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521results about How to "Avoid warping" patented technology

Laser cutting platform deck and laser cutting equipment

The invention relates to the technical field of laser cutting, in particular to a laser cutting carrying table and laser cutting equipment. The device comprises a machine body, racks are arranged on the two sides of the bottom of a movable base plate, a vibration assembly is arranged below the racks, and when the movable base plate moves, the racks drive the vibration assembly to knock the surface of a workbench. When the eccentric rod rotates, a hitting ball is driven to hit the surface of the workbench, slag particles left in a supporting plate on the surface of the workbench are loosened, the slag particles adhered and clamped in the supporting plate are blown away in cooperation with an air blowing pipe, and it is avoided that slag splashes into a laser light path, and the cutting precision and quality are seriously affected; the surface of the supporting plate is always kept in a clean state, and the service life of the laser cutting device is prolonged.
Owner:JIANGSU SMART WORKSHOP TECHNOLOGY RESEARCH INSTITUTE CO LTD

Back contact cell, back contact cell string, cell assembly, and photovoltaic system

The invention relates to the technical field of solar cells, and particularly discloses a back contact cell, a back contact cell string, a cell assembly and a photovoltaic system.The back contact cell comprises first grid lines and second grid lines which are alternately arranged in the first direction; the first Pad points and the second Pad points are alternately arranged in the second direction, the first Pad points are connected with the first grid lines, and the second Pad points are connected with the second grid lines; wherein the first grid line comprises a first grid line body and a third grid line, and the first grid line body and the third grid line are connected into an integrated structure; along the first direction, the third grid line is arranged at the corresponding first pad point, and the width of the third grid line is greater than that of the first grid line body. The problem of welding tension in the prior art can be solved, and the connection reliability between the welding strip and the fine grid is improved.
Owner:ZHEJIANG AIKO SOLAR ENERGY TECH CO LTD +4

Manufacturing method of photovoltaic module

The embodiment of the invention relates to the technical field of photovoltaic, and provides a manufacturing method of a photovoltaic module, which is at least beneficial to improving the reliability of the photovoltaic module. The manufacturing method comprises the steps that a first adhesive film layer and a second adhesive film layer are laid on a first cover plate, the first adhesive film layer covers the surface of the first cover plate, the second adhesive film layer is located on the first adhesive film layer, the second adhesive film layer is provided with a plurality of hollowed-out parts arranged in the first direction, and the hollowed-out parts and the first adhesive film layer define a containing groove; the thickness of the first adhesive film layer is greater than that of the second adhesive film layer; battery pieces are laid, the multiple battery pieces are in one-to-one correspondence with the containing grooves, and the adjacent battery pieces are sequentially connected through interconnection parts; laying a third adhesive film layer and a second cover plate on the battery piece to form a to-be-laminated piece; and laminating the to-be-laminated piece.
Owner:JINKO SOLAR CO LTD +1

Production detection equipment of instrument panel mounting shell structure

The invention relates to the technical field of shell production and detection, in particular to production and detection equipment for an instrument panel mounting shell structure. The production and detection equipment comprises a workbench, a conveying belt is mounted in the workbench, a first frame and a second frame are fixedly mounted on the surface of the upper end of the workbench, and a first air cylinder is mounted on the surface of the upper end of the first frame; a plurality of shells in a production line can be automatically conveyed and fixed, so that the detection equipment can adapt to production detection of the plurality of shells, the shells can be subjected to partition detection, the strength detection accuracy is improved, the to-be-detected position is automatically switched, and the detection efficiency is improved. According to the shell detection device, the detection work is simpler, more convenient and more efficient, through arrangement of the cleaning rollers, the two ends of the shell can be pressed downwards, warping is prevented, the surface of the shell can be cleaned, the situation that chippings generated during pressing shield the shell is avoided, and workers can conveniently store and collect the detected shells in a classified mode.
Owner:SHAOXING ZHEWEI AUTOMOTIVE ELECTRONICS CO LTD

Automatic cutting device for cutting metal casting

The invention belongs to the technical field of metal casting cutting, and particularly relates to an automatic cutting device for cutting metal castings, which comprises a cutting table, a receiving bin is arranged in the upper surface of the cutting table, and casting clamping mechanisms are arranged on the bin walls of the two sides of the receiving bin and used for positioning and clamping the metal castings to be cut. A sliding supporting mechanism is arranged on the upper surface of the cutting table, a cutting conversion mechanism is installed on the sliding supporting mechanism, the cutting conversion mechanism comprises cutting discs, and the symmetrical cutting discs are hung above the cutting table in a sliding mode through the sliding supporting mechanism and used for cutting and separating the positioned and clamped group tree type metal castings; through mutual cooperation of the casting clamping mechanism and the cutting switching mechanism, the metal casting and the pouring system can be rapidly cut and separated, and meanwhile, the situation that the normal use of the metal casting is affected due to the fact that residual waste materials on the metal casting are not completely cut can be prevented.
Owner:DONGGUAN BIEN TECH CO LTD

Adjustable feeding equipment for stainless steel product machining

The invention discloses adjustable feeding equipment for stainless steel product machining, and relates to the technical field of stainless steel wafer machining, in particular to the adjustable feeding equipment for stainless steel product machining, which comprises a feeding area and a discharging area, the feeding area is positioned at one end of the discharging area, and the discharging area consists of a discharging base and a steering seat; and a driving steering gear and a driven steering gear are rotationally connected to the interior of the discharging base. According to the adjustable feeding equipment for stainless steel product machining, when a set of coiled plates are discharged to be close to the tail end, raw materials can be mounted on the mounting disc on the other side, then horizontal steering is conducted through the steering base, the production preparation time is further shortened, the bracket can easily jack the coiled materials to the proper height to be parallel to the mounting disc through the first hydraulic jacking cylinder, the mounting steps are simplified, and the production efficiency is improved. The height of the feeding area can be adjusted through a second hydraulic jacking cylinder, the feeding area is accurately in butt joint with external stamping equipment, the position of a limiting plate can be adjusted according to the specifications of the plates, and the plates are prevented from deviating in the conveying process.
Owner:BAZHONG XINYUE STAINLESS STEEL CO LTD

Temporary bonding and de-bonding method, preparation method of composite substrate and manufacturing method of wafer

The invention belongs to the field of semiconductor processing and manufacturing, and provides a temporary bonding and de-bonding method, a composite substrate preparation method and a wafer manufacturing method.The temporary bonding and de-bonding method comprises the steps that silicon oxide layers are formed on two silicon substrates; the silicon oxide layer is subjected to ion implantation, hydrofluoric acid treatment and plasma activation, temporary bonding of the two silicon substrates is realized through hydrophilic bonding, and a temporary bonding interface is cracked through de-bonding annealing, so that de-bonding is realized. According to the method, a bonding medium does not need to be used, the thermal properties of the two substrates can be kept consistent, and warping and breaking are effectively avoided; temporary bonding is high in strength and good in stability, the functional substrate can be greatly thinned through the method, and therefore the composite substrate is prepared or the method is further used for manufacturing a multi-layer wafer bonding structure.
Owner:SABERS CO LTD

Multi-roller system after cast film stripping and stripping chamber with multi-roller system

ActiveCN119458727Aquality improvementIt serves as an auxiliary flattening functionPlastic recyclingFlat articlesCast filmsChain link
The invention discloses a multi-roller system used after cast film stripping and a stripping chamber with the multi-roller system. The multi-roller system comprises a guide roller, a traction roller and a gravity roller which are arranged on a rack of the multi-roller system. The traction roller is located on the downstream side of the stripping roller, and one or more guide rollers are arranged between the traction roller and the stripping roller at intervals; the traction roller comprises two driving rollers which are arranged adjacently, and the film conveying path is of an S-shaped structure at the traction roller; the gravity roller is located on the downstream side of the traction roller, and the gravity roller and the gravity roller balance weight mechanism are arranged on the same closed chain or arranged on the two closed chains through a synchronous transmission mechanism respectively. According to the scheme, the problems that embossing is generated, the film thickness is affected and the like are avoided, constant tension is provided through gravity or other modes, tension adjustment is achieved, and micro longitudinal stretching is carried out; therefore, the film quality is improved. A negative pressure air curtain device is preferably arranged in the stripping chamber, so that the process environment control stability and the system safety are remarkably improved.
Owner:GUANGDONG SHICHENG PLASTIC MACHINERY

Chip heat dissipation packaging structure and preparation method of chip heat dissipation packaging structure

The present invention provides a chip heat dissipation packaging structure and a preparation method of the chip heat dissipation packaging structure, which relates to the field of chip packaging technology. The chip heat dissipation packaging structure includes a substrate, a packaged chip, a heat conductive material layer and a first heat dissipation cover, wherein the packaged chip is mounted on the substrate; the heat conductive material layer is arranged on the side of the packaged chip away from the substrate; the first heat dissipation cover is arranged on the substrate and covers the outside of the packaged chip, and the first heat dissipation cover is at least partially located on the side of the heat conductive material layer away from the substrate; wherein a plurality of first heat dissipation bumps are arranged on the side of the first heat dissipation cover close to the substrate, and the plurality of first heat dissipation bumps are all connected to the surface of the side of the packaged chip away from the substrate, and the heat conductive material layer is connected to the first heat dissipation cover. Compared with the prior art, the present invention can greatly increase the heat dissipation area by adding the first heat dissipation bump and combining the design of the heat conductive material layer, without expanding the design size of the first heat dissipation cover, and avoiding the problem of warping of the substrate or chip caused by thermal stress.
Owner:FOREHOPE ELECTRONICS NINGBO CO LTD

Method for tempering glass through low-temperature ion exchange

PendingCN119409428Aincrease surface stressImprove warpageLithiumIon exchange
The invention relates to the technical field of glass, in particular to a method for strengthening glass through low-temperature ion exchange, which comprises the following steps: carrying out first ion exchange strengthening treatment on glass to be treated by adopting first molten salt to obtain primary strengthened glass; carrying out secondary ion exchange strengthening treatment on the primary strengthened glass by adopting second fused salt to obtain the low-temperature ion exchange strengthened glass, wherein the first molten salt comprises a lithium salt, the second molten salt comprises a potassium salt, the temperature range of the first ion exchange strengthening treatment and the second ion exchange strengthening treatment is 250-400 DEG C, and the ion exchange temperature requirement can be met. The two-step strengthening is adopted at low temperature to gradually enhance the surface stress of the glass, so that the bending deformation of the glass caused by sudden enhancement of the surface stress of the strengthened glass is avoided, and the phenomenon of warping of the edge of the glass is effectively improved.
Owner:QINHUANGDAO GLASS IND RES & DESIGN INST

Loader counterweight

The utility model relates to the technical field of loading machine counter weights, in particular to a loading machine counter weight which comprises a fixing frame, a counter weight box is fixedly installed on the fixing frame, sand is filled in the counter weight box, a moving groove is formed in the fixing frame, a threaded rod is horizontally and rotatably installed in the moving groove, and the threaded rod is fixedly connected with the fixing frame. A driving motor is fixedly mounted at one end of the fixing frame, a threaded rod is sleeved with a moving block in a threaded mode, a mounting plate is fixedly mounted on the lower surface of the moving block, a plurality of fixing frames are mounted on the mounting plate through connecting assemblies, and balancing weights are fixedly mounted on the fixing frames. Through mutual cooperation of the driving motor, the threaded rod, the moving block, the mounting plate, the fixing frame and the balancing weight, the gravity center of the balance weight on the loader can be horizontally adjusted, the loader is prevented from tipping over and tilting backwards, the problem that the gravity center position of a traditional loader balance weight cannot be adjusted is solved, and the overall applicability and flexibility of the loader are improved.
Owner:SHANDONG KAIZER HEAVY IND CO LTD

Semiconductor chip production and processing equipment

The invention relates to the technical field of semiconductor chip production, and particularly discloses semiconductor chip production and processing equipment which comprises a machine body, a workbench and a supporting plate, the workbench and the supporting plate are fixedly installed on the inner wall of the machine body, a placing table used for placing a wafer is fixedly installed at the top of the workbench, the supporting plate is located above the workbench, and an air cylinder is fixedly installed at the top of the workbench. The output end of the air cylinder penetrates through the supporting plate in a sliding mode and is fixedly provided with a driving plate, the bottom of the driving plate is provided with a rotary dispatching mechanism, a rail stripping mechanism and an annular cutting mechanism, and a follow-up ejection mechanism is arranged between the placing table and the driving plate. The whole process is completed in a full-automatic manner and is realized by utilizing the intermittent period of scheduling movement of the laser head, and the cutting time is not occupied, so that the stripping efficiency and the stripping quality are greatly improved, and the wafer production period does not need to be prolonged at the same time.
Owner:JINGYAO SEMICON TECH (SHANDONG) CO LTD

Automatic vegetable cutter

The utility model provides an automatic vegetable cutter which belongs to the technical field of vegetable cutters and comprises an electric conveying belt and a pressing mechanism arranged in the middle of the electric conveying belt, the pressing mechanism comprises electric telescopic rods transversely and symmetrically arranged in the middles of the left surface and the right surface of the electric conveying belt, and round rods are arranged in the middles of the upper end faces of the telescopic ends of the electric telescopic rods. Mounting plates are arranged on the upper end faces of the round rods, an electric conveying belt is slidably connected between the two round rods, and an automatic vegetable cutting assembly is further arranged at the front end of the electric conveying belt. By means of the downward pressing mechanism, the food material cutting device can meet the downward pressing requirements of food materials with different thicknesses, it can be guaranteed that the food materials are relatively stable in the cutting process, it is avoided that the food materials are away from a cutter and warp in the cutting process, and it is guaranteed that the food materials are kept in a straight posture in the cutting stage; therefore, the shape, the finished product and the regularity of the processed vegetables meet the required requirements.
Owner:HENAN YUNONG FOOD CO LTD

Preparation method of CoCrNi medium-entropy alloy / 316L stainless steel composite sheet

The invention provides a preparation method of a CoCrNi medium-entropy alloy / 316L stainless steel composite sheet, and belongs to the field of metal matrix composite material forming. The preparation method comprises the following steps: preparing the CoCrNi medium-entropy alloy / 316L stainless steel composite thick plate by adopting an explosive welding method; cutting a blank with good interface bonding from the composite thick plate; then multi-fire and multi-pass hot rolling is carried out; performing multi-pass cold rolling on the hot-rolled plate after annealing; and stress relief annealing is conducted after cold rolling, and the medium-entropy alloy / stainless steel composite sheet is obtained after air cooling. The CoCrNi medium-entropy alloy / 316L stainless steel composite sheet obtained by the method is uniform in thickness, flat and straight in joint surface, excellent in mechanical property, simple in production process and suitable for industrial production.
Owner:HUNAN NANHENG INTELLIGENT EQUIPMENT CO LTD

Metal rolling equipment capable of adjusting rolling thickness

The invention provides metal rolling equipment capable of adjusting the rolling thickness, and relates to the technical field of metal plate rolling. A rectangular plate is fixed to the upper end of the bottom frame, two supports are installed on the rectangular plate through bolts, two fixing bases are fixed to the two supports respectively, adjusting bolts are screwed to the fixing bases in a threaded mode, and a partition plate is installed at the upper ends of the four adjusting bolts. The spring on the vertical rod can upwards extrude the bottom roller, the spring and the top roller jointly apply rolling force to a metal plate, the position of the partition plate can be accurately adjusted by rotating the four sets of adjusting bolts, then the distance between the bottom roller and the top roller is adjusted, and accurate control over the rolling thickness is achieved; the height of the adjusting roller can be finely adjusted by controlling stretching and retracting of the first hydraulic rod, the right side of the metal plate can be effectively prevented from being pressed downwards through the adjusting roller, it is guaranteed that the metal plate is kept in a balanced state in the whole rolling process, and therefore warping or inclination caused by uneven stress is avoided.
Owner:NANTONG HONGJIN METAL MATERIALS PROCESSING CO LTD

A neurosurgery retractor

The present invention relates to the technical field of medical instruments, and more specifically, it relates to a retractor for neurosurgery, including a retracting mechanism, which includes a handle assembly, and a retracting assembly rotatably mounted on the handle assembly, the handle assembly including a first handle and a second handle rotatably connected together, and a matching self-locking member arranged on the first handle and the second handle, the retracting assembly including a support rod rotatably mounted on one end of the first handle and the second handle, a sliding member arranged on the support rod, a retracting hook rotatably mounted on the sliding member, and a parallel separation member arranged on the support rod. The present invention solves the problem that during surgery, the doctor's limb movements during surgery will cause the retractor's retractor hook to warp up or down, thereby causing excessive pulling on the patient's tissue.
Owner:AFFILIATED HOSPITAL OF INNER MONGOLIA MEDICAL UNIV (INNER MONGOLIA AUTONOMOUS REGION CARDIOVASCULAR INST)

Vertical lockrand aluminum-magnesium-manganese plate metal roof structure

The utility model discloses a vertical lockrand aluminum-magnesium-manganese plate metal roof structure which comprises a plurality of protruding connecting pieces fixedly installed on a roof steel frame beam, and connecting plates are fixedly arranged on the two sides of the protruding connecting pieces in the direction perpendicular to the roof steel frame beam. A profiling spraying aluminum plate is fixedly installed on a roof steel frame beam, a dustproof layer, a sound absorption layer, a vapor barrier layer, a heat preservation layer, a waterproof layer and roof panels are sequentially laid on the profiling spraying aluminum plate, and an edge locking support is fixedly installed on a connecting plate and can lock the connecting edge of every two adjacent roof panels. A windproof clamp is detachably installed on the lockrand support and located on the outer side of the roof panel, and a roof lightning protection net is detachably installed on the windproof clamp. The structure can bear large wind load, is not prone to deformation and edge warping, is high in waterproof capacity, can be rapidly connected with a roof lightning protection system, and is simple and compact in structure, convenient to install and high in practicability.
Owner:BEIJING URBAN CONSTR GROUP

RFID (Radio Frequency Identification Device) hang tag packaging compound machine

The utility model provides an RFID (Radio Frequency Identification Device) hang tag rolling compound machine which comprises a rack, the rack is rotationally connected with a chip roller, a surface paper roller and a bottom paper roller, a film roll with a chip is loaded on the chip roller, a surface paper roll is loaded on the surface paper roller, a bottom paper roll is loaded on the bottom paper roller, and a film roll with a chip is loaded on the bottom paper roll. A film with a chip, surface paper and bottom paper are adhered and compounded through the compounding assembly under the action of the multiple traction rollers to form a hang tag roll, the hang tag roll sequentially passes through the light source assembly, the cold air assembly and the cutting assembly to form a hang tag, the hang tag is conveyed through the conveying assembly, and waste of the hang tag roll is wound through the first recycling roller. The first recycling roller and the second recycling roller are used for winding the interlayer belt and the hang tag roll waste respectively, winding routes are separated, and normal production of hang tags is prevented from being affected. The air cooler is additionally arranged, the air cooler conducts continuous air drying on the hang tag roll obtained after gluing and compounding, the gluing effect of the hang tag roll can be improved, the phenomenon that the hang tag roll is turned up is avoided, and therefore the produced hang tag is turned up.
Owner:JUNAI INTELLIGENT LABEL TECH (ZHEJIANG) CO LTD

Composite device for cloth production

The invention provides a compounding device for cloth production, and relates to the technical field of cloth compounding equipment. Comprising a composite conveying piece, and a conveying driving part is installed on the composite conveying piece; a glue solution cooling part is mounted on the composite conveying piece; the glue solution cooling part is used for reducing the permeability of the glue solution; a conveying and smoothing piece is mounted on the composite conveying piece; the conveying and smoothening piece is used for smoothening suede cloth; a differential control piece is mounted on the conveying and smoothing piece, and is used for pre-stretching the thermal shrinkage cloth; the composite device for fabric production can improve the flatness during suede compounding, prevents poor compounding molding quality caused by local aggregation, can perform prestretching by utilizing differential speed, is smoother, and can facilitate direct observation of stretching parameters, so as to solve the problems that an existing composite device for fabric production is inconvenient to cool a hot melt adhesive, so that the permeability is reduced, the permeability is high, and the environmental protection property is poor; and the cloth is easy to wrinkle.
Owner:ZHEJIANG TIANYING NEW MATERIAL TECH CO LTD

Wafer flatness measuring device and method

The invention discloses a wafer flatness measuring device and method, and particularly relates to the technical field of semiconductors, the wafer flatness measuring device comprises a first main body and a second main body, the first main body is internally provided with a moving mechanism and a measuring mechanism, the second main body is internally provided with a feeding device, and the moving mechanism is provided with a fixing mechanism. Through the arrangement of the plugging plate, the plugging plug, the sealing plate and other structures, air flow in the negative pressure hole corresponding to the adsorption groove which is not covered by the to-be-tested wafer can normally flow, the plugging plate and the plugging plug in the corresponding valve body can continue to move downwards, and the plugging plug can be inserted into the sealing plate to realize sealing and sleeving; the negative pressure air flow cannot continue to circulate, impurities in the air are prevented from entering the negative pressure cavity through the negative pressure hole under the action of the suction force, the influence of dust accumulation on the normal work of the external air supply device and the negative pressure suction cup is avoided, the warping phenomenon of the wafer to be measured in the measurement process caused by the reduction of the suction force is avoided, and the measurement precision is improved.
Owner:ZHEJIANG LISHUI XIN WAFER SEMICON TECH CO LTD

Electrode foil heat treatment device

The invention relates to the technical field of electrode foil production, and discloses an electrode foil heat treatment device which comprises a heat treatment box, resistance wire heaters are installed on the inner surface of the top and the inner surface of the bottom of the heat treatment box, movable columns are movably connected to the inner surfaces of fixed columns, and a tight supporting cylinder is arranged between the two movable columns. And the inner surface of the bottom of the heat treatment box is fixedly connected with a closed cylinder, the inner surface of the closed cylinder is movably connected with a piston disc, the outer surface of a transverse shaft is fixedly sleeved with two balance gears, and the outer surface of the bottom of a transverse plate is fixedly connected with two racks. In the heat treatment process, as the temperature rises, the piston disc drives the ejector rod to move upwards, and the racks on the two sides rise at the same time in cooperation with the racks and the balance gear, so that in the heat treatment process, the tensioning force of the tensioning cylinder can be adjusted, and deformation or warping caused by release of internal stress when the electrode foil is heated is avoided; and the heat treatment effect of the electrode foil is improved.
Owner:JIANGSU RONGSHENG ELECTRONICS +1

Anti-uncovering self-adhesive label

The anti-uncovering self-adhesive label comprises a self-adhesive label body and a protective film, the protective film is connected to one side of the self-adhesive label body, and a pressing piece of a rectangular frame structure is fixedly glued to the side, away from the self-adhesive label body, of the protective film. The side, close to the adhesive label body, of the protective film is connected with a second adhesive tape of a rectangular frame structure. The self-adhesive label body comprises a label printing layer, a covering film, a first adhesive layer, a transparent plastic soft plate, first release paper, a second adhesive layer and second release paper, a pulling piece is integrally formed in the middle of one end of the second release paper, and characters are printed on one side of the label printing layer. By means of the design of the transparent plastic soft plate, the strength of the self-adhesive label body can be improved, the self-adhesive label body is not prone to deformation, by means of the design of the pressing piece, edge warping of the protective film can be avoided, and by means of the design of the protective film, edge warping of the self-adhesive label body can be avoided, and the self-adhesive label body is prevented from being uncovered.
Owner:ZHEJIANG SANTIAN PRINTING CO LTD

Welding machine with fixing clamp

The invention relates to the technical field of welding equipment, in particular to a welding machine with a fixing clamp, which comprises a support frame and a welding mechanism, and further comprises a workpiece fixing assembly, the workpiece fixing assembly comprises a placing frame and the fixing clamp, and the fixing clamp is used for fixing two workpieces at preset positions; the movable turnover assembly is installed on the supporting frame and used for driving the containing frame to move in the X-axis direction and turn over by 180 degrees, so that the containing frame can be switched between a first position with the front face facing upwards and a second position with the back face facing upwards; and the two telescopic limiting assemblies are installed on the supporting frame and located below the first position and the second position correspondingly, and the telescopic limiting assemblies can stretch out or retract in the vertical direction so as to conduct overturning limiting or release overturning limiting on the containing frame. Automatic overturning and double-face welding of the workpiece are achieved, the welding efficiency and the welding quality are improved, and the labor intensity and the safety risk are reduced.
Owner:GUANGZHOU HONGHUI METAL PROD CO LTD

Temperature gradient control method, device, equipment and medium for color glazed glass tempering heating section

The invention provides a color glazed glass toughening heating section temperature gradient control method, device and equipment and a medium, belongs to the field of electric digital data processing, and is used for controlling a preset toughening furnace. Comprising the following steps: acquiring to-be-heated colored glazed glass; respectively measuring glass parameters, toner parameters, glass powder parameters and screen parameters corresponding to the colored glazed glass; obtaining target information after the colored glaze glass to be tempered is tempered; the target information comprises target flatness and target glaze ripeness; generating production information corresponding to the colored glazed glass according to the glass parameters, the toner parameters, the glass powder parameters and the screen printing plate parameters; generating control information corresponding to the toughening furnace according to the production information and the target information; the control information comprises preheating control parameters, heating control parameters and soaking control parameters; and controlling the toughening furnace according to the preheating control parameter, the heating control parameter and the soaking control parameter in sequence to realize temperature gradient control of the toughening heating section of the colored glazed glass.
Owner:FAR EAST HENG FAI FACADE (ZHUHAI) LTD +1

Split cooperation type film applicator

ActiveCN224393077UAccurate opening and closingAutomatic precise alignmentFlexible coversWrappersControl theoryFilm applicator
The utility model relates to intelligent equipment pasting film device technical field especially discloses a split cooperation formula pasting film device, including bearing base and with bearing base cooperation use's positioning frame, external intelligent terminal passes via bearing base limit, be equipped with first resistance and second resistance on the positioning frame, the positioning frame is used for the outside of external intelligent terminal of bearing base limit and is set, makes external intelligent terminal between bearing base and positioning frame, first resistance is used for external resistance smart terminal's screen frame, external protective film is used for inserting between second resistance and external intelligent terminal's screen, positioning frame is equipped with abstracts the mouth, when positioning frame sets in the outside of external intelligent terminal, the release film of protective film is driven under the draw -in strip and takes out positioning frame through abstracts the mouth to make the functional film of protective film pastes to the screen surface of external intelligent terminal.
Owner:蒋春林

Preparation method of packaging structure and packaging structure

The invention relates to a preparation method of a packaging structure and the packaging structure, and the preparation method of the packaging structure comprises the steps: providing a first carrier plate; an interposer structure, an interposer substrate, a wiring layer and a conductive through hole structure are formed on the first carrier plate, the wiring layer is located on the side, away from the first carrier plate, of the interposer substrate, and the conductive through hole structure penetrates through the interposer substrate and is connected with the wiring layer; forming a chip on one side, far away from the interposer substrate, of the wiring layer; forming a plastic package layer covering the chip and the interposer structure; removing the first carrier plate; and forming an external circuit module on one side of the interposer structure far away from the chip, wherein the external circuit module is connected with the chip through the interposer structure. The performance of the packaging structure can be effectively improved.
Owner:JCET SEMICON (SHAOXING) CO LTD

A five-roller embosser

This application discloses a five-roll embossing machine, including a machine body, an embossing assembly, a paper feeding assembly, a main drive assembly, and a pressing roller. The embossing assembly includes five embossing rollers, a pair of main gears, and a pair of positioning assemblies. The pair of main gears are rotatably mounted on both sides of the machine body and driven to rotate by the auxiliary drive assembly. Each embossing roller is provided with a quick-release assembly at both ends. The quick-release assembly includes a bearing groove, a toothed cover, several pressure covers, and a fastening assembly. The fastening assembly achieves simultaneous locking of all pressure covers and toothed covers by a single bolt operation through a linkage. The main drive assembly drives the working position embossing roller and the pressing roller to rotate synchronously. The positioning assembly performs precise circumferential positioning of the main gears. This invention solves the problems of cumbersome roller changing, long time consumption, and low positioning accuracy of existing embossing machines, realizes quick roller changing by a single person and seamless switching of five patterns, and greatly improves production efficiency and equipment versatility.
Owner:瑞安市奥特包装机械有限公司

A PCB manufacturing method for preventing slot copper layer from delamination and a PCB

The present invention belongs to the technical field of PCB board manufacturing, and discloses a PCB board manufacturing method for preventing slot hole copper layer delamination and a PCB board, and the PCB board manufacturing method for preventing slot hole copper layer delamination comprises the following steps: after drilling a slot hole on the PCB board, the first baking plate, copper deposition, full-board electroplating and second baking plate are sequentially performed, wherein the baking plate temperature of the first baking plate and the second baking plate are both 145-155°C, and the baking plate time is both 4-5h; the copper layer thickness of the PTH slot hole wall after full-board electroplating is ≥12μm. The present invention can effectively reduce the stress of the slot hole by controlling the copper layer thickness of the PTH slot hole wall after full-board electroplating to 12μm, and then cooperates with the baking plate temperature and baking plate time control of the first baking plate and the second baking plate, and the three processes are combined to produce a synergistic effect, effectively improve the adhesion between the slot hole and the copper layer, prevent the copper layer from separating during the tin spraying process, and greatly reduce the probability of copper layer separation in the slot hole of the PCB board.
Owner:QINGYUAN FUYING ELECTRONICS