360results about How to "Reduce warpage" patented technology

The invention provides a terahertz horn antenna and a preparation method thereof, and relates to the technical field of mobile communication systems. The antenna layer is arranged to be the antenna layer with the horn antenna groove structure, and due to the advantages of the horn antenna, the terahertz horn antenna has the advantages of being simple in structure, convenient to control gain, excellent in frequency characteristic, small in loss and the like. Moreover, the antenna layer and the radio frequency layer provided by the invention are fixed through bonding of the radiation electrode and the metal film, so that a low-reflection interconnection channel is realized, THz waves can be limited in a bonding area, the problem of electromagnetic leakage caused by stacking of the antenna layer and the radio frequency layer is avoided, and the performance of the terahertz horn antenna is improved. According to the terahertz horn antenna, the antenna layer and the radio frequency layer both adopt the glass substrates, the glass substrates have the advantages of high mechanical strength, small dielectric loss and the like, and the glass substrates can bear higher temperature, so that the problems of warping and deformation of the substrates are reduced, and the preparation quality of the terahertz horn antenna can be improved.

The invention discloses an injection molding temperature control method for rapid injection molding of an injection molded part, and relates to the field of injection molding temperature control, and the injection molding temperature control method comprises the following steps: performing main body division on a mold by scanning three-dimensional space data of the mold and combining geometric characteristics, and performing structural stability evaluation and gradient calibration on a main body division result; analyzing the surface curvature of a main body division area based on a main body division result, and setting a cooling channel local loop in combination with the heat distribution condition of an actual thermoplastic process; performing loop integration on the cooling channels of all the main body division areas, and setting the flow velocity of cooling liquid in the cooling channels based on the stress change of the injection molding part; based on the finally determined communication distribution of the cooling channels and the flow speed of the cooling liquid, the mold and the cooling channels are produced through 3D printing; according to the method, the injection molding period is remarkably shortened, the production efficiency and the quality and stability of injection molded parts are improved, and the method is suitable for rapid molding requirements of high-precision complex injection molded parts.

The invention discloses a multi-objective optimization method for double-material injection molding process parameters. The multi-objective optimization method comprises the following steps: firstly, obtaining a simulation result data set based on Moldflow simulation analysis and a Taguchi test; then, on the basis of the simulation test data set, a GAM model is constructed and then trained, super-parameters of GAM are optimized through a GTO algorithm, and a GTO-GAM model between injection molding process parameters and a quality optimization target is established; then, performing multi-target optimization on the GTO-GAM model through an MODA algorithm to obtain a Pareto leading edge of a quality optimization target; and finally, determining an optimal combination of process parameters in the obtained Pareto leading edge of the quality optimization target through a CRITIC-TOPSIS evaluation method. According to the method, the buckling deformation and the volume shrinkage rate of the double-material injection molding plastic part can be effectively reduced, and a theoretical basis and data support can be provided for obtaining the optimal technological parameter combination of double-material injection molding.

The invention discloses a multi-objective optimization method for injection molding process parameters. The method comprises the following steps: firstly, obtaining a simulation result data set based on Moldflow simulation analysis and CCF; then, an NGO-XGBoost is adopted to construct an injection molding quality optimization model; then explaining and analyzing the NGO-XGBoost model by using an SHAP method to obtain importance and positive and negative influences of each optimization design variable on a prediction quality optimization target, and performing multi-target optimization through MOMVO to obtain a Pareto leading edge; and finally, determining an optimal combination of process parameters through a CRITIC-TOPSIS evaluation method. According to the method, the buckling deformation and the volume shrinkage of the ABS plastic injection molding plastic part can be effectively reduced, so that a high-quality ABS plastic part product is obtained, and a theoretical basis and data support can be provided for obtaining an optimal technological parameter combination of ABS plastic injection molding.

The invention discloses a heat-resistant flame-retardant reinforced polyamide composition as well as a preparation method and application thereof, and the heat-resistant flame-retardant reinforced polyamide composition comprises the following raw materials in parts by weight: 30-41 parts of polyamide, 15-20 parts of a flame retardant, 2-5 parts of a synergistic flame retardant, 10-20 parts of syndiotactic polystyrene, 2-8 parts of a compatilizer and 10-30 parts of glass sheets. The polyamide comprises one or more of PA66 (polyamide 66) and PA6 (polyamide 6); the compatilizer comprises maleic anhydride grafted syndiotactic polystyrene; according to the invention, syndiotactic polystyrene with excellent dimensional stability and polyamide are selected for composite modification, so that the obtained composition has the advantages of high dimensional stability, low warpage, excellent mechanical property, flame retardance and heat resistance, simple process, good processability and low cost. And the composite material can meet the fields of automobiles, electronic appliances, traffic equipment, aerospace automobiles, electric tools and sports equipment with high requirements on dimensional stability, warping property, strength, flame retardance and heat resistance.

The invention provides low-yield-ratio super-thick maritime work steel with excellent core low-temperature toughness and a manufacturing method of the low-yield-ratio super-thick maritime work steel, and belongs to the field of steel and iron material preparation. The low-yield-ratio super-thick marine steel with the excellent core low-temperature toughness comprises the following chemical components in percentage by mass: 0.10%-0.15% of C, 0.35%-0.45% of Si, 1.20%-1.50% of Mn, 3.00%-3.50% of Ni, 0.30%-0.50% of Mo, 0.15%-0.3% of Cr, 0.01%-0.02% of Ti, 0.030%-0.040% of V, 0.050%-0.060% of Nb, 0.0016%-0.0020% of B, 0.15%-0.25% of Cu, 0.060%-0.070% of Al, less than or equal to 0.010% of P, less than or equal to 0.004% of S, less than or equal to 0.39% of CET and the balance of Fe and inevitable impurities. According to the invention, a component design thought of a low-C, Ni-Nb-Mo-Al-B system is adopted, and a three-section rolling and quenching and tempering heat treatment process is combined. Through strict control of smelting continuous casting, controlled rolling and controlled cooling processes and quenching and tempering heat treatment parameters, the super-thick marine steel with excellent comprehensive mechanical properties is successfully prepared. The steel shows good low-temperature toughness in the core part, and meanwhile, the steel has a relatively low yield ratio. According to the low-yield-ratio super-thick maritime work steel with the excellent core low-temperature toughness, the thickness range is 80-150 mm, the yield strength is larger than or equal to 690 MPa, the tensile strength is larger than or equal to 920 MPa, the percentage elongation after fracture is larger than or equal to 20%, the yield ratio is smaller than or equal to 0.77, and the impact energy KV2 at the temperature of-60 DEG C is larger than or equal to 80 J.

The invention provides a glass core plate of an FCBGA packaging substrate and a manufacturing method of the glass core plate, and the manufacturing method of the glass core plate comprises the following steps: providing a glass plate comprising a first surface and a second surface which are oppositely arranged, and defining at least one of the first surface and the second surface as a functional surface of the glass plate; forming a metal seed layer covering the functional surface of the glass plate, and forming a shielding layer on the surface, away from the glass plate, of the metal seed layer; patterning the shielding layer to form a plurality of first openings exposing the metal seed layer in the shielding layer; conductive circuits filling the first openings are formed, and the shielding layer is removed to obtain second openings located between the two adjacent conductive circuits; and removing the metal seed layer at the bottom of the second opening to obtain the glass core plate. According to the FCBGA packaging substrate, the glass plate which is low in thermal expansion coefficient and high in glass transition temperature is adopted as the core plate of the glass core plate in the FCBGA packaging substrate, warping of the substrate is reduced, and the reliability of the substrate and the yield of products are improved.

The embodiment of the invention provides an adapter plate and a preparation method thereof, a chip packaging structure and electronic equipment, relates to the technical field of semiconductors, and is used for improving the signal transmission efficiency in the adapter plate. The adapter plate comprises a substrate, a conductive structure arranged in the substrate, a first redistribution layer arranged on the substrate and a second redistribution layer arranged on the side, away from the first redistribution layer, of the substrate. The second redistribution layer is coupled to the first redistribution layer through the conductive structure. Wherein the material of the substrate comprises a semiconductor material, the first redistribution layer comprises a first metal wire, the second redistribution layer comprises a second metal wire, and the thickness of the first metal wire and / or the second metal wire is greater than 1 [mu] m.

The invention belongs to the technical field of high polymer materials, and particularly relates to a high laser transmittance black glass fiber reinforced PBT composite material and a preparation method thereof, the high laser transmittance black glass fiber reinforced PBT composite material comprises, by weight, 35-46 parts of PBT resin, 10-25 parts of polycarbonate, 30 parts of rectangular cross section glass fiber, 0.2-0.6 part of a lubricant, 0.2-0.6 part of an antioxidant, 0.05-0.2 part of a transesterification inhibitor, and 0.1-0.5 part of black powder. The PBT resin, the polycarbonate, the lubricant, the antioxidant, the ester exchange inhibitor and the black powder are added into a high-speed stirrer according to the proportion to be mixed for 1-2 minutes, and a premix is obtained; and adding the premix into a double-screw extruder through a main hopper and a sanitary hopper, adding rectangular cross section glass fibers at a side feeding position, and carrying out melting, pelletizing and extrusion to obtain the black laser welding glass fiber reinforced PBT composite material. The flat glass fiber and the compound black powder are adopted, so that the light transmittance is remarkably improved, and meanwhile, the impact performance is improved through PC.

The invention discloses a glass substrate and a manufacturing method thereof, and relates to the technical field of semiconductor packaging. The manufacturing method of the glass substrate comprises the following steps: opening a hole in a glass core plate, forming a first seed layer, forming a first mask, metalizing a through hole, removing the first mask and the first seed layer covered by the first mask, plugging the hole and forming a first resin layer, forming a second seed layer, forming a second mask, and forming an inner circuit layer, forming a through hole in the second resin layer on the first surface and the second surface; forming a third seed layer; forming a third mask; forming a circuit layer; and repeating the steps from forming the second resin layer to removing the third mask and the third seed layer covered by the third mask at least once, manufacturing the solder mask and performing ball planting so as to reduce the warping of the substrate and improve the reliability of the substrate.

The invention belongs to the technical field of double-color injection molds, and provides an anti-deformation method for a double-color injection molded part, electronic equipment and a storage medium, and the anti-deformation method comprises the following steps: constructing a double-color injection simulation model according to a modeling mode; an injection molding simulation part is obtained through the double-color injection molding simulation model; analyzing the injection molding simulation part to obtain warping data of the injection molding simulation part; determining a pre-deformation scheme according to the warping data; mold opening data and reserved data are modified according to the pre-deformation scheme; mold opening verification is conducted according to the modified data and the reserved data, and an injection molding workpiece is obtained; the actual deformation amount of the injection molding workpiece is obtained; and if the actual deformation cannot meet the requirement, the mold opening data and the reserved data are adjusted until the actual deformation meets the requirement. According to the method, the mold opening data and empirical measure reservation are corrected by analyzing the theoretical deformation data, obtained by the double-shot molding simulation model, of the simulation part, and the product quality of the formed part is improved.

The utility model discloses a laser cutting adsorption jig and laser cutting equipment, the laser cutting adsorption jig comprises an adsorption assembly, a first suction module and a second suction module, the adsorption assembly is provided with an adsorption cavity, an adsorption hole and a dust suction port, the adsorption hole and the dust suction port are respectively located on two adjacent cavity walls of the adsorption cavity, and the first suction module and the second suction module are arranged on the adsorption cavity. The first suction module is communicated with the adsorption hole, and the second suction module is communicated with the dust suction port. According to the arrangement, the first suction module and the second suction module are matched with the adsorption hole and the dust suction opening correspondingly, so that dust removal and adsorption of the laser cutting adsorption jig are controlled separately, the air pressure of the dust removal and the air pressure of the adsorption jig are prevented from being affected by each other, and the laser cutting quality is improved; and meanwhile, the adsorption holes and the dust suction openings are located in the two adjacent cavity walls of the adsorption cavity correspondingly, the wind field of the whole dust removal system can be improved, the phenomenon that the to-be-cut materials are blown by wind to tilt after cutting is reduced, and then the laser cutting quality is improved.

The utility model discloses a film coating device and relates to the technical field of coating devices. The film coating device comprises a film laminating machine wallboard, a glue coating steel roller, a metering rubber roller, an eccentric roller, a glue coating transfer rubber roller, an unwinding guide roller, a driving device and a rotating steel roller assembling and disassembling structure are arranged on the film laminating machine wallboard, the rollers are rapidly replaced through the rotating steel roller assembling and disassembling structure, and the glue coating steel roller can be rapidly replaced by accurately controlling gaps between the glue coating steel roller and the metering rubber roller and between the glue coating steel roller and the glue coating transfer rubber roller. And uniform coating is realized. By adopting the technical scheme, the coating process is optimized, and the consistency and quality of the coating are ensured. By finely adjusting the gluing gap and the coating gap, the device can adapt to materials with different thicknesses and types, and it is ensured that a coating is uniform and flawless. Due to the design of the unwinding guide roller and the eccentric roller, the tension and position control of the material are further improved, the coating process is more stable, and warping and wrinkling of the material are reduced. By means of the rotating steel roller assembling and disassembling structure, the replacement work of the roller is simplified, the downtime is shortened, and the production efficiency is improved.

The invention relates to the technical field of glass, in particular to a method for strengthening glass through low-temperature ion exchange, which comprises the following steps: carrying out first ion exchange strengthening treatment on glass to be treated by adopting first molten salt to obtain primary strengthened glass; carrying out secondary ion exchange strengthening treatment on the primary strengthened glass by adopting second fused salt to obtain the low-temperature ion exchange strengthened glass, wherein the first molten salt comprises a lithium salt, the second molten salt comprises a potassium salt, the temperature range of the first ion exchange strengthening treatment and the second ion exchange strengthening treatment is 250-400 DEG C, and the ion exchange temperature requirement can be met. The two-step strengthening is adopted at low temperature to gradually enhance the surface stress of the glass, so that the bending deformation of the glass caused by sudden enhancement of the surface stress of the strengthened glass is avoided, and the phenomenon of warping of the edge of the glass is effectively improved.

The invention belongs to the technical field of high-molecular polymer floor materials, and particularly relates to an anti-warping and anti-aging plastic floor base material, a floor and a preparation method. A floor base material is prepared from PETG resin, ABS resin, a compatilizer, activated halloysite / calcium carbonate composite powder, a chain extender, a lubricant, a coupling agent, an antioxidant and a light stabilizer according to a certain ratio. Floor products can be manufactured by adopting the floor base material provided by the invention to be coated with a color film, a transparent film, a mute layer and the like. A floor made of the floor base material has the advantages of being low in warping, resistant to cracking and arching, free of halogen, environmentally friendly and the like, and belongs to a green low-carbon PVC-free environment-friendly floor.

The embodiment of the present invention provides a wafer-level fan-out packaging method and a wafer-level fan-out packaging structure, which relate to the field of chip packaging technology. The method prepares a carrier with a relief protrusion and directly forms a plastic package body on the carrier. After removing the carrier, a plastic package body with a relief groove is obtained. The relief groove is directly obtained by plastic packaging with a plastic packaging material, and then the chip is embedded in the relief groove, and a passivation layer covering the relief groove is formed on the surface of the plastic package body, and finally the wafer-level processes such as wiring layer and solder ball are completed. The advantages of easy plasticity and low cost of the plastic package material are fully utilized, and the mature plastic packaging shaping process is used. In combination with the relief protrusion of the carrier, the relief groove and other structures can be accurately shaped, and the process is simple and the process difficulty is low. In addition, by embedding the chip in the relief groove, the front side is rewired to fan out each signal contact outside the plastic package, thereby improving the reliability of the plastic package.

The invention relates to the technical field of rewiring structures, and discloses a preparation method of a rewiring structure and the rewiring structure, and the method comprises the steps: providing a semiconductor substrate; forming a barrier layer, a seed layer and a photoresist layer on the surface of one side of the semiconductor substrate; exposing and developing the photoresist layer to form a via hole window and a wiring window on the photoresist layer, and exposing the seed layer from the via hole window; forming a first metal layer on the seed layer exposed by the via hole window; removing part of photoresist reserved in the wiring window; forming a second metal layer on the first metal layer and the seed layer exposed by the wiring window; removing the photoresist layer, removing the seed layer and the barrier layer which are not covered by the first metal layer, and removing the seed layer and the barrier layer which are not covered by the second metal layer to form a via hole and a wiring layer; and forming a plastic package layer on the surface of one side of the semiconductor substrate to form a rewiring structure. The alignment deviation of the wiring layer and the via hole can be eliminated, so that the I / O density is improved.

The invention discloses a high-yield laminated mold, and relates to the technical field of molds, the high-yield laminated mold comprises a middle mold base, external mold bases are slidably connected to the two sides of the middle mold base, mold cavities are formed in the two sides of the middle mold base, and hot runners communicating with the mold cavities are installed in the middle mold base; a cavity is formed in the middle mold base, an ejector pin penetrating through the middle mold base and extending into the cavity is slidably connected into the middle mold base, a boss is fixedly installed in the ejector pin, a positioning column used for being connected with a nut in a sleeved mode is fixedly connected to the boss, and the sealing unit comprises a sleeve and a piston plate which are slidably connected into the positioning column. The larger the internal pressure of the first sealing ring is, the tighter the first sealing ring and the inner wall of the nut is, plastic in a molten state is prevented from entering threads of the nut under the pressure, after a material is cooled and shaped, the roller and the first sealing ring can automatically restore to the original shape, the force needed by demolding ejection of a product is reduced, and the ejector pin can eject the product perfectly and conveniently.

The invention discloses a silicon-based embedded double-face plastic-packaged high-density 3D packaging structure and a manufacturing method. A chip is mounted on a silicon substrate, a rewiring structure is manufactured on the surface of the silicon substrate, a functional chip is connected to the rewiring structure, the functional chip and the silicon substrate are subjected to plastic packaging respectively, and a first plastic packaging body and a second plastic packaging body are formed; forming a metal rewiring structure on the first plastic package body, and arranging a second metal conductive structure on the metal rewiring structure; and grinding and thinning the second plastic package body until the chip is exposed. According to the method, firstly, a groove is dug in one side of a silicon substrate, a chip is attached to the groove, then a rewiring structure is manufactured and connected with a functional chip, then plastic package thinning is carried out, in order to reduce warping, plastic package is carried out on the other side of the silicon substrate, the plastic package thickness is determined by the warping degree until no warping phenomenon exists, then wiring is carried out, signal three-dimensional interconnection and stress release are achieved through a TMV hole structure, and the reliability of the silicon substrate is improved. And the second plastic packaging body is ground and thinned until the chip is exposed, so that the heat dissipation capability of the packaging structure is improved.

The invention discloses a composite brightness enhancement film and a preparation method and application thereof, and belongs to the technical field of optical films. The composite brightness enhancement film comprises a first prism layer, a first base material layer, a first back coating layer, a second prism layer, a second base material layer and a second back coating layer. The upper surface of the first base material layer is coated with the first prism layer, the lower surface of the first base material layer is bonded with the second prism layer through the first back coating layer, the second prism layer is arranged on the upper surface of the second base material layer, the second back coating layer is coated on the lower surface of the second base material layer, and an included angle exists between prism structure arrays of the first prism layer and the second prism layer. The range of the included angle is larger than or equal to 40 degrees and smaller than or equal to 60 degrees, or larger than or equal to-60 degrees and smaller than or equal to-40 degrees, and the haze of the first back coating layer is 10%-20%. According to the composite brightness enhancement film, the emergent surface of light can be more comprehensive, and the brightness uniformity is effectively considered while the front-view brightness is remarkably improved; and meanwhile, the first back coating layer with medium haze is matched, so that certain atomization and light leakage effects are achieved, and the emergent surface of light rays is more uniform.

The invention relates to the technical field of special glass manufacturing, in particular to a method for preparing ultrathin aluminosilicate glass, which comprises the following steps: mixing SiO2, Al2O3, MgO, K2O, Na2O and ZrO2 / Li2O in proportion; feeding the mixed raw material into a glass melting furnace for high-temperature melting to form molten glass; pouring the molten glass into a float tank filled with tin liquor, and forming a layer of uniform glass tape on the surface of the tin liquor; standing and cooling the glass tape in the tin bath until the glass tape is solidified to form plate glass; carrying out annealing treatment on the cured plate glass, and carrying out chemical strengthening treatment in the annealing treatment process; judging whether the chemical strengthening treatment meets a preset standard or not according to the strengthening warping value; secondarily judging whether the chemical strengthening treatment meets a preset standard or not according to the strength evaluation value; the plate glass which meets the preset standard through chemical strengthening treatment is cut to obtain the ultra-thin aluminosilicate glass, and the quality of the ultra-thin aluminosilicate glass is improved.

The invention relates to the technical field of battery piece production, in particular to an interconnection method of a main-grid-free back contact battery assembly, which comprises the following steps of: printing insulating glue on a positive electrode fine grid line or a negative electrode fine grid line; the battery piece printed with the insulation paste is dried; printing conductive adhesive on the fine grid lines which are not printed with the insulating adhesive, wherein the conductive adhesive is composed of a weld-aid part and a conductive connecting part; laying a welding strip on the battery piece, and pressing the welding strip on the conductive adhesive; the conductive adhesive is dried for preliminary curing, and the welding strip is pre-fixed on the battery piece; and then carrying out lamination welding treatment to realize alloying connection between the welding strip and the fine grid line. According to the invention, the conductive adhesive composed of the welding aid part and the conductive connecting part is used together with the insulating adhesive, so that the problem that the battery piece needs to be baked for multiple times when the traditional solder paste / insulating adhesive / curing adhesive is combined for use is solved, the process is simplified, the warping condition of the battery piece is reduced, the yield of the battery piece is ensured, and the quality of the battery piece is ensured.

The invention discloses a high-precision circuit board and a preparation method thereof. The preparation method comprises the following steps: acquiring a preset circuit diagram; setting a plurality of conductive layer groups according to a preset circuit diagram; wherein the conductive layers which need to form the same blind hole or buried hole form a conductive layer group, and the adjacent conductive layers which do not need to form the blind hole or buried hole form a conductive layer group; each conductive layer group comprises a core plate; placing the conductive layers in a stacked manner, placing bonding layers between the core plates in the same group or between the core plates and the conductive layers, and placing auxiliary layers between different conductive layer groups; laminating the conductive layer, the bonding layer and the auxiliary layer which are stacked, and stripping the auxiliary layer after lamination so as to enable the conductive layer group to form a sub-board; drilling a hole in a preset position of the daughter board to form a through hole; the daughter boards are placed in a stacked mode, and bonding layers are placed between the adjacent daughter boards; and laminating the sub-board and the bonding layer which are stacked. By adopting the technical scheme, the problems of alignment and warping caused by an asymmetric structure due to respective pressing of the sub-boards can be solved.

The invention relates to a preparation method of a multi-chip interconnection packaging structure and the multi-chip interconnection packaging structure. The preparation method of the multi-chip interconnection packaging structure comprises the following steps: providing a packaging substrate and a plurality of chips; a substrate circuit is arranged in the packaging substrate; providing an interconnection chip; a chip interconnection circuit is arranged in the interconnection chip; forming a plurality of grooves in one side of the packaging substrate; mounting interconnection chips in the plurality of grooves in a one-to-one correspondence manner, wherein the thickness of the interconnection chips is smaller than or equal to the depth of the grooves; a plurality of chips are inversely arranged on the side, where the interconnection chips are exposed, of the packaging substrate, the interconnection chips are connected with at least two chips at the same time, and meanwhile the chips are connected with the substrate circuits respectively. According to the preparation method of the multi-chip interconnection packaging structure, the height of the packaging structure can be reduced, the process can be simplified, the reliability and the yield of the packaging structure can be improved, the test cost can be reduced, and the parasitic effect between the chips can be reduced.

The hardening liquid for the PMMA base material comprises a bifunctional polyurethane acrylate oligomer, a hexa-functional polyurethane acrylate oligomer and the like, the hardening liquid is coated on the PMMA base material to form an optical film, the hardening liquid and the PMMA base material have good adhesive force, and hardness, low reflectivity and low warpage are considered.

The invention discloses a polygonal panel warping inhibition operation platform and a warping inhibition method thereof, and the operation platform comprises a bearing platform which is used for bearing a polygonal panel; the supporting mechanism is located below the bearing table and can move in the vertical direction, and when the supporting end of the supporting mechanism protrudes out of the bearing table, the polygonal panel can be supported; the jacking mechanism can drive the supporting mechanism to move up and down in the vertical direction, and when the supporting mechanism moves upwards, the polygonal panel is supported on the supporting mechanism; when the supporting mechanism moves downwards, the polygonal panel can be borne on the bearing table. One flattening mechanism corresponds to one side edge of the bearing table, and when the polygonal panel is placed on the bearing table, the multiple flattening mechanisms abut against the multiple edge parts of the polygonal panel downwards at the same time, so that the polygonal panel is attached to the bearing table. According to the invention, automatic warping suppression processing can be realized, and damage to the panel can be reduced.

The invention relates to a high-strength low-warpage 3D printing nylon modified material and a preparation method thereof, the high-strength low-warpage 3D printing nylon modified material comprises the following raw materials by weight: 64-87 parts of nylon resin, 1-2 parts of a crystallization accelerator, 1-2 parts of a maleic anhydride grafted flexibilizer, 1-2 parts of a benzene ring-containing hyperbranched polymer, 5-15 parts of modified silicon carbide whisker, 5-15 parts of modified carbon fiber, and 0.2-0.5 part of a lubrication dispersant TAF. Wherein the modified silicon carbide whisker is obtained by coating the surface of a silicon carbide whisker with a layer of conductive polymer and then performing electrochemical treatment; the modified carbon fiber is obtained by coating a layer of layered dihydroxy compound on the surface of carbon fiber and introducing a functional substance between the dihydroxy compound layers through ion exchange. According to the 3D printing nylon modified material disclosed by the invention, the modified silicon carbide whiskers and the modified carbon fibers are added, so that the tensile strength and the bending strength of the material are improved, and the deformation and warping of the material are reduced.

The invention relates to the technical field of circuit board manufacturing, and particularly discloses a circuit board pressing process, which comprises the following steps of: stacking a newly-added circuit layer on a basic circuit layer, and overlapping a semi-cured adhesive layer between the newly-added circuit layer and the basic circuit layer; the newly-added circuit layer and the basic circuit layer are bonded together through thermocompression bonding to form a multi-layer circuit layer; if the multiple circuit layers are warped, blind fishing is carried out on the multiple circuit layers to form stress grooves so as to release pressing thermal stress, and then the next process is carried out; and if the multiple circuit layers do not warp, performing the next process. According to the invention, if the multiple circuit layers are warped after lamination, the multiple circuit layers are subjected to blind fishing to form the stress grooves so as to release the lamination thermal stress, so that the warpage degree is reduced, and the process can prevent the multiple circuit layers from being warped and recovered after being subjected to external force; therefore, the influence on the subsequent process due to the high warping degree of the multi-layer circuit board is avoided.

The invention discloses a PCB positioning device and solder paste printing equipment, and relates to the technical field of circuit board production, and the PCB positioning device comprises a first lifting mechanism, a second lifting mechanism and a positioning clamp. Wherein the first lifting mechanism can do lifting motion relative to the base table, the second lifting mechanism is located above the first lifting mechanism and can do lifting motion relative to the first lifting mechanism, the upper portion of the second lifting mechanism is further provided with a carrying table used for carrying a PCB, and the positioning clamp is located above the second lifting mechanism. The positioning clamp forms a clamping space for the PCB, and the object placing table can be driven by the second lifting mechanism to move in the direction close to or away from the clamping space. The two lifting mechanisms lift the PCB to the highest position of the clamping position of the positioning clamp and the height of the printing position, it is guaranteed that the upper surface of the positioning clamp and the printing face of the PCB can make full contact with the lower surface of the steel mesh, it is guaranteed that printing content cannot be lost, the good printing quality is guaranteed, and the final process effect is improved.

The application provides a stacked system module and a welding method thereof. The system module comprises a first substrate, a carrier plate and a second substrate stacked in sequence along a first direction. The first substrate comprises a first surface and a second surface arranged oppositely, and the second surface is provided with a first pad. The second substrate comprises a third surface and a fourth surface arranged oppositely, wherein the third surface faces the second surface, and the third surface is provided with a second pad. The carrier plate comprises an opening and a connecting piece, wherein, along the first direction, projections of the first pad and the second pad are both located at the periphery of the projection of the opening, and the connecting piece is used for electrically connecting part of the first pad and part of the second pad through the connecting piece. The system module is beneficial to reducing the warping of the system module, reducing the failure rate of welding the first substrate and the second substrate on the carrier plate, facilitating heat dissipation of the first substrate and the second substrate, and improving the space utilization of the system module.