60results about How to "High mechanical reliability" patented technology

The invention provides a manufacturing method of a 3D packaging structure of an optical engine module and a CPO module, and relates to the technical field of semiconductor packaging. Firstly, an optical chip wafer is provided, then an electric chip and an optical port protection piece are mounted on the basis of the surface of the optical chip wafer, plastic packaging is carried out on the basis of the upper portion of the optical chip wafer, the electric chip and the optical port protection piece are wrapped by plastic packaging materials, and then the plastic packaging materials are thinned until the optical chip and the optical port protection piece are exposed; the method comprises the following steps: manufacturing a TSV through hole on the basis of an optical chip wafer, thinning the bottom surface of the optical chip wafer until the TSV through hole is exposed, manufacturing an RDL layer and a solder ball on the basis of the bottom surface of the optical chip wafer, connecting the RDL layer with the TSV through hole, removing an optical port protection piece, and finally cutting the optical chip wafer to form a single optical engine module. According to the scheme provided by the invention, the optical chip is prevented from being damaged in the packaging process, and the design flexibility of the optical port is improved.

This invention belongs to the field of acoustic-to-electric conversion technology, and discloses an aerogel acoustic-to-electric conversion device with both sound absorption and power generation functions, as well as its preparation method. The aerogel acoustic-to-electric conversion device of this invention includes a nanofiber aerogel layer, electrode layers respectively disposed on opposite sides of the nanofiber aerogel layer, and a clamp for fixing the nanofiber aerogel layer and the electrode layers. The nanofiber aerogel layer comprises a three-dimensional porous structure composed of piezoelectric nanofibers. The electrode layers include a substrate and a conductive layer disposed on one side of the substrate. The electrode layers have a through-hole array, and the conductive layer is in contact with the nanofiber aerogel layer. The aerogel acoustic-to-electric conversion device of this invention can achieve the conversion of sound wave-induced mechanical energy into electrical energy while maintaining the sound absorption performance of the aerogel, and is suitable for scenarios such as noise absorption, sound energy harvesting, and self-powered sensing.

The invention relates to the technical field of electric energy metering boxes, in particular to a modular electric energy metering box which comprises a box body, a storage plate is movably arranged on the box body, a storage groove is formed in the storage plate, the storage plate can move to the position below the box body, and an opening of the storage groove faces upwards. And the storage plate can also move to the upper part of the box body and is arranged on the top wall of the box body. The storage plate is arranged to be of a structure capable of moving to the position below or above the box body, so that an operator can flexibly adjust the position of the storage plate according to actual requirements, and the functionality of the storage plate is improved.

The utility model relates to the technical field of resistors, in particular to an electronic equipment resistor suitable for a wide temperature range. The resistor comprises a resistor body, supporting assemblies are movably connected to the positions, close to the two ends, of the bottom of the resistor body, and protection assemblies are arranged between the outer wall of the resistor body and the two supporting assemblies. Through collaborative design of the protection assembly and the supporting assembly, the reliability problem of a traditional winding resistor in a wide-temperature and vibration environment is solved. The protection assembly adopts an alloy spiral ring to wind a resistor body, a gap is reserved to buffer thermal expansion and cold contraction, and material oxidation and resistance drift are inhibited; the spiral structure and the gap form an elastic buffer space, vibration energy is absorbed, and welding spot stress concentration is avoided. The supporting assembly is movably connected with the bottom of the body through an L-shaped honeycomb supporting plate, disperses vibration stress, adapts to size changes and is in flexible connection with the end in cooperation with fine adjustment of screws, and structural stability is guaranteed.

The invention relates to a rotor, a motor rotor surface grooving method, a motor and a vehicle, the rotor comprises a rotor body, the surface of the rotor body is provided with a surface groove body, the surface groove body is of a symmetrical structure extending in the axial direction of the rotor body, and the width of the surface groove body is smaller than or equal to the distance between two adjacent guide bars in the rotor body. The slotting method comprises the following steps: acquiring a structural mode and an inherent frequency of a stator; obtaining the space wave number and the mechanical frequency of harmonic electromagnetic force generated by the stator harmonic and the rotor harmonic; determining to-be-optimized harmonic electromagnetic force based on the spatial wave number and the mechanical frequency; obtaining the resonance speed and torque of the motor based on the structural mode and the inherent frequency; determining the minimum amplitude of the harmonic electromagnetic force based on the resonance rotating speed and the torque; and obtaining small-amplitude rotor surface slotting characteristics. According to the invention, the technical problems of easy failure of motor noise reduction and reduction of motor power and service life caused by the noise reduction process in the prior art can be improved.

The utility model relates to earphone technical field discloses an ear clip type earphone, including host computer subassembly and elastic ear block, host computer subassembly includes host computer casing and connecting portion, connecting portion is located host computer casing one end, and with host computer casing integral forming, elastic ear block is located connecting portion away from host computer casing one end, and elastic ear block with connecting portion between be equipped with the fixed structure of snap -on connection. Through integral type structure's host computer subassembly and elastic ear block connection, strengthened earphone whole's mechanical stability and reliability, and elastic ear block preferably soft glue or memory sponge material, can in long -term use, bear frequent deformation and restore and not easy to appear material inside microstructure damage, simultaneously, adopt the elastic ear block of soft glue or memory sponge material, can make more close ear, not easy to drop, and soft glue or memory sponge material can also improve the wearing comfort of user, thereby improve the user's use experience feeling.

The utility model relates to the technical field of electrical equipment, in particular to a power socket and a double-sided socket module thereof. The double-sided socket module comprises two groups of socket units which are arranged back to back and are fixedly connected, and an L-pole conductive strip and an N-pole conductive strip which are arranged between the two groups of socket units, and the two groups of socket units are each consistently equipped with at least one power taking potential; and when the two groups of socket units are fixedly connected in a back-to-back manner, the contacts in the socket units are conducted with the L-pole conductive strips and the N-pole conductive strips. According to the scheme, on one hand, two groups of socket units opposite to each other can be fixedly connected without a socket shell, and on the other hand, the mounting structure can be simplified.

This invention relates to the field of electronic packaging composite materials technology, and particularly to a thermally conductive epoxy encapsulation material, its preparation method, and its application. The invention uses Fe3O4 nanospheres and sodium polyacrylate solution as raw materials to prepare polyacrylic acid-modified Fe3O4 nanospheres; these are then blended with adipic acid and epoxy resin, and a thermally conductive epoxy encapsulation material is prepared through a curing reaction. The thermally conductive epoxy encapsulation material prepared by the method of this invention exhibits uniform dispersion of Fe3O4 nanospheres, good interfacial compatibility, and high thermal conductivity, demonstrating excellent thermal conductivity, interfacial reliability, and mechanical properties, making it well-suited for electronic chip packaging applications.

The utility model provides a replaceable foldable broken terminal crimping pliers, and relates to the technical field of electrician's tools, in particular to a multifunctional terminal crimping pliers with replaceable shearing head and foldable handle structure. It contains replaceable pliers body head, pliers body main part, rotatable connecting handle, lower connecting handle, the replaceable pliers body head is connected on the pliers body main part through hexagon bolt, and the bottom of rotatable connecting handle is inserted with lower connecting handle. The pliers body main part includes two pliers body main part handles, and the top of two pliers body main part handles is hinged to each other. The top of two pliers body main part handles is hinged to each other in the middle, and the top of two pliers body main part handles is hinged to replaceable pliers body head through hexagon bolt on both sides. It realizes the technical effect of one pliers with multiple uses and convenient carrying through the replaceable design of shearing head and crimping head combined with foldable handle structure, significantly improves the adaptability and convenience of construction tools, and makes the crimping have good crimping effect by using long handle.

The invention belongs to the technical field of flexible electronic materials, and particularly relates to a multi-layer composite transparent electrode for a flexible substrate and a preparation method of the multi-layer composite transparent electrode. The electrode sequentially comprises a stress buffer layer, a transparent core layer and an interface optimization layer from the surface of the flexible substrate; the stress buffer layer is zinc oxide-tin oxide composite nanoparticles grafted with a silane coupling agent; the transparent core layer is a silver nanowire network of which the surface is coated with a tin-doped indium oxide shell layer; and the interface optimization layer is a molybdenum oxide and tungsten oxide blended film formed by controlling oxygen partial pressure. Through combination of multilayer material design and a low-temperature preparation process, the electrode has the characteristics of high light transmittance, low sheet resistance, excellent bending resistance, strong interface adhesion and high work function, and is suitable for flexible display and wearable electronic devices.

The utility model belongs to the technical field of flow battery bipolar plates, and particularly relates to a flow battery high-conductivity bipolar plate with a self-sealing structure. The utility model aims to solve the sealing problem of the traditional composite bipolar plate and the contradiction between the mechanical strength and the conductivity. The high-conductivity bipolar plate of the flow battery with the self-sealing structure comprises a high-strength base plate and a high-conductivity bipolar plate, wherein the high-strength base plate consists of an effective area base body and a sealing base body; the sealing base body is located on the periphery of the effective area base body, and the effective area base body and the sealing base body are integrally formed. The thickness of the sealing substrate is smaller than that of the effective area substrate; the high conductive film is adhered to the surface of the effective area substrate; the geometric dimension of the high-conductivity film is the same as the surface dimension of the effective area substrate; the elastic self-sealing assembly is arranged on the outer side of the sealing base body in a sleeving mode The bipolar plate provided by the utility model provides a more reliable solution for large-scale application of the flow battery.

The invention discloses a lamination process of an AMB ceramic substrate and an FPC flexible circuit board, and relates to the technical field of semiconductors, and the lamination process comprises the following steps: preparing an AMB substrate; preparing an FPC (Flexible Printed Circuit) flexible board; pre-pressing and cleaning; performing vacuum pressing; performing laser cutting on the appearance; coating a functional coating; according to the lamination process of the AMB ceramic substrate and the FPC flexible circuit board, the positions of positioning holes of the AMB ceramic substrate and the FPC flexible circuit board are reserved in the design stage so that accurate positioning can be facilitated, the vacuum hot-pressing binding force with the FPC substrate is guaranteed through the AMB substrate pre-cleaning process before lamination, meanwhile, the filler of the coating is treated through long-chain alkyl silane, and therefore the coating quality is improved. And the moisture-proof and anti-permeation capacities of the coating are obviously improved. According to the invention, by optimizing the pressing process and functionalizing the protective coating, the packaging structure has excellent mechanical reliability and corrosion resistance at the same time.

The utility model provides a kind of TO encapsulation photodiode fixed bolster, and photodiode includes package shell and pin, package shell is equipped with photosensitive chip inside, fixed bolster includes: female head, for installing photodiode, female head is equipped with light hole along axial direction, and light hole is used for photosensitive chip receiving light source;Male head includes supporting part and abutting portion, and abutting portion is used for cooperating with female head and fixing photodiode, pin passes through abutting portion and is welded with circuit board along axial direction, and supporting part is welded with circuit board.The photodiode is fixed in female head by the cooperation of male head and female head, the pin of photodiode is welded with circuit board by passing through abutting portion, and is fixed by being welded with circuit board by supporting part, so that photodiode has enough supporting capacity in strong vibration environment, the pin of photodiode does not deform or de-soldering with circuit board, avoid the risk of photosensitive chip and light source forming angle and falling, and then avoid affecting normal output signal of photosensitive chip.

The application discloses a kind of high-precision explosion-proof touch glass of integrated differential mutual capacitance collection circuit, it relates to the technical field of industrial explosion-proof touch and high-precision signal acquisition, the touch glass is sequentially stacked by multiple functional layers, high-precision high-sensitivity touch collection circuit is integrated below touch layer, edge is set with electromagnetic shielding structure, collection circuit uses differential signal acquisition, high-precision amplification filtering and intrinsic safety type control and power supply design, touch layer uses nanowire composite grid structure, the application is coupled with the matching design of structure and circuit, can actively compensate the signal attenuation caused by explosion-proof structure, while strictly meet the intrinsic safety explosion-proof requirement, preparation method includes tempering, laminated composite, circuit integration, encapsulation solidification and comprehensive performance detection etc.Step.The product of the application has high touch precision, strong anti-interference, good environmental adaptability, and is suitable for man-machine interaction equipment in explosive hazardous environment such as coal mine, chemical industry etc..

The utility model discloses a high -voltage connector subassembly for cable relates to high -voltage connector field, including plug shell, the inside of this plug shell is provided with the socket shell, the outside of plug shell is provided with the supplementary pair of collets for providing additional lateral force support, prevents the auxiliary connection of loosening or misplacement, and the bottom of socket shell is provided with the bottom fixed cover, and the top of bottom fixed cover is provided with the cable positioning mechanism for preventing cable displacement or pull off, the inside of socket shell is provided with cable, and the outside of cable is equipped with sealing mechanism, to prevent the impurity from invading the inside of socket shell, prevents the phenomenon of electric leakage. The utility model discloses through setting up cable positioning mechanism can be fixed under the effect of snap ring and fix one end of cable, make it firmly fixed on socket shell and prevent cable loosening or falling off, and then can prevent the cable displacement or pull off due to external mechanical tension, vibration or frequent bending.

The invention relates to the technical field of electric connectors, in particular to a feed-through connector which comprises a feed-through insertion piece, a coaxial cable, a coaxial connector with the characteristic impedance of 50 ohms, an epoxy resin sealing layer and a connecting plug. The feed-through insertion piece is made of an insulating high-molecular polymer material and comprises an installation body, the installation body is provided with a first side and a second side which are oppositely arranged in the axial direction, an installation channel penetrating in the axial direction is formed in the installation body, and a plurality of bolt holes are formed in the installation body; the mounting channel comprises a first hole section and a second hole section which are sequentially communicated in the axial direction, the hole diameter of the first hole section is larger than that of the second hole section, and the connecting plug is fixedly arranged on the first side of the mounting body and coaxially and correspondingly arranged with the mounting channel; and stable coaxial transmission and sealing insulation effects can be realized while the mechanical connection reliability is maintained.

This invention provides a split-type cold screen for an infrared detector and its assembly method. The split-type cold screen for the infrared detector includes a cold screen body and matte fins. The assembly method includes: applying a black coating to both the cold screen body and the matte fins, pre-baking them, then initially assembling the pre-baked cold screen body and the matte fins, and finally baking the pre-assembled cold screen to complete the assembly. This invention places the cold screen assembly step after pre-baking and before baking, using the bonding force of the black coating to connect the cold screen body and the matte fins. This eliminates the adhesive bonding step in the split-type cold screen assembly process, solving the problem of using adhesives to bond the cold screen body and matte fins in the split-type cold screen assembly process. This ensures good mechanical reliability of the cold screen assembly in low-temperature vibration environments and also improves the performance of the detector components and the efficiency of the cold screen assembly process.

The application discloses a kind of design and manufacture method of printed circuit board inner layer circuit, the design and manufacture method includes: determining drilling parameter, and the basic size of connection PAD is set based on drilling parameter;Tear drop-shaped gradual widening structure is generated in the transition area of connection PAD and inner layer circuit, the structure of heat dissipation PAD is designed synchronously, and inner layer circuit wiring design is completed;Form inner layer circuit film, and check film;At the same time, pre-treatment is carried out to PCB inner layer substrate;The pattern is formed by aligning the film that passes the check with inner layer substrate;Substrate is etched;The substrate after etching is cleaned, and unqualified product is identified and screened, and the qualified product is inner layer circuit product.The application solves the problem of weak connection and easy breakage of PTH hole and inner layer circuit in high-density PCB through the three-in-one technical route of structure optimization+process synergy+precision control, and improves the mechanical strength, electrical reliability and thermal management capability of the product.

This invention discloses an optical waveguide module, relating to the field of optical device technology. It includes a substrate, an optical waveguide layer on top of the substrate, and a buffer layer with a continuously curved, wave-shaped design between the substrate and the waveguide layer. This invention forms a stress-relieving structure based on the wave-shaped buffer layer, substrate, and waveguide layer, achieving thermal expansion coefficient matching and bending stress dispersion between the substrate and the waveguide layer. Simultaneously, combined with various adhesion enhancement layers, it ensures the long-term stability of the multi-layer interface. Furthermore, the input coupling layer employs a composite design of a blazed grating and a subwavelength grating, significantly improving the coupling efficiency from visible light to near-infrared. The output coupling layer achieves wide field-of-view output through a gradient periodic grating, adapting to large viewing angle requirements. Additionally, it integrates a modulator and a graphene thermal conductive layer, simultaneously solving the problems of high-speed modulation and heat dissipation, significantly improving the optical performance, thermal stability, and mechanical reliability of the optical waveguide module.

The invention discloses a multi-layer aluminum core copper-clad plate adopting a plasma oxidation-copper plating process and also discloses a preparation method of the copper-clad plate, and the preparation method comprises the following steps: carrying out plasma anodic oxidation and copper plating treatment on the surface of an aluminum substrate to obtain a copper-clad plasma anodic aluminum oxide substrate; manufacturing an inner-layer circuit pattern on the surface of the copper-clad plasma anodic aluminum oxide substrate, then overlapping the inner-layer circuit pattern with a copper foil and a prepreg, and carrying out vacuum hot-pressing curing to obtain a multi-layer plate blank embedded with an aluminum core; through holes are formed in the multi-layer plate blank, activation and copper plating treatment are carried out, and interlayer electrical interconnection is achieved; and manufacturing an outer-layer circuit pattern on the surface of the multi-layer plate blank, preparing a solder mask layer on the surface of the circuit, and carrying out nickel plating and gold leaching surface treatment to obtain the multi-layer aluminum core copper-clad plate. According to the method, the problems of weak interlayer binding force, low heat dissipation efficiency, insufficient electrical interconnection reliability and the like of the aluminum core multilayer board are solved, and the prepared copper-clad plate can meet the use requirements of high-frequency and high-power electronic equipment.

The application discloses a right-angle PCMCIA male connector, which comprises an insulating body, a plurality of rows of terminals and a metal shielding member. The insulating body is provided with a guide block, and a plurality of through guide grooves are formed on the guide block. The guide grooves comprise guide grooves extending along a first direction and guide grooves extending along a second direction, and the two kinds of guide grooves are perpendicular to each other. The plurality of rows of terminals comprise first right-angle terminals arranged in sequence, second right-angle terminals located at the periphery of the first right-angle terminals, and third right-angle terminals located at the outermost row. The third right-angle terminals comprise a plurality of terminal connecting parts and a connecting lock plate fixedly connected with the terminal connecting parts, and the plurality of terminal connecting parts are positioned and fixed by the same connecting lock plate. The connector is compact in structure, accurate in guidance, stable in terminal positioning, suitable for high-speed signal transmission and reliable mechanical fixation of a PCMCIA standard interface, and has good electromagnetic shielding performance.

The utility model provides a kind of battery module, including module frame, the reinforcing structure of several electric cores being arranged in module frame, electric core includes the shell of at least one end being provided with opening, the cover plate of encapsulating the opening, and electrode assembly being arranged in the shell, at least one side of shell is formed with weld joint;Reinforcing structure is arranged between module frame and the weld joint of at least one electric core, and at least part is abutted to weld joint by module frame, reinforcing structure can efficiently disperse and transmit to module frame at the expansion stress of weld joint;Reinforcing structure is formed by that hollow window is opened in weld joint corresponding area through insulating cladding layer and setting connecting layer in window, or thickening area is formed in weld joint area through insulating cladding layer, while structural adhesive covers thickening area formation, solve the weld joint structure damage and blue film puncture failure problem caused by steel shell electric core expansion stress, improve the structural stability and security of battery.

The utility model relates to audio equipment technical field especially relates to a earphone antenna structure, including antenna main part, is composed of a plurality of laser carving antenna, the laser carving antenna includes connecting portion and contact point, connecting portion and contact point link to each other, support part is semicircular arc structure, is divided into first support part and second support part, the outer surface of support part is equipped with surface layer groove for fitting in the antenna main part, a plurality of laser carving antenna embeds the outer surface of support part, a plurality of contact points are used for realizing circuit connection and antenna communication function, the first support part end is connected with extension assembly, and the second support part end is connected with contact assembly, the utility model discloses through increasing the bending -resistant ability of earphone antenna to improve the stability of signal transmission.

The invention discloses a sectional type rotor structure, and belongs to the technical field of servo motors. The structure comprises a plurality of iron core sections formed by laminating the same kind of rotor punching sheets, and the punching sheets are provided with asymmetrical front surfaces and back surfaces. A first type of iron core sections are formed by laminating with the front faces facing upwards, a second type of iron core sections are formed by laminating with the back faces facing upwards, and the two types of iron core sections are alternately arranged in the axial direction and staggered by a certain angle around the axis. Each iron core section is provided with a positioning part, and two adjacent iron core sections achieve accurate angle positioning and assembly by aligning the positioning parts. According to the invention, the segmented rotor with the dislocation effect can be manufactured by using only one set of mold, so that the cost is greatly reduced; the cogging torque and the electromagnetic noise are effectively weakened through the segmented pole staggering effect, and the operation stability is improved; meanwhile, the permanent magnet is firmly installed, the assembling process is simple and convenient, mistake proofing is achieved, and the consistency and reliability of products are guaranteed.

The utility model relates to the field of chip packaging, in particular to a chip packaging structure capable of preventing line collision, which comprises a substrate, a chip, a stepped welding spot, a metal wire I and a metal wire II, the chip is arranged on the right side of the upper end of the substrate, the stepped welding spot is arranged on the left side of the upper end of the substrate, the stepped welding spot comprises a bottom part and an arched part, and the metal wire I is arranged on the bottom part of the substrate. The arched part is fixed to the upper end of the bottom, the right end of the first metal wire is connected with the rear end of the left side of the chip, the left end of the first metal wire is connected with the top end of the arched part, the right end of the second metal wire is connected with the front end of the left side of the chip, and the left end of the second metal wire is connected with the right side of the upper end of the bottom and located on the right side of the arched part. Through the combination of a three-dimensional stepped welding spot structure and metal wire path planning, the metal wire collision risk is completely eradicated from the physical space level.

This application relates to the field of battery structure, and more particularly to a battery and an electrical device. The battery includes a cell assembly, a housing, and a mounting bracket; the mounting bracket is located within the housing and includes a bracket body and an abutment member. The bracket body is used to fix the cell assembly; the abutment member is circumferentially arranged on the bracket body, and the abutment member elastically abuts against the inner wall of the housing. The battery provided in this application, by setting the abutment member to elastically abut against the inner wall of the housing, allows the mounting bracket and the housing to be tightly assembled together, thereby ensuring that the cell assembly does not shake within the housing, thus improving the overall mechanical reliability of the product. When the battery is subjected to severe impact or tumbling / drop impact, the elastic force generated by the abutment member can effectively absorb external vibrations, thus playing a cushioning role.

The application provides a printed circuit board and a preparation method thereof, and the complete printed circuit board structure is formed by adopting glass as a PCB medium layer material and combining the step-by-step construction of a multi-layer build-up structure and a pressing process, high-density interconnection of a complex circuit is realized, and problems such as signal attenuation and poor reliability caused by insufficient dielectric properties, thermal stability or mechanical strength of a traditional PCB medium layer material in a high-frequency high-speed transmission scene are solved.