Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

1558 results about "Laser etching" patented technology

Fuel cell platelet separators having coordinate features

PCT No. PCT/US95/13325 Sec. 371 Date Sep. 28, 1997 Sec. 102(e) Date Sep. 28, 1997 PCT Filed Oct. 10, 1995 PCT Pub. No. WO96/12316 PCT Pub. Date Apr. 25, 1996Fuel cell stacks comprising stacked separator/membrane electrode assembly fuel cells in which the separators comprise a series of thin sheet platelets, having individually configured serpentine micro-channel reactant gas humidification active areas and cooling fields therein. The individual platelets are stacked with coordinate features aligned in contact with adjacent platelets and bonded to form a monolithic separator. Post-bonding processing includes passivation, such as nitriding. Preferred platelet material is 4-25 mil Ti, in which the features, serpentine channels, tabs, lands, vias, manifolds and holes, are formed by chemical and laser etching, cutting, pressing or embossing, with combinations of depth and through etching preferred. The platelet manufacturing process is continuous and fast. By employing CAD based platelet design and photolithography, rapid change in feature design can accommodate a wide range of thermal management and humidification techniques. One hundred H2-O2/PEM fuel cell stacks of this IFMT platelet design will exhibit outputs on the order of 0.75 kW/kg, some 3-6 times greater than the current graphite plate PEM stacks.
Owner:H POWER

Laser machining method and device applicable for complicated curved surface

The invention provides a laser machining method applicable for a complicated curved surface. By adopting processing steps of dividing the complicated curved surface into curved surface sheets and establishing a coordinate system of each curved surface sheet, the subsequent processing steps of dividing sub blocks and machining pattern parallel projection can be implemented according to the coordinates of the curved surface sheets respectively, so the limit that a machining molded surface backing to a laser incident direction or a steep surface parallel to an optical axis direction cannot be machined because only one coordinate system is adopted to perform whole injection in the prior art can be overcome, the machining efficiency is improved and the machining applicable range is extended. The invention also provides a laser machining device. The laser machining device has a three-axis laser machining head structure provided with a two-axis laser polarization mirror and a Z-axis mobile mechanism, so the problem that the conventional system depends on a three-axis lathe is solved; therefore, a machining unit is independent and compact, and is easy to assemble and disassemble; the conventional five-axis linkage milling machine can be changed into a laser-etching machining lathe so that the functions are compatible; and the laser machining device has a significant practical value.
Owner:武汉飞能达激光技术有限公司

Method for projection-type laser etching on free curved surface

The invention discloses a method for projection-type laser etching on a free curved surface. By combining a laser galvanometer as well as a triaxial coordinate positioning technology and adopting the principles of partitioned parallel projection as well as height mapping, the invention directly conducts precise surface laser etching on the basis of a discrete point cloud model of a free curved surface part. The method has the characteristic that the laser etching properties such as the shape and size of a spot and the energy distribution remain unchanged within the focal depth range of a focusing lens, so that the free curved surface is converted into a plurality of plane subblocks for processing, and the high-precision processing efficiency of the free curved surface can be improved even by adopting the existing laser etching technology. The diameter of the focusing spot of a laser beam can reach tens of microns and is much smaller than the size of the part processed by a traditional knife tool; and the processing precision of nearly 10 microns can be realized by controlling the laser energy property. Under the premise of meeting the demands for high precision and high efficiency of pattern etching on the free curved surface, the method can realize high reliability and high flexibility in the processing of the free curved surface.
Owner:武汉飞能达激光技术有限公司

Double-side etching high-temperature and high-pressure printed circuit board heat exchanger

The invention relates to a double-side etching high-temperature and high-pressure printed circuit board heat exchanger. The double-side etching high-temperature and high-pressure printed circuit board heat exchanger is composed of a heat exchanging core, a flow equalizing section, a hot fluid inlet and outlet port and a cold fluid inlet and outlet port. The core is divided into an inlet section, a core heat exchanging section and an outlet section. According to the heat exchanger, runners are machined in the double sides of heat exchanging plates with a certain thickness in a photochemistry manner, a laser etching manner, a machining manner and the like. The first heat exchanging plate and the second heat exchanging plate are arranged in a spaced manner. A fusion type channel novel structure is adopted in an inlet distribution section, and fluid in the heat exchanger can be easily distributed more evenly. The heat exchanging efficiency of the heat exchanger can be improved, the thermal stress damage at an existing channel sharp corner is effectively avoided, the circulation section area of the heat exchanger is increased, and the compactness of the heat exchanger is improved; thermal stress distribution at the sharp corner is improved, plastic deformation caused by stress concentration is avoided, and the even distribution of fluid in the heat exchanger is improved; and the safety performance of the heat exchanger is improved, and the service life of the heat exchanger is prolonged.
Owner:XI AN JIAOTONG UNIV

Heat activated applique with upper stretch fabric layer

ActiveUS20090280290A1Excellent heat activated appliquéEasy to cutDecorative surface effectsSynthetic resin layered productsYarnPolyester
The heat activated appliqué for providing in particular decorative elements providing contrast in texture or color including graphical images, logos, numbers and letters for apparel and other textile products, specifically but not limited to those made out of stretch fabrics (typically knit or woven fabrics) comprised of synthetic or natural fiber yarns constructed with spandex fibers and yarns. The appliqué includes an upper stretchable fabric layer bonded to a substrate by a thermoplastic adhesive. Preferably, the stretchable fabric layer is a knit or woven fabric comprised of at least 3% and preferably between 3% to 33% spandex and polyester or nylon threads and the thermoplastic adhesive is a urethane-based thermoplastic adhesive with suitable stretch and recovery characteristics. The appliqué can be layered to provide three-dimensional characteristics. The stretchable fabric layer can be embossed to provide surface characteristics to the heat activated appliqué, either prior to or during application. This is also suitable for applying additional indicia in the form of direct printing or sublimation dye heat transferred into the stretchable fabric layer.
The above appliqué may bear a combination of digitally-printed elements such as letters, logo graphics and numbers or other indicia, and may include a simulated embroidery-stitched appearance from either said printing or laser-etching or some combination of both, all in a form that is easily heat-sealed to a garment or other textile.
Owner:LION BROS CO INC

Machining device and machining method for enhancing sapphire laser back wet etching rate

ActiveCN103418912AEnhanced laser etch rateRealize the microstructureLaser beam welding apparatusSemiconductor devicesMicro structureLaser etching
The invention relates to a machining device and a machining method for enhancing a sapphire laser back wet etching rate. The machining device comprises a protection device, a laser beam, a lens assembly, a container and a limit layer, operating fluid is filled in a hollow cavity formed in the container, a workpiece is placed on the surface of the operating fluid and contacts with the operating fluid, the protection device is mounted at the top of the workpiece, the limit layer is mounted below the workpiece, and the laser beam irradiates the back of the workpiece through the lens assembly. The machining device has a high material removing rate under the condition of ensuring fine surface machining quality of sapphires. According to the machining method, chippings are easily taken away by the fluid, the heat effect of laser ablation is small, a regelation layer in a machining area is omitted, machining quality is fine, a laser-induced cavitation effect leads to a micro-jet enhancement effect, the laser etching rate of transparent materials such as the sapphires is enhanced, and micro-structures and shape cutting of material surfaces can be realized. The machining method is simple to operate, convenient, practical and high in machining speed.
Owner:GUANGDONG UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products