95results about How to "Reduce warpage" patented technology

The application provides a stacked system module and a welding method thereof. The system module comprises a first substrate, a carrier plate and a second substrate stacked in sequence along a first direction. The first substrate comprises a first surface and a second surface arranged oppositely, and the second surface is provided with a first pad. The second substrate comprises a third surface and a fourth surface arranged oppositely, wherein the third surface faces the second surface, and the third surface is provided with a second pad. The carrier plate comprises an opening and a connecting piece, wherein, along the first direction, projections of the first pad and the second pad are both located at the periphery of the projection of the opening, and the connecting piece is used for electrically connecting part of the first pad and part of the second pad through the connecting piece. The system module is beneficial to reducing the warping of the system module, reducing the failure rate of welding the first substrate and the second substrate on the carrier plate, facilitating heat dissipation of the first substrate and the second substrate, and improving the space utilization of the system module.

In order to obtain a high-frequency module with less warping, small size, and high connection reliability, a wiring substrate is provided, which has: a core material made of glass, having a first surface, a second surface opposite to the first surface, and a through-hole passing through the first surface to the second surface; a first adhesion layer formed so as to adhere to the first surface and an inner wall of the through-hole, and further block a bottom of the through-hole on the second surface side; a second adhesion layer adhering to the second surface and the first adhesion layer blocking the bottom of the through-hole on the second surface side; a first wiring layer laminated on the first adhesion layer; and a second wiring layer laminated on the second adhesion layer, wherein in a case where a total area of the first wiring layer is set as A, and an area occupied by copper in the first wiring layer is set as B, a residual copper rate C of the first wiring layer is represented by C=B / A (%), C=70-100%, and a Young's modulus of a material of the first adhesion layer is 0.1-0.85 times a Young's modulus of a material of the first wiring layer.

This invention discloses a high-density, high-thermal-conductivity hot-pressed aluminum nitride substrate and its preparation method, belonging to the field of ceramic thermally conductive materials technology. The aluminum nitride substrate is composed of aluminum nitride powder and a composite sintering aid, the composite sintering aid being a fluoride, with a total addition amount of 2%-8% of the aluminum nitride powder mass. The aluminum nitride substrate has a multi-layer composite structure, including an upper dense layer, a middle stress buffer layer, and a lower dense layer. The porosity of the upper and lower dense layers is ≤0.3%, and the porosity of the middle stress buffer layer is 1%-5%. The preparation method includes steps such as raw material mixing, multi-layer molding, hot-pressing sintering, and diamond wire saw cutting. This invention achieves grain boundary purification through a pure fluoride composite aid system, combined with a multi-layer structure design to absorb cutting stress and thermal stress, resulting in a substrate density ≥99.5%, thermal conductivity ≥240W / (mK), and an ultra-thin substrate edge chipping rate ≤3%, while simultaneously reducing the sintering temperature and shortening the production cycle.

The invention provides a low-water-absorption glass bead modified PBT (polybutylene terephthalate) material and a preparation method thereof. The low-water-absorption glass bead modified PBT material comprises the following components in parts by weight: 70-100 parts of PBT resin; 0 to 30 parts of solid glass beads; 0-5 parts of a toughening agent; 0-2 parts of an antioxidant; 0-2 parts of a lubricant; 0-2 parts of black color master batch; 0-2 parts of a coupling agent; 0-5 parts of polytetrafluoroethylene wax; wherein the average particle size of the solid glass beads is 1-50 [mu] m; the average particle size of the polytetrafluoroethylene wax is 3-15 [mu] m, and the weight-average molecular weight of the polytetrafluoroethylene wax is 10000-30000 g / mol; the weight ratio of the solid glass beads to the polytetrafluoroethylene wax is (5-10): 1. According to the invention, the polytetrafluoroethylene wax is added into the solid glass bead modified PBT material, so that the shrinkage difference between the material flow direction and the vertical flow direction is effectively reduced, the water absorption rate of the material is remarkably reduced, the preparation process is simple, and the production process is easy to control.

This utility model discloses an eco-board based on single mortise and tenon joint. The eco-board includes sub-wood strips and mother-wood strips, and the transverse direction of the eco-board is spliced ​​using mortise and tenon joints, while the longitudinal direction is spliced ​​using toothed joints. Its advantages are as follows: Compared with double mortise and tenon joints, the eco-board of this utility model, using a single mortise and tenon joint, has higher process efficiency and better economy. The processing time for single mortise and tenon joints can be reduced by 30%-50%, making it particularly suitable for mass production and requiring lower equipment precision. Secondly, it reduces the grooving process, lowering labor and tooling costs. Furthermore, the single mortise and tenon joint reduces material removal, making it suitable for scenarios requiring weight reduction (such as hanging cabinets and movable furniture). Moreover, the single mortise and tenon joint is particularly suitable for thin boards, requiring no larger board thickness for support, and can be used stably in eco-boards with a thickness of less than 18mm, thus broadening its application range.

The application discloses a kind of based on high-precision prediction model injection molding process parameter multi-objective optimization method, based on simulation test result, first by MIC and GAN to data is enhanced, to improve the quality of simulation data;Then utilize the mixed framework of KOA and IVYA to carry out hyperparameter tuning;Subsequently adopt SHAP method to enhance the explainability of XGBoost model, and provide the search range of optimized process parameter;Finally, application MOCGO finds the Pareto front of quality target, and determines optimal process parameter combination.Test results show that, using the process parameter combination optimized by the method of the application makes warping deformation and volume shrinkage rate reduce by 35.7% and 10.1% respectively, can realize effectively reduce the warping deformation and volume shrinkage rate of forming plastic part, and then obtain high-quality plastic product, can provide theoretical basis and data support for obtaining injection molding optimal process parameter combination.

The application provides an insulating ink with ultra-micro warping degree, a back contact cell without main grid, a preparation method of the back contact cell, a back contact cell and an electrical equipment, and relates to the field of back contact cells. According to the insulating ink with ultra-micro warping degree, the raw materials include 55-65% of polyimide resin, 15-20% of solvent, 3-5% of filler, 3-5% of leveling agent and 2-5% of crosslinking agent, with the mass of the insulating ink with ultra-micro warping degree being 100%. The ink of the formula can reach high hardness and small warping degree after solidification.

The embodiment of the application provides a kind of adaptive sheet laser cutting quality closed loop optimization method and device, it is related to laser cutting technical field, method includes scanning and establishing initial three-dimensional curved surface model and marking non-contact area by cutting head two sides array laser displacement sensor before cutting;Path pre-compensation is carried out based on multivariate regression thermal deformation empirical model, and adaptive micro-hole array is generated in the expected warping section to actively release internal stress;During cutting, the same axis optical sensor and array displacement sensor data are fused to monitor slit width and slag splashing in real time, and laser power, cutting speed and auxiliary air pressure are dynamically linked and adjusted;After cutting, the same sensor array verifies deviation and intelligently disposes;Recursive least squares (RLS) algorithm is used to close loop correct empirical model parameters.The application has the effect of reducing sheet flatness deviation, improving productivity and reducing scrap rate.

This utility model provides a pre-compression and shaping structure for packaging boxes, which is installed on a conveying device. It includes: a vertical beam, one end of which is located on the side of the conveying device, and the other end extending above the conveying device and spaced apart from the conveying surface of the conveying device; a guide member, located at the other end of the vertical beam and extending along the conveying direction of the conveying device; a pre-compression plate, horizontally positioned and vertically guided at the other end of the vertical beam; and a driving device, one end connected to the pre-compression plate and the other end connected to the vertical beam, for driving the pre-compression plate to move vertically. This arrangement enables pre-compression and shaping of the packaging box, effectively preventing box distortion caused by the lid lifting and improving the quality of subsequent packaging.

The invention provides an electronic device and a manufacturing method thereof. The manufacturing method of the electronic device includes the following steps. Providing a substrate structure, wherein the substrate structure comprises a first substrate and a second substrate; providing a first anti-warping layer on at least one side of the substrate structure; forming a first circuit structure on the first substrate; and forming a packaging structure on the first circuit structure, wherein the first substrate is arranged between the first circuit structure and the second substrate, and the thermal expansion coefficient of the first substrate is greater than that of the second substrate.

This invention discloses an impact-resistant plastic granule and its preparation method, belonging to the technical field of polyamide modified materials. The preparation method includes the following steps: raw material drying pretreatment, premixing and activation treatment, overall material blending, twin-screw oriented melt extrusion, cooling granulation, and post-treatment sieving. A twin-screw extruder, combined with a stretching die, induces hydroxyapatite (HAP) nanowires to orient orderly along the melt flow direction, forming a biomimetic enamel-like framework structure. Simultaneously, utilizing the B-N coordination between the terminal amino groups of polyamide and boric acid, and the dehydration esterification reaction of the terminal hydroxyl groups introduced by the hydroxylated graft compatibilizer with boric acid and HAP surface hydroxyl groups, dynamic borate ester covalent bonds and B-N coordination bonds are generated in situ, supplemented by Ca coordination bonds and hydrogen bonds to construct a multi-interface bonding system. This invention completely eliminates the use of elastomer toughening agents, increasing the notched impact strength of the cantilever beam from 5 kJ / m of pure PA6 to 12–15 kJ / m, and the flexural modulus from 2.5 GPa to 3.2–3.8 GPa, achieving a simultaneous improvement in rigidity and toughness.

The utility model discloses a wooden floor base material and a wooden floor, and belongs to the field of wooden floors. The wooden floor base material comprises a frame plate blank defined by a middle batten and side battens, the side battens are located on the two sides of the middle batten in the width direction, a dividing groove is formed in the surface of the middle batten, and the extending depth of the dividing groove on the surface of the middle batten does not penetrate through the thickness of the middle batten; insert strips are installed in the dividing grooves in a matched mode and are made of metal materials or plastic materials. According to the wood floor, the problems of dry shrinkage, wet expansion and buckling deformation of the wood floor can be relieved in a targeted mode, and therefore the long-term use stability of the wood floor is improved.

This invention relates to the field of photovoltaic cells, specifically to a bending mechanism for a stacking welding machine and its usage method, and a photovoltaic module, including pressure pins, suction nozzles, a lifting plate, and a driving mechanism. Multiple pressure pins and suction nozzles are disposed at the bottom of the lifting plate. The output end of the driving mechanism is connected to the lifting plate to drive the pressure pins and suction nozzles to move up and down. The pressure pins act on the non-busbar dense area of ​​a single cell, independently bending and shaping each cell in the cell string entering the stacking process. The suction nozzles are correspondingly disposed in the center area of ​​the cell, adsorbing and fixing the cell after bending for welding. This invention solves the problem of warping, microcracks, and even breakage of BC cells during the stacking process, resulting in a flatter cell string and thus improving module yield and reliability.

The invention relates to the technical field of photoelectric devices, and discloses an optical engine packaging structure and a preparation method thereof. The structure comprises an adapter plate structure, an electrical module, a first rewiring layer, an optical module and a packaging substrate, a containing space of the adapter plate structure comprises at least part of the thickness of the adapter plate structure, and a conductive structure is arranged in a penetrating mode in the thickness direction; the electrical module is arranged in the accommodating space and the front surface of the electrical module is exposed; the first redistribution layer is arranged on the adapter plate structure and is electrically communicated with the conductive structure and the electrical module; the optical module is arranged on the first rewiring layer, the front side faces the first rewiring layer, and an optical port is exposed to the external space and connected with an external optical device; the packaging substrate is arranged on the back surface of the adapter plate structure and is suitable for being electrically connected with the electrical module. According to the invention, the optical module is stacked on the electrical module, so that the warping is reduced, the signal transmission is improved, the packaging size is reduced, and the process is simple.

The utility model provides a battery piece anti-bending device, battery string carrying equipment and a battery piece fixing anti-bending assembly. The battery piece anti-curving device comprises a pressing structure; the driving structure is connected with the downward pressing structure, and the driving structure is used for pushing the downward pressing structure to downwards press the battery piece; and the adsorption structure is arranged on at least one side of the downward pressing structure and is used for abutting against one surface of the battery piece. Thus, according to the battery piece anti-bending device, the downward pressing structure is arranged, downward pressing anti-bending can be conducted on the protruding part of the welded battery piece, meanwhile, the adsorption structure abuts against one surface of the battery piece, and therefore excessive warping of the side portion of the battery piece caused when the downward pressing structure presses the battery piece can be relieved; therefore, the warping of the battery piece after welding is reduced.

The invention provides a groove type Schottky barrier diode capable of being freely spliced. The diode comprises a substrate, and the surface of the substrate comprises a groove type Schottky barrier diode formed by a plurality of rectangular unit blocks which can be spliced. Each unit block comprises a plurality of groove type cells and a closed terminal groove surrounding the cells; and the unit blocks are isolated from one another through the substrate. According to the technical scheme, through the structure of the plurality of unit blocks, the concentrated stress of the integral structure is dispersed to the isolation areas among the unit blocks, and the stress conduction efficiency is further weakened in combination with central symmetry arrangement and the vertical gate electrode direction, so that the warping degree of the wafer when the temperature is changed is reduced, and the reliability of the wafer is improved. And the electrical stability and the process yield are improved.

The application discloses a multi-directional filament laying control method of a variable-angle filament laying component, belongs to the technical field of composite material manufacturing, and acquires filament laying design parameters and production parameters, generates a reference path curve through a path generation algorithm, and performs curvature judgment and optimization according to a curvature radius reference value, so as to ensure the path feasibility; the equal-distance, continuation and interpolation methods are adopted to generate a layer of filaments based on the production parameters, the starting point is adjusted according to a predefined laying principle, and the curve path information of the whole component is generated through filament translation; for a plurality of layers, the alternating layer principle is applied to generate the paths of the layers; control instructions containing the motion path, the filament laying angle and the speed are generated based on all the path information, so as to drive the filament laying equipment to perform the multi-directional filament laying operation; through the unit-level refined modeling and the active control of defects, the application realizes the accurate control of the variable-angle filament laying, and effectively improves the structural strength and the manufacturing quality of the composite material component.

The application discloses a method for improving the thickness and quality uniformity of crystal growth, a repairing method and a crystal. The method comprises the following steps: providing a growth system required for growing a group III nitride crystal by a flux method liquid phase epitaxy, forming a temperature gradient between a top layer part and a bottom layer part of a molten growth material, so as to form a closed circulation flow field of the molten growth material and a nitrogen source in the molten growth material; and in an initial stage of the growth of the group III nitride crystal, adjusting the temperature gradient to a positive temperature gradient, and then alternately switching the temperature gradient between the positive temperature gradient and a negative temperature gradient, so as to change the nitrogen source concentration distribution and the growth rate of different regions of a growth interface of the group III nitride crystal, until the growth interface of the group III nitride crystal presents as a flat surface. The method provided by the application is simple in operation and wide in application range, and can reduce the production cost and improve the yield of the crystal.

The utility model relates to cross -film self -adhesion waterproof roll material technical field, concretely is a kind of cross -film self -adhesion waterproof roll material production equipment, it includes production table, preheating tensioning mechanism, cooling mechanism and sliding block: preheating tensioning mechanism is set in the end of production table;Cooling mechanism is set in the top of workbench;Sliding block is slidably arranged on preheating tensioning mechanism.The utility model is through the setting of winding assembly and preheating tensioning mechanism, motor one is rotated winding by winding roller and is rolled, motor two drives the air in preheating roller to flow quickly to thus accelerate the preheating of preheating roller, spring two and spring three can be according to the size of roll material adjust the position of pressing plate and preheating roller, like this can ensure that roll material keeps flat in production process, avoid the wrinkle, deformation or thickness uneven caused by slackening, to improve the appearance quality and size precision of roll material, and make roll material base material and glue layer heat consistent, avoid the performance difference caused by local overheating or supercooling.

This invention discloses a highly sensitive detection device and method for immersion-type ultrasonic signal detection in liquids. The invention provides a circular diaphragm with concentric corrugations and a center-thinned structure, and uses this diaphragm as a reflective surface of an optical interference cavity to construct a highly sensitive detection device for immersion-type ultrasonic signal detection in liquids. The diaphragm, used to sense ultrasonic signals, has identical concentric corrugations and a center-thinned structure on both sides, enabling the diaphragm to achieve higher mechanical sensitivity without significantly reducing its natural frequency. The concentric corrugations effectively release initial residual stress introduced during processing and packaging, reducing surface warping and baseline drift. Simultaneously, a replaceable acoustic membrane is constructed in front of the diaphragm, achieving high sound transmission and anti-contamination under long-term immersion in liquid conditions. This detection device can be directly placed in the liquid for detection, improving the sensitivity of ultrasonic signal detection while maintaining a wide frequency range, preventing contamination of the detection element, and ensuring the long-term stability of the detection device.

The application relates to a bamboo rotary cutting device, a supporting slide frame, a clamping frame arranged at one end of the supporting slide frame, a rotary cutting slide rail arranged at the upper portion of the supporting slide frame, a sliding cutter frame arranged on the rotary cutting slide rail at one side of the bottom of the clamping frame, a hinged cutter frame arranged in the sliding cutter frame, a rotary cutter horizontally arranged in the hinged cutter frame, a supporting slide rail hingedly arranged at one end of the bottom of the supporting slide frame close to the clamping frame, and a lifting rod arranged at the other end of the bottom of the supporting slide frame. The following technical effects can be achieved: the eccentric shaft frame and the cutter distance screw rod can be used in cooperation to finely adjust the vertical distance between the pressure ruler and the rotary cutter; the pushing screw rod can be used to horizontally adjust the horizontal position of the pressure ruler; the lifting rod can be used to adjust the angle of the supporting slide rail; the hinged cutter frame sliding on the supporting slide rail can be inclined according to the height of the supporting slide rail; the rotary cutter can always keep the optimal cutting angle with the surface of the wood, and the uneven thickness can be avoided.

This application belongs to the field of metal composite plate preparation, specifically relating to a 304 stainless steel-high manganese steel composite plate and its preparation method. The preparation method includes the following steps: S1, obtaining 304 stainless steel slabs and high manganese steel slabs, stacking and welding the 304 stainless steel slabs and high manganese steel slabs to obtain a first composite slab; S2, heating the first composite slab to obtain a second composite slab; S3, rolling the second composite slab to obtain the 304 stainless steel-high manganese steel composite plate. This application solves the problem of "excessive thinning of the soft phase" caused by the hardness difference in "soft / hard" composite plates during rolling by introducing a thickness ratio compensation formula in the billet assembly stage. This significantly improves the thickness ratio accuracy of the final product. By dynamically adjusting the speed ratio, the rolling effect generated by "variable speed rolling" effectively offsets the internal bending moment caused by uncoordinated deformation, significantly reducing the warping and buckling phenomenon of the composite plate.

The application relates to a silicon micro powder-boron nitride composite material and a preparation method and application thereof, and the preparation method comprises the following steps: mixing silicon micro powder, a silane coupling agent and an organic solvent and heating, so that the surface of the silicon micro powder is grafted with amino groups, thereby obtaining a seed solution; mixing the seed solution, an emulsifier and a solvent, thereby obtaining a seed emulsion; mixing a boron-containing compound, a nitrogen-containing compound and an organic solvent, thereby obtaining a precursor solution; and mixing the seed emulsion and the precursor solution and heating, so that the surface of the silicon micro powder is coated with boron nitride, thereby obtaining the silicon micro powder-boron nitride composite material. The preparation method realizes the regulation of the structure and performance of the silicon micro powder-boron nitride composite material and is beneficial to improving the consistency of the prepared silicon micro powder-boron nitride composite material. The operation process of the preparation method is relatively simple, the cost is controllable, and the preparation method has a good industrial production prospect.

The present disclosure provides a carrier assembly for carrying semiconductor package strips, comprising: a carrier body comprising a housing, the housing comprising side walls with support slots for carrying the semiconductor package strips inside the housing respectively, and the housing defining a front opening and a rear opening between the side walls to allow placement and displacement of the semiconductor package strips; and a pair of clamping devices for applying a clamping force to the semiconductor package strips against the support slots respectively, and each of the pair of clamping devices comprising: a locking plate; a strip contact extension extending from the locking plate and insertable through one of the front opening and the rear opening of the housing; and a locking member for moving the strip contact extension between a locked position and an unlocked position, wherein in the locked position, a semiconductor package strip is pressed by the respective strip contact extension against the support slot.

The application provides a common metal mask plate and an evaporation system. The common metal mask plate comprises a peripheral area and an opening area, the opening area has a plurality of evaporation openings, the peripheral area and the opening area each are a part around the evaporation openings and respectively comprise a bridge part and a first etching part arranged in sequence close to the evaporation openings, a first surface of the bridge part is protruded from a first surface of the first etching part and is used for being attached to a to-be-evaporated substrate, the first etching part is configured to form a first cavity with the to-be-evaporated substrate, the first cavity is communicated with the evaporation openings, an edge of the peripheral area away from the evaporation openings comprises a second etching part, a welding spot for welding a frame is arranged in the second etching part, the first surface of the first etching part is protruded from the first surface of the second etching part, the second etching part is configured to form a second cavity with the to-be-evaporated substrate, and the second cavity is communicated with an external environment. The application can reduce the attachment area of the common metal mask plate and the to-be-evaporated substrate.

This invention relates to the use of a PET double-sided copper foil composite material in the fabrication of 224Gbps or 448Gbps high-speed communication cables. The PET double-sided copper foil composite material comprises a PET base film and a first copper foil layer and a second copper foil layer respectively disposed on both sides of the PET base film. This type of composite material was originally used as a conductive current collector in batteries; this invention adapts it for the field of high-speed communication cables, allowing it to serve as a covering layer, shielding layer, conductive connection layer, or grounding connection layer in 224G or 448G high-speed communication cables. A continuous shielding and grounding path is formed through overlaps, exposed copper foil connection areas, drain lines, grounding conductors, connection terminals, or shielding shells to improve electromagnetic shielding continuity, reduce crosstalk and external electromagnetic interference, and improve impedance stability, insertion loss stability, and shielding reliability after bending. This application differs from its use as a carrier of active materials for battery electrodes and as a current collector for battery charging and discharging; it addresses the issues of shielding, covering, conductive connection, and signal integrity in high-speed signal transmission environments.

The invention relates to the field of photovoltaic module manufacturing, in particular to an insulating glue printing screen plate for a back contact solar cell and a using method thereof.The insulating glue printing screen plate comprises a plurality of discontinuous insulating glue printing units distributed in the extending direction of a main grid, and interval areas without printing patterns are arranged between every two adjacent insulating glue printing units; forming a sectional insulating glue layer on the surface of the battery piece in the silk-screen printing process; wherein the insulating glue printing unit corresponds to an electrical isolation area on the battery piece. The solar cell can reduce the using amount of insulation paste, reduce the warping problem of the cell, reduce the back shading area, improve the double-sided rate, gain back power generation and reduce the cost.

This invention relates to the field of battery technology, specifically to a battery. The battery includes a casing and an electrode assembly, the electrode assembly being located within a receiving space formed by the casing. The casing includes a first through-hole, and the battery further includes a connecting mechanism connected to a first tab assembly, the connecting mechanism passing through the first through-hole. The connecting mechanism includes a conductive element and an insulating element, the conductive element being connected to the first tab assembly, and the insulating element being located between the casing and the conductive element. At least one of the interfaces between the conductive element and the insulating element and between the insulating element and the casing forms a bonding region. The bonding region includes a first surface of the conductive element facing the insulating element and / or a second surface of the casing facing the insulating element, the first surface and / or the second surface including a plurality of recesses, the orthographic projection of the insulating element covering the recesses, and the insulating element including protrusions embedded in the recesses. The battery of this invention is applicable to batteries of various thicknesses and can improve the sealing performance and connection strength of the connecting mechanism.

The application discloses a kind of warping LED chip protection liquid method, in turn is chip front face film, back cutting, chip overturn, protection liquid drop, protective film covers, vacuum adsorption and centrifugal rotation.Combining the warping characteristics of the existing grinding method to the LED chip, by chip front face film, reduce the risk of chip fragment, chip back cutting releases grinding stress to reduce chip warping, protective film covers can guarantee that all areas of warping LED chip are wrapped with protection liquid, centrifugal rotation makes the protection liquid of LED chip surface everywhere uniform, forms tight and uniform protective layer on the surface of LED chip, plays the role of isolation heat and metal debris when laser cutting, achieves the effect that chip surface circuit is not oxidized and chip is not broken edge, after laser cutting, clean up metal debris and residual protective layer completely.