52results about "Circuit security details" patented technology

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

A secured control unit (100) for a system in a vehicle, wherein the control unit (100) comprises a control electronics (110) and a housing (120) enclosing the control electronics (110), and the control electronics (110) is configured to detect an opening of the housing (120) and to perform a security function based on this.

Various aspects of the disclosure generally relate to credit card processing readers and related security features. Part of those features include landing pads which may be vulnerable to certain attacks and tamper attempts. Some landing pads are more easily accessed (vulnerable) in a tamper attempt, than others. In one aspect, this disclosure recites a direct electrical connection between landing areas, where one of the landing areas is more accessible and the other is less accessible. This may reduce device vulnerability when both landing areas must be accessed in a tamper attempt.

Electronic component comprising a printed circuit board (30) and an electronic component (10), in which - the electronic component (10) comprises a substrate (11), an encapsulation layer (13), an electronic structure (12) arranged between the substrate (11) and the encapsulation layer (13), and at least one first electrically conductive contact layer (14) arranged next to the encapsulation layer (13) on the substrate (11) and electrically connected to the electronic structure (12), - the printed circuit board (30) comprises a carrier layer (32) and at least one second electrically conductive contact layer (31), - the printed circuit board (30) is arranged next to the encapsulation layer (13) on the substrate (11), - the first electrically conductive contact layer (14) and the second electrically conductive contact layer (31) are electrically connected to each other, and - the carrier layer (32) and the encapsulation layer (13) each have at least one alignment structure (20) which interlock and define the position of the printed circuit board (30) to the electronic component (10) in at least one spatial direction, wherein - the encapsulation layer (13) and the support layer (32) have mutually facing end faces (231, 232) on which the at least one alignment structure (20) is formed, wherein the at least one alignment structure (20) on the encapsulation layer (13) has the contour of a recess (211, 212) or a tab (221, 222) and the at least one alignment structure (20) on the support layer (32) has the contour of a tab (221, 222) or a recess (211, 212), wherein the at least one alignment structure (20) on the encapsulation layer (13) extends in a principal extent plane of the encapsulation layer (13) and wherein the at least one alignment structure (20) on the support layer (32) extends in a principal extent plane of the support layer (32), and wherein the at least one alignment structure (20) on the carrier layer (32) and at least one alignment structure (20) on the encapsulation layer (13) are formed in such a way thatthat the tab (221, 222) can be inserted into the recess (211, 212), and , - the tab (221, 222) and / or the recess (211, 212) are designed in such a way that the tab (221, 222) at least partially releases itself from the recess (211, 212) under a predetermined tensile or compressive load.

According to non-limiting embodiments, a method is provided for forming a security barrier for an electronic device (104) under protection. The method includes depositing a deformable dielectric material layer (102) on the electronic device (104) under protection, and converting a portion of the deformable dielectric material layer into at least one electrical circuit structure (110, 111) having at least one measurable electrical property. The method further includes depositing a thermally stabilized material layer (112) on the deformable dielectric material layer (102).

A wired circuit board (1) is provided with a wiring section (2) and a first support section (3A) that supports one end of the wiring section (2). The wiring section (2) has a metal support layer (11), a conductor layer (12), a first insulating layer (13), and a wiring (143A). The ratio (T1 / W1) of the thickness (T1) of the metal support layer (11) to the width (W1) of the metal support layer (11) is less than 1. The conductor layer (12) is disposed on one surface (S1) of the metal support layer (11) in the thickness direction of the metal support layer (11).

Provided is a component mount board which includes: a board having a base, a first conductive pattern, a mount component connected to the first conductive pattern, and a soluble layer; and a second conductive pattern, in which the soluble layer is soluble in liquid, and the second conductive pattern is soluble in liquid or is weakened when getting wet with liquid, the base has, in a portion of the base corresponding to the second conductive pattern, a first missing portion the first conductive pattern has a first portion and a second portion separated from the first portion through the first missing portion, the second conductive pattern connects, over the first missing portion, the first and second portions of the first conductive pattern to each other, and a portion of the second conductive pattern at least over the first missing portion is formed on a first surface of the soluble layer.

The invention discloses a safety circuit of financial equipment and a production method thereof. The production method comprises the following steps: S1, cleaning a shielding case of a POS machine; s2, printing a first insulating ink layer on the outer surface of the shielding cover by adopting a screen printing machine; s3, curing and drying the first insulating ink layer; s4, printing a first safety circuit layer on the surface of the first insulating ink layer by adopting a screen printing machine; s5, curing and drying the first safety circuit layer; s6, a second insulation ink layer is printed on the upper surface of the first safety circuit layer through the screen printing machine; according to the method, the metal shielding cover is adopted as a base material of the safety circuit, and the damage resistance of the circuit is remarkably improved. As the metal material has higher hardness and toughness, the substrate is difficult to damage by external force to cause a damage point, so that the risk that the equipment is illegally disassembled and information is leaked is effectively prevented.

Descripted herein may be a securely linked NFC device which may include a printed circuit board which may have a single NFC antenna and a plurality of individually selectable NFC chips designed for end user needs. Each NFC chip may be selected by use of a mechanical switch which may use non-metallic contacts that temporarily activates a single NFC chip at a time while leaving all other NFC chips deactivated. Said activation may occur by selectively closing a circuit on Printed Computer Board and using a variable circuit trace geometry to select electrically conductive paths which maintain impedance balance. This securely linked NFC device may enhance security of NFC uses because all NFC chips remain in a deactivated state until selected via mechanical selector from the end user.

The present application relates to the technical field of LED display, and discloses an LED module having through channels and conforming to certification standards of DCI and a display screen. The LED module includes a printed circuit board, the printed circuit board being provided with a plurality of first through channels, an inner peripheral side wall of the first through channel being provided with a first conductive layer, both sides of the printed circuit board being respectively provided with a conductive edge corresponding to the first through channel one to one, the conductive edge being disposed around a peripheral side of the first through channel and connected to the first conductive layer, and the first conductive layer being disposed in a grounding manner; and a supporting structure, which is disposed opposite to the printed circuit board and tightly connected to the printed circuit board, and has a plurality of second through channels, the supporting structure having a second conductive layer, and the second conductive layer being grounded and abutting against the conductive edge. The present application solves the problems for reducing blockage of the LED screen on sound and having a risk of data leakage.

The tamper detection system can include an organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated to form a cut in the organic material. A portion of the tamper detection circuit interrupts a fragment of the ablation path. The tamper detection circuit remains intact. The cut allows gas flow between a first side of the organic material and a second side of the organic material.

A radio device (10) with tamper protection is described. The radio device (10) comprises a housing (14). The housing (14) comprises a first housing part (22) and a second housing part (24), which are movable relative to one another. The contact mechanism (28) comprises a first contact (30), a second contact (32), and an electrically insulating separating element (34). The separating element (34) is connected to the second housing part (24) such that the separating element (34) is removable from the contact area between the first contact (30) and the second contact (32) when the second housing part (24) is moved relative to the first housing part (22), whereby the first contact (30) and the second contact (32) come into contact with one another. A processing circuit (26) is connected to the contact mechanism (28) and configured to execute a response when the first contact (30) and the second contact (32) come into contact with one another.

Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

This invention provides a composite PCB for an energy storage battery module with integrated overcurrent protection and current collection, comprising an FR-4 substrate and a copper plate, the copper plate being bonded to the FR-4 substrate. The FR-4 substrate has multiple locking holes, arranged in groups of two, in multiple rows. Each group of locking holes is fitted with a fuse structure in series and parallel, and the multiple fuse structures surround the outer periphery of the copper plate. The copper plate has elongated sections, with multiple current collection nodes protruding at intervals on both the inner and outer sides of the sections, each current collection node located between two adjacent locking holes. The composite PCB for an energy storage battery module of this invention has a simple structure, good electrical performance, and low manufacturing cost.

A method is provided to form a security barrier of an electronic device under protection. The method includes depositing a transformable dielectric material layer on the electronic device under protection, and converting a target portion of the transformable dielectric material layer into at least one electrical circuit structure having at least one measurable electrical characteristic. The method further includes depositing a thermal stabilizing material layer onto the transformable dielectric material layer.

Printed circuit board, associated electronic device and manufacturing process. This printed circuit board (12) comprises several layers (15, 15') laminated one on top of the other and has a top face (14A). The board includes a via (20), which is formed through the board (12) and which includes a first metal barrel (21). The via (20) includes a second metal barrel (22), which is arranged in a first internal volume (V21) of the first barrel and is bonded to the first barrel by means of a first polymer resin (32). A top end (26A) of the second barrel is closer to the top face than a top end (24A) of the first barrel, the first barrel being suitable for connection to a first conductive element having a first electrical potential, while the second barrel is suitable for connection to a second conductive element having a second electrical potential, different from the first electrical potential. Figure for the abbreviation: Figure 3c)

A rigid-flex printed circuit board (PCB) includes at least one rigid PCB including at least one electrical component, a flex circuit, and a built-in diagnostic circuit. The flex circuit includes at least one end connected to the at least one rigid PCD. The flex circuit includes at least one signal trace configured to deliver an electrical signal to the at least one electrical component. The built-in diagnostic circuit is configured to detect a fault in the rigid-flex PCB.

To provide a printed circuit board that comprises a main printed circuit board and a flexible printed circuit board where a damper detection pattern is formed, and that can make compact the structure for ensuring the security of the main printed circuit board.SOLUTION: A flexible printed circuit board 3 of a printed circuit board comprises a box part 3a formed in a box shape, and fixed parts 3b to 3d spreading on an outer peripheral side of the box part 3a. Internal lands 35 to 38 forming one end part of a tamper detection part are electrically connected to the main printed circuit board and arranged inside the box part 3a, and external lands 45 to 48 forming the other end part of the tamper detection part are formed at the fixed parts 3b to 3d, fixed to the main printed circuit board, and also electrically connected to the main printed circuit board. The external lands 45 to 48 are insulated from one another, and the external lands 45 to 48 are not electrically connected to other external lands 45 to 48.SELECTED DRAWING: Figure 4

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

Systems and methods for an optimized multipath loop system for detecting condition changes are provided. An example includes a system comprising a multipath loop component, wherein the multipath loop component includes a plurality of nested discontinuous conductive paths forming a parallel circuit component, and a logic circuit operationally coupled to the multipath loop component. The logic circuit can be configured to detect whether a continuous circuit path has been formed through at least one of the plurality of nested discontinuous conductive paths in response to at least one environmental condition within a region defined by the plurality of nested discontinuous conductive paths. The logic circuit can also be configured to output a signal indicating that the formation of the continuous circuit path has been detected.

To provide a system and a method for secure payment processing systems that interface flexibly and intuitively with a variety of mobile computing devices.SOLUTION: A POS device includes a nest portion and a cradle portion. The nest portion includes one or more payment cards or near field communication (NFC) readers. The cradle portion couples to interchangeable frames of different sizes that serve to secure a mobile computing device to the cradle portion of the POS device in turn. The mobile computing device is connected to the rest of the POS device via a connector. Payment card information read by the reader is transported to the mobile computing device via the connector for processing. The POS device may also include tamper detection circuitry.SELECTED DRAWING: Figure 1A

Integrated circuit physical security devices are disclosed, specifically devices and methods for physical chip security. In at least one embodiment, a security module is affixed to a board to restrict physical access to an integrated circuit mounted on the security module and provide one or more contacts that enable data access to the integrated circuit.

An anti-fuse apparatus (100) for enabling or disabling features associated with one or more integrated circuits (IC) set into a substrate (110) includes a layer of low melting point dielectric material (102) deposited above and / or between two conductive pads (114, 116) set into the substrate (110) and not otherwise electrically coupled. A layer of a low melting point conductive alloy (104) is deposited above the dielectric layer (102), and a layer of an energetic material (106) deposited above the conductive alloy layer. The energetic material (106) is connected to an ignition circuit (120) for triggering a thermal reaction within the energetic material (106), removing the dielectric layer (102) and melting the conductive alloy (104) to electrically bridge the conductive pads (114, 116), enabling or disabling features associated with the ICs (or providing tamper-proof identification strapping) without otherwise fracturing or damaging the underlying substrate or ICs set thereinto.

A circuit board assembly includes a first printed circuit board having at least one trace plane. The trace plane has a plurality of traces secured to a core material of the first printed circuit board. A security layer is included, where the security layer at least partially covers the at least one trace plane such that the security layer forms at least one of a ground shield and an electromagnetic shield over the at least one trace plane. In some implementations, the security layer is integral with a core material of the circuit board.

A structure for circuitry for securing an area against tampering is disclosed. The structure includes circuitry having at least one of a top tamper enclosure and a bottom tamper enclosure that cover components in a protected area of ​​the circuitry. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry, and tear initiation sites are added to sides of a perimeter of the circuitry that borders the protected area including the at least one tamper enclosure, such that the tear initiation sites are positioned and configured to allow propagation of delamination of at least one internal layer of the circuitry and severance of the security circuit when a removal force is applied to at least one of the top tamper enclosure and the bottom tamper enclosure.

Systems and methods for optimizing a multipath loop system for conditional change detection are provided. Examples include a system comprising: a multi-path loop assembly comprising a plurality of staggered discontinuous conductive paths, the plurality of staggered discontinuous conductive paths forming a parallel circuit assembly; and a logic circuit operably coupled to the multipath loop component. The logic circuit may be configured to, in response to at least one environmental condition in a region defined by the plurality of staggered discontinuous conductive paths, detect whether a continuous circuit path has been formed by at least one of the plurality of staggered discontinuous conductive paths. The logic circuit may also be configured to output a signal indicating that the formation of the continuous circuit path has been detected.

A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.

An anti-tamper assembly is disclosed for a circuit board which comprises one or more electronic components. The assembly comprises a container having side walls, a first closed end and a second, opposing open end, the container being configured to be mounted on said circuit board at said open end, over at least one of the electronic components to form, in use, a sealed cavity around said at least one of said electronic components. The assembly further comprises a source of radioactive particles mounted within the container, an image sensor for capturing image frames within said sealed cavity, in use. The image sensor comprises a detector region defining an array of pixels, a screen member located, in use, within the cavity between the radioactive source and the detector, said screen member having at least one aperture, and a processor for retrieving said captured image frames, monitoring said image frames for changes in the statistical distribution of active pixels and, in the event that statistical distribution of active pixels indicates the presence of a feature in an image frame, generating a tamper alert.

Tamper detection assemblies and methods of manufacture are provided. A tamper detection assembly includes a laminate carrier having embedded tamper detection circuitry therein, and one or more electronic components on the laminate carrier. Further, the tamper detection assembly includes a heat sink cover. The heat sink cover includes a heat sink and a tamper detection circuit integrated within the heat sink cover. A heat sink cover is mounted to the laminate carrier and encapsulates the one or more electronic components between the laminate carrier and the heat sink cover. The embedded tamper detection circuitry of the laminate carrier and the integrated tamper detection circuitry of the heat sink cover together at least partially define a secure space around the one or more electronic components.