layer, and the second conductive layer being grounded and abutting against the conductive edge. The present application solves the problems for reducing blockage of the LED screen on sound and having a risk of data leakage.

The tamper detection system can include an organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated to form a cut in the organic material. A portion of the tamper detection circuit interrupts a fragment of the ablation path. The tamper detection circuit remains intact. The cut allows gas flow between a first side of the organic material and a second side of the organic material.

Printed circuit board, associated electronic device and manufacturing process. This printed circuit board (12) comprises several layers (15, 15') laminated one on top of the other and has a top face (14A). The board includes a via (20), which is formed through the board (12) and which includes a first metal barrel (21). The via (20) includes a second metal barrel (22), which is arranged in a first internal volume (V21) of the first barrel and is bonded to the first barrel by means of a first polymer resin (32). A top end (26A) of the second barrel is closer to the top face than a top end (24A) of the first barrel, the first barrel being suitable for connection to a first conductive element having a first electrical potential, while the second barrel is suitable for connection to a second conductive element having a second electrical potential, different from the first electrical potential. Figure for the abbreviation: Figure 3c)

A rigid-flex printed circuit board (PCB) includes at least one rigid PCB including at least one electrical component, a flex circuit, and a built-in diagnostic circuit. The flex circuit includes at least one end connected to the at least one rigid PCD. The flex circuit includes at least one signal trace configured to deliver an electrical signal to the at least one electrical component. The built-in diagnostic circuit is configured to detect a fault in the rigid-flex PCB.

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

Systems and methods for an optimized multipath loop system for detecting condition changes are provided. An example includes a system comprising a multipath loop component, wherein the multipath loop component includes a plurality of nested discontinuous conductive paths forming a parallel circuit component, and a logic circuit operationally coupled to the multipath loop component. The logic circuit can be configured to detect whether a continuous circuit path has been formed through at least one of the plurality of nested discontinuous conductive paths in response to at least one environmental condition within a region defined by the plurality of nested discontinuous conductive paths. The logic circuit can also be configured to output a signal indicating that the formation of the continuous circuit path has been detected.

To provide a system and a method for secure payment processing systems that interface flexibly and intuitively with a variety of mobile computing devices.SOLUTION: A POS device includes a nest portion and a cradle portion. The nest portion includes one or more payment cards or near field communication (NFC) readers. The cradle portion couples to interchangeable frames of different sizes that serve to secure a mobile computing device to the cradle portion of the POS device in turn. The mobile computing device is connected to the rest of the POS device via a connector. Payment card information read by the reader is transported to the mobile computing device via the connector for processing. The POS device may also include tamper detection circuitry.SELECTED DRAWING: Figure 1A

Integrated circuit physical security devices are disclosed, specifically devices and methods for physical chip security. In at least one embodiment, a security module is affixed to a board to restrict physical access to an integrated circuit mounted on the security module and provide one or more contacts that enable data access to the integrated circuit.

A circuit board assembly includes a first printed circuit board having at least one trace plane. The trace plane has a plurality of traces secured to a core material of the first printed circuit board. A security layer is included, where the security layer at least partially covers the at least one trace plane such that the security layer forms at least one of a ground shield and an electromagnetic shield over the at least one trace plane. In some implementations, the security layer is integral with a core material of the circuit board.

Systems and methods for optimizing a multipath loop system for conditional change detection are provided. Examples include a system comprising: a multi-path loop assembly comprising a plurality of staggered discontinuous conductive paths, the plurality of staggered discontinuous conductive paths forming a parallel circuit assembly; and a logic circuit operably coupled to the multipath loop component. The logic circuit may be configured to, in response to at least one environmental condition in a region defined by the plurality of staggered discontinuous conductive paths, detect whether a continuous circuit path has been formed by at least one of the plurality of staggered discontinuous conductive paths. The logic circuit may also be configured to output a signal indicating that the formation of the continuous circuit path has been detected.

An anti-tamper assembly is disclosed for a circuit board which comprises one or more electronic components. The assembly comprises a container having side walls, a first closed end and a second, opposing open end, the container being configured to be mounted on said circuit board at said open end, over at least one of the electronic components to form, in use, a sealed cavity around said at least one of said electronic components. The assembly further comprises a source of radioactive particles mounted within the container, an image sensor for capturing image frames within said sealed cavity, in use. The image sensor comprises a detector region defining an array of pixels, a screen member located, in use, within the cavity between the radioactive source and the detector, said screen member having at least one aperture, and a processor for retrieving said captured image frames, monitoring said image frames for changes in the statistical distribution of active pixels and, in the event that statistical distribution of active pixels indicates the presence of a feature in an image frame, generating a tamper alert.

Tamper detection assemblies and methods of manufacture are provided. A tamper detection assembly includes a laminate carrier having embedded tamper detection circuitry therein, and one or more electronic components on the laminate carrier. Further, the tamper detection assembly includes a heat sink cover. The heat sink cover includes a heat sink and a tamper detection circuit integrated within the heat sink cover. A heat sink cover is mounted to the laminate carrier and encapsulates the one or more electronic components between the laminate carrier and the heat sink cover. The embedded tamper detection circuitry of the laminate carrier and the integrated tamper detection circuitry of the heat sink cover together at least partially define a secure space around the one or more electronic components.

In-situ fabrication of tamper-respondent sensors with random security circuit patterns is provided. The method includes establishing a random security circuit pattern for fabricating a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components within a secure volume. The establishing includes generating a trace pattern extending once through nodes of a plurality of nodes dispersed within an area of the tamper-respondent sensor, and randomly modifying the trace pattern to produce a randomly modified trace pattern with a desired randomization index relative to a specified randomization threshold, and providing the randomly modified trace pattern as a random security circuit pattern. Further, the method includes initiating fabricating of the tamper-respondent sensor in-situ on a surface of an enclosure to facilitate defining the secure volume, with the fabricating using the random security circuit pattern.

Descripted herein may be a securely linked NFC device which may include a printed circuit board which may have a single NFC antenna and a plurality of individually selectable NFC chips designed for end user needs. Each NFC chip may be selected by use of a mechanical switch which may use non-metallic contacts that temporarily activates a single NFC chip at a time while leaving all other NFC chips deactivated. Said activation may occur by selectively closing a circuit on Printed Computer Board and using a variable circuit trace geometry to select electrically conductive paths which maintain impedance balance. This securely linked NFC device may enhance security of NFC uses because all NFC chips remain in a deactivated state until selected via mechanical selector from the end user.

A point of sale (POS) device includes a nest portion and a cradle portion. The nest portion includes one or more payment card or near field communication (NFC) readers. The cradle portion couples to differently-sized interchangeable frames, which in turn help secure a mobile computing device to the cradle portion of the POS device. The mobile computing device is connected via a connector to the rest of the POS device. Payment card information read by the readers is conveyed to the mobile computing device over the connector for processing. The POS device may also include tamper detection circuitry.

A method is provided to form a security barrier of an electronic device under protection (104). The method includes depositing a transformable dielectric material layer (102) on the electronic device under protection (104), and converting a target portion of the transformable dielectric material layer into at least one electrical circuit structure (110, 111) having at least one measurable electrical characteristic. The method further includes depositing a thermal stabilizing material layer (112) onto the transformable dielectric material layer (102).

This invention relates to a burn-out resistant packaging structure, a system-in-package module, and a packaging method, solving the problem of a short circuit in a power chip causing significant heat to spread to the motherboard and damage it. The burn-out resistant packaging structure is used for packaging a power chip package and a motherboard; it includes a self-protection structure and a soldering structure; the power chip package has a first pad on its lower surface; the self-protection structure includes an opening on its upper surface corresponding to the first pad, a through-hole extending from the opening to the lower surface of the self-protection structure, and a groove on the sidewall of the through-hole containing filler material; the soldering structure connects the first pad to a second pad on the upper surface of the motherboard through the through-hole and is in contact with the filler material, which absorbs the solder in the soldering structure in its molten state. This design enables timely disconnection of the power supply path between the motherboard and the power chip package when a short circuit occurs in the power chip, resulting in increased current and heat, thus protecting the motherboard from damage.

The tamper detection system can include an organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated to form a cut in the organic material. A portion of the tamper detection circuit interrupts a fragment of the ablation path. The tamper detection circuit remains intact. The cut allows gas flow between a first side of the organic material and a second side of the organic material.

The invention relates to a secured control unit (100) for a system in a vehicle, wherein the control unit (100) comprises control electronics (110) and a housing (120) enclosing the control electronics (110), and the control electronics (110) are designed to ascertain an opening of the housing (120) and to carry out a securing function on the basis thereof.

A wiring circuit board includes a wiring portion and a first support portion supporting one end portion of the wiring portion. The wiring portion has a metal support layer, a conductive layer, a first insulating layer, and a wiring. A ratio (T1 / W1) of a thickness T1 of the metal support layer to a width W1 of the metal support layer is below 1. The conductive layer is disposed on a one-side surface of the metal support layer in a thickness direction of the metal support layer.

A system for authentication of a product includes at least one printed circuit board. First and second printed circuit boards may each include near field communication circuits in communication with each other. A processor mounted on one of the printed circuit boards may read an identifier from each near field communication circuit and verify that the identifiers are identical. The at least one printed circuit board is mounted within a housing, where an interior surface of the housing may include a first security member. A second security member is mounted on the at least one printed circuit board. When the at least one printed circuit board is mounted within the housing, the first security member engages the second security member to positively retain the at least one printed circuit board to the housing.

A point of sale (POS) device includes a nest portion and a cradle portion. The nest portion includes one or more payment card or near field communication (NFC) readers. The cradle portion couples to differently-sized interchangeable frames, which in turn help secure a mobile computing device to the cradle portion of the POS device. The mobile computing device is connected via a connector to the rest of the POS device. Payment card information read by the readers is conveyed to the mobile computing device over the connector for processing. The POS device may also include tamper detection circuitry.

A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.

A system for authentication of a product includes at least one printed circuit board. First and second printed circuit boards may each include near field communication circuits in communication with each other. A processor mounted on one of the printed circuit boards may read an identifier from each near field communication circuit and verify that the identifiers are identical. The at least one printed circuit board is mounted within a housing, where an interior surface of the housing may include a first security member. A second security member is mounted on the at least one printed circuit board. When the at least one printed circuit board is mounted within the housing, the first security member engages the second security member to positively retain the at least one printed circuit board to the housing.