The invention belongs to the technical field of
semiconductor manufacturing, and particularly relates to an
integrated circuit packaging wire bonder pressing plate structure which comprises a base, the lower side wall of the base is connected with a pressing plate, the lower side wall of the pressing plate is provided with an annular groove, an annular
rubber ring is fixed in the annular groove,
magnetorheological fluid is distributed in the annular
rubber ring, and the
magnetorheological fluid is connected with the pressing plate. The pressing plate is filled with an annular coil located on the upper side of the annular
rubber ring. Intelligent pressure application is achieved through the
magnetorheological fluid dynamic pressing
system, the liquid magnetorheological fluid keeps the rubber ring soft in a
normal state, and the surface of the
chip is prevented from being damaged; after
electrification, the
magnetic field enables the magnetorheological fluid to be solidified instantly, uniform and adjustable pressure is applied to the edge of the
chip in combination with the
magnetic field efficiency enhanced by the
permalloy plate, the problem of displacement or damage caused by pressure concentration of a traditional pressing plate is thoroughly solved, and meanwhile, the
diamond copper pressing plate and the multi-channel cooling
system are adopted for cooperative heat dissipation.
Ethylene glycol cooling liquid efficiently flows and absorbs heat in the bevel heat conduction cavity and is shunted to the
cooling pipe through the distribution plate, so that efficient cooling is realized.