3336 results about "Internal connection" patented technology

Apparatus is described for stimulating healing of wounds, particularly burns, to the hands or feet. The apparatus comprises an envelope for receiving the affected part of the body. The envelope (12) comprises an air-tight cover which contains a porous pad (22, 24, 26) for covering the wound. Means are provided for connecting the interior of the envelope to a source of suction.

A stack type semiconductor package, and a method of fabricating the same are provided. The stack type semiconductor package may include a lower unit package and an upper unit package. The lower unit package may include a substrate, and a semiconductor chip on an upper surface of the substrate. A bump may be on an upper surface of the substrate, and a protecting layer, covering the semiconductor chip, may be formed. The protecting layer may include a via hole partially exposing the bump. The upper unit package may be on the protecting layer, and may include an internal connection solder ball on a lower surface of the upper unit package. The internal connection solder ball may be inserted into the via hole and connected to the bump.

Methods are disclosed for establishing a path for data transmissions in a system having a plurality of possible paths by creating a configuration database and establishing internal connection paths based upon a configuration policy and the configuration database. The configuration policy can be based on available system resources and needs at a given time. In one embodiment, one or more tables are initiated in the configuration database to provide connection information to the system. For example, a path table and a service endpoint table can be employed to establishing a partial record in the configuration database whenever a user connects to a particular port on a universal port card in the system. The method can further include periodically polling records in the path table and transmitting data from the partial records to a policy provisioning manager (PPM). The PPM then implements a connection policy by comparing one or more of the new path characteristics, to the available forwarding card resources in the quadrant containing the universal port card port and path. The path characteristics can include the protocol, the desired number of time slots, the desired number of virtual circuits, and any virtual circuit scheduling restrictions. The PPM can also take other factors into consideration, including quality of service, for example, redundancy requirements or dedicated resource requirements, and balancing resource usage (i.e., load balancing) evenly within a quadrant.

A disclosed device includes a manufacturing method of semiconductor device including preparing a semiconductor substrate including semiconductor chip forming regions, scribing regions surrounding these regions, and cutting regions formed in the scribing regions and narrower than the scribing regions, forming check patterns and semiconductor chips, forming a resist film, forming through grooves narrower than the scribing regions and wider than the check patterns and the cutting regions, removing the check patterns with a wet blast process using the resist film and collectively forming grooves at portions of a protection film and the semiconductor substrate facing the through grooves, removing the resist film, forming internal connection terminals on the contacting faces, forming an insulating resin layer, forming a wiring forming face by removing until connecting faces are exposed, forming wiring patterns, and cutting the semiconductor substrate, the insulating resin layer, and a solder resist layer to separate into individual semiconductor devices.

A cushioning component for an article of footwear is disclosed that includes a fluid-filled chamber and a covering element extending over a portion of the chamber. The chamber is devoid of internal connections, and the fluid within the chamber may be at a pressure that is substantially equal to an ambient pressure. The chamber defines a plurality of lobes, and the cushioning element includes a plurality of inserts that extend between the lobes. The inserts are elongate structures that decrease the compressibility of peripheral portions of the cushioning component.

A circuit element is disposed on an organic substrate and is connected to a wiring pattern provided on the organic substrate. Internal connection electrodes are formed on a support of a conductive material through electrofomiing such that the internal connection electrodes are integrally connected to the support. First ends of the internal connection electrodes integrally connected by the support are connected to the wiring pattern. After the circuit element is resin-sealed, the support is removed so as to separate the internal connection electrodes from one another. Second ends of the internal connection electrodes are used as external connection electrodes on the front face, and external connection electrodes on the back face are connected to the wiring pattern.

The system and method for providing load balancer visibility in an intelligent workload management system described herein may expand a role or function associated with a load balancer beyond handling incoming and outgoing data center traffic into supporting governance, risk, and compliance concerns that may be managed in an intelligent workload management system. In particular, the load balancer may establish external connections with destination resources in response to client devices establishing internal connections with the load balancer and then attach connection tracers to monitor the internal connections and the external connections. The connection tracers may then detect incoming traffic and outgoing traffic that the internal and external connections pass through the load balancer, and traffic tracers may collect data from the incoming traffic and the outgoing traffic, which the workload management system may use to manage the data center.

A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.

Multilayer capacitors incorporate both low inductance (ESL) and controlled Equivalent Series Resistance (ESR) features into a cost-effective unitary device. Internal electrode patterns generally include one or more pairs of mother electrodes adapted for external connection (e.g., to a circuit, another electrical component, circuit board, or other mounting environment), and multiple pairs of daughter electrodes adapted only for internal connection to other electrodes (e.g., other daughter electrodes and/or selected mother electrodes) without direct connection to an external circuit. Mother and daughter electrodes are interdigitated with electrode tab features, where daughter electrodes have internal-connection tabs, and mother electrodes have both internal-connection tabs and circuit-connection tabs, all of which are connected to respective internal-connection or circuit-connection terminals. ESR is increased by the parallel connection between mother and daughter electrodes as well as other optional features such as but not limited to resistive terminations, resistive connectors, serpentine terminations and increased current path lengths.

A first level packaging assembly includes a chip-mounting base defined by a first surface and a second surface opposite to the first surface; a plurality of external connection lands disposed on the first surface; a plurality of solder balls connected to the external connection lands; a plurality of internal connection lands disposed on the second surface; a plurality of solder joints connected to the internal connection lands including solder materials having lower melting temperature than the solder balls; a semiconductor chip defined by a third surface and a fourth surface opposite to the third surface, connected to the solder joints on the third surface; and an underfill resin sandwiched between the second and third surfaces so as to mold the solder joints.

An improved hybrid integrated circuit is provided in order that the specification can quickly be modified and adjusted when required without need for preparing a new mask and without need for compromising the performance of the hybrid integrated circuit. The hybrid integrated circuit comprises: a common substrate on which an electrode pattern is formed; a first monolithic semiconductor chip designed by the use of an ASIC technology and mounted on the common substrate; a second monolithic semiconductor chip designed by the use of an FPGA technology and mounted on the common substrate; and external terminals provided for the common substrate; and an insulating material encapsulating the first monolithic semiconductor chip and the second monolithic semiconductor chip, wherein the second monolithic semiconductor chip is provided with a storage element which is rewritable by means of a control signal given through the external terminal in order to store circuit configuration data with which internal connections of the second monolithic semiconductor chip are modified to form a hardware configuration within the second monolithic semiconductor chip corresponding to a predetermined operational specification, and wherein the first monolithic semiconductor chip and the second monolithic semiconductor chip cooperate with each other by exchanging signals through the electrode pattern of the common substrate in order to implement the predetermined operational specification.

A supporting frame comprises four transversal supporting tubes, each of the transversal supporting tubes having two hollow ends; each two adjacent inner faces of each transversal supporting tube being formed with a screw hole; four longitudinal supporting tubes, each upper end of the longitudinal supporting tubes being a hollow end; moreover, each two adjacent inner faces of each longitudinal supporting tube being formed with respective screw holes; and a plurality of three-way internal connecting units; each three-way internal connecting unit having three inserting ends; each inserting end of the three-way internal connecting unit can be inserted into the hollow ends of the transversal supporting tube and the longitudinal supporting tube; thus by the longitudinal supporting tubes, the four transversal supporting tubes can be assembled as a rectangular upper frame and the four longitudinal supporting tubes being assembled as legs of the upper frame.

The self-watering assembly is used in combination with a conventional planter having flow hole apertures formed within a base thereof. The assembly includes a set of water-permeable flow hole inserts each including a portion of capillary material such as spandex. The flow hole inserts are inserted into a flow hole of the planter for direct contact with soil positioned therein. The flow hole inserts are sized and shaped to securely fit within the flow hole preventing soil from falling out of the flow hole and preventing roots from growing through the flow hole. Additional capillary material, also formed of spandex, couples an interior of a water reservoir to the capillary material of the water-permeable inserts. By using spandex as the capillary material, sufficient capillary flow may be achieved to properly water even medium to large sized plants. By employing water-permeable inserts for insertion into the planter wherein the inserts have capillary material mounted therein, water can be more effectively drawn into the soil of the planter as compared to many self watering planters wherein the planter merely rests on capillary material. Also, upon removal of the planter from the water reservoir, the inserts typically remain mounted within the flow holes of the planter such that soil from the planter is prevented from falling out of the planter via the flow holes. Entirely conventional planters may be employed thereby reducing overall costs which permit the customer a wide choice of planter shapes and sizes.

A semiconductor integrated circuit device includes a semiconductor substrate, a circuit element formed on one major surface of the semiconductor substrate and constituting an integrated circuit having a plurality of functions or a plurality of characteristics, an internal connection terminal, connected to the integrated circuit, for selecting one of the plurality of functions or one of the characteristics in the integrated circuit, an insulating layer covering the internal connection terminal such that the internal connection terminal is selectively exposed, and an external connection terminal arranged on the insulating layer. One of the plurality of functions or one of the plurality of characteristics is selected by a connection state between the internal connection terminal and the external connection terminal.

A fluid-filled chamber for an article of footwear and a method for manufacturing the chamber are disclosed. The chamber may be incorporated into a sole structure of the footwear and includes a central area and a plurality of lobes extending outward from the central area. The lobes are in fluid communication with the central area and are formed from a first surface, a second surface, and a sidewall. The sidewall joins with the first surface with the second surface to seal the fluid within the chamber, but no internal connections are generally utilized to join interior portions of the first surface with interior portions of the second surface. The fluid within the chamber may be air at a pressure that is approximately equal to an ambient pressure.

A display apparatus for displaying an article such as a pneumatic tire includes an elongate base with a substantially planar top surface and article support members projecting from said top surface at opposed ends of the base. Opposed side or lateral article support members are also provided each having an elongate side wall for supporting the article and connection means are provided projecting from opposed ends of each of the side article support members for removable and adjustable inner connection with the article support members on the base to provide a display for displaying an article such as a pneumatic tire in a vertical position and with the ability to accommodate different sizes of tires.

A stack type semiconductor package and a method of fabricating the stack type semiconductor package. The stack type semiconductor package includes: a lower semiconductor package including a circuit board, a semiconductor chip which is disposed on an upper surface of the circuit board, via-pads which are arrayed on the upper surface of the circuit board around the semiconductor chip, and an encapsulation layer which encapsulates the upper surface of the circuit board and has via-holes through which the via-pads are exposed; and an upper semiconductor package which is stacked on the encapsulation layer, is electrically connected to the lower semiconductor package, and comprises internal connection terminals which are formed on a lower surface of the upper semiconductor package.

A piezoelectric electroacoustic transducer includes a substantially rectangular piezoelectric diaphragm having electrodes and flexurally vibrating in response to application of an alternating signal between the electrodes, a resin case having a supporting member disposed inside sidewalls of the case for supporting the diaphragm, terminals insert-molded in the case so as to have internal connections exposed in the supporting member and external connections exposed on the external surface of the case, a conductive adhesive for electrically connecting the electrodes of the diaphragm to the internal connections of the terminals, an elastic sealant for sealing a gap between the external periphery of the diaphragm and the internal periphery of the case, and a lid plate for closing an opening of the case. The terminals are pressed terminals, which are made by punching a metallic plate so that a flash-producing surface is to be the lower surface, and flashes on both respective side-edges of the internal connections are embedded inside the supporting member of the case so that the top surfaces of the internal connections are flush with the surface of the supporting member, and the external connections of the terminals are bent toward the bottom surface of the case via the side surfaces thereof.

A beverage shaker (10) consists of an insulated container (20) which is configured to hold the ingredients for protein supplement drinks. The shaker permits manual mixing by shaking to and fro and retains any large pieces of the remaining ice within the container. The shaker has a removable top member (32) that is attached to the container which includes a smooth peripheral lip (26) surrounding the container suitable for drinking. A strainer (50) is supported internally by the top member and is configured for holding back large sized pieces of ice. A lid (60) internally interfaces with the top member in a leak proof manner permitting protein supplement drink ingredients to be mixed and consumed directly from the shaker when the lid is removed.