2results about "Printed circuit dielectrics" patented technology

A package substrate with an embedded device and a manufacturing method therefor are disclosed. The method includes: manufacturing a third circuit layer and a target on a temporary carrier plate, and laminating a third dielectric layer; placing a device to be embedded on the third dielectric layer which is then covered with a second dielectric layer; laminating a second copper foil and manufacturing a second circuit layer, a second copper pillar, and a third copper pillar; laminating a first dielectric layer and a first copper foil sequentially, and removing the temporary carrier plate; laminating a fourth dielectric layer on the third circuit layer; laminating a fourth copper foil on the fourth dielectric layer; and manufacturing a fourth circuit layer and a fourth copper pillar through the fourth copper foil, and manufacturing a first circuit layer and a first copper pillar through the first copper foil.

An electronic device is provided. The electronic device includes: a display having a first surface; a metal frame structure configured to form a side surface of the electronic device; a back plate having a second surface facing a third direction; at least one antenna module disposed within the side surface and having a radiating surface; at least one dielectric layer having at least a partial area attached to the radiating surface; and a wireless communication circuit configured to transmit or receive radio frequency (RF) signals to or from the at least one antenna module, wherein the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, wherein the first dielectric sheet is made of a thermally conductive material having a first dielectric constant, and the second dielectric sheet is made of a material having a second dielectric constant greater than the first dielectric constant.