49results about "Printed circuit dielectrics" patented technology

A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and / or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

[Object] To provide a multilayer assembly that excels in pore properties, is flexible, and is satisfactorily handled and processed; and a method of producing the multilayer assembly.[Solving Means] A multilayer assembly includes a base and, arranged on at least one side thereof, a porous layer and has a large number of continuous micropores with an average pore diameter of 0.01 to 10 μm. The multilayer assembly suffers from no interfacial delamination between the base and the porous layer when examined in a tape peeling test according to the following procedure:Tape Peeling TestA 24-mm wide masking tape [Film Masking Tape No. 603 (#25)] supplied by Teraoka Seisakusho Co., Ltd. is applied to a surface of the porous layer of the multilayer assembly and press-bonded thereto with a roller having a diameter of 30 mm and a load of 200 gf to give a sample; and the sample is subjected to a T-peel test with a tensile tester at a peel rate of 50 mm / min.

A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.

Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and / or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and / or physically transform upon application of at least one internal and / or external stimulus.

An insulated metal substrate (IMS) for supporting a device comprises a metallic substrate having a ceramic coating formed at least in part by oxidation of a portion of the surface of the metallic substrate. The ceramic coating has a dielectric strength of greater than 50 KV mm−1 and a thermal conductivity of greater than 5 Wm−1K−1.

Aspects of the invention can provide a patterning forming method capable of patterning a thin film by a simple and inexpensive device. The thin film can be provided on a base member including a photothermal conversion material that converts optical energy into thermal energy and light is radiated onto the base member to remove the thin film corresponding to a light-radiated region, such that the thin film is patterned.

The invention relates to a single- or multilayer, oriented film in which at least one layer is comprised of a thermoplastic polymer having a minimum amount of amide groups. The polymer is a polyester, a polyamide, or a mixture comprised of polyester and polyamide, or is a copolymer comprised of these two materials. The film also comprises a component a) which, when irradiated with electromagnetic or particulate radiation, forms metal nuclei onto which further metal can be accumulated in further steps of the process. The invention also relates to a process for the production of this film, and to its use in printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, or film-based circuits of any type.

A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of nanowires of an inorganic material. The nanowires are, in isolated form, characterized by a first conductivity stability temperature. Further, the plurality of nanowires is embedded within at least a region of the layer of cross-linked polymer, where the region is continuous from the surface of the layer of cross-linked polymer. The layer of cross-linked polymer and the inorganic mesh are arranged to form the composite conductive film having a second conductivity stability temperature that is greater than the first conductivity stability temperature.

This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

A light-transmitting electromagnetic wave shielding film which is a conductive silver thin film with a metallic silver portion formed on a support in a meshy state, wherein the metallic silver portion formed in the meshy state has a line width of 18 μm or less, an opening rate of 85% or more, an Ag content of 80 to 100% by mass and a surface resistance value of 5 Ω / sq or less. This light-transmitting electromagnetic wave shielding film has characteristic features that it has a high electromagnetic wave shielding property and a high transparency at the same time and the meshy portion is black.

[Object] To provide a multilayer assembly that excels in pore properties, is flexible, and is satisfactorily handled and processed; and a method of producing the multilayer assembly.[Solving Means] A multilayer assembly includes a base and, arranged on at least one side thereof, a porous layer and has a large number of continuous micropores with an average pore diameter of 0.01 to 10 μm. The multilayer assembly suffers from no interfacial delamination between the base and the porous layer when examined in a tape peeling test according to the following procedure:Tape Peeling TestA 24-mm wide masking tape [Film Masking Tape No. 603 (#25)] supplied by Teraoka Seisakusho Co., Ltd. is applied to a surface of the porous layer of the multilayer assembly and press-bonded thereto with a roller having a diameter of 30 mm and a load of 200 gf to give a sample; and the sample is subjected to a T-peel test with a tensile tester at a peel rate of 50 mm / min.

A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

The present invention relates to electronic components and in particular relates to ceramic-based electronic components wherein a portion of the component comprises a metal-infiltrated ceramic. In a preferred embodiment, the metal-infiltrated ceramic comprises copper metal.

Optical stacks containing one or more patterned transparent conductor layers may be damaged by electrostatic discharges that occur during the optical stack manufacturing process. Such damage may result in non-conductive conductors within the patterned transparent conductor layer. An electrostatic discharge protected optical stack may include a substrate layer, a first anti-static layer having a sheet resistance of from about 106 ohms per square (Ω / sq) to about 109 Ω / sq, and a patterned transparent conductor layer. Methods of testing and assessing damage to patterned transparent conductors are provided.

When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electronic component from a corresponding terminal pad on the substrate. A conductive bonding material is then melted on the terminal pad. The melted conductive bonding material gets exposed to the peripheral atmosphere over a larger area. Even if a bubble is generated within the melted conductive bonding material, the bubble is allowed to easily get out of the melted conductive bonding material. Removal of the gas is promoted in the melted conductive bonding material. The solid support is subsequently melted. The electronic component is moved down toward the substrate, thereby contacting the terminal conductor with the melted conductive bonding material on the corresponding terminal pad. Removal of the gas in this manner leads to improvement in the strength of bonding between the substrate and the electronic component.

Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers andcompositions of the present invention may include between 45.0 to 58.0 weight percent SiO2; greater than 18.0 weight percent B2O3 and no more than 26.0 weight percent B2O3; greater than 16.0 weight percent AI2O3 and no more than 23.0 weight percent AI2O3; between 0.25 to 12.0 weight percent P2O5; greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO; less than 4.50 weight percent MgO; greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO; less than 0.80 weight percent Fe2O3; and less than 0.50 weight percent TiO2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius.

The present invention provides a white film comprising a thermoplastic resin composition containing 25-100 parts by mass of an inorganic filler based on 100 parts by mass of a thermoplastic resin, wherein the average reflectance at a wavelength of 400-800 nm is 70% or more, the average linear expansion coefficient in the machine direction and the transverse direction is 35×10−6 / ° C. or less, and the decreasing rate in reflectance at a wavelength of 470 nm after thermal treatment at 200° C. for 4 hours is 10% or less; and the invention provides a metal laminated body. These exhibit high thermal resistance, high reflectance within visual light range, and small decrease in reflectance under a high heat load environment, but also be applicable for a large sized printed circuit boards for mounting LEDs.

A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

A strain-resistant electrical connection and a method of making the same is provided. A wire or other conductive lead is connected to a circuit in a manner that makes the connection more resistant to mechanical stresses such as movement or rotation of the lead relative to the circuit. A material is configured around the lead and near the point of connection to the circuit so as to create a region of decreasing flexibility or graduated stiffness near the point of connection. In certain embodiments, the lead may also be coiled or otherwise shaped to provide additional ability to withstand mechanical stresses. In other embodiments, additional elements may be provided to assist in controlling the stiffness near the connection point.

A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation.

A strain-resistant electrical connection and a method of making the same is provided. A wire or other conductive lead is connected to a circuit in a manner that makes the connection more resistant to mechanical stresses such as movement or rotation of the lead relative to the circuit. A material is configured around the lead and near the point of connection to the circuit so as to create a region of decreasing flexibility or graduated stiffness near the point of connection. In certain embodiments, the lead may also be coiled or otherwise shaped to provide additional ability to withstand mechanical stresses. In other embodiments, additional elements may be provided to assist in controlling the stiffness near the connection point.

A resin composition having a high adhesion between a resin layer and a metallic layer as well as an excellent durability, a process for producing the same, and an electrophotographic fixing member are provided. In the resin composition, a metallic layer is provided on a surface of a resin layer having a porous structure at least on the surface.

There is provided a sheet used for manufacturing multilayer electronic parts in which accuracy in shape and formation position and uniformity in thickness of a complex configuration with recesses and projections of an insulating layer or the like are assured. A layer made of a photosensitive material containing a powder having a specific electric characteristic is formed on a light transmissive base member. A mask having a plurality of patterns with different transmittances for ultraviolet light is disposed on the back side of the base member. The photosensitive material is subjected to an exposure process in which it is irradiated with ultraviolet light or the like through the mask. The photosensitive material is subjected to development process after the exposure process.