505results about How to "High mechanical reliability" patented technology

The present invention discloses a structure of device package comprising a first substrate with a die metal pad, a first wiring circuit on top surface of said first substrate and a second wiring circuit on bottom surface of said first substrate. A die is disposed on the die metal pad. A second substrate has a die opening window for receiving the die, a third wiring circuit on top surface of the second substrate and a fourth wiring circuit on bottom surface of the second substrate. An adhesive material is filled into the gap between back side of the die and top surface of the first substrate and between the side wall of the die and the side wall of the die receiving through hole and the bottom side of the second substrate.

The present invention discloses a semiconductor device package and the method for the same. The method includes preparing a first substrate and a second substrate; opening a die opening window through the second substrate by using laser or punching; preparing an adhesion material; attaching the first substrate to the second substrate by the adhesion material; aligning a die by using the aligning mark of the die metal pad and attaching the die onto the die metal pad with force by the adhesion material; forming a first dielectric layer on top surfaces of the second substrate and the die and pushing the first dielectric layer into gap between the side wall of the die and the side wall of the die opening window under vacuum condition; opening a plurality of via openings in the first dielectric layer; and forming a redistribution layer in the plurality of via openings and on the first dielectric layer.

A single mode fiber having a core, an inner cladding, a depressed cladding, and an outer cladding composed of pure silica glass. The core is surrounded in sequence with the inner cladding and the depressed cladding. The core has silica glass doped with germanium and fluorine, with a diameter (a) of 8.0-8.8 μm, a relative refractive index difference (Δ₁) of 0.35-0.38%, and the contribution of fluoride (Δ_F) is −0.09±0.02%. The inner cladding has silica glass doped with germanium and fluorine, with a diameter (b) of 18-21 μm and a relative refractive index difference (Δ₂) of 0±0.02%. The depressed cladding has silica glass doped with fluorine, with a diameter (c) of 26-36 μm and a relative refractive index difference (Δ₃₂) at the external interface thereof is between −0.22 and −0.35%, and a relative refractive index difference (Δ₃₁) at the internal interface thereof is between −0.20 and −0.35%, and Δ₃₂≦Δ₃₁. The fiber has a good bending resistance, good mechanical properties, and extended service lifetime, and prevents the additional stresses generated by bending from passing on to the core, thereby reducing attenuation.

A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive posts are electrically interconnected with the microelectronic element. Each conductive post has a conductive base that is in contact with the flexible substrate and a conductive tip that extends from the base, with the base of the conductive post having a larger diameter than the tip of the conductive post. In certain embodiments, the conductive base and the conductive tip have a cylindrical shape.

In a stacked chip configuration, and manufacturing methods thereof, the gap between a lower and an upper chip is filled completely using a relatively simple process that eliminates voids between the lower and upper chips and the cracking and delamination problems associated with such voids. The present invention is applicable to both chip-level bonding and wafer-level bonding approaches. A photosensitive polymer layer is applied to a first chip, or wafer, prior to stacking the chips or stacking the wafers. The photosensitive polymer layer is partially cured, so that the photosensitive polymer layer is made to be structurally stable, while retaining its adhesive properties. The second chip, or wafer, is stacked, aligned, and bonded to the first chip, or wafer, and the photosensitive polymer layer is then cured to fully bond the first and second chips, or wafers. In this manner, adhesion between chips/wafers is greatly improved, while providing complete gap fill. In addition, mechanical reliability is improved, alleviating the problems associated with cracking and delamination, and leading to an improvement in device yield and device reliability.

In a conventional display device comprising a sub-display, the display device is increased in thickness and in the number of components as the number of displays is increased. In the present invention, a dual emission display device is used so that either surface of a display is used as a main display or a sub-display. Accordingly, the display device can be reduced in thickness and in the number of components. Further, mechanical reliability can be enhanced when the invention is applied to a tablet PC, a video camera and the like.

Membranes including anodic aluminum oxide structures that are adapted for separation, purification, filtration, analysis, reaction and sensing. The membranes can include a porous anodic aluminum oxide (AAO) structure having pore channels extending through the AAO structure. The membrane may also include an active layer, such as one including an active layer material and/or active layer pore channels. The active layer is intimately integrated within the AAO structure, thus enabling great robustness, reliability, resistance to mechanical stress and thermal cycling, and high selectivity. Methods for the fabrication of anodic aluminum oxide structures and membranes are also provided.

A light emitting display and a method of manufacturing the same, wherein the light emitting display includes a first substrate on which a plurality of light emitting devices is formed, a second substrate provided to face the first substrate, a dam member provided between the first substrate and the second substrate to surround the plurality of light emitting devices, an inorganic sealing material provided between the first substrate and the second substrate on an outer circumference of the dam member to attach the first substrate and the second substrate to each other, and a filling material provided on an internal side of the dam member to cover the plurality of light emitting devices. The inorganic sealing material effectively shields moisture or oxygen and/or increases the life of the light emitting display. The filling material fills the space between the substrates to improve mechanical reliability.

Composite membranes that are adapted for separation, purification, filtration, analysis, reaction and sensing. The composite membranes can include a porous support structure having elongate pore channels extending through the support structure. The composite membrane also includes an active layer comprising an active layer material, where the active layer material is completely disposed within the pore channels between the surfaces of the support structure. The active layer is intimately integrated within the support structure, thus enabling great robustness, reliability, resistance to mechanical stress and thermal cycling, and high selectivity. Methods for the fabrication of composite membranes are also provided.

The present invention aims to provide a cover glass for display devices, made of soda-lime glass, excellent in cutting easiness and reliability of surface strength. The cover glass for display devices of the present invention includes a chemically strengthened glass, and has a compressive stress layer having a depth of 6 to 15 μm.

In the cover glass, a shape parameter determined in accordance with JIS R 1625 (1996) based on analysis of a facture stress of the cover glass measured by a coaxial double ring test is not less than 7, and strength of the cover glass when a cumulative fracture probability is 1% is not less than 450 MPa.

The glass plate before the ion exchange is made of soda-lime glass.

A planar light source unit includes: a light source; an upper case having an opening through which the light is emitted from the light source; a lower case fitted with the upper case and including a hole; a light guide plate disposed inside the upper case and the lower case; a resin frame including a first surface that holds the light guide plate, a second surface opposed to the first surface, a first restriction member penetrated through the hole of the lower case, the first restriction member including a first portion extending from and substantially perpendicular to the second surface, and a second portion contacted with a portion of the first portion and having a third surface substantially parallel to the second surface; and a first member, a part of which is inserted into a clearance defined by the second surface, the first portion and the third surface.

An organic light emitting display device, including: a first substrate on which a plurality of light emitting elements are formed; a second substrate that is disposed to be opposed to the first substrate; a primary dam member that is provided between the first substrate and the second substrate in order to surround the plurality of light emitting elements; a filler that is filled between the first substrate and the second substrate and in a first region defined by the primary dam member, an auxiliary dam member that is between the first substrate and the second substrate and in a second region outside the first region, and is made of porous material; and an inorganic sealant that is provided between the first substrate and the second substrate and in a third region outside the first region and the second region, and is jointed to the first substrate and the second substrate.

This invention relates to a dense ceramics having ESD dissipative characteristics, tunable volume and surface resistivities in semi-insulative range (10.sup.3 -10.sup.11 Ohm-cm), substantially pore free, high flexural strength, light colors, for desired ESD dissipation characteristics, structural reliability, high vision recognition, low wear and particulate contamination to be used as ESD dissipating tools, fixtures, load bearing elements, work surfaces, containers in manufacturing and assembling electrostatically sensitive microelectronic, electromagnetic, electro-optic components, devices and systems.

A screwdriver for actuating bone screws which have a shaft and a fork head for holding a vertebral rot or the like, includes a central shaft, which at its distal end is provided with a formfitting or force-fitting profile for engagement in a corresponding counter profile on the bone screw for turning the bone screw, a distal sleeve which rotatably engages around the shaft and is provided with connecting means for holding the screwdriver on the fork head of the bone screw, a handle provided at the proximal end of the screwdriver and a turn handle which is connected with the distal sleeve, and an adjustment device for axial adjustment of the relative position of the central shaft relative to the distal sleeve in at least two different predefined positions which are adjusted for different sizes and shapes of bone screws.

A flexible display apparatus is disclosed. The flexible display apparatus includes a display panel, a cover substrate, a first receiving portion and a first fluid. The display panel includes a first region and a second region surrounding at least one sides of the first region. The cover substrate is disposed over the display panel. The first receiving portion is disposed between the display panel and the cover substrate. The first receiving portion overlaps the first region of the display panel and has an empty space. The first fluid is disposed in the first receiving portion.

The bonding strength to a glass substrate comprising soda lime glass is increased with good reproducibility at a time of laser sealing, to improve the sealing ability and the reliability of an electronic device.

A glass substrate 3 has a sealing region. On the sealing region, a sealing material layer 5 is provided, which is a fired layer of a glass material for sealing containing a sealing glass, a low-expansion filler and a laser absorbent. The sealing glass contains, as represented by mass percentage, from 70 to 90% of Bi₂O₃, from 1 to 20% of ZnO, from 2 to 12% of B₂O₃ and from 10 to 380 ppm of Na₂O. Such a glass substrate 3 and a glass substrate 2 having an element-formed region provided with an electronic element, are laminated, the sealing material layer 5 is irradiated with a laser light 6 to be melted to bond the glass substrates 2 and 3.

Methods and assemblies relate to bezel packaging of a sealed glass assembly, such as a frit-sealed OLED device. The bezel packaging includes a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the bezel. A bonding agent, which may include the low modulus of elasticity material and/or a separate bonding material, affixes the sealed glass assembly to the bezel. Bezel modifications may be made to stabilize the bezel. Exemplary bezel modifications include reinforced bezel side walls and supporting straps attached between bezel walls. The bezel design may include a gap between the edges of the sealed glass assembly and the bezel walls, so as to avoid direct contact therewith. The gap may be filled at least in part with low modulus of elasticity organic adhesive to provide additional shock absorbency. The low modulus of elasticity material may include foam, ceramic fiber cloth and/or a low modulus of elasticity polymeric organic coating.