578results about "Electrostatic transducer loudspeakers" patented technology

A demodulation signal generator, coupled to an air-pulse generator comprising a flap pair, includes a resonance circuit. The resonance circuit produces a first demodulation signal and a second demodulation signal. The resonance circuit and the flap pair co-perform a resonance operation, such that the first demodulation signal and the second demodulation signal are generated via the co-performed resonance operation and have opposite polarity. The flap pair performs a differential movement to form an opening to perform a demodulation operation on a modulated air pressure variation.

An air-pulse generating device includes a film structure including a first flap and a second flap opposite to each other. The film structure is actuated to operate at an ultrasonic frequency, and the air-pulse generating device produces a plurality of air pulses at an ultrasonic pulse rate. The first flap and the second flap are actuated to perform a differential movement to form an opening or a virtual valve. A slit is formed between the first flap and the second flap, and the opening or the virtual valve is formed because of the slit. The slit is formed as a zigzagging pattern on the film structure.

An air-pulse generating device includes a film structure including a first flap and a second flap opposite to each other. The film structure is actuated to operate at an ultrasonic frequency, and the air-pulse generating device produces a plurality of air pulses at an ultrasonic pulse rate. The first flap and the second flap are actuated to perform a differential movement to form an opening or a virtual valve. A slit is formed between the first flap and the second flap, and the opening or the virtual valve is formed because of the slit. The slit is formed as a zigzagging pattern on the film structure.

In an example, the present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of silicon or graphene material which has a first surface and a second surface opposite of the first surface and sensor to track position of the diaphragm. The device has a housing enclosing the movable diaphragm device, the electrode device and an encapsulation device. The electrode device can be part of a CMOS device with electronics integrated on to the device that converts input audio signal in to signal that electrostatically actuates the micro-speaker from one or more surfaces.

The invention provides a frequency mixing MEMS piezoelectric loudspeaker and a manufacturing method thereof, the frequency mixing MEMS piezoelectric loudspeaker comprises a plurality of MEMS piezoelectric sound production units, the structure of a vibrating diaphragm of each unit is a cantilever beam structure, a bridge type structure or a periphery reinforcing structure, if the sizes of cavities of all the MEMS piezoelectric sound production units are the same, the structures of the vibrating diaphragms of at least two MEMS piezoelectric sound production units are different, and if the sizes of the cavities of all the MEMS piezoelectric sound production units are the same, the structures of the vibrating diaphragms of all the MEMS piezoelectric sound production units are different. If the size of the cavity of at least one MEMS piezoelectric sound production unit is different from the size of the cavity of the other MEMS piezoelectric sound production unit, the structures of the vibrating diaphragms of the plurality of MEMS piezoelectric sound production units are the same or different, and the sizes of the cavities and the structures of the vibrating diaphragms are related to the resonant frequency of the MEMS piezoelectric sound production units. According to the loudspeaker, the plurality of MEMS piezoelectric sounding units have different diaphragm structures and / or have different cavity sizes, so that the output sound pressure level SPL of the loudspeaker can be improved, and the audio frequency response range is widened.

A package includes a substrate having a first surface and an opposing second surface, a first cavity adjacent to the first surface of the substrate within the package, and a second cavity adjacent to the second surface of the substrate within the package, wherein the second cavity includes a fluid opening for allowing a fluid to enter the second cavity; a through hole in the substrate providing fluid communication between the first and second cavities; a MEMS sound transducer disposed in one of the first cavity or the second cavity; a MEMS pressure sensor disposed in the other one of the first cavity or the second cavity; and a discrete transfer block arranged on the substrate and configured to provide an electric path between the package pad and the MEMS sound transducer and the MEMS pressure sensor, wherein the transfer block is a discrete component separate from the substrate.

The invention relates to a MEMS component, in particular an acoustic transducer or pressure sensor, comprising: a substrate with a cavern and a mainland, an interaction element arranged above the cavern and connected to the mainland, where the interaction element is a bending beam, a boundary layer arranged at a distance from the bending beam via connecting elements, which defines a cavity with the bending beam, and a back plate located within the cavity, which is designed as a back electrode, wherein the back plate is designed to be stiffer with respect to the boundary layer and the bending beam, at least one electrode which forms a readable capacitance with a back electrode of the back plate in order to capacitively detect a deflection of at least one of the bending beam, the connecting elements and the boundary layer, at least one stop element which is designed to be displaced into a mechanical stop, wherein the stop element in the stop has at least one fluid flow resistance, in particular a fluid seal, between the cavity on a substrate-facing side and a volume on a substrate-facing side of the cavity.

The invention discloses an intelligent audio scene adaptation method based on an MEMS loudspeaker, and relates to the technical field of audio scene adaptation. Audio is collected through a microphone array, and features such as frequency domain entropy are fused to construct vectors; a scene is identified by using BiLSTM and a self-attention model, and rapid adaptation is carried out in combination with transfer learning; optimizing loudspeaker parameters based on a coupling model and a genetic algorithm, and compensating temperature influence; the equal-sound curve is dynamically adjusted according to the scene, the audio is enhanced, and cross-scene adaptation, parameter pre-adjustment and multi-loudspeaker collaborative optimization are realized through the technologies of adversarial training, model prediction control and the like. According to the invention, through multi-modal feature fusion and deep learning, the scene recognition accuracy is improved, the loudspeaker parameters are optimized by using the coupling model, and distortion and power consumption are reduced; the audio enhancement parameters are dynamically adjusted, multi-scene adaptation is achieved, the tone quality and the user experience are improved, and the application bottleneck of a traditional MEMS loudspeaker is solved.

MEMS device (10) with a movable displacement element (12) and a drive device (14) for driving the movable displacement element (12), wherein the drive device (14) has at least one drive electrode (16), characterized in that the drive electrode (16) is segmented and at least one functional electrode (18) is provided for measuring the deflection of the displacement element (12).

The objective of the present invention is to provide an automobile interior material that includes a flexible thin speaker, is made sufficiently thin, and is flexible, and that can consequently be installed in various parts within an automobile, and to provide an automobile including the automobile interior material. The present invention relates to an automobile interior material including a flexible thin speaker, characterized by having a thickness of 30 mm or less and by generating sound pressure through the vibration of a flexible diaphragm, and an automobile including the automobile interior material, wherein a dielectric layer is disposed between a pair of opposing electrically conductive layers, and an electric signal is applied to the pair of electrically conductive layers to cause the pair of conductive layers and the dielectric layer to vibrate integrally, thereby generating sound pressure.

A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.

The present invention relates to technical fields such as the manufacture of new electroacoustic components and microelectronic devices, and in particular to a MEMS structure and a preparation method thereof, a MEMS piezoelectric bionic vector microphone. The MEMS structure of the present invention includes: a substrate, including: a substrate outer ring body, a substrate back cavity; a vibration layer, including: a fixed area; a detection area, separated from the fixed area by a slit; two rotating connection structures, respectively connected to the detection area at the front and rear sides of the fixed area, and a rotation axis is formed by the straight lines of the two rotating connection structures, and the rotation axis divides the detection area into a first rotating beam and a second rotating beam; 2N cantilever beam units, wherein the first and second rotating beams are respectively connected to the fixed area through N cantilever beam units; for each cantilever beam unit, its free end is connected to the corresponding detection area through a hinge structure; a piezoelectric functional module. The present invention can drive the cantilever beam to produce a greater bending deformation and increase the output voltage signal.

An electro-acoustic transducer includes a substrate, a MEMS device disposed on the substrate, and a membrane disposed on the MEMS device. The electro-acoustic transducer further includes a pair of internal connection pads that serve as a path for a signal to be supplied to a drive source; and one or more height adjustment pads disposed in a region of an upper surface of the substrate that overlaps with a fixed portion in plan view. A lower surface of the fixed portion is bonded to the upper surface of the substrate, and the internal connection pads and the height adjustment pad are interposed between the substrate and the fixed portion.

A MEMS audio device includes a first substrate having a first surface, a cavity, and a first vent hole formed through the first substrate, a device layer disposed upon the first substrate comprising a semiconductor material sandwiched between a first and second oxides, wherein a portion of the semiconductor material is substantially free of oxide, wherein the first oxide is disposed against the first surface, and wherein the device layer comprises first contacts, a substrate disposed upon the device layer, including a first vent hole formed through the second substrate, and second electrical contacts coupled to the first electrical contacts, wherein the portion of the semiconductor material forms a diaphragm for the MEMS audio device and wherein the diaphragm is configured to move within the first cavity.

Provided is a connector structure that is capable of inhibiting physical damage to a connection portion between a conductive layer and a wiring part, and is also capable of inhibiting electrical damage to the connection portion, and therefore, is suitable for functional fibers. When one surface 1a of a conductive layer 1 forms an XY plane defined by an X axis and a Y axis, a connector structure 10 is formed by connecting wiring part 2 to the one surface 1a in a Z-axis direction. In at least one cross-section that appears when a connection portion 3 is cut along the Z-axis direction, an internal angle θ that is located on the side of the wiring part 2 and that is formed by a virtual straight line L1 drawn by the one surface 1a and a virtual straight line L2 drawn by a surface of the wiring part 2 connected to the one surface 1a is greater than 90 degrees.

The invention provides a method for releasing a sacrificial layer of an MEMS structure and the MEMS structure, and the method comprises the following steps: providing a substrate on which the sacrificial layer is to be released, and sequentially forming a structure layer, the sacrificial layer, a device layer and a release hole communicated with the sacrificial layer on the substrate; carrying out pre-etching treatment on the substrate by adopting a fluorine-containing and oxygen-containing dry etching process; and releasing the sacrificial layer through a dry etching process by using the release holes. According to the method, the pre-etching treatment is added before the sacrificial layer is released, so that residues in a previous layer process are removed, the surface state of the sacrificial layer is improved, efficient sacrificial layer release is further achieved, the sacrificial layer can be removed in a shorter time and at a lower temperature, damage of the release process to the surfaces of structures such as a structural layer and a device layer is reduced, and the yield of the device is improved. Therefore, the MEMS device with a clean surface, good uniformity and excellent roughness is obtained.

The invention discloses a directional sound wave loudspeaker control method based on MEMS, and relates to the technical field of stereo loudspeakers. By initializing the MEMS array, the microphone array and the control circuit, stable operation of the system is ensured. The microphone array accurately locates a sound source by using a TDOA or beam forming algorithm, and the control circuit calculates phase and amplitude parameters of the MEMS unit to realize high-precision beam forming. The MEMS acoustic metasurface array transmits directional sound wave beams according to parameter adjustment, a microphone in a target area monitors sound wave quality in real time, and a control circuit dynamically and finely adjusts array setting through a feedback optimization algorithm to adapt to environmental changes. The system has the advantages of high-precision positioning, efficient beam forming, real-time optimization and low power consumption, is suitable for scenes such as smart home and virtual reality, and remarkably improves sound wave directionality and quality stability.

This earphone comprises: a housing 11 to which a guide tube part 15 for emitting sound to the outside is coupled; fixed poles 17 fixed to the inside of the housing 11; a vibration membrane 21 which is provided to bisect the space inside the housing 11 and vibrates in response to a potential difference generated between the facing fixed poles 17; a support member 27 which supports the vibration membrane 21 so that a portion of the vibration membrane 21 is in contact with the fixed poles 17; and an adjustment hole part 14 which is formed in the housing 11 so as to pass through a wall on a side opposite to the guide tube part 15 when viewed from the vibration membrane 21, and which is for adjusting the pressure inside the housing 11. A membrane-penetrating hole 22 which passes through the vibration membrane 21 is formed in the portion of the vibration membrane 21.

The invention relates to the technical field of semiconductors, in particular to an MEMS micro loudspeaker packaging structure and a preparation method thereof, and the packaging structure comprises a substrate which is provided with a hollow cavity structure, a limiting device and a plurality of vent holes in the bottom; and the MEMS sound production chip is inversely arranged on the substrate, and the edge area of the MEMS sound production chip is bonded with the substrate through the connecting part. According to the packaging structure of the MEMS micro loudspeaker provided by the invention, the MEMS sound production chip is inversely arranged and is in direct contact with the substrate used for packaging, so that the packaging structure has higher impact resistance, the inversely arranged MEMS sound production chip can better dissipate heat, and a double-sound-cavity structure in the packaging structure increases system damping and reduces the quality factor of device resonance; the stability and reliability of the chip can be improved, the design of multiple vent holes is combined with the limiting device, the nonlinear displacement of the MEMS sound production chip under the resonant frequency is effectively inhibited, and the total harmonic distortion is reduced.

The invention relates to a MEMS sound transducer (1), in particular for generating and / or detecting sound waves in the audible wavelength spectrum and / or in the ultrasound range, comprising a carrier (2) and at least one piezoelectric element (4, 17) arranged on the carrier (2) and deflectable in the direction of a stroke axis (3), the piezoelectric element having at least one piezoelectric layer (5, 25) and at least one structural layer (6, 31), wherein electrical signals and deflections of the piezoelectric element (4) can be converted into one another by means of the at least one piezoelectric layer (5, 25). According to the invention, the at least one piezoelectric layer (5, 25) is made of scandium aluminum nitride. The invention further relates to a method for manufacturing a MEMS sound transducer (1).

There is a composite material for an acoustic transducer diaphragm comprising: a thermoplastic polymer resin, a graphitic filler, and optionally a coupling agent. The thermoplastic polymer resin is selected from the group consisting of polypropylene, polyethylene, poly(methyl methacrylate), polycarbonate, polyoxymethylene, cyclic olefin copolymer, polyethylene terephthalate, acrylonitrile butadiene styrene, polybutylene terephthalate, polyamide, poly(ADP-ribose) polymerase, polyethylenimine, polyamide-imide, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, polyacetals, polyvinyl acetals, polyketone, polyamides, cyclic olefin copolymer, thermoplastic thermotropic liquid-crystal polymer, polyphenylene sulfide, polyimide and a mixture thereof. The graphitic filler is selected from the group consisting of graphene oxide, reduced graphene oxide, graphite, graphene and carbon nanotubes, and a mixture thereof. The coupling agent or a mixture is selected from the group consisting of titanium organometallics, aluminum organometallics, zirconium organometallics, and silicon organometallics.

A cantilever structure includes an anchor portion and a film structure. The film structure covers over a cavity and vibrates within the cavity. A length of the film structure is less than a width of the film structure. The anchor portion includes at least one protrusion protruding toward the cavity, and the film structure is anchored on the anchor portion with the at least one protrusion.

An electrostatic transducer that enables improvement of detection accuracy or driving precision while allowing flexibility is provided. The electrostatic transducer (1) is provided with: an insulator sheet (11); at least one electrode sheet (12) which is laminated on the insulator sheet (11), constitutes a target region to be used as a detection region or a driving region, is formed of an elastomer comprising a conductive filler, and includes at least one terminal part (12b); and at least one bypass conductor (13) which has an electrical resistivity less than that of the electrode sheet (12), is disposed in contact with the electrode sheet (12) along the surface of a part of the electrode sheet (12), and is electrically connected to the electrode sheet (12) in the area in contact with the electrode sheet (12).

The invention relates to the field of semiconductor devices, and provides an MEMS loudspeaker, a manufacturing method thereof and electronic equipment. The MEMS loudspeaker comprises a substrate and a vibrating diaphragm located on the upper side of the substrate in the thickness direction, a sound cavity is formed between the vibrating diaphragm and the upper portion of the substrate in the thickness direction, a sound hole is formed in the lower side of the substrate in the thickness direction, and the sound cavity is communicated with the sound hole. And the size of at least one part of the sound cavity in the thickness direction in the horizontal direction is larger than the size of at least one part of the sound hole in the thickness direction in the horizontal direction. Therefore, the sound cavity and the sound hole are respectively formed at the upper side and the lower side of the substrate, and the substrate widths at the left side and the right side of the sound cavity are narrower than the substrate widths at the left side and the right side of the sound hole, so that the effective working area of the vibrating diaphragm is ensured, the strength of the substrate is enhanced, the conditions of wafer fragments or chip breakage are avoided, the performance of the MEMS loudspeaker can be improved, and the manufacturing cost of the MEMS loudspeaker is reduced. And the production cost can also be reduced.

Techniques described herein generally relate to generating an audio signal with a speaker. In some examples, a speaker device is described that includes a membrane and a shutter and driver device is configured to receive an audio signal, modulate it and generate electric signals to operate the speaker and generate an acoustic audio signal.

A microelectromechanical sensor component. The component includes: a substrate; a movable sensor structure connected to the substrate and having a seismic mass portion and a deflection electrode arranged thereon; and at least one evaluation electrode arranged on the substrate. The deflection electrode is arranged so as to be movable relative to the evaluation electrode. The evaluation electrode is configured for capacitive detection of a deflection of the deflection electrode. The deflection electrode and the evaluation electrode form a comb structure. The deflection electrode has a plurality of deflection electrode fingers extending from a deflection electrode bar in the direction of the evaluation electrode. The evaluation electrode has a plurality of evaluation electrode fingers extending, parallel at least in portions to the deflection electrode fingers, from an evaluation electrode bar in the direction of the deflection electrode.

The invention discloses a fixed end beam-cantilever beam type piezoelectric MEMS loudspeaker and a preparation method and application thereof. The piezoelectric MEMS loudspeaker comprises a substrate, an upper electrode, a piezoelectric layer, a lower electrode and a vibrating membrane, the upper electrode, the piezoelectric layer and the lower electrode are sequentially arranged on the substrate, and the vibrating membrane and an etching gap surrounding the vibrating membrane are formed on the upper electrode, the piezoelectric layer and the lower electrode in an etching mode; the vibration displacement of the fixed end beam-cantilever beam type piezoelectric MEMS loudspeaker is very large, and is mainly attributed to the superposition of the vibration displacement of the fixed end beam and the vibration displacement of the cantilever beam.

The invention provides a diaphragm capable of improving the bonding strength with other components and an electro-acoustic conversion device capable of improving the assembly precision of MEMS equipment and peripheral components. This electro-acoustic conversion device is provided with a substrate, a MEMS device disposed on the substrate, and a diaphragm disposed on the MEMS device, the MEMS device having a frame-shaped fixed part, a movable part, a torsion beam and a drive beam connecting the fixed part and the movable part at positions closer to the lower surfaces than the upper surfaces of the fixed part and the movable part, and a drive source disposed on the lower surface of the drive beam. A pair of pads for internal connection and pads for height alignment, which serve as paths for signals supplied to the drive source, are disposed in a region of the upper surface of the substrate that overlaps the fixed portion in the planar direction, and the lower surface of the fixed portion is bonded to the upper surface of the substrate with the pads for internal connection and the pads for height alignment interposed therebetween. This diaphragm is provided with a frame part, a central part, and a connecting part that connects the inner edge of the frame part and the outer edge of the central part. The upper surface and the lower surface of the frame part are provided with a concave-convex structure.

Provided is an acoustic processing apparatus in which a microelectromechanical systems (MEMS) device is effectively arranged. The acoustic processing apparatus includes an enclosure, a sound duct extending from the enclosure, and a MEMS device housed in the sound duct.

Provided is a speaker, including: a diaphragm structure including first and second diaphragms, the first diaphragm is configured to push air to vibrate to generate initial sound wave, and a signal of which is modulated based on a signal within an audible sound frequency band; and a cover plate structure enclosing with the diaphragm structure to form sound-generating cavity, the cover plate structure has a sound outlet hole connecting the sound-generating cavity with outside, the initial sound wave in the sound-generating cavity is transmitted to the outside through the at least one sound outlet hole to form a sound signal, the second diaphragm and the cover plate structure generate an acoustic environmental impedance used to modulate the initial sound wave to change sound pressure of the sound signal. The speaker can modulate and output a sound signal covering the audible sound frequency band based on the acoustic environmental impedance.