2091results about "Laminated elements" patented technology

The invention belongs to the technical field of power station boiler waste heat recycling energy-saving equipment and relates to a plate-and-shell type coal economizer. The plate-and-shell type coal economizer comprises a corrugated plate heat exchange core body (1), a heat exchanger shell (2), a first and a second water inlet / outlet water tank (3, 3') and a first and a second exhaust gas inlet / outlet pipeline (4, 4'), wherein the corrugated plate heat exchange core body (1) is mounted in the heat exchanger shell (2), the first and second water inlet / outlet water tanks (3, 3') are respectively arranged at the upper and lower ends of the front side of the corrugated plate heat exchange core body (1), and the first and second exhaust gas inlet / outlet pipelines (4, 4') are respectively arranged at the upper and lower sides of the corrugated plate heat exchange core body (1). The plate-and-shell type coal economizer solves the problem that the length of a water passage needs to be increased to solve the problem of unapparent water heating due to the great difference between an exhaust gas density and a water density, and meanwhile, a corrugated passage at the exhaust gas side enables the exhaust gas flow turbulivity to be increased and the heat transfer efficiency to be improved; the blockage due to ash accumulation happens rarely, even if the ash is accumulated, the cleaning is easy to finish.

A liquid cooled heat exchanger includes first and second heat exchange chambers that are in thermal communication. The first heat exchange chamber is downstream of the second heat exchanges chamber and receives heat from a heat generating device, such as an electronic circuit. Heat in the first heat exchange chamber can be transferred to the second heat exchange chamber to increase the temperature of a subcooled liquid working fluid in the second heat exchange chamber. This can render a pressure drop across the heat exchanger that is relatively insensitive to a fraction of liquid that is vaporized in the first heat exchange chamber.

The invention relates to the field of petrochemical equipment, and discloses a cobweb-shaped oil-water emulsification turbulator with turbulent flow fins, which comprises an oil-water emulsification pipe, a cobweb-shaped turbulator arranged in the oil-water emulsification pipe, and annular fins and bent fins fixed on the inner side of the pipe wall of the oil-water emulsification pipe, the annular fins and the bent fins are distributed in the axial direction of the oil-water emulsification pipe, the bent fins are arranged close to the cobweb-shaped spoiler, and a gap for fluid circulation is formed between the bent fins and the cobweb-shaped spoiler. A multi-scale composite turbulent flow field is constructed through cooperative cooperation of the annular fins, the bent fins and the cobweb-shaped spoilers, the annular fins can effectively damage a boundary layer of a pipe wall and enhance local shear force, so that oil drops leaning against the wall are separated from the pipe wall and guided to a central area of a pipeline, and the bent fins further guide fluid to deviate towards the center so as to reduce flowing dead zones. The net-shaped structure of the cobweb-shaped spoiler is used for continuously stretching, shearing and secondarily crushing oil drops, and the oil-water mixing uniformity and the emulsifying efficiency are remarkably improved under the combined action of the three parts.

The invention provides a plate heat exchanger which is characterized in that a first plate sheet comprises a first trough and a second trough which are adjacent, the first trough and the second trough are sunken downwards relative to the same reference plane P1, and the depth of the first trough is larger than that of the second trough; the second plate sheet comprises a first wave crest and a second wave crest which are adjacent, the first wave crest and the second wave crest protrude upwards relative to the same reference plane P2, and the height of the first wave crest is larger than that of the second wave crest; the first wave crest and the first wave trough are mutually contacted and fixedly welded; the second wave crest is at least partially opposite to the second wave trough, and the height of the second wave crest is unequal to the depth of the second wave trough. According to the plate heat exchanger, through the structural design, the surfaces of the two heat exchange plates forming the inter-plate flow channel have different flow resistances, and flow channels with asymmetric sections are formed between the plates, so that the turbulence degree is larger when fluid flows through, and the heat exchange performance of the heat exchanger is improved.

A heat exchanger according to the present invention includes plates each having, at one side thereof, an inlet port into which a fluid is introduced, and a first junction port having a periphery protruding upward, and having, at the other side thereof, an outlet port from which the fluid is discharged, and a second junction port having a periphery protruding upward, and a heat dissipation fin seated on an upper surface of the plate and having at least one non-heat dissipation fin portion formed by cutting a predetermined region of the heat dissipation fin in a direction parallel to a direction from one side to the other of the plate, in which the heat dissipation fin may be inserted between the pair of stacked plates.

The present invention relates to a heat exchanger assembly and a water heater comprising same, wherein the heat exchanger assembly comprises a heat exchanger unit provided with an inlet for introducing a fluid and an outlet for discharging the fluid, and the heat exchanger unit may comprise: a first plate; a second plate disposed on one surface side of the first plate to define, together with the first plate, an internal space in which the fluid introduced through the inlet moves toward the outlet; a heat generation member coupled to at least one of the first plate and the second plate and provided to provide heat into the internal space; and a guide part disposed in the internal space and provided to guide the fluid introduced through the inlet toward one plate, to which the heat generation member is coupled, of the first plate and the second plate.

A heat exchanger for a turbomachine of an aircraft, the heat exchanger having a plurality of fins intended to be swept by a first fluid in a first direction, the fins extending in a second direction between a first panel and a second panel, being arranged in several rows in a third direction, and being arranged in a staggered manner, each row of fins being parallel and connected to one another. The heat exchanger can be annular, centered on the third direction and can have an inner cylindrical surface defining an inlet and an outer cylindrical surface defining an outlet, and the fins can have a length which decreases radially in the heat exchanger, in the first direction, between the inner cylindrical surface and the outer cylindrical surface.

A heat exchanger with a heat-exchanging portion is electrochemically deposited onto a base (for thermal coupling to a heat source) or directly on the heat source. The heat-exchanging portion comprises extensions that define openings (e.g., channels) for passing heat transfer fluid through the heat exchanger. The geometry of these c and / or openings varies throughout the exchange to achieve different unit-area thermal conductivities for at least two different portions of the heat-receiving surface. For example, the thickness, height, spacing, shape, and / or materials of the heat-exchanging extensions may be selected to achieve the desired heat transfer at each zone. This variability in unit-area thermal conductivities may be used to accommodate for “hot spots”, heating of the heat transfer fluid, fluid dynamics, and other factors associated with the heat exchanger operation. Electrochemical additive manufacturing (ECAM) is used to fabricate at least heat-exchanging extensions thereby enabling precise and zone-specific thermal transfer characteristics.

The invention relates to a compartment designed to receive a part capable of giving off heat during its operation, in particular the part being an electrochemical energy storage module. The compartment includes a lid, a tray provided with a bottom wall on which the part can be placed, and a side wall designed to be assembled with the lid that closes the tray, the bottom wall and the side wall being in a single piece. The compartment further includes an outer plate which is designed to be assembled on an outer assembly face of the tray or of the lid, in order to form at least one flow channel for a heat transfer fluid.

The disclosure relates to a plate heat exchanger comprising: a package of heat exchanger plates, each having a peripheral portion and several port portions with through flow ports communicating with flow passages between adjacent heat exchanger plates. First guiding ribs are arranged in the port portions, which first guiding ribs in every other flow passage between the heat exchanger plates are configured to guide and distribute the first heat exchange medium from a first inlet channel to a heat exchange portion and from the heat exchange portion to a first outlet channel, and in that second guiding ribs are arranged in the port portions, which second guiding ribs in the remaining flow passages between the heat exchanger plates are configured to guide and distribute a second heat exchange medium from a second inlet channel to the heat exchange portion and from the heat exchange portion to a second outlet channel.

To provide a heat sink with excellent thermal connectivity between a base and heat dissipating fins, and also with excellent flexibility in the arrangement of heat-conductive members.SOLUTION: A heat sink has a base portion having a first surface and a second surface opposite the first surface, and to which a heating element is thermally connected to the second surface, and a heat radiation fin erected on said first surface of the base portion, and the base portion and the heat radiation fin are integrally molded into the heat sink, and at least a portion of a heat conductive member is embedded in the heat sink.SELECTED DRAWING: Figure 1

Device for containing liquid, of the type container or circulation circuit, and methods of manufacturing this device. The invention relates to a device (1) for containing liquid, of the type container or thermal regulation circuit with heat transfer fluid, comprising at least one metal wall (2) which has openings (3, 3') for the passage of the liquid through said wall (2), a supply or discharge pipette (4, 4') being present on the external face of said wall (2), at the level of each opening (3, 3') and being connected in a hermetic manner to the opening (3, 3') concerned.Device (1) characterized in that each pipette (4, 4') is a pipette made of thermoplastic material, attached exclusively indirectly to the metal wall (2), around the relevant opening (3, 3'), through an intermediate metal piece (5), assembled directly with the outer face of said metal wall (2), and / or, through an intermediate piece or layer made of thermoplastic material (5'), attached by welding or overmolding onto the outer face (2') of said metal wall (2) or onto an intermediate metal piece (5) assembled directly with said outer face (2') of the metal wall (2). Figure to be published with the abbreviation: Fig. 5A.

The invention relates to a device for thermal regulation of at least one electronic component, including at least two circulation conduits of a heat transfer fluid, arranged along a stacking axis, and at least one heat transfer fluid manifold in fluidic communication with the circulation conduits. The heat transfer fluid manifold includes at least two fluidic connection portions, respectively assembled at one end of a corresponding circulation conduit and having, respectively, at least one collar bordering an orifice, and at least one hollow connector interposed between two fluidic connection portions along the stacking axis, and having two opposite end sections, slidably mounted inside the collars of two facing fluidic connection portions.

A cooling assembly for liquid cooling of a heat-generating component such as a dual in-line memory module (DIMM) in a computer device is disclosed. The cooling assembly includes a bracket holding a micro-pipe assembly. The micro-pipe assembly has a cold manifold, a hot manifold and a series of micro-pipes. The micro-pipes are fluidly coupled between the cold manifold and hot manifold to allow coolant flow between the cold manifold and the hot manifold. The bracket positions the micro-pipe assembly such that micro-pipes are positioned proximate to opposite sides of the heat-generating component. A coolant inlet supplies coolant to the cold manifold and a coolant outlet collecting coolant from the hot manifold.

Embodiments of this application relate to the field of electronic device technologies, and provide a vapor chamber and an electronic device. The vapor chamber includes: a housing, where the housing includes a first cover plate and a second cover plate, the first cover plate is connected to the second cover plate to enclose a closed cavity, and the cavity is provided with a cooling medium; a capillarity structure, disposed in the cavity; and a heat dissipation structure, disposed in an inner surface of the cavity, where the heat dissipation structure includes at least one structure of a protrusion and a groove. The vapor chamber and electronic device provided in embodiments of this application have good heat dissipation performance.

The present invention relates to a cooling fin arrangement (1) of a cooler, through which fluid can flow, for cooling power electronics (200). The cooling fin arrangement (1) comprises at least one cooling fin (10), which is formed from a wave profile that periodically repeats in a direction of repetition (501), the direction of repetition (501) being perpendicular to a flow direction (500). The invention also relates to a cooler, through which fluid can flow, for cooling power electronics (200), the cooler comprising a cooling fin arrangement (1) of this type, and to a power electronic assembly (1000), comprising power electronics (200) and a cooler (100) of this type, through which fluid can flow.

A heat dissipation device for use in a semiconductor technology system, comprising a surface component (31) and a heat sink (63) connected to the surface component (31). The surface component (31) is designed to reduce heat transfer from a heat source (22) located on one side of the surface component (31) to a region of the semiconductor technology system located on the other side of the surface component (31). According to the invention, the surface component (31) has at least one thermally conductive layer (62) extending along the surface component (31) made of a material with anisotropic thermal conductivity, wherein the anisotropic thermal conductivity along a surface extension of the thermally conductive layer (62) is more than 10 times greater than along a direction perpendicular to the surface extension, and wherein the thermally conductive layer (62) is vacuum-tightly shielded from the surroundings of the surface component (31).The heat dissipation device enables very effective thermal shielding of the heat source, especially when limited installation space is available.

The device comprises a connecting box body, a heat exchange plate spacing adjustable structure and a swing flushing structure are arranged in the box body, the end face of the box body is connected with a water pump, the side wall of the box body is connected with a controller, a water outlet pipe is arranged at the bottom of the box body, and the water pump and two motors are electrically connected with the controller. The heat exchange plate spacing adjustable structure drives a lead screw, a sliding block, a pull rod and the like to perform transmission through a driving motor, so that the movable heat exchange plates are clamped or uniformly separated; the swing flushing structure drives a gear to transmit through a rotating motor, so that a cleaning nozzle swings back and forth between heat exchange plates and cooperates with a water pump to spray water for flushing. The method comprises the steps that the driving motor is controlled to separate the heat exchange plates, the rotating motor is started to drive the nozzles to swing, the water pump is started to wash the plugs, and finally the driving motor clamps the heat exchange plates for sealing. Spacing adjustment and automatic cleaning are achieved without disassembly, the problems that an existing device is tedious in operation and wastes time and labor are solved, the heat exchange efficiency and use convenience are improved, waste heat is effectively recycled, and energy waste is reduced.

A one-piece formed metal heat dissipation plate includes a substrate and multiple heat dissipation strips arranged in a longitudinal direction. The substrate includes a first surface and a second surface arranged opposite to each other. Each of the heat dissipation strips includes two connection ends connected to the first surface, at least two ridge portions arranged between the two connection ends, and multiple concave-convex tooth portions formed on at least one side of at least one of the ridge portions. A cut slot is defined in the substrate corresponding to the at least two ridge portions of each heat dissipation strip, and the cut slot penetrates the first surface and the second surface.

The invention relates to the technical field of heat exchangers, and particularly discloses a self-adaptive heat exchanger based on non-uniform heat exchange plates, which comprises a front pressing plate and a rear pressing plate, a plurality of heat exchange plates are stacked between the front pressing plate and the rear pressing plate, each heat exchange plate comprises a first heat exchange surface and a second heat exchange surface which are oppositely arranged, and a sealing assembly is arranged between any two heat exchange plates. The sealing assembly comprises an external sealing ring and an internal sealing strip, the external sealing ring is located on the edge of the first heat exchange face, the first heat exchange face comprises a circulation heat exchange area, two corner hole isolation areas and two corner hole circulation areas, and the internal sealing strip is only arranged on the two corner hole isolation areas. Internal sealing strips of the front heat exchange plate and the rear heat exchange plate in every two adjacent heat exchange plates are arranged at intervals in a staggered mode, a plurality of heat exchange hinges which are arranged from dense to sparse in the flowing direction are arranged in the circulation heat exchange area, and reset assemblies are arranged in the heat exchange hinges. The heat exchanger is good in comprehensive performance and can stably operate under variable working conditions, and reasonable matching between heat transfer and resistance is achieved.

A heat exchange assembly comprising: (I) two or more panels; (II) a plurality of channels formed between the two or more panels; and (III) one or more reservoirs located adjacent to the plurality of channels and configured to at least temporarily store a temperature control material, wherein the plurality of channels are configured to direct a flow path of the temperature control material between the two or more panels and provide structural rigidity to the assembly.

The present invention relates to the technical field of temperature equalizing heat dissipation, and in particular to a temperature equalizing heat dissipation apparatus and a manufacturing method and design method therefor, a storage medium, and an electronic device. The temperature equalizing heat dissipation apparatus comprises a heat dissipation substrate; the upper surface and the lower surface of the heat dissipation substrate are a heat source surface and a heat dissipation surface, respectively; a phase change cavity is formed in the heat dissipation substrate by means of drilling; and the phase change cavity is parallel to the heat source surface and the heat dissipation surface.

This invention discloses a heat dissipation fin, a thermosiphon radiator, and a multi-dimensional heat dissipation device, relating to the field of electronic heat dissipation technology. The heat dissipation fin includes: a shell, an air inlet and a liquid outlet disposed on the shell, and a gas-liquid cavity disposed within the shell; wherein: the air inlet connects the gas-liquid cavity to a receiving cavity within the heat dissipation substrate of the thermosiphon radiator; the liquid outlet connects the gas-liquid cavity and the receiving cavity; the height of the air inlet in the vertical direction is higher than the height of the liquid outlet; the gas-liquid cavity includes: a first guide portion for guiding gas flow and communicating with the air inlet; a second guide portion for guiding liquid flow and communicating with the liquid outlet; and a connecting portion communicating with both the first and second guide portions; the angles between the first guide portion and the connecting portion, and between the connecting portion and the second guide portion, are both obtuse angles. This invention can improve the problem of poor working fluid flow in the prior art and can improve the heat dissipation performance of the radiator.

The invention provides a pin-fin design method in a heat exchanger, the heat exchanger and a heat exchanger design method, and aims to solve the problem of insufficient heat exchange performance caused by the fact that pin-fin design cannot meet actual requirements in the prior art. The design method for the pin fins in the heat exchanger comprises the steps that the design boundary domain and design constraints of the pin fins are determined; based on the design boundary domain and the design constraint, designing a pin fin according to a super elliptic function and a cubic Bezier curve, and constructing a pin fin sample library; the cross section contour shape and the bottom surface size of the pin fin are limited by the super elliptic function, and the side contour of the pin fin is limited by the cubic Bezier curve; and the performance of different pin fin designs in the pin fin sample library is analyzed through simulation, and the pin fin design meeting the target performance is selected. According to the method, a continuously adjustable three-dimensional pin-fin structure is constructed based on a mathematical description controllable super ellipse and Bezier curve configuration method, the heat dissipation requirement of a high-heat-flux electronic device can be effectively met, and the method is an important supplement and breakthrough for the prior art.

The invention relates to a runner plate assembly and a heat exchanger, and belongs to the technical field of sewage treatment.The runner plate assembly comprises heat transfer plates, a plurality of runners are separated between the two heat transfer plates through a plurality of partition plates, at least one heat transfer plate is provided with a plurality of discontinuous through grooves, and discontinuous protrusions are arranged on the contact faces of the partition plates and the heat transfer plates; the intermittent protrusions are arranged in the intermittent through grooves. By arranging a matching structure of the intermittent through grooves and the intermittent protrusions, the connecting strength and the sealing performance between the partition plate and the heat transfer plate are effectively enhanced, meanwhile, stress concentration is reduced, and the pressure resistance and the temperature resistance of the heat exchanger are improved; the intermittent design facilitates machining and assembling, welding deformation is reduced, and production efficiency is improved.

A thermopneumatic interface includes one or more pneumatic inlet ports in fluid communication with one or more pneumatic outlet ports and a cooling loop extending through the thermopneumatic interface. The cooling loop is configured to maintain the thermopneumatic interface at a baseline temperature. The one or more pneumatic outlet ports are configured to contact a surface of a microfluidic chip. Each pneumatic inlet port is configured to receive a change in pressure and provide the change in pressure to a corresponding pneumatic outlet port. The thermopneumatic interface is configured to maintain the microfluidic chip at the baseline temperature.

The utility model discloses a heat exchange assembly which comprises a heat exchange body, the heat exchange body comprises at least one waste gas outlet, a waste gas inlet, a fresh air inlet and a fresh air outlet, the heat exchange body comprises a plurality of heat exchange plates, the heat exchange plates are arranged in parallel, a waste gas channel is formed between every two adjacent heat exchange plates, and each heat exchange plate comprises a heat exchange part. The heat exchange part is a channel provided with a plurality of bends, the waste gas channel correspondingly forms a channel provided with a plurality of bends, the waste gas outlet communicates with the waste gas inlet, the fresh air inlet communicates with the fresh air outlet, fresh air flows through the interior of the heat exchange plate, and waste gas flows through the waste gas channel. The heat exchange part in the heat exchange plate is the bent channel, so that the flow speed of a medium between the heat exchange part and the adjacent heat exchange part can be slowed down, the heat exchange time of the medium inside and outside the medium heat exchange plate can be prolonged, and the heat exchange efficiency and the energy utilization rate are improved.

The invention relates to a non-uniform heat sink fin geometry for improved thermal performance. According to various embodiments, a heat sink includes a plurality of cooling fins, in which a first cooling fin included in the plurality of cooling fins includes a first portion having a first height and includes a second portion having a second height less than the first height, and wherein the first height and the second height are defined in a direction parallel to a direction in which cooling air flows through the plurality of cooling fins.

Systems and methods for thermal management using matrix coldplates are disclosed. One illustrative method may comprise directing a flow of coolant through a coldplate comprising a plurality of parallel passages by selectively connecting portions of the parallel passages to one another to create one or more regions of parallel flow, serial flow, or blocked flow in the coldplate. Selectively connecting portions of the parallel passages may comprise machining a plurality of transverse passages into the cold plate such that each of the transverse passages intersects at least some of the parallel passages. Valves may be installed to interact between the parallel and transverse passages to create and modify the different flow regions.