450results about How to "Improve mass production" patented technology

A magnetoresistance effect device including a multilayer structure having a pair of ferromagnetic layers and a barrier layer positioned between them, wherein at least one ferromagnetic layer has at least the part contacting the barrier layer made amorphous and the barrier layer is an MgO layer having a highly oriented texture structure.

The present invention provides a method for constructing a universal LED bulb, a snap ring structured LED bulb and a lamp. The constructing method comprises: supporting an optical engine core member of the LED bulb in the lens snap ring (8) using a lens snap ring (8) as a supporting main body, using an inner snap ring (81) provided on the inner side of a light distribution optical lens (7) in the optical engine core member as an auxiliary supporting structure, and further using the inner snap ring (81) as an installation base of an optical engine module (4) and a heat conductive bracket (3) or an installation base of an LED bulb radiator (103); the optical engine core member of the LED bulb is composed of the heat conductive bracket (3), the optical engine module (4), the inner snap ring (81) and the light distribution optical lens (7).

The present invention provides a heat exchanger for exchanging heat through heat transfer plates by flowing a primary airflow and a secondary airflow in air passages. The heat exchanger comprises a unit element having a heat transfer plate and an air passage formed between the heat transfer plates by stacking the unit elements. Each of the unit elements is structured by molding a space rib for holding the space between the heat transfer plates integrally with a shield rib for shielding the leak of the airflows by use of a resin. The unit element includes an error detection part which can easily detect an error in stacking when the unit elements are stacked.

A light transmission and reception module includes: a belt-shaped macromolecular optical waveguide film having an optical waveguide, an optical transmitter having a light emitting element and a first sub-mount for holding the light emitting element, for holding one end of the macromolecular optical waveguide film on the first sub-mount so that a light emitted from the light emitting element may be coupled to an incident end surface of the optical waveguide, and an optical receiver having a light detecting element and a second sub-mount for holding the light detecting element, for holding the other end of the macromolecular optical waveguide film on the second sub-mount so that the light emitted from an exit end surface of the optical waveguide may be received in the light detecting element.

The present invention relates to a light emitting diode package for mounting a light emitting diode, a light emitting diode device with the light emitting diode package mounting a vertical electrode type light emitting diode thereon and a manufacturing method for manufacturing the light emitting device.

The light emitting diode package of the invention comprises at least a molding, and a first clip 122 and a second clip 123 fitted on the molding. The molding has at least a first opening 1212 and a second opening 1213 formed in a bottom portion thereof. The molding also has a reflecting portion 1214 formed around the first opening 1212 and the second opening 1213 for reflecting light. The molding further has a fluorescent film member mounting portion 1113 formed integrally for mounting a fluorescent film member 116 in the opening of the reflecting portion 1214. The first clip 122 has a light emitting diode mounting projection formed substantially at the center portion thereof for mounting the light emitting diode and is made to engage resiliently with the molding at both ends thereof. The first clip 122 engages with the molding at both ends thereof. The second clip 123 has a bonding projection formed to engage resiliently with the molding at both ends thereof.

It is intended to provide a pluripotent cell having the following properties: (1) being contained in a mixed-cell type population obtained by enzymatic treatment of the tissue collected from an animal; (2) being contained in a sedimented cell population obtained by centrifugating the mixed-cell type population of the property (1); (3) selectively proliferating by culturing in a medium containing 2% (v/v) or lower serum and 1 to 100 ng/ml of fibroblast growth factor-2; and (4) being differentiated into cells having the characteristics of adipocytes, osteoblasts, chondrocytes, tendon cells, myocardial cells, myoblasts, neurocytes or vascular endothelial cells by adjusting the culture condition; cells having differentiated from the above cell; and a method of conveniently obtaining the pluripotent cell in a large amount.

An angular rate sensor comprises a piezoelectric film having a first and a second surfaces forming an x-y plane and utilizes a perturbation mass coherently vibrating elastic acoustic waves on which a Coriolis force acts when the angular rate sensor undergoes a rotary motion about an x-direction. A first elastic acoustic wave is excited in the piezoelectric film by a driving transducer and a second elastic acoustic wave generated by the Coriolis force proportional to an angular rate of the rotary motion of the angular rate sensor itself is detected by the detecting transducer. The angular rate sensor further comprises at least a first electrode disposed on the first surface of the piezoelectric film for discharging a surface charge caused due to piezoelectric effect at the lower surface of the film in which the first elastic acoustic wave is excited.

The invention provides a USB based on a Type C. The USB comprises a housing, an upper insertion assembly and a lower insertion assembly. The upper insertion assembly comprises an upper insulation body and an upper row of conductive terminals. The lower insertion assembly comprises a lower insulation body, a metal shielding layer and a lower row of conductive terminals. The metal shielding layer and the lower row of conductive terminals are integrally molded. The lower row of conductive terminals comprises lower grounding terminals. Abutting portions of the lower grounding terminals comprise plate-shaped grounding basal bodies and grounding portions formed through projecting downwards from the basal bodies. The grounding portions and the grounding basal bodies are in different planes. The grounding basal bodies are arranged in the lower insulation body. The grounding portions are exposed outside the lower insulation body, and are used for contact with grounding terminals for abutting the USB; and the grounding basal bodies and main body portions of the lower grounding terminals are widened portions. Through adoption of the USB of the invention, the part composition of the product can be reduced; the reliability of the product when heavy currents pass can be raised; and the simplicity can also be raised.

In order to reduce manufacturing cost of a base supporting a semiconductor laser, without deteriorating accuracy of mounting of the semiconductor laser, a mounting member is provided between the base supporting the semiconductor laser and the semiconductor laser; and the semiconductor laser and the base are fixedly attached with heat-cured silver paste. The silver paste has a lower curing temperature than an assurance temperature of the semiconductor laser, and a higher heat resistance than an operation temperature of the semiconductor laser. The mounting member is formed of a material having a higher heat resistance than the curing temperature of the silver paste.

An electronic part holding film (30) includes an electronic part module (32) and winding conductor patterns (34a, 34b). The winding conductor patterns (34a, 34b) have ends in which terminal pads (35, 36) are formed and to which a connecting part (37) is not connected, respectively. The terminal pads (35, 36) are electrically connected to each other via the electronic part module (32). The electronic part holding film (30) is folded at a folding position (38). In this way, a thin IC tag (20) is manufactured. According to the thin IC tag (20), it is possible to provide a thin IC tag which does not increase the number of manufacturing steps and the manufacturing cost and on which an electronic part and the like can be mounted with ease.

A method is provided for enhancing the bond between the polarizable electrode layer and the undercoat layer. The method includes a first step for forming an undercoat layer on a collector and a second step for forming a polarizable electrode layer on said undercoat layer. The first step is performed by coating said collector with a coating solution for the undercoat layer that includes electroconductive particles, a first binder, and a first solvent. The second step is performed by coating said undercoat layer with a coating solution for the polarizable electrode layer that includes porous particles, a second binder, and a second solvent. The first solvent can dissolve or disperse said first and second binders. The second solvent can dissolve or disperse said first and second binders. The fusion of the interface between the undercoat layer and the polarizable electrode layer enhances the bond therebetween.

The invention discloses a preparation method of a local binderless reinforce panel. The preparation method comprises the steps of I, punching a product hole and a base material positioning hole in a base material by utilizing a base material punching die; II, punching an avoiding area and a rubber material positioning hole in a rubber material by utilizing a rubber material punching die; III, centering the punched basal material and the rubber material through a coating guide rod; IV, laminating the centered basal material and the rubber material through a positioning laminating mechanism; V, centering the laminated basal material and the rubber material to a semi-finished product through a centering rod of a forming mechanism; VI, finally placing the semi-finished product into a forming mechanism to be molded in a punching manner so as to form a local binderless reinforce panel. By utilizing the method, the local binderless reinforce panel with precise position and different shapes can be obtained; moreover, continuity in operation can be realized, a foundation is set for realizing the high-quality flexible plate, and the high productivity is greatly improved.

An embedded chip semiconductor has a substrate, at least one chip, an encapsulant, two circuit patterns and multiple contact vias. The substrate has a top surface, a bottom surface and at least one chip recess. The at least one chip has multiple terminals and is mounted in a corresponding chip recess. The thickness of the chip is equal to or less than the thickness of the substrate. The encapsulant is formed in the chip recess to hold the chip. The circuit patterns are respectively formed on the top and bottom surfaces of the substrate and one of the circuit patterns is connected to the multiple terminals of the chip. The two circuit patterns on two surfaces of the substrate are connected through the multiple contact vias. Therefore, the semiconductor has dual electronic connection faces to be suitable for different applications.

A light-emitting diode array comprising a conductive layer formed on a substrate, separate light-emitting portions formed on the conductive layer, a first electrode formed on at least part of an upper surface of each light-emitting portion, and a second electrode formed on the conductive layer adjacent to the light-emitting portions; the first electrode comprising a common switching electrode matrix; the second electrode comprising a common electrode divided such that one second electrode exists in every block; and at least one of bonding pads extending to the first common electrode and the second common electrode being formed on a bonding portion formed on the conductive layer like an island, whereby the bonding pads are separate from each other.

The invention relates to a method for thinning a flat glass substrate and a device thereof. First, etching liquor is mixed and processed of temperature treatment in a reagent preparation trough; the prepared etching liquor is quickly pumped into an etching trough. The glass substrate is placed into the etching trough and is etched by adopting a self-circulation way of bubbling and etching. After being etched, the glass substrate is taken out and the etching liquor is quickly poured into a temporary storage trough for a temporary storage and a precipitation. The etching liquor can be re-prepared and reused when the glass substrate is etched next time. The etched and thinned glass substrate is cleaned, dried and polished. The invention provides the method for thinning the flat glass substrate and a device thereof. By adopting the etching method of reagent circulation and bubbling, the aim of batch production can be received, thus supplying a thin glass substrate product and improving the good product rate and production quantity.

In detectors for imaging and other applications, delay line anodes are arrayed so as to allow detection of the location and/or timing of particle hits. The anodes are arrayed to provide an upper anode and one or more lower anodes, with particles incident on the upper anode passing in turn to the lower anodes. The anode arrays allow the use of identically manufactured anodes which are maintained in parallel spaced relation along the travel path of the particles of interest without dielectric material or other structure situated between the anodes. The spacing between the anodes is preferably adjustable so as to allow the installer and/or user to modify the performance characteristics of the array. The anodes may be made of pre-formed metal foil signal and ground layers laminated onto opposing sides of a dielectric sheet, or may be etched or otherwise formed from flex circuit material, so that the anodes and the overall array are light weight, compact, and flexible.