109 results about "Laser etching" patented technology

The present application relates to a kind of organic solar cell module and its preparation method.The organic solar cell module, in addition to deposit a conductive layer (1A,1B) on the first electrode layer, etching connection channel (P2) and partition channel (P3) on the conductive layer.Compared with prior art, the significant advantages of the present application are: when laser etching connection channel (P2) and partition channel (P3), it improves the fault tolerance of etching, both protects the first electrode layer, and makes each layer be etched completely, improves the performance of device.

The application discloses a kind of superfast laser processing system and method that can steplessly regulate the inclination of micro slot side wall, including laser, laser exit beam is divided into two beams after beam splitter, wherein beam 1 is parallel to Y axis, beam 2 is parallel to X axis;Beam is reflected after first mirror and exits parallel to Y axis;Two beams are vertically incident into double-beam adjustable tilt moving device, and after regulating light beam, respectively through second mirror, third mirror and through first convex lens, second convex lens, it converges in a certain angle and a certain interval on the surface of workpiece to be processed, and the workpiece to be processed is clamped on three-dimensional motion platform, and the focal point of two intersecting converging beams is relatively moved with workpiece to be processed, to realize the laser etching processing of surface micro slot;The application can regulate the inclination of two sides respectively to realize the efficient controllable processing of rectangular micro channel, other side wall inclination micro channel and even negative inclination micro channel.

The utility model discloses an embodiment relates to a kind of based on 6D magnetic levitation system's laser etching machine, and the utility model is driven by magnetic levitation transmission mechanism to carry out displacement mobile, and it is combined first laser etching area, second laser etching area, turnover area and detection area, and corresponding laser etching mechanism, turnover mechanism and detection mechanism, realize the high-precision transmission of electric core, double-sided laser etching and real-time detection, to solve the problem of low transmission accuracy, big mechanical impact and insufficient flexibility in the prior art, improve electric core transmission accuracy and stability, reduce mechanical impact, enhance production line flexibility.

A semiconductor package and a redistribution processing method including same are disclosed. The redistribution processing method according to one embodiment of the present disclosure may comprise the steps of: using a UV laser to drill a first metal layer provided on an insulating layer; using the UV laser to etch a portion of the insulating layer provided below the first metal layer; and using plasma to etch the remaining portion of the insulating layer.

The application provides a high-performance bulletproof ceramic and a preparation method thereof, and the method comprises the following steps: preparing a hard alloy coating on a metal transition layer on the surface of a ceramic base by using a supersonic flame spraying method; then, a plurality of blind hole grooves arranged in a matrix interval are opened on the surface of the hard alloy coating by using a laser etching method; then, the blind hole grooves are filled with soft metal by using the supersonic flame spraying method; after the upper surface of the soft metal in each blind hole groove is polished to be flush with the upper surface of the hard alloy coating, a hard ceramic coating is prepared on the upper surface of the hard alloy coating and the soft metal by using an atmospheric plasma spraying method. The soft metal filled in each blind hole groove of the hard alloy coating captures the broken ceramic to achieve a secondary anti-penetration effect, and the soft area formed by the soft metal and the hard area formed by the hard alloy coating make the bullet body bear uneven stress to achieve the effect of deflecting the penetration path.

The application discloses a high-adaptability feeding mechanism of a two-dimensional code automatic laser etching machine, and relates to the technical field of laser etching machines.The laser etching machine cabinet is internally provided with a conveying track, and a conveying mechanism cabinet is attached to one side of the laser etching machine cabinet.Through the attachment of the track plate, the limiting ring and the rubber belt, the rubber belt can serve as the extension end of the external conveying mechanism, and then be attached to the conveying track built-in the laser etching machine cabinet, thereby reducing the circuit board conveying fluctuation caused by the gap between the external conveying mechanism and the conveying track built-in the laser etching machine cabinet.The rubber belt, as a flexible transition connecting piece, can be closely attached to the internal and external conveying tracks, eliminate the mechanical gap, significantly reduce the vibration and displacement caused by the gap, ensure the stable transmission of the circuit board, and the deformable setting of the rubber belt can facilitate the adaptation of different specifications of laser etching machines, thereby improving the adaptability of the synchronous belt and the rubber belt as the external conveying mechanism.

This invention discloses a welding method, heat sink, and aircraft applicable to multi-layer precision structures, belonging to the field of aircraft welding technology. The welding method includes: depositing a solder film on a first substrate to obtain a substrate to be etched; optimizing the laser scanning path according to a preset precision structure and solder pattern; placing the substrate to be etched at the laser etching location and performing integrated scanning etching using a laser to complete the preparation of the solder pattern and precision structure, obtaining a first substrate to be welded; vertically aligning a first welding cover plate with the first substrate to be welded and performing interlayer welding of the precision structure; repeating the above process to complete the interlayer welding of the double-layer precision structure. This invention achieves precise preparation of solder for small-scale complex pattern welding points and integrated interlayer welding of multi-layer precision structures through laser etching, meeting the stringent requirements of the aerospace field for high airtightness, high sealing performance, and high-precision welding.

The present application provides a kind of ship hull barnacle protection net.The support layer of the protection net is nanofiber membrane with micron pit array formed by laser etching, the inside is attached to the adhesive made of modified dopamine-acrylate copolymer, nano-silica, calcium alginate microspheres, chitosan, chitin nanofiber, lanolin and antioxidant, and the outside is compounded with stainless steel wire mesh.The present application realizes long-term inhibition of barnacles through the physical barrier of the hydrophobic support layer and the synergistic effect of the antifouling components in the adhesive without adding toxic antifouling agents, and has the characteristics of firm bonding, excellent mechanical properties, environmental protection and non-toxicity, effectively solves the problems of poor antifouling effect, insufficient bonding reliability and poor environmental protection of existing protection materials, and is suitable for barnacle protection of underwater parts of ship hull.

The application discloses a MiniLED chromatic aberration suppression method based on a thermal balance packaging structure and a display device, relates to the technical field of semiconductor display, and comprises a composite substrate, a thermoelectric cooler (TEC) array, a MiniLED chip array, a phase change material layer and a dynamic temperature control system; the MiniLED chromatic aberration suppression display method based on the thermal balance packaging structure comprises the following steps: S1, preparing the composite substrate: adopting a copper-graphene composite material as the substrate, forming a microchannel with a width of 200 mu m and a depth of 150 mu m in the substrate by laser etching; S2, the thermoelectric cooler (TEC) array: distributing TEC units on the back of the substrate according to regions; S3, the die bonding process: using high-thermal-conductivity silver glue to fix the MiniLED chip, applying a 5N die bonding pressure and curing at 80 DEG C; S4, filling the phase change material, which is suitable for solving the chromatic aberration problem caused by uneven temperature distribution and realizing high-precision display control of chromatic aberration.

The utility model discloses a kind of three-dimensional interconnection structures based on wafer bump and gradient CTE transition, it is related to semiconductor packaging technical field, including hard board and chip, the trapezoidal cavity is formed by laser etching process to the hard board, and the bottom of shape cavity is formed by etching processing exhaust hole through hard board;The bottom of the chip is provided with flexible board, and the top of flexible board is formed with copper column bump by electroplating, the chip is connected with flexible board by copper column bump, the top of trapezoidal cavity is formed copper pad array by electroplating process;The utility model is etched cavity structure on hard board, chip flip chip is welded on copper bump array of flexible board, chip is embedded cavity after folding flexible board, it is applicable to Chiplet heterogenous integration, 2.5D / 3D packaging, high-frequency millimeter wave device etc. Scene, solve high-density wiring, thermal mechanical reliability and high-frequency signal transmission collaborative optimization problem of soft and hard board interconnection in semiconductor packaging.

The application relates to the technical field of semiconductor structure failure analysis, and discloses a chip opening method and clamp for a double-sided heat dissipation device with transfer molding and encapsulation, which comprises the following steps: adopting plane grinding on an upper lining plate until epoxy molding compound in the double-sided heat dissipation device with transfer molding and encapsulation appears; removing the epoxy molding compound in the double-sided heat dissipation device with transfer molding and encapsulation by adopting a laser etching gasification principle until bonding leads in the double-sided heat dissipation device with transfer molding and encapsulation appear; adopting a first mixed acid solution to perform chemical wet etching on the double-sided heat dissipation device with transfer molding and encapsulation until the bonding leads in the double-sided heat dissipation device with transfer molding and encapsulation are completely exposed; heating and remelting solder between a chip and a pad block, and removing the pad block; adopting a second mixed acid solution to perform chemical wet etching on the double-sided heat dissipation device with the removed pad block until the chip completely appears. The chip of the double-sided heat dissipation device with transfer molding and encapsulation is nondestructively opened, so that subsequent chip-level microscopic analysis is facilitated.

The present invention provides a fluororesin film capable of ensuring heat-resistant adhesion to a rubber layer, and a method for manufacturing a fluororesin film that can standardize the processing quality of laser etching. [Solution] The fluororesin film of the present invention is characterized by having a treated surface, wherein the ratio to untreated surface, represented by Formula 1, is 1.22 or more. The method for manufacturing the fluororesin film of the present invention comprises the step of forming a treated surface by laser etching the surface of a fluororesin film, wherein the ratio to untreated surface, represented by Formula 1, is 1.22 or more. [Equation 1]: Surface area after laser etching (m²) 2 ) / Surface area before laser etching (m²) 2 )

The application relates to the technical field of metal surface groove forming, in particular to a metal surface groove forming method for forming a groove with a set shape on a metal surface, which comprises the following steps: a laser works at a first parameter to perform laser etching on the metal surface, part of the material on the metal surface is removed to form a basic depth of the groove; the laser works at a second parameter to perform laser etching on the bottom of the groove, part of the material on the bottom of the groove is removed to process the groove to a set depth; the laser works at a third parameter to perform laser etching on the sidewall of the groove, and the protruding structure on the sidewall of the groove is removed; wherein the pulse width value in the first parameter is greater than the pulse width values in the second parameter and the third parameter. According to the technical scheme, the groove is formed through multi-step laser etching, the processing efficiency is guaranteed, and the perpendicularity, surface roughness, shape and position size precision and the like of the groove processing are guaranteed at the same time.

A laser-plasma synergistic surface treatment method for CFRP / titanium alloy heterojunctions belongs to the field of heteromaterial bonding technology. First, nanosecond pulsed lasers are used to etch the surfaces of CFRP and titanium alloy to be bonded, constructing a micro-nano composite structure. Then, atmospheric pressure cold plasma is used to activate the etched surfaces, grafting polar functional groups. Finally, the two are bonded and cured using an adhesive. This invention achieves a dual enhancement effect of "mechanical interlocking" and "chemical bonding" by organically combining "laser etching to construct micro-nano physical structures" and "plasma activation to introduce chemical functional groups," significantly improving the interfacial bonding strength of CFRP / titanium alloy heterojunctions. Compared with single treatment methods, this invention can increase the joint shear strength by more than 38%, and the failure mode changes from interfacial failure to cohesive failure. It has advantages such as environmentally friendly process, good controllability, and significant effects, and has broad application prospects in aerospace, high-end equipment manufacturing, and other fields.

The application discloses a preparation method of an underwater bubble micro-reactor with a fixed-point reaction capability, and belongs to the field of underwater gas micro-reaction controller preparation methods. First, a laser marking machine is used to etch a hollow pattern on a pure zinc sheet as a mask, and the mask obtained through laser etching is attached to a substrate by double-sided adhesive tape. Then, polydimethylsiloxane, a curing agent and hydrophobic silicon dioxide are added to n-hexane and uniformly mixed to obtain a spraying liquid. The spraying liquid is sprayed onto the substrate covered with the mask. The sprayed substrate is placed in an oven for curing. After curing, the mask is removed, and an underwater bubble micro-reactor containing a gas-permeable pattern is obtained. The underwater bubble micro-reactor can achieve good control over underwater micro-reactions. The bubbles act as a protective "shell" to prevent the internal detection liquid drops from being polluted and evaporated. The laser etching and simple spraying technology can be combined to realize large-scale preparation and popularization.

The application provides a laser etching device and method, relates to the technical field of laser processing, and the device comprises a pulse laser device and a base for carrying a battery. The pulse laser device is used for emitting a plurality of laser sub-beams towards the battery. The surface of the battery has at least one electrode line preset area. After the plurality of laser sub-beams are emitted, a plurality of focused light spots are formed in the same electrode line preset area. The plurality of focused light spots are spaced apart from each other. The pulse laser device is used for controlling the plurality of focused light spots to scan the battery along the same electrode line preset area. The arrangement direction of at least two focused light spots in the plurality of focused light spots is arranged at an acute angle with the scanning direction of the plurality of focused light spots. When the plurality of focused light spots satisfying the above conditions are used to perform laser etching on the same electrode line preset area, the spacing between adjacent etching holes is increased, the etching width is optimized, the seed crystal area is increased, the series resistance is reduced, the fill factor is improved, and the photoelectric conversion efficiency is improved.

The application relates to a device and a method for dynamically-chemically-liquid-assisted femtosecond laser etching of a silicon carbide wafer, which comprises a laser, a working tank, a moving assembly and a liquid storage tank with a water pump installed therein, the focal point of the laser is perpendicular to and directly opposite to the working tank used for placing the silicon carbide wafer, the working tank is a hollow opening structure, the silicon carbide wafer is used to be placed in the working tank and has an optical lens above the silicon carbide wafer; the liquid storage tank has a liquid outlet pipe on one side and a liquid return pipe on the other side, the liquid outlet pipe and the liquid return pipe are both in communication with the working tank above the liquid storage tank, the liquid outlet pipe, the liquid return pipe and the water pump in the liquid storage tank enable the chemical liquid to realize external dynamic circulation and form a water film between the optical lens and the silicon carbide wafer at the same time; the laser is connected with an optical fiber, a laser beam passes through the optical lens and is coupled with the chemical liquid to act on the surface of the silicon carbide wafer to realize laser etching, and the processing rate is ensured while the yield of the silicon carbide wafer is ensured.

The invention discloses a TBC battery and a preparation method thereof, and belongs to the technical field of solar photovoltaic batteries. The preparation method comprises the following steps: depositing a tunneling layer and a polycrystalline silicon layer on the back surface of an alkali-polished N-type silicon-based substrate; carrying out boron doping and high-temperature oxidation to form a borosilicate glass layer; performing laser etching to form a P-type doped region and an etching region; carrying out alkali washing on the etching region, and depositing a tunneling oxide layer and a phosphorus-doped N-type doping layer; performing crystallization treatment; borosilicate glass layer cleaning is carried out on the P-type doped region, winding plating is carried out on the front surface, and alkali texturing is completed; and depositing an AlOx layer and a SiNx layer on the back surface and the front surface of the product. According to the method, the technological process is simple, compared with the mode that a PVD precise direction coating mode is adopted in the market to achieve isolation of the PN area, one picosecond laser etching procedure can be omitted, the equipment investment can be obviously reduced, the production efficiency can be improved, and the TOPCon technology of an existing PVD route can be upgraded to the TBC technology.

The utility model discloses a kind of shell piece laser etching positioning clamps, it includes clamp base, clamp cover, clamp base interior has base inner cavity, clamp base outer surface is equipped with pipe joint, the upper surface of clamp base is provided with several suction holes respectively with base inner cavity intercommunication;The upper surface of clamp base is provided with profiled mold core, the upper surface of profiled mold core is profiled curved surface, several suction holes are respectively located profiled curved surface of profiled mold core;Clamp base is equipped with positioning block on the two sides opposite profiled mold core respectively, each positioning block is equipped with cover plate positioning pin protruding on the upper surface of corresponding positioning block;Clamp cover is respectively provided with vertical through cover plate positioning hole corresponding each cover plate positioning pin, clamp cover is provided with vertical through and shape and shell piece contour shape are adapted cover plate clearance hole. Through the above structural design, the utility model has the advantages of novel structure design, high positioning accuracy, and can be effectively applied to curved surface shell piece laser etching positioning.

This invention provides a physical simulation device and method for developing high-temperature and ultra-high-pressure fractured-vuggy oil and gas reservoirs. By setting an asymmetrical combination of a central hole and an eccentric hole on the end face of the first probe, combined with a closed rubber sleeve structure, it achieves a realistic simulation of the eccentric contact state between the wellbore and the fractured-vuggy body, avoiding the problem of artificially high recovery rates caused by traditional end-face opening methods. Simultaneously, the use of a rubber sleeve made of high-temperature and high-pressure resistant composite material and a multi-seal structure, along with independent control of axial pressure and confining pressure, ensures stable operation of the device under ultra-high temperature and ultra-high pressure conditions. Furthermore, by combining laser etching fractured-vuggy core fabrication technology with a multi-pore combination development scheme, it can flexibly simulate various development modes such as depletion development, huff-and-puff production, and displacement development, providing a reliable experimental platform for studying the development laws of fractured-vuggy oil and gas reservoirs. This significantly improves the matching degree between physical simulation results and actual field conditions, and has strong engineering application value.

This invention relates to the field of heavy metal pollution remediation in soil, and discloses a method for remediating heavy metal contaminated soil based on biochar loading technology. The method involves constructing a helical chiral topological structure of biochar through femtosecond laser etching and loading a composite layer of CdS quantum dots and graphene oxide to enhance the selective adsorption and photocatalytic reduction capabilities of heavy metals. Combined with magnetic field-responsive microcapsules that dynamically release remediation agents, reinforcement learning algorithms are used to optimize multi-physics parameters, achieving precise control over the migration, transformation, and fixation of heavy metals. An ultraviolet light-triggered self-healing mechanism is introduced to repair microcapsule damage, and pyrolysis oxidation and acid leaching processes are simultaneously employed to recover heavy metals and regenerate biochar. This invention overcomes the shortcomings of traditional technologies, such as poor material selectivity, uncontrollable release, and non-recyclability, achieving efficient targeted remediation and resource recovery.

The application relates to the technical field of yoga mat processing, and discloses a laser etching equipment based on yoga mat processing, which comprises a workbench and a laser device arranged on the top of the workbench, and further comprises a first pressing roller arranged at one end of the workbench and used for pressing and fixing one end of the placed yoga mat; the problems that the yoga mat is prone to wrinkle and bulge during processing, the positioning and fixing effect is poor, the surface impurities are not completely cleaned, the etching quality is affected, the etching lines are easily damaged due to the differential cleaning before and after processing, the cleaning parts need to be frequently stopped for cleaning, the degree of automation is low, and the overall processing efficiency is low are solved, the yoga mat is self-adaptively rolled, laid, pressed, and double-precisely positioned in a negative pressure mode, two cleaning modes of front-mounted impurity removal and rear-mounted impurity removal can be switched, impurity adsorption, rotation operation and centralized collection can be automatically completed, and the laser etching uniformity and the product quality are effectively guaranteed.

The utility model discloses a kind of based on robot automatic laser etching production line, it is related to connector production technical field, including feeding mechanism, laser etching workstation, rotary drive mechanism, laser generator, conveying belt and industrial robot.Feeding mechanism has feeding height adjusting mechanism, linear drive module and fixture, feeding height adjusting mechanism adopts electric screw rod lifting device, can accurately adjust connector height to industrial robot clamping position;Linear drive module drives fixture to convey connector.Rotary drive mechanism drives connector rotation, and laser generator emits laser and etches specification parameter on connector surface.Industrial robot drive end is equipped with two groups of pneumatic clamps, for transferring connector.After laser etching is completed, conveying belt transports finished product connector to next process.This production line is high in degree of automation, can greatly improve production efficiency, ensure laser etching quality stability and consistency, reduce artificial cost and labor intensity.

This application discloses a method for preparing a dicing blade and the dicing blade itself. The method includes parametric design of the dicing blade body and microstructure to obtain dicing blade parameters; designing a dicing blade model based on the dicing blade parameters; preparing a photocurable printing paste; adding the photocurable printing paste to a photocurable 3D printing device and importing the dicing blade model file into the photocurable 3D printing device, whereby the microstructure is formed on the surface of the dicing blade body to obtain a dicing blade blank; and densifying the dicing blade blank to obtain the dicing blade. This application eliminates the need for secondary processing via laser etching or mechanical grinding, preventing breakage due to insufficient blade strength during dicing; ensuring that the cooling medium fully acts on the grinding core area to reduce processing temperature and improve cooling and utilization efficiency; avoiding grinding force fluctuations caused by intermittent machining of the toothed cutting edge; and improving the dicing accuracy and surface quality of multilayer composite chip chips to meet the requirements of high-precision dicing processing.

The application relates to a hydraulic cylinder part high-sealing protective coating and a protective treatment method thereof, and comprises the following steps: S1, a metal ceramic coating is prepared on the surface of a part by adopting a supersonic flame spraying method, and a first-stage workpiece is obtained; S2, laser micro-melting interface activation treatment is carried out, a metal bonding phase is selectively micro-melted, the surface of the metal ceramic coating is smelted into a metallurgical bonding metal base surface, and a second-stage workpiece is obtained; S3, a high-entropy alloy is sprayed by adopting a high-pressure cold spraying method, the high-entropy alloy is metallurgically combined on the surface of the second-stage workpiece to form a plugging layer, and a third-stage workpiece is obtained; S4, a plurality of oil storage pits are etched on the third-stage workpiece by adopting a laser etching method, and a fourth-stage workpiece is obtained; and S5, a super-hydrophobic functional layer is coated, and the protective treatment is completed. The application can solve the technical problems that the sealing performance of a hydraulic cylinder coating in a high-permeability environment is poor, wear resistance and corrosion resistance cannot be considered at the same time, the hydraulic cylinder is prone to early failure, and the service life of the hydraulic cylinder is limited.

This invention discloses a PCB board with fine lines and its preparation method, relating to the field of PCB processing. The preparation method includes preparing a copper-clad laminate with a hydrocarbon resin substrate; using a UV laser with a wavelength of 315-400 nm to etch away copper foil to form circuit patterns; using a CO2 or green laser to remove the substrate to process holes; and cleaning, wet desmearing, shadowing, dry lamination, and electroplating the copper-clad laminate to obtain the PCB board. This application uses a UV laser to remove the copper foil on the surface of the copper-clad laminate to process circuit patterns without damaging the substrate, and utilizes a CO2 or green laser to remove the substrate to process holes. This enables ultra-fine circuit processing with a line width / spacing ≤15 μm, and the high etching factor and uniformity result in low resistance and heat loss. This method requires no chemically polluting reagents and does not use special materials, improving processing efficiency and quality while reducing production costs and environmental impact.

The application discloses a stainless steel ceramic heater and a process thereof, wherein the stainless steel ceramic heater comprises a base material layer, an outer wall of the base material layer is coated with a first ceramic insulation layer, a surface of the first ceramic insulation layer is covered with a metal resistance layer, the metal resistance layer is etched with a resistance circuit through rotary laser, and the resistance circuit is coated with a second ceramic insulation layer on the outer side. The application has the advantages of fast heating speed, small thermal inertia, high power density, good temperature uniformity, long service life, high laser etching process precision, wide application range, etc.

The utility model discloses a small size multiband 4G laser carving antenna relates to laser carving antenna technical field, including base body, is fixedly arranged with main radiating circuit, auxiliary radiating circuit and feed point on it, main radiating circuit and auxiliary radiating circuit all are electrically connected with feed point, and main radiating circuit is L -shaped to extend to the side of base body. The small size multiband 4G laser carving antenna provided by the utility model is divided into main radiating circuit and auxiliary radiating circuit with the circuit on the base body, and makes main radiating circuit L -shaped to extend to the outside of base body, thereby reduces the longitudinal length of circuit on base body, shortens the size length of laser carving antenna, realizes the miniaturization and small size demand of laser carving antenna.