22results about How to "Increase inductance" patented technology

The invention discloses a U-shaped coil inductor and a production method thereof, and the method comprises the following steps: S1, cutting a copper sheet into a required size through a punching machine, and bending the copper sheet into a U-shaped coil; s2, the U-shaped coil is placed on a lower punching die with the opening facing downwards, and an electrode of the U-shaped coil is placed in a groove of the lower punching die; s3, feeding the alloy powder into a mold, and applying pressure to press the alloy powder and the U-shaped coil into an inductor; s4, putting the inductor into an oven for baking; s5, uniformly covering the inductor with an organic coating through spraying equipment to form a protective layer; and S6, stripping the protective layer of the exposed electrode of the inductor by using laser, and plating a tin layer on the electrode through electroplating. The U-shaped coil has the beneficial effects that the U-shaped coil is formed by bending the copper sheet, the structure is simple, automatic generation and processing are facilitated, and the production efficiency is improved; the U-shaped coil and the magnetic powder block are pressed and integrally formed, the volume is small, the magnetic powder block can be easily integrated into a circuit, the design of the circuit is more compact, and the requirement for high integration of components is met.

The invention discloses a four-corner snakelike bridge broadband electromagnetic band gap structure, and belongs to the technical field of circuit microwaves. According to the structure, complementary split-ring resonator shape etching is carried out at the center, and the snake-shaped bridge structures are arranged between the adjacent units, so that the inductance between the electromagnetic band gap units is increased, low-frequency-band SSN is effectively suppressed, the bandwidth is relatively wide, and SSN of a stop band can be effectively suppressed. The four sides of the EBG structure are etched into rectangles, and adjacent elements are connected to form a bridge. Compared with a traditional L-bridge structure, the S-shaped structure is designed, so that the surface current path can be increased, and the equivalent inductance and the equivalent capacitance are increased. The gap between the resonant rings generates a gap current and generates a resonant circuit, so that the cut-off frequency can be effectively reduced and the width of a stop band can be improved. The ultra-wide band gap structure takes the suppression depth of-30dB as a standard, can reach an ultra-wide band gap of 23.8 GHz, is obviously superior to a conventional electromagnetic band gap structure, and can better suppress the noise of a synchronous switch.

The invention relates to a filter for a vehicle-mounted driving motor system, which comprises a common-mode magnetic ring group, a front noise filtering capacitor bank, a rear noise filtering capacitor bank, a high-voltage copper bar and a support, and is characterized in that the common-mode magnetic ring group is mounted in the support, and the front noise filtering capacitor bank and the rear noise filtering capacitor bank are mounted on one side of the support; the high-voltage copper bar passes through the common-mode magnetic ring group; the common-mode magnetic ring group comprises a primary magnetic core, a secondary magnetic core and a tertiary magnetic core; and the front noise filtering capacitor bank and the rear noise filtering capacitor bank respectively comprise an X capacitor, a Y capacitor and a damping resistor. Compared with the prior art, the system has the advantages that the topological structure has more expansibility, the magnetic cores of the common-mode magnetic ring group are selected according to the requirements of different driving motor systems on electromagnetic compatibility, and the application range is wide; the front noise filtering capacitor bank and the rear noise filtering capacitor bank are integrated into a two-in-one filter plate, so that the problem of ESL (Electronic Security Language) caused by overlong lead terminals is effectively solved; and a shielding cabin is formed by the filter through the shielding cover, so that a space coupling path is cut off, and the like.

This utility model relates to the field of electronic component technology, and in particular to a vertical dual-winding coupled inductor. The vertical dual-winding coupled inductor of this utility model adopts a dual-winding structure design. The first winding is wound on a magnetic core, and the second winding is wound on a bushing base. The magnetic core is then inserted into the bushing base, so that the first winding and the second winding are combined. The magnetic core of the first winding increases the inductance of the second winding. After assembly, the base and the outer shell are installed to separate the windings. The staggered second wire outlet holes and wire slots ensure that the lead ends of the two windings can maintain a certain distance, reducing the chance of contact and achieving effective isolation, which can effectively avoid the risk of short circuits and failures.

The invention relates to the technical field of electric reactors, and discloses a three-phase zero-sequence electric reactor which comprises side columns, a middle core column, a first yoke, a second yoke, a first winding, a second winding and a third winding. The two ends of the side column and the two ends of the middle core column are fixedly connected with the first yoke and the second yoke respectively. And the first winding, the second winding and the third winding are wound on the middle core column. According to the invention, the structure is simple, the structure is compact, the three-phase symmetry is perfect, the geometric positions are completely symmetrical, the experienced magnetic circuit conditions are completely consistent, and the problem of three-phase current and impedance imbalance caused by the asymmetry of the magnetic circuit is fundamentally eliminated. Besides, zero-sequence magnetic flux is bound in the middle core column and does not need to flow through a side column and a long yoke to form a lengthy path like a traditional structure, so that a magnetic circuit is remarkably short, magnetic resistance is extremely small, larger magnetic flux can be generated under the same number of turns, higher inductance can be obtained by using fewer copper wires, copper loss is reduced, efficiency is improved, and cost is reduced. The inductor has the advantages of high inductance value and high efficiency.

This utility model discloses an antenna structure, antenna device, and electronic device, including a main body and two feed sections respectively connected to the main body; the two feed sections are intertwined to increase the inductance of the antenna structure. The antenna structure is formed by the main body and the two feed sections, and the ends of the two feed sections furthest from the main body are intertwined to make the two feed sections closer together, thereby increasing the coupling degree of the antenna structure and thus improving the inductance of the antenna structure.

The embodiment of the utility model provides an inductor, a circuit board assembly and a household appliance. The inductor comprises a magnetic core, a single group of coils and two pins, wherein the magnetic core comprises a first magnetic column and two second magnetic columns. The two second magnetic columns are arranged at intervals in the first direction, the two ends of the first magnetic column are connected with the two second magnetic columns, the first magnetic column is in an arc shape, and the second magnetic columns extend along a straight line. The single coil is wound on the first magnetic column and the two second magnetic columns. And the two pins are connected to the two ends of the single group of coils. According to the inductor provided by the embodiment of the invention, the two linear second magnetic columns are arranged at the two ends of the arc-shaped first magnetic column, winding of the linear magnetic columns is denser and more uniform, and magnetic leakage is reduced while the inductance value is increased. When the inductor is installed on the circuit board and the extension direction of the second magnetic column is parallel to the thickness direction of the circuit board, the number of winding turns of a single coil is increased by increasing the extension size of the second magnetic column, and the occupied area of the inductor on the circuit board is not increased while the inductance value is increased.

The utility model relates to filter technical field, specifically disclose a compact multistage LC filter, the filter includes rectangle insulating substrate, its four corner position is equipped with mounting hole, the filter shell is fixedly installed above the insulating substrate, the both ends of filter shell are equipped with input and output port, in the filter shell, the insulating substrate top is equipped with at least two stages filter unit, and each stage filter unit contains spiral inductance and interdigital capacitance, and they are connected through microstrip line between the filter unit of adjacent stage alternately cascaded. Two insulating shield baffles are arranged between the adjacent filter units, which are connected with the insulating substrate and the filter shell, and the shielding layer formed between the insulating shield baffles is connected with the bottom ground plane through the metallized via on the insulating substrate. The filter realizes compact volume, excellent filtering performance and anti-interference ability through three-dimensional inductance, shielding structure and optimized layout.

The invention relates to the technical field of inductance elements, in particular to an inductance element, a preparation method thereof and electronic equipment. The inductor element comprises an inductor body and a physical vapor deposition metal layer. The inductor body has an assembly surface. A physical vapor deposition metal layer is disposed on the assembly surface. Wherein a separation groove is arranged between two ends of the physical vapor deposition metal layer in the direction parallel to the assembly surface, the separation groove is configured to cut off the physical vapor deposition metal layer into two parts along the thickness direction of the physical vapor deposition metal layer, one part of the physical vapor deposition metal layer forms a first extraction electrode of the inductor body, and the other part of the physical vapor deposition metal layer forms a second extraction electrode of the inductor body. And the other part of the physical vapor deposition metal layer forms a second extraction electrode of the inductor body. According to the inductance element, the physical vapor deposition metal layer is used as the electrode, the physical vapor deposition metal layer has the advantage of being small in thickness, the volume ratio of the inductance body in the inductance element can be increased, and then the inductance value of the inductance element is improved.

Provided are a power semiconductor module and a power conversion device that have an internal wiring structure that can reduce electrical vibration that occurs in internal wiring. This power semiconductor module comprises: an upper arm that has a first substrate upon which at least one power semiconductor chip including a first switching element is mounted, and a second substrate upon which at least one power semiconductor chip including a second switching element connected in parallel to the first switching element is mounted; and a lower arm that has a third substrate upon which at least one power semiconductor chip including a third switching element is mounted, and a fourth substrate upon which at least one power semiconductor chip including a fourth switching element connected in parallel to the third switching element is mounted. The power semiconductor module is characterized in that: the upper arm has first wiring that connects the first substrate and the second substrate and connects an emitter or source for the first switching element to an emitter or source for the second switching element; and the first wiring is disposed at a position further away from the lower arm in comparison to the end portion on the far side away from the lower arm of the power semiconductor chip positioned furthest from the lower arm from among the power semiconductor chips of the upper arm.

This invention discloses a method for preparing a high-density patch inductor blank, relating to the field of patch power inductors. In the prefabrication process, the patch inductor blank undergoes a first-stage pressing and a second-stage pressing. During the first-stage pressing, the current positions of the upper die head and the second lower die head are kept constant. The first lower die head is activated and controlled to press upwards at a first preset pressure. When the powder height on the periphery of the cavity is higher than a preset dimension of powder height at the center of the cavity, the second-stage pressing begins. During the second-stage pressing, the first lower die head continues to press at the first preset pressure, while the upper die head and the second lower die head are activated and controlled to press downwards and upwards respectively at a second preset pressure. When the powder height on the periphery of the cavity is equal to the powder height at the center of the cavity, the pressing pressure of the first lower die head is adjusted to the second preset pressure and held, resulting in a patch inductor blank. This method significantly improves the compaction density and permeability of the inductor blank.

The invention relates to the technical field of inductors, in particular to a magnetic conductivity gradient controllable laminated power inductor internal structure preparation process and a product thereof, the magnetic conductivity gradient controllable laminated power inductor internal structure preparation process comprises the following preparation steps: S1, a lamination process is adopted to prepare a plurality of FeSiCr prepregs by using FeSiCr slurry, the prepregs used for the first layer and the top layer are not punched, and the rest prepregs are punched; s2, NiZnCuFeO3 slurry is printed on the FeSiCr prepreg, a NiZnCuFeO3 circuit layer is formed, and the circuit layer needs to pass through the holes; s3, an inner electrode wire is printed on the surface of the NiZnCuFeO3 circuit layer, the edge of an inner electrode ring cannot exceed the edge of the NiZnCuFeO3 circuit layer, the inner electrode ring of the first-layer board prepreg does not need to penetrate through the hole, and the inner electrode wires of the other prepregs need to penetrate through the hole; and S4, after the inner electrode wire is printed on the first layer of prepreg, placing the second layer of prepreg, repeating the steps S2-S3, placing the third prepreg, repeating the steps S2-S3, and so on, and finally placing the top layer of prepreg to form a multi-layer structure and obtain the internal structure of the inductor.

This application provides an inductor, its fabrication method, and an electronic device. The inductor includes: a magnetic core with a hollow slot; a conductive busbar inserted within the hollow slot; an inner frame disposed within the hollow slot and distributed along the slot wall, the inner frame enclosing the conductive busbar; an outer frame enclosing the outer sides of the magnetic core; and a housing enclosing the outer sides of the outer frame, the two end faces of the magnetic core, and the two end faces of the inner frame, and fixing the conductive busbar thereto. The housing is integrally injection molded. Utilizing a rigid double-layer metal frame structure formed by the inner and outer frames, the magnetic core is sandwiched in the middle. During the integral injection molding process, the inner and outer frames protect the magnetic core, preventing it from cracking or degrading due to stress. This allows the magnetic core to be made of nanocrystalline materials with high saturation magnetic induction intensity and low loss, thereby achieving higher inductance and greater DC bias current capability within the same volume, exhibiting high power density and high current carrying capacity.

The invention relates to a laminated inductor and a preparation method and application thereof. The laminated inductor comprises laminated magnetic powder cores, the layered magnetic powder core comprises a soft magnetic metal layer and an open annular copper conductor embedded in the soft magnetic metal layer; in every two adjacent layers of layered magnetic powder cores, openings of the open annular copper conductors are arranged in a staggered mode, and the second open end of one layered magnetic powder core is connected with the first open end of the other layered magnetic powder core. According to the laminated inductor and the preparation method thereof, the inductance value of the laminated inductor is increased, high inductance value (larger than or equal to 1000 mu H) can be achieved while large current (larger than or equal to 200 A) is coped with, the preparation method is simple, and automatic production is easy to achieve.

This invention discloses a design method for an ultra-thin 3D inductor passive device, comprising the following steps: S1, selecting a suitable substrate; S2, setting a bottom metal on the bottom of the substrate, metallizing a hole on the bottom metal, and extending the metallized hole through the substrate and above the upper surface of the substrate; S3, setting a trace metal on the metallized hole, and fixing the trace metal to the upper surface of the substrate; S4, setting bumps on the trace metal, and setting a top metal on the top of the bumps, forming a passive device with 3D inductance. This invention reduces the aspect ratio of the 3D inductor while ensuring inductance performance, lowers the processing difficulty, and reduces the thickness of the manufactured product and the overall thickness of the packaging module.

The invention discloses an oil-immersed reactor and a flexible direct-current power transmission system, and relates to the technical field of flexible direct-current power transmission. The oil-immersed reactor comprises six groups of reactance coils; multiple groups of reactance coils corresponding to multiple groups of bridge arms of the flexible direct current power transmission system are integrated, so that two groups of reactance coils corresponding to one group of upper and lower bridge arms form a two-arm two-phase integrated structure, and three groups of reactance coils corresponding to each group of upper bridge arms or each group of lower bridge arms form a single-arm three-phase integrated structure. By means of the two-arm two-phase integrated structure and the single-arm three-phase integrated structure, larger inductance is provided for a single phase, under the condition that the inductance requirement is not changed, the overall size and the occupied area of the reactor are remarkably reduced, and the power density and the space utilization rate of a system are improved.

The invention discloses a common mode inductor with an inner and outer step annular structure, relates to the technical field of common mode inductors, and aims to solve the problem that a traditional pure circular magnetic ring common mode inductor cannot guarantee product consistency in the winding process. The four protruding steps with the height being about 1 mm are additionally arranged on the inner side and the outer side of the magnetic core respectively, the magnetic ring is equally divided into four symmetrical winding intervals, two coils of the common mode inductor are equally divided into four coils, the fixed distance is kept, and the product consistency is improved. In addition, the step design increases the surface area of the magnetic core, enhances the heat dissipation performance and reduces the temperature rise; meanwhile, the weight of the magnetic core is increased, the inductance value is improved, and the EMI effect is better. The common-mode inductor has the advantages of being novel in structure, accurate in winding, good in consistency, high in heat dissipation performance, high in inductance value and remarkable in EMI suppression effect, is suitable for the electronic field of high-efficiency and high-power switching power supplies and the like, and provides stable and reliable electromagnetic compatibility protection for circuits.

The application discloses a kind of plasma source assembly and semiconductor process chamber, belong to the field of semiconductors.A kind of plasma source assembly, applied to semiconductor process chamber, the plasma source assembly includes: insulating medium pipe, Faraday shield, coil and magnetic conducting piece;The insulating medium pipe is used to communicate with the cavity of the semiconductor process chamber;The coil is wound on the outside of the insulating medium pipe;The magnetic conducting piece is encircled in the outer periphery of the coil.A kind of semiconductor process chamber includes the above-mentioned plasma source assembly.The application can at least solve the problem that high power in coil leads to higher power loss.

The utility model provides a kind of co-fired inductor, including first magnetic core, second magnetic core and coil, the coil spiral shape is wound in the surface of first magnetic core, and the number of turns of the coil is more than one, the adjacent two turns of the coil are interval arrangement, the coil is between the first magnetic core and the second magnetic core, the surface of at least part of the first magnetic core and at least part of the coil are wrapped by the second magnetic core, and the first magnetic core side is reversed to.The utility model provides a kind of co-fired inductor, by spiral shape winding, so that the number of turns of coil after winding is at least above one, and then the number of turns of coil winding can be improved, and then the inductance that can be obtained under the same volume can be improved, and the interval arrangement between the adjacent two turns, this design does not need to carry out surface insulation treatment to coil.

The invention discloses a small-size shielding type electromagnetic metamaterial design method for a KHz segment, and relates to the technical field of metamaterial design, and the method comprises the steps: constructing a double-layer end-to-end spiral coil electromagnetic metamaterial element model, carrying out the simulation of the model, obtaining an inductance parameter and a resistance parameter, and determining an external lumped capacitance parameter and a quality factor; judging whether near-zero magnetic conductivity possibly occurs or not; simulating the newest model to obtain a solution of the element resonant frequency, and comparing the solution with the resonant frequency required by the design; calculating geometric factors of the model; calculating to obtain a curve of the complex permeability of the electromagnetic metamaterial; determining a point of which the magnetic conductivity is zero and selecting an own target near-zero interval; and simulating the designed model, and observing the shielding effect. The metamaterial is simple and convenient to operate, the efficiency and repeatability of the design and manufacturing process are improved, the small size of the metamaterial is achieved, the low-frequency-band and high-efficiency electromagnetic shielding requirements can be met, and high practicability and market value are achieved.

The invention relates to a machine system (1) comprising an electric machine (2) and a plurality of half-bridges (3) for controlling the electric machine (2), the electric machine (2) having a stator winding (4) comprising two winding parts (4.1, 4.2), each winding part (4.1, 4.2) having a winding branch (14) and a winding connection (10), the winding connections (10) of the winding parts (4.1) being electrically connected to phase connections (8) of the half-bridges (3) of a first group (13.1), and the phase connections (8) of the half-bridges (3) of a second group (13.1) being electrically connected to phase connections (8) of the half-bridges (3) of the second group (13.1). The winding connection (10) of the first winding part (4.1) is electrically connected to the phase connection (8) of the half-bridge (3) of the first group (13.1), and the winding connection (10) of the other winding part (4.2) is electrically connected to the phase connection (8) of the half-bridge (3) of the second group (13.2), the phase connection (8) of the half-bridge (3) of the first group (13.1) being electrically connectable in each case via a bridge connection (11) to one of the phase connections (8) of the half-bridge (3) of the second group (13.2) for electrically connecting two winding connections (10) of the different winding parts (4.1, 4.2), a switchable switching device (12) is arranged in the respective bridge connection (11), characterized in that-the half-bridge (3) of the machine system (1) is a regulated half-bridge,-each winding branch (14) of one of the two winding parts (4.1, 4.2) forms a branch pair (15) with one of the winding branches (14) of the respective other winding part (4.1, 4.2), the winding branches (14) of each branch pair (15) are phase-shifted by 180 degrees relative to one another, and-the respective bridge connection (11) can be switched by means of the respective switching device (12) so as to be conductive continuously in both current directions.

The application discloses a method for manufacturing an inductor on an integrated circuit chip and an inductor increasing structure of the integrated circuit chip manufactured by the method. The method is used for increasing an inductor between target metal layers of the integrated circuit chip. The method comprises the following steps: positioning target metal layers, which need to increase the inductor, in the integrated circuit chip, wherein the target metal layers comprise a first metal layer and a second metal layer; etching the integrated circuit chip to expose the first metal layer; etching the integrated circuit chip to expose the second metal layer; and forming a metal coil with the same inductance value as the target inductor on the surface of the integrated circuit chip, wherein the metal coil is electrically connected to the first metal layer and the second metal layer. The method for manufacturing the inductor on the integrated circuit chip and the inductor increasing structure of the integrated circuit chip can greatly improve the chip verification efficiency.