Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

1966results about "Diaphragm mounting/tensioning" patented technology

Vibration actuator having magnetic circuit elastically supported by a spiral damper with increased compliance

A vibration actuator includes an electromechanical transducer having a magnetic circuit (1-4) and a driving coil (5), a support frame (9), and a damper (270) elastically supporting the magnetic circuit onto the support frame to flexibly damp the vibration of the magnetic circuit when a driving AC current is supplied to the coil (5). The damper (270) comprises inner and outer ring portions (271, 272) and a plurality of spiral spring portions (273) determined by a plurality of spiral slits (274, 275) formed in the damper. In order to reduce the spiral spring portion determined by the adjacent two spiral slits in its compliance, each of the spiral spring portions has an effective spring length determined by an effective angle (theta) which is determined as an angle (by angular degree) from an inner end of the inner spiral slit to an outer end of the outer spiral slit defining each respective spiral spring portion around a center of the damper. The effective angle is 55 angular degree or more. In a preferable example, the effective spring length is determined by a product (r.theta) of an average radius (r) value by the unit of "mm" and the effective angle (theta) value by unit of the angular degree. The effective spring length is selected to 320 or more, and preferably 400 or more.
Owner:TOKIN CORP

MEMS process and device

A MEMS device, for example a capacitive microphone, comprises a flexible membrane 11 that is free to move in response to pressure differences generated by sound waves. A first electrode 13 is mechanically coupled to the flexible membrane 11, and together form a first capacitive plate of the capacitive microphone device. A second electrode 23 is mechanically coupled to a generally rigid structural layer or back-plate 14, which together form a second capacitive plate of the capacitive microphone device. The capacitive microphone is formed on a substrate 1, for example a silicon wafer. A back-volume 33 is provided below the membrane 11, and is formed using a “back-etch” through the substrate 1. A first cavity 9 is located directly below the membrane 11, and is formed using a first sacrificial layer during the fabrication process. Interposed between the first and second electrodes 13 and 23 is a second cavity 17, which is formed using a second sacrificial layer during the fabrication process. A plurality of bleed holes 15 connect the first cavity 9 and the second cavity 17. Acoustic holes 31 are arranged in the back-plate 14 so as to allow free movement of air molecules, such that the sound waves can enter the second cavity 17. The first and second cavities 9 and 17 in association with the back-volume 33 allow the membrane 11 to move in response to the sound waves entering via the acoustic holes 31 in the back-plate 14. The provision of first and second sacrificial layers has the advantage of protecting the membrane during manufacture, and disassociating the back etch process from the definition of the membrane. The bleed holes 15 aid with the removal of the first and second sacrificial layers. The bleed holes 15 also contribute to the operating characteristics of the microphone.
Owner:CIRRUS LOGIC INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products