Full-carbon coaxial line and manufacturing method thereof

Abstract

The invention discloses a full-carbon coaxial line and a manufacturing method of the full-carbon coaxial line, and belongs to the technical field of integrated circuits. Graphene serves as a monatomic layer thickness, is coiled into a cylinder and form an inner conductor of the coaxial line with a small radius (can be as small as the nm level), and the inner conductor of the coaxial line transfers currents. Meanwhile, a signal layer or multiple layers of graphene serve(s) as an outer conductor of the coaxial line to form a boundary of electromagnetic waves in a space, and graphite oxide serves as medium materials between the inner conductor and the outer conductor to limit and guide oriented transmission of electromagnetic wave energy. The coaxial line is quite small in size and applicable to radio-frequency and microwave integrated circuits.

Description

technical field [0001] The invention belongs to the technical field of integrated circuits, and in particular relates to an all-carbon coaxial cable and a preparation method thereof. Background technique [0002] The lines used for interconnection between transistors in integrated circuits are called interconnections. In the case of DC or low frequency, there is no need to consider the distribution effect and field effect of interconnection lines. With the continuous improvement of the clock speed of digital circuits and the operating frequency of radio frequency and microwave circuits, not only the distribution effect of interconnection wires needs to be considered, but also the energy of the signal includes not only the kinetic energy of electronic motion inside the wire, but also the energy in the space around the wire. The electromagnetic field energy, the current on the wire and the electromagnetic field in the surrounding space or medium restrict each other, so that th...

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Problems solved by technology

[0003] At present, there are some problems affecting the performance and reliability of the circuit when using metals (copper, aluminum, tungsten, gold, etc.) to prepare transmission lines: (1) Some metal conductors (such as copper) need to deposit an additional diffusion barrier layer, while The resistivity of the barrier layer material is usually very high, which will increase the total resistance of the transmission line (resulting in the increase of circuit RC delay and conductor heat loss). In addition, this layer of barrier layer also occupies nearly 20% of the width of the transmission line conductor. The surface of the conductor will also be dented during the process of metallization, which will further increase the total resistance of the conductor; (2) As the interconnection size decreases, the cross-section of the metal conductor in the transmission line and the mean free path of electrons (~40nm) will change. In the same order of magnitude, this will greatly increase the scattering of electrons on the surface of the conductor and the grain boundary, causing an increase in the resistance of the conductor; (3) passing a current on the metal wire for a long time will cause the movement of metal ions (electromigration effect), which It will eventually lead to the breakage of the wire or the short circuit with another wire, resulting in the failure of the circuit (the occurrence rate of electromigration depends on the temperature, crystal structure and average current density); (4) As the signal frequency increases, the metal conductor The skin effect will also lead to an increase in the resistance of the conductor and attenuation of the signal

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