49results about "Printed circuit dielectrics" patented technology

Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and / or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

The invention relates to a single- or multilayer, oriented film in which at least one layer is comprised of a thermoplastic polymer having a minimum amount of amide groups. The polymer is a polyester, a polyamide, or a mixture comprised of polyester and polyamide, or is a copolymer comprised of these two materials. The film also comprises a component a) which, when irradiated with electromagnetic or particulate radiation, forms metal nuclei onto which further metal can be accumulated in further steps of the process. The invention also relates to a process for the production of this film, and to its use in printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, or film-based circuits of any type.

A light-transmitting electromagnetic wave shielding film which is a conductive silver thin film with a metallic silver portion formed on a support in a meshy state, wherein the metallic silver portion formed in the meshy state has a line width of 18 μm or less, an opening rate of 85% or more, an Ag content of 80 to 100% by mass and a surface resistance value of 5 Ω / sq or less. This light-transmitting electromagnetic wave shielding film has characteristic features that it has a high electromagnetic wave shielding property and a high transparency at the same time and the meshy portion is black.

[Object] To provide a multilayer assembly that excels in pore properties, is flexible, and is satisfactorily handled and processed; and a method of producing the multilayer assembly.[Solving Means] A multilayer assembly includes a base and, arranged on at least one side thereof, a porous layer and has a large number of continuous micropores with an average pore diameter of 0.01 to 10 μm. The multilayer assembly suffers from no interfacial delamination between the base and the porous layer when examined in a tape peeling test according to the following procedure:Tape Peeling TestA 24-mm wide masking tape [Film Masking Tape No. 603 (#25)] supplied by Teraoka Seisakusho Co., Ltd. is applied to a surface of the porous layer of the multilayer assembly and press-bonded thereto with a roller having a diameter of 30 mm and a load of 200 gf to give a sample; and the sample is subjected to a T-peel test with a tensile tester at a peel rate of 50 mm / min.

When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electronic component from a corresponding terminal pad on the substrate. A conductive bonding material is then melted on the terminal pad. The melted conductive bonding material gets exposed to the peripheral atmosphere over a larger area. Even if a bubble is generated within the melted conductive bonding material, the bubble is allowed to easily get out of the melted conductive bonding material. Removal of the gas is promoted in the melted conductive bonding material. The solid support is subsequently melted. The electronic component is moved down toward the substrate, thereby contacting the terminal conductor with the melted conductive bonding material on the corresponding terminal pad. Removal of the gas in this manner leads to improvement in the strength of bonding between the substrate and the electronic component.

This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

A strain-resistant electrical connection and a method of making the same is provided. A wire or other conductive lead is connected to a circuit in a manner that makes the connection more resistant to mechanical stresses such as movement or rotation of the lead relative to the circuit. A material is configured around the lead and near the point of connection to the circuit so as to create a region of decreasing flexibility or graduated stiffness near the point of connection. In certain embodiments, the lead may also be coiled or otherwise shaped to provide additional ability to withstand mechanical stresses. In other embodiments, additional elements may be provided to assist in controlling the stiffness near the connection point.

There is provided a lighting device and a method to manufacture such a lighting device. The inventive concept is based on manufacturing a lighting device on an at least partly flexible sheet assembly which is rolled into a tube, such that the light source of the lighting device is arranged within the tube. The flexible sheet assembly is arranged such that the tube provides a light mixing chamber and light exit surface for the lighting device. Thus, the tube shaped lighting device instantly delivers the necessary optical and mechanical properties for easy assembly and the functionality of a light engine.

A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element having a plurality of electrode pads disposed on upper and lower surfaces thereof, the passive element being embedded in the dielectric layer unit and corresponding to the positioning pad; a first circuit layer disposed on the top surface of the dielectric layer unit, the first circuit layer having first conductive vias electrically connected to the electrode pads disposed on the upper surface of the passive element; and a second circuit layer disposed on the bottom surface of the dielectric layer unit, the second circuit layer having second conductive vias electrically connected to the electrode pads disposed on the lower surface of the passive element. Through the embedding of the passive element, the overall structure may have a reduced height.