68results about How to "High wiring density" patented technology

A silicon based package (SBP) is formed starting with a thick wafer, which serves as the base for the SBP, composed of silicon which has a first surface and a reverse surface which are planar. Then form an interconnection structure including multilayer conductor patterns over the first surface. Form a temporary bond between the SBP and a wafer holder, with the wafer holder being a rigid structure. Thin the wafer to a desired thickness to form an Ultra Thin Silicon Wafer (UTSW) for the SBP. Forming via holes which extend through the UTSW, forming metallization in the via holes which extends through the UTSW, making electrical contact to the interconnection structure on the first surface. Then bond the metallization in the via holes to pads of a carrier.

A structure and method of fabricating a “Lego”-like interlocking contact for high wiring density semiconductors is characterized in that the barrier liner formed in the contact via extends only partially upwards into the adjacent wire level. As a consequence, current crowding and related reliability problems associated with conventional prior art interconnect structures is avoided and structural integrity of the contact via (metal stud) structure is enhanced. The novel “crown” shape of the Lego-like interlocking contact structure that is fabricated to extend in an upward direction may be employed for other integrated circuit applications including forming capacitor (e.g., MIMCAP) and heat sink structures due to its increased surface area.

In a stacked package in which a plurality of packages having semiconductor elements mounted on substrates are stacked, while being electrically connected together, by use of connection sections, wherein the connection sections are formed from pillar-like members and solder joint sections and the upper package is supported on the lower package by pillar-like members.

A wiring structure includes a general signal line, a differential signal line having a pair of signal wiring lines and a reference potential layer. The signal wiring lines respectively transmit differential signals of which waveforms are inverted from each other. The reference potential layer is arranged to have a distance from the general signal line and the differential signal line, and has a non-formed portion in a region to be electromagnetically coupled to the differential signal line.

The invention is directed to improvement of a write element of a thin film magnetic head. In said write element, a first coil and a second coil are provided on a first insulating film formed on one surface of a first magnetic film and surround in a spiral form a back gap portion. A second yoke portion in the upper position comprises a wide portion, a narrow portion and a sloping flare portion. The wide portion has a flat surface and is connected to the first magnetic film by a back gap portion at the rear of the medium-facing surface. The narrow portion forms the second pole portion and the surface of the narrow portion being at a lower position than the surface of the wide portion. The sloping flare portion extends from the narrow portion to the wide portion, gradually increasing in width and its surface sloping upward away from the surface of the narrow portion to the surface of the wide portion.

The invention discloses a conductive elastic wave for a loudspeaker, which comprises an elastic wave main body, wherein a wave peak, a wave trough and a voice coil are arranged on the elastic wave main body; and the cross section is of a wave structure. The conductive elastic wave for the loudspeaker is characterized in that two or a plurality of FPCs (Flexible Printed Circuit) are arranged on the wave peak and the wave trough of the elastic wave; one end of each of the FPCs are connected with the voice coil; a connecting end is arranged at the other end of each of the FPCs; a connecting power supply stretches out from the outer side of the elastic wave main body; the FPCs are connected with the elastic wave main body integrally in the way of hot-pressing, or penetration or sewing; and two of the FPCs are arranged vertically on the surface of the elastic wave. The thickness of each FPC is 0.01mm-2mm, and the conductive elastic wave for the loudspeaker has the advantages of simple structure, low production cost, good effect and the like.

To provide a mutilayer wiring board wherein high density wiring exceeding the application limit of the conventional build up wiring boards is made possible. A wiring board is provided with a board, which is formed by stacking along a board flat plane direction a plurality of dielectric layers arranged along a facing direction of the both main planes of the board, and an inner conductor pattern arranged on the surface of the dielectric layer. The adjacent dielectric layers are integrally formed to be communicated with each other by being connected at the layer edges on one of the board main planes. The connecting portions of the adjacent dielectric layers are alternately provided on one of the board main planes, and the dielectric layers are formed in a shape of one dielectric sheet which is arranged by being bent.

The present invention relates to an electrical connector assembly. The electrical connector assembly comprises a first connector and a second connector for connecting a female circuit board; the first connector comprises an insulating body as well as a first terminal group, a second terminal group and a metal spacer which are all accommodated in the insulating body; the insulating body includes a main body portion and a tongue plate projecting forwardly from the main body portion; the electrical connector assembly further comprises a flexible circuit board connected with the first connector and the second connector; the second connector is a board-to-board connector; the second connector is convenient to be in butt joint with the board-to-board connector on the female circuit board; and the flexible circuit board can easily and conveniently change the position of the first connector in an electronic device, so that different installation height (offset) requirements can be satisfied, new molds are not required to be manufactured, the categories of products can be decreased, and costs can be decreased.

A field programmable gate array is described for use in a semiconductor chip such as a VLSI chip. The array is provided with variable wire-through porosity to allow for optimum chip-level routing through the array. This is achieved by dividing the array into blocks which can be individually assessed for required porosity. Then blocks that have been prefabricated with differing porosities are placed in the macro to optimize local chip level routing. The routing of wires is determined by developing a chip floor plan to include early timing allocation and a proposed placement of the array. The floor plan is then overlaid with critical logical wiring nets. From this, an initial selection of blocks is made based on proposed wiring density, and the macro is assembled with the blocks strategically placed therein. The procedure is likewise applicable to other types of densely obstructed cores embedded with a chip.

The invention discloses a ball grid array (BGA) package structure, which is characterized in that wire carriages are utilized to support corresponding wires so as to prevent the wires from collapsing in a vertical direction, and effectively separate the wires in an upper layer from the wires in a lower layer. Meanwhile, the wire carriages are provided with rough insulating surfaces, and can further prevent the wires from deviating and being rushed in a horizontal direction. Therefore, the structure can effectively avoid the wires in any two adjacent layers or the left and right wires from generating contact short circuit.

The invention discloses an inorganic flexible LED color display screen and a preparation method. The preparation method comprises the following steps: forming a flexible circuit board by using a layerof a basic layer, multiple layers of insulating layers and multiple layers of electrode layers, wherein the basic layer is a bottom layer, and successively and alternately installing the insulating layers and the electrode layers on the basic layer; selecting PET polyester plate or PI polyimide plate, plating a layer of a conducting film on the plate, etching a common circuit to prepare the basiclayer through a laser; using PI polyimide solution, and preparing the insulating layers by using silk-screen printing; using conducting ink containing nano-silver carbon, and preparing the electrodelayers by using 3D ink-jet printing; and finally, pasting an LED light-emitting device on the flexible circuit board by using a chip mounter, and covering by a protecting layer prepared by transparentflexible protecting glue. The display has the characteristics of good flexibility, light weight of a finished product, convenient installation, and small influence to luminescence uniformity and visual effect after curled. The preparation method is capable of overcoming a bottleneck of large-scale display screen preparation, and guaranteeing the preparation of the inorganic flexible LED color display screen.

The invention discloses a hand-held device with a short-range wireless communication antenna and an assembly method thereof. The hand-held device comprises a body, a short-range wireless communication antenna, a battery and a hold-down piece pivoted on the body, wherein a battery groove is formed on the body; an accommodating groove is formed on one side of the battery groove; a circuit board is also arranged in the body; the battery is arranged in the battery groove; the hold-down piece is pivoted on the body and is arranged in the accommodating groove; the short-range wireless communicationantenna is prepared from a flexible circuit board and comprises an antenna area and a connection area connected to one side of the antenna area; the connection area of the short-range wireless communication antenna is detachably clamped in the hold-down piece and is connected with the circuit board; and the antenna area leans against the surface of the battery flexibly. The short-range wireless communication antenna is assembled in the hand-held device detachably, and an assembly process is simple; and when the hand-held device is replaced, the short-range wireless communication antenna can be utilized repeatedly.

When ceramic electronic parts such as multilayer ceramic substrates that have a substrate body and metal wiring conductors comprising silver are manufactured, a composition comprising not only a borosilicate glass powder and a ceramic powder, but also an additive powder comprising at least one of cerium oxide, bismuth, bismuth oxide, antimony and antimony oxide is used as a composition for preparing the substrate body. Gray discoloration of the substrate body and yellow discoloration in the vicinities of the metal wiring conductors can be prevented.

The present invention relates to a method of manufacturing a wound stator. The method promises the following steps: (1) providing a stator, which has a plurality of radial grooves arranged at an inner circumference of the stator, (2) providing a plurality of wires for the stator, and (3) sequentially embedding the straight portions of each wire in corresponding grooves of the stator so that each of the grooves is embedded with the wires. Each of the plurality of wire comprises: a first end, a second end, and a plurality of wave-shaped coils located between the first end and second end. Each wave-shaped coil is formed of straight portions and curved portions that alternate with each other.

The present invention provides a display device includes: a pixel array section including a set of pixels arranged in a form of a matrix; and a driving section for driving the pixel array section.

The invention relates to a solar battery piece assembly and an assembling method thereof. The solar battery piece assembly comprises a solar battery piece, low-temperature lead-free tin paste and a flexible circuit board; and the solar battery piece is welded on the flexible circuit board by using the low-temperature lead-free tin paste through a backflow welding manner. By adoption of a solder-strip-free battery pack series technology, the problem of influence to the collection efficiency of a photovoltaic module current from the quality of a solder strip in the conventional process is eliminated; the low-temperature lead-free tin paste is adopted between the battery piece and the flexible circuit board, and the backflow peak temperature is controlled to be 190 DEG C or below, so that thephenomena of solar battery piece cracking or hidden cracking caused by an overhigh welding temperature can be avoided; meanwhile, silver paste is not used, so that production cost is greatly lowered;by taking the flexible board as the welding circuit board, the thickness of the solar battery assembly can be greatly lowered; and therefore, the solar battery piece assembly has the characteristicsof low limitation on the overall wiring space of the assembly, high wiring density, high flexibility and less process steps.