The invention discloses a packaging structure of MEMS (Micro Electro Mechanical Systems)
chip integration. On an ASIC (
Application Specific Integrated Circuit)
chip, a
silicon through hole is manufactured to lead
signal output on the front side of the ASIC
chip to the back surface of the ASIC chip, and the electrical
interconnection of the ASIC chip and a base plate is realized through a
metal re-wiring layer and solder bumps on the back surface. According to the way, a
signal transmission path is reduced, meanwhile, a phenomenon that a
lead bonding connection way requires an overlarge base plate area is avoided, and the size of the packaging structure is reduced. The front side of the MEMS chip and the front side of the ASIC chip are electrically connected directly through a
metal lead to guarantee the minimum path of
signal transmission and avoid introducing stray
capacitance. Or a
silicon through hole technology is used for leading the signal output on the front side of the MEMS chip to the back surface of the MEMS chip, then the electric
interconnection of the MEMS chip and the ASIC chip is realized through the
metal re-wiring layer and the solder bumps, furthermore, the signal transmission path is reduced, and the connection way of
lead bonding is completely avoided so as to further reduce the size of the packaging structure of the chip.