The application discloses a
memory chip processing method and a
memory chip, and relates to the technical field of integrated circuits. The
memory chip processing method comprises the following steps: providing a memory material and a control
crystal grain, wherein the memory material comprises a plurality of memory
crystal grains; packaging the memory
crystal grains with a first substrate, so that the plurality of memory crystal grains are connected with the first substrate, and a first packaging body is obtained;
cutting the first substrate, so that the plurality of memory crystal grains are separated, and a plurality of semi-finished memory modules are obtained, wherein each
memory module comprises a memory crystal grain and a sub-substrate arranged on one side of the memory crystal grain, and the sub-substrate is divided from the first substrate; and packaging at least one
memory module and the control crystal grain on a second substrate, so that a finished memory
chip is obtained, and the control crystal grain is connected with the at least one
memory module through a circuit. The memory
chip processing method can improve the accuracy of testing and reduce the loss of testing of the memory
chip.