6results about "Printed circuit dielectrics" patented technology

To provide a method for manufacturing an embedded device package substrate, a package substrate, and a semiconductor, capable of improving bonding force of material and reducing risk of stratification due to subsequent heating.SOLUTION: A method for manufacturing an embedded device package substrate comprises the steps of: forming a first circuit layer; laminating a first photosensitive layer onto the first circuit layer; disposing an embedded device on the first photosensitive layer, where a pin surface of the embedded device is disposed opposite to the first photosensitive layer; disposing a second photosensitive layer, where the second photosensitive layer covers the embedded device; partially removing the first dielectric layer such that minimum thickness of the first dielectric layer covering a side surface of the embedded device is greater than or equal to a preset threshold; disposing a second dielectric layer, where the second dielectric layer covers the first dielectric layer; and forming a second circuit layer on the second dielectric layer, where the second circuit layer is electrically connected to the first circuit layer and the embedded device.SELECTED DRAWING: Figure 1

The invention relates to the technical field of circuit board processing, in particular to a copper block-embedded PCB (printed circuit board) preparation process, which is characterized in that liquid resin can flow into the bottom of a milling groove under the guide action of a capillary fiber strip I, that is, resin filling operation is carried out from the bottom of the milling groove, so that a cavity can be effectively prevented from being generated in a resin layer; the problems of low stability and short circuit caused by a cavity formed in the resin layer are avoided, and meanwhile, the angle of the first capillary fiber strip is adjusted through the motor, so that the bending direction of the first capillary fiber strip is always the same as the extending direction of the milling-breaking groove, and the service life of the first capillary fiber strip is prolonged. Therefore, the capillary fiber strip I can be smoothly inserted into the milling groove for resin filling operation; the invention relates to a copper block-embedded PCB (Printed Circuit Board) preparation device, which comprises a connecting plate, a liquid conveyor and a camera, the connecting plate is connected with a liquid conveyor; a camera is mounted on the liquid conveyor; the device further comprises a first cylinder, a first connector, a first needle tube, a first capillary fiber strip and a driving assembly. The liquid conveyor is communicated with a first cylinder.

The invention relates to the technical field of circuit board processing, and in particular to a copper-buried PCB board preparation process. Under the guidance of a capillary fiber strip, liquid resin can flow into the bottom of a milling groove, that is, the resin filling operation is started from the bottom of the milling groove, which can effectively prevent the formation of cavities in the resin layer, avoid the problems of low stability and short circuit caused by the formation of cavities in the resin layer, and at the same time, the angle of the capillary fiber strip is adjusted by a motor so that the bending direction of the capillary fiber strip is always the same as the extension direction of the milling groove, so that the capillary fiber strip can be smoothly inserted into the milling groove for resin filling operation; a copper-buried PCB board preparation device comprises a connecting plate, a liquid conveyor and a camera; the connecting plate is connected to the liquid conveyor; the camera is installed on the liquid conveyor; it also comprises a cylinder, a joint, a needle tube, a capillary fiber strip and a driving component; the liquid conveyor is connected to the cylinder.

A package substrate with an embedded device and a manufacturing method therefor are disclosed. The method includes: manufacturing a third circuit layer and a target on a temporary carrier plate, and laminating a third dielectric layer; placing a device to be embedded on the third dielectric layer which is then covered with a second dielectric layer; laminating a second copper foil and manufacturing a second circuit layer, a second copper pillar, and a third copper pillar; laminating a first dielectric layer and a first copper foil sequentially, and removing the temporary carrier plate; laminating a fourth dielectric layer on the third circuit layer; laminating a fourth copper foil on the fourth dielectric layer; and manufacturing a fourth circuit layer and a fourth copper pillar through the fourth copper foil, and manufacturing a first circuit layer and a first copper pillar through the first copper foil.

An integrated multilayer assembly (100, 200, 300) for an electronic device comprising a first substrate film (106) configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film (202) configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature (214B) on the first side of the first substrate film, at least one other electrical feature (214A) on the first side of the second substrate film, and a molded plastic layer (204) between the first and second substrate films at least partially embedding the electrical features on the first sides thereof. A related method of manufacture is presented.

An electronic device is provided. The electronic device includes: a display having a first surface; a metal frame structure configured to form a side surface of the electronic device; a back plate having a second surface facing a third direction; at least one antenna module disposed within the side surface and having a radiating surface; at least one dielectric layer having at least a partial area attached to the radiating surface; and a wireless communication circuit configured to transmit or receive radio frequency (RF) signals to or from the at least one antenna module, wherein the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, wherein the first dielectric sheet is made of a thermally conductive material having a first dielectric constant, and the second dielectric sheet is made of a material having a second dielectric constant greater than the first dielectric constant.