105results about How to "High mechanical reliability" patented technology

The invention relates to the technical field of microelectronic packaging, and discloses a packaging method of a multi-layer stacked memory chip, which comprises the following steps: constructing a 3D packaging structure layout of a memory chip to be packaged; constructing a physical field of the 3D packaging structure layout, and integrating the physical field and the field action relationship into the 3D packaging structure layout to obtain a coupled 3D packaging structure layout; calculating a hot spot, a high stress area and a high electric field area of the coupled 3D packaging structure layout, and optimizing the coupled 3D packaging structure layout to obtain a target packaging structure layout; performing multi-layer stacking on the to-be-packaged storage chip to obtain a multi-layer stacked storage chip; and packaging the multi-layer stacked memory chip to obtain a packaged multi-layer stacked memory chip, activating packaging repair of the self-repair material by using a preset material repair algorithm to obtain a packaging repair material, and performing multi-layer stacked packaging of the to-be-packaged memory chip based on the packaging repair material. According to the invention, the packaging stability of the multi-layer stacked storage chip can be improved.

The invention discloses a large-depth pressure-resistant communication antenna of an unmanned underwater vehicle and the underwater vehicle, and belongs to the technical field of underwater vehicles, the antenna comprises an antenna shell, a pressure-resistant cabin body and a fin-shaped component, the pressure-resistant cabin body is a component forming a cabin body segment of the underwater vehicle, and the fin-shaped component is a fin-shaped component. The antenna shell comprises a radial supporting part fixed to the pressure-resistant cabin and a shell part fixed to the top end of the radial supporting part, the fin-shaped component is fixed to the radial supporting part, an antenna unit is installed in the shell part, and a wireless communication function unit connected with the antenna unit is arranged in the pressure-resistant cabin. The large-depth pressure-resistant communication antenna of the unmanned underwater vehicle has the advantages of being excellent in communication quality, high in pressure resistance, optimized in size, high in space utilization rate, stable and reliable for a long time and the like, and can meet operation requirements in a deep sea environment.

The invention provides a preparation process of a circuit board with an embedded copper core aluminum nitride ceramic high-heat-dissipation module. The preparation process comprises the following steps: carrying out first milling and cutting treatment on a plurality of first core plates; pre-stacking the plurality of first core boards, the plurality of second core boards, the plurality of first PP resin layers, the plurality of second PP resin layers and the third PP resin layers to obtain a multi-layer core board group; after the embedded copper core aluminum nitride ceramic high-heat-dissipation module is embedded into the semi-buried groove, the multi-layer core plate set is subjected to pressing treatment; drilling the laminated multi-layer core board group to form a conductive through hole in the multi-layer core board group; carrying out metallization treatment on the multi-layer core board group after the drilling treatment; and performing line manufacturing processing on the multi-layer core board group after metallization processing to obtain the circuit board embedded with the copper core aluminum nitride ceramic high-heat-dissipation module.

The invention provides a manufacturing method of a 3D packaging structure of an optical engine module and a CPO module, and relates to the technical field of semiconductor packaging. Firstly, an optical chip wafer is provided, then an electric chip and an optical port protection piece are mounted on the basis of the surface of the optical chip wafer, plastic packaging is carried out on the basis of the upper portion of the optical chip wafer, the electric chip and the optical port protection piece are wrapped by plastic packaging materials, and then the plastic packaging materials are thinned until the optical chip and the optical port protection piece are exposed; the method comprises the following steps: manufacturing a TSV through hole on the basis of an optical chip wafer, thinning the bottom surface of the optical chip wafer until the TSV through hole is exposed, manufacturing an RDL layer and a solder ball on the basis of the bottom surface of the optical chip wafer, connecting the RDL layer with the TSV through hole, removing an optical port protection piece, and finally cutting the optical chip wafer to form a single optical engine module. According to the scheme provided by the invention, the optical chip is prevented from being damaged in the packaging process, and the design flexibility of the optical port is improved.

The invention relates to the technical field of material brazing, and provides a welding method for quartz glass, which comprises the following steps: preparing nano-silver paste; coating the nano-silver paste on the bonding surface of the quartz glass and the material to be connected; the bonding surface of the quartz glass and the bonding surface of the to-be-connected material are in contact and abut against each other, and the nano-silver paste is melted to form a welding joint; and cooling the welding joint, the quartz glass and the material to be connected. According to the welding method for the quartz glass, the connecting strength between the quartz glass and the to-be-connected material can be improved, and the situation that the quartz glass cracks is reduced.

The invention provides a super-lens based on a double-coupling structure, and relates to the field of optical zooming, the super-lens comprises a substrate and a phase wave front arranged on the substrate, the phase wave front is composed of a plurality of nano-columns arranged periodically, a corresponding phase distribution value is given according to the position point of each nano-column, and the phase distribution value is calculated according to the position point of each nano-column. The phase wavefront is arranged on the substrate, the phase wavefront is arranged on the substrate, the phase wavefront is arranged on the phase wavefront, the nanometer columns are arranged on the phase wavefront to convert plane waves incident to the phase wavefront into light beams focused at a specified focal length, each nanometer column has the same rectangular cross section, a slit is formed in the long axis direction of each nanometer column, and the slits penetrate through the nanometer columns and extend to the surface of the substrate. And thus, the nano-columns form a double-coupling structure. According to the invention, the focusing efficiency of the super lens can be improved.

The invention relates to a glass cover plate which comprises a light-emitting surface and a side surface adjacent to the light-emitting surface, a first area on the side surface is provided with an anti-reflection structure, and the anti-reflection structure comprises a glass ceramic structure. According to the glass cover plate, the anti-reflection structure is arranged in the first area of the side face, abnormal reflection of the side face of the glass cover plate is reduced, the anti-reflection structure is a glass ceramic structure, the edge strength of the cover plate can be effectively improved, and the mechanical reliability of the whole machine is improved. The invention further relates to a display module and a manufacturing method of the glass cover plate.

The present invention discloses an inward folding flexible screen terminal, comprising a left shell body and a right shell body, wherein a hinge mechanism for providing torque, unfolding and locking, and driving the two to rotate synchronously is installed between the left shell body and the right shell body, wherein the hinge mechanism comprises a first shrimp shell member, a second shrimp shell member, and a third shrimp shell member, which are arranged in parallel, and a torque mechanism, a locking mechanism, and a synchronization mechanism for realizing synchronous linkage between the three shrimp shell members and the shell body are installed on the inner sides of the first shrimp shell member, the second shrimp shell member, and the third shrimp shell member; the present invention uses a locking mechanism to lock the hinge mechanism when the left shell body and the right shell body are fully unfolded, thereby avoiding accidental rotation of the left shell body and the right shell body, and the locking mechanism is simple and has good mechanical reliability, while increasing the user experience of the flexible screen terminal, and when the hinge mechanism is locked by using the locking mechanism, the left shell body and the right shell body are fully unfolded to 180 degrees, thereby avoiding stress on the flexible screen and further improving the service life of the flexible screen.

This invention belongs to the field of acoustic-to-electric conversion technology, and discloses an aerogel acoustic-to-electric conversion device with both sound absorption and power generation functions, as well as its preparation method. The aerogel acoustic-to-electric conversion device of this invention includes a nanofiber aerogel layer, electrode layers respectively disposed on opposite sides of the nanofiber aerogel layer, and a clamp for fixing the nanofiber aerogel layer and the electrode layers. The nanofiber aerogel layer comprises a three-dimensional porous structure composed of piezoelectric nanofibers. The electrode layers include a substrate and a conductive layer disposed on one side of the substrate. The electrode layers have a through-hole array, and the conductive layer is in contact with the nanofiber aerogel layer. The aerogel acoustic-to-electric conversion device of this invention can achieve the conversion of sound wave-induced mechanical energy into electrical energy while maintaining the sound absorption performance of the aerogel, and is suitable for scenarios such as noise absorption, sound energy harvesting, and self-powered sensing.

The present invention relates to a method for controlling an aircraft taxiing system, comprising the following steps: generating a traction command (Com) for controlling an electric motor of a wheel drive actuator; detecting whether an external braking command is generated, the external braking command being intended to control wheel braking by means of a brake; if the external braking command is generated, generating a predetermined minimum command (Cmp) for controlling the electric motor so that the drive actuator applies a predetermined minimum motor torque on the wheel during braking, the minimum motor torque being strictly positive; detecting whether the speed of the aircraft becomes zero, and if so, disabling the predetermined minimum command (Cmp) so that the drive actuator applies zero torque on the wheel.

The invention relates to the technical field of electric energy metering boxes, in particular to a modular electric energy metering box which comprises a box body, a storage plate is movably arranged on the box body, a storage groove is formed in the storage plate, the storage plate can move to the position below the box body, and an opening of the storage groove faces upwards. And the storage plate can also move to the upper part of the box body and is arranged on the top wall of the box body. The storage plate is arranged to be of a structure capable of moving to the position below or above the box body, so that an operator can flexibly adjust the position of the storage plate according to actual requirements, and the functionality of the storage plate is improved.

The utility model provides an image acquisition device and a terminal device. The image acquisition device comprises at least one image acquisition element, and the image acquisition element is in communication connection with a terminal device in an on-off mode. The at least one image acquisition element is arranged on the equipment main body, the equipment main body is detachably and physically connected with the terminal equipment, the at least one image acquisition element is arranged on the equipment main body, and when the equipment main body is connected with the terminal equipment, the orientation of the image acquisition element is different from the display orientation of the terminal equipment. According to the image acquisition equipment, the image can be directly acquired, and the acquired image is transmitted to the terminal equipment, so that the terminal equipment realizes an AR function based on the image, the definition of the acquired image is improved, the precision requirement on parts is reduced, and the service life of the equipment is prolonged.

The utility model relates to the technical field of resistors, in particular to an electronic equipment resistor suitable for a wide temperature range. The resistor comprises a resistor body, supporting assemblies are movably connected to the positions, close to the two ends, of the bottom of the resistor body, and protection assemblies are arranged between the outer wall of the resistor body and the two supporting assemblies. Through collaborative design of the protection assembly and the supporting assembly, the reliability problem of a traditional winding resistor in a wide-temperature and vibration environment is solved. The protection assembly adopts an alloy spiral ring to wind a resistor body, a gap is reserved to buffer thermal expansion and cold contraction, and material oxidation and resistance drift are inhibited; the spiral structure and the gap form an elastic buffer space, vibration energy is absorbed, and welding spot stress concentration is avoided. The supporting assembly is movably connected with the bottom of the body through an L-shaped honeycomb supporting plate, disperses vibration stress, adapts to size changes and is in flexible connection with the end in cooperation with fine adjustment of screws, and structural stability is guaranteed.

The invention relates to a rotor, a motor rotor surface grooving method, a motor and a vehicle, the rotor comprises a rotor body, the surface of the rotor body is provided with a surface groove body, the surface groove body is of a symmetrical structure extending in the axial direction of the rotor body, and the width of the surface groove body is smaller than or equal to the distance between two adjacent guide bars in the rotor body. The slotting method comprises the following steps: acquiring a structural mode and an inherent frequency of a stator; obtaining the space wave number and the mechanical frequency of harmonic electromagnetic force generated by the stator harmonic and the rotor harmonic; determining to-be-optimized harmonic electromagnetic force based on the spatial wave number and the mechanical frequency; obtaining the resonance speed and torque of the motor based on the structural mode and the inherent frequency; determining the minimum amplitude of the harmonic electromagnetic force based on the resonance rotating speed and the torque; and obtaining small-amplitude rotor surface slotting characteristics. According to the invention, the technical problems of easy failure of motor noise reduction and reduction of motor power and service life caused by the noise reduction process in the prior art can be improved.

The utility model relates to earphone technical field discloses an ear clip type earphone, including host computer subassembly and elastic ear block, host computer subassembly includes host computer casing and connecting portion, connecting portion is located host computer casing one end, and with host computer casing integral forming, elastic ear block is located connecting portion away from host computer casing one end, and elastic ear block with connecting portion between be equipped with the fixed structure of snap -on connection. Through integral type structure's host computer subassembly and elastic ear block connection, strengthened earphone whole's mechanical stability and reliability, and elastic ear block preferably soft glue or memory sponge material, can in long -term use, bear frequent deformation and restore and not easy to appear material inside microstructure damage, simultaneously, adopt the elastic ear block of soft glue or memory sponge material, can make more close ear, not easy to drop, and soft glue or memory sponge material can also improve the wearing comfort of user, thereby improve the user's use experience feeling.

The utility model relates to the technical field of electrical equipment, in particular to a power socket and a double-sided socket module thereof. The double-sided socket module comprises two groups of socket units which are arranged back to back and are fixedly connected, and an L-pole conductive strip and an N-pole conductive strip which are arranged between the two groups of socket units, and the two groups of socket units are each consistently equipped with at least one power taking potential; and when the two groups of socket units are fixedly connected in a back-to-back manner, the contacts in the socket units are conducted with the L-pole conductive strips and the N-pole conductive strips. According to the scheme, on one hand, two groups of socket units opposite to each other can be fixedly connected without a socket shell, and on the other hand, the mounting structure can be simplified.

This invention relates to the field of electronic packaging composite materials technology, and particularly to a thermally conductive epoxy encapsulation material, its preparation method, and its application. The invention uses Fe3O4 nanospheres and sodium polyacrylate solution as raw materials to prepare polyacrylic acid-modified Fe3O4 nanospheres; these are then blended with adipic acid and epoxy resin, and a thermally conductive epoxy encapsulation material is prepared through a curing reaction. The thermally conductive epoxy encapsulation material prepared by the method of this invention exhibits uniform dispersion of Fe3O4 nanospheres, good interfacial compatibility, and high thermal conductivity, demonstrating excellent thermal conductivity, interfacial reliability, and mechanical properties, making it well-suited for electronic chip packaging applications.

The utility model provides a replaceable foldable broken terminal crimping pliers, and relates to the technical field of electrician's tools, in particular to a multifunctional terminal crimping pliers with replaceable shearing head and foldable handle structure. It contains replaceable pliers body head, pliers body main part, rotatable connecting handle, lower connecting handle, the replaceable pliers body head is connected on the pliers body main part through hexagon bolt, and the bottom of rotatable connecting handle is inserted with lower connecting handle. The pliers body main part includes two pliers body main part handles, and the top of two pliers body main part handles is hinged to each other. The top of two pliers body main part handles is hinged to each other in the middle, and the top of two pliers body main part handles is hinged to replaceable pliers body head through hexagon bolt on both sides. It realizes the technical effect of one pliers with multiple uses and convenient carrying through the replaceable design of shearing head and crimping head combined with foldable handle structure, significantly improves the adaptability and convenience of construction tools, and makes the crimping have good crimping effect by using long handle.

The invention belongs to the technical field of flexible electronic materials, and particularly relates to a multi-layer composite transparent electrode for a flexible substrate and a preparation method of the multi-layer composite transparent electrode. The electrode sequentially comprises a stress buffer layer, a transparent core layer and an interface optimization layer from the surface of the flexible substrate; the stress buffer layer is zinc oxide-tin oxide composite nanoparticles grafted with a silane coupling agent; the transparent core layer is a silver nanowire network of which the surface is coated with a tin-doped indium oxide shell layer; and the interface optimization layer is a molybdenum oxide and tungsten oxide blended film formed by controlling oxygen partial pressure. Through combination of multilayer material design and a low-temperature preparation process, the electrode has the characteristics of high light transmittance, low sheet resistance, excellent bending resistance, strong interface adhesion and high work function, and is suitable for flexible display and wearable electronic devices.

The utility model belongs to the technical field of flow battery bipolar plates, and particularly relates to a flow battery high-conductivity bipolar plate with a self-sealing structure. The utility model aims to solve the sealing problem of the traditional composite bipolar plate and the contradiction between the mechanical strength and the conductivity. The high-conductivity bipolar plate of the flow battery with the self-sealing structure comprises a high-strength base plate and a high-conductivity bipolar plate, wherein the high-strength base plate consists of an effective area base body and a sealing base body; the sealing base body is located on the periphery of the effective area base body, and the effective area base body and the sealing base body are integrally formed. The thickness of the sealing substrate is smaller than that of the effective area substrate; the high conductive film is adhered to the surface of the effective area substrate; the geometric dimension of the high-conductivity film is the same as the surface dimension of the effective area substrate; the elastic self-sealing assembly is arranged on the outer side of the sealing base body in a sleeving mode The bipolar plate provided by the utility model provides a more reliable solution for large-scale application of the flow battery.

The invention discloses a lamination process of an AMB ceramic substrate and an FPC flexible circuit board, and relates to the technical field of semiconductors, and the lamination process comprises the following steps: preparing an AMB substrate; preparing an FPC (Flexible Printed Circuit) flexible board; pre-pressing and cleaning; performing vacuum pressing; performing laser cutting on the appearance; coating a functional coating; according to the lamination process of the AMB ceramic substrate and the FPC flexible circuit board, the positions of positioning holes of the AMB ceramic substrate and the FPC flexible circuit board are reserved in the design stage so that accurate positioning can be facilitated, the vacuum hot-pressing binding force with the FPC substrate is guaranteed through the AMB substrate pre-cleaning process before lamination, meanwhile, the filler of the coating is treated through long-chain alkyl silane, and therefore the coating quality is improved. And the moisture-proof and anti-permeation capacities of the coating are obviously improved. According to the invention, by optimizing the pressing process and functionalizing the protective coating, the packaging structure has excellent mechanical reliability and corrosion resistance at the same time.

The utility model provides a kind of TO encapsulation photodiode fixed bolster, and photodiode includes package shell and pin, package shell is equipped with photosensitive chip inside, fixed bolster includes: female head, for installing photodiode, female head is equipped with light hole along axial direction, and light hole is used for photosensitive chip receiving light source;Male head includes supporting part and abutting portion, and abutting portion is used for cooperating with female head and fixing photodiode, pin passes through abutting portion and is welded with circuit board along axial direction, and supporting part is welded with circuit board.The photodiode is fixed in female head by the cooperation of male head and female head, the pin of photodiode is welded with circuit board by passing through abutting portion, and is fixed by being welded with circuit board by supporting part, so that photodiode has enough supporting capacity in strong vibration environment, the pin of photodiode does not deform or de-soldering with circuit board, avoid the risk of photosensitive chip and light source forming angle and falling, and then avoid affecting normal output signal of photosensitive chip.

The application discloses a kind of high-precision explosion-proof touch glass of integrated differential mutual capacitance collection circuit, it relates to the technical field of industrial explosion-proof touch and high-precision signal acquisition, the touch glass is sequentially stacked by multiple functional layers, high-precision high-sensitivity touch collection circuit is integrated below touch layer, edge is set with electromagnetic shielding structure, collection circuit uses differential signal acquisition, high-precision amplification filtering and intrinsic safety type control and power supply design, touch layer uses nanowire composite grid structure, the application is coupled with the matching design of structure and circuit, can actively compensate the signal attenuation caused by explosion-proof structure, while strictly meet the intrinsic safety explosion-proof requirement, preparation method includes tempering, laminated composite, circuit integration, encapsulation solidification and comprehensive performance detection etc.Step.The product of the application has high touch precision, strong anti-interference, good environmental adaptability, and is suitable for man-machine interaction equipment in explosive hazardous environment such as coal mine, chemical industry etc..

The utility model discloses a high -voltage connector subassembly for cable relates to high -voltage connector field, including plug shell, the inside of this plug shell is provided with the socket shell, the outside of plug shell is provided with the supplementary pair of collets for providing additional lateral force support, prevents the auxiliary connection of loosening or misplacement, and the bottom of socket shell is provided with the bottom fixed cover, and the top of bottom fixed cover is provided with the cable positioning mechanism for preventing cable displacement or pull off, the inside of socket shell is provided with cable, and the outside of cable is equipped with sealing mechanism, to prevent the impurity from invading the inside of socket shell, prevents the phenomenon of electric leakage. The utility model discloses through setting up cable positioning mechanism can be fixed under the effect of snap ring and fix one end of cable, make it firmly fixed on socket shell and prevent cable loosening or falling off, and then can prevent the cable displacement or pull off due to external mechanical tension, vibration or frequent bending.

The invention relates to the technical field of electric connectors, in particular to a feed-through connector which comprises a feed-through insertion piece, a coaxial cable, a coaxial connector with the characteristic impedance of 50 ohms, an epoxy resin sealing layer and a connecting plug. The feed-through insertion piece is made of an insulating high-molecular polymer material and comprises an installation body, the installation body is provided with a first side and a second side which are oppositely arranged in the axial direction, an installation channel penetrating in the axial direction is formed in the installation body, and a plurality of bolt holes are formed in the installation body; the mounting channel comprises a first hole section and a second hole section which are sequentially communicated in the axial direction, the hole diameter of the first hole section is larger than that of the second hole section, and the connecting plug is fixedly arranged on the first side of the mounting body and coaxially and correspondingly arranged with the mounting channel; and stable coaxial transmission and sealing insulation effects can be realized while the mechanical connection reliability is maintained.

This invention provides a split-type cold screen for an infrared detector and its assembly method. The split-type cold screen for the infrared detector includes a cold screen body and matte fins. The assembly method includes: applying a black coating to both the cold screen body and the matte fins, pre-baking them, then initially assembling the pre-baked cold screen body and the matte fins, and finally baking the pre-assembled cold screen to complete the assembly. This invention places the cold screen assembly step after pre-baking and before baking, using the bonding force of the black coating to connect the cold screen body and the matte fins. This eliminates the adhesive bonding step in the split-type cold screen assembly process, solving the problem of using adhesives to bond the cold screen body and matte fins in the split-type cold screen assembly process. This ensures good mechanical reliability of the cold screen assembly in low-temperature vibration environments and also improves the performance of the detector components and the efficiency of the cold screen assembly process.

The application discloses a kind of design and manufacture method of printed circuit board inner layer circuit, the design and manufacture method includes: determining drilling parameter, and the basic size of connection PAD is set based on drilling parameter;Tear drop-shaped gradual widening structure is generated in the transition area of connection PAD and inner layer circuit, the structure of heat dissipation PAD is designed synchronously, and inner layer circuit wiring design is completed;Form inner layer circuit film, and check film;At the same time, pre-treatment is carried out to PCB inner layer substrate;The pattern is formed by aligning the film that passes the check with inner layer substrate;Substrate is etched;The substrate after etching is cleaned, and unqualified product is identified and screened, and the qualified product is inner layer circuit product.The application solves the problem of weak connection and easy breakage of PTH hole and inner layer circuit in high-density PCB through the three-in-one technical route of structure optimization+process synergy+precision control, and improves the mechanical strength, electrical reliability and thermal management capability of the product.

This invention discloses an optical waveguide module, relating to the field of optical device technology. It includes a substrate, an optical waveguide layer on top of the substrate, and a buffer layer with a continuously curved, wave-shaped design between the substrate and the waveguide layer. This invention forms a stress-relieving structure based on the wave-shaped buffer layer, substrate, and waveguide layer, achieving thermal expansion coefficient matching and bending stress dispersion between the substrate and the waveguide layer. Simultaneously, combined with various adhesion enhancement layers, it ensures the long-term stability of the multi-layer interface. Furthermore, the input coupling layer employs a composite design of a blazed grating and a subwavelength grating, significantly improving the coupling efficiency from visible light to near-infrared. The output coupling layer achieves wide field-of-view output through a gradient periodic grating, adapting to large viewing angle requirements. Additionally, it integrates a modulator and a graphene thermal conductive layer, simultaneously solving the problems of high-speed modulation and heat dissipation, significantly improving the optical performance, thermal stability, and mechanical reliability of the optical waveguide module.